TWI691525B - 半導體裝置及其製造方法 - Google Patents

半導體裝置及其製造方法 Download PDF

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Publication number
TWI691525B
TWI691525B TW107109576A TW107109576A TWI691525B TW I691525 B TWI691525 B TW I691525B TW 107109576 A TW107109576 A TW 107109576A TW 107109576 A TW107109576 A TW 107109576A TW I691525 B TWI691525 B TW I691525B
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TW
Taiwan
Prior art keywords
insulating film
interlayer insulating
solvent
semiconductor device
ppm
Prior art date
Application number
TW107109576A
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English (en)
Chinese (zh)
Other versions
TW201841989A (zh
Inventor
湯之口智恵
Original Assignee
日商旭化成股份有限公司
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Application filed by 日商旭化成股份有限公司 filed Critical 日商旭化成股份有限公司
Publication of TW201841989A publication Critical patent/TW201841989A/zh
Application granted granted Critical
Publication of TWI691525B publication Critical patent/TWI691525B/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/66—Conductive materials thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/121—Arrangements for protection of devices protecting against mechanical damage
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9413—Dispositions of bond pads on encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H10W74/117—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations the substrate having spherical bumps for external connection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts

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  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Materials For Photolithography (AREA)
  • Formation Of Insulating Films (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
TW107109576A 2017-03-22 2018-03-21 半導體裝置及其製造方法 TWI691525B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-056225 2017-03-22
JP2017056225 2017-03-22

Publications (2)

Publication Number Publication Date
TW201841989A TW201841989A (zh) 2018-12-01
TWI691525B true TWI691525B (zh) 2020-04-21

Family

ID=63795739

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107109576A TWI691525B (zh) 2017-03-22 2018-03-21 半導體裝置及其製造方法

Country Status (3)

Country Link
US (1) US10354932B2 (https=)
JP (2) JP7366521B2 (https=)
TW (1) TWI691525B (https=)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7241502B2 (ja) * 2018-10-18 2023-03-17 旭化成株式会社 感光性樹脂組成物、硬化レリーフパターンの製造方法
JP7370229B2 (ja) * 2018-12-28 2023-10-27 旭化成株式会社 半導体装置、及びその製造方法
JP7267812B2 (ja) * 2019-03-29 2023-05-02 太陽ホールディングス株式会社 感光性樹脂組成物、ドライフィルム、硬化物、および電子部品
KR102888048B1 (ko) * 2019-11-19 2025-11-20 듀폰스페셜티머터리얼스코리아 유한회사 감광성 수지 조성물 및 이로부터 제조된 절연막
KR102669551B1 (ko) * 2020-02-20 2024-05-28 스미또모 베이크라이트 가부시키가이샤 감광성 수지 조성물의 제조 방법
WO2021172421A1 (ja) * 2020-02-28 2021-09-02 富士フイルム株式会社 硬化性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、及び、半導体デバイス
TWI904246B (zh) * 2020-09-29 2025-11-11 日商富士軟片股份有限公司 樹脂組成物、硬化物、積層體、硬化物的製造方法及半導體元件
TWI825626B (zh) * 2021-03-26 2023-12-11 日商富士軟片股份有限公司 感光性樹脂組成物、硬化物、積層體、硬化物的製造方法及半導體元件
KR20240031210A (ko) * 2021-07-05 2024-03-07 가부시끼가이샤 레조낙 감광성 수지 조성물, 영구 레지스트, 영구 레지스트의 형성 방법, 및 영구 레지스트용 경화막의 검사 방법
CN113759046A (zh) * 2021-09-23 2021-12-07 上海彤程电子材料有限公司 气相色谱-质谱联用检测光刻胶膜中丙二醇甲醚醋酸酯的方法及半导体器件的加工工艺
WO2025182048A1 (ja) * 2024-02-29 2025-09-04 Ｈｄマイクロシステムズ株式会社 感光性樹脂組成物、パターン硬化物の製造方法、パターン硬化物、及び電子部品
WO2025182050A1 (ja) * 2024-02-29 2025-09-04 Ｈｄマイクロシステムズ株式会社 感光性樹脂組成物、パターン硬化物の製造方法、パターン硬化物、及び電子部品

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201638663A (zh) * 2015-03-06 2016-11-01 東麗股份有限公司 感光性樹脂組成物及電子零件
TW201710390A (zh) * 2015-08-31 2017-03-16 Fujifilm Corp 組成物、硬化膜、硬化膜的製造方法、半導體元件的製造方法及半導體元件

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100427832B1 (ko) * 1999-01-21 2004-04-28 아사히 가세이 가부시키가이샤 폴리아미드산 에스테르
JP3947043B2 (ja) 2002-05-31 2007-07-18 株式会社日立製作所 半導体装置
JP5256018B2 (ja) 2008-12-26 2013-08-07 旭化成イーマテリアルズ株式会社 組成物、組成物からなる塗膜、塗膜を含む積層体、及び積層体を組み込んだ電子機器
JP5815309B2 (ja) 2011-07-05 2015-11-17 旭化成イーマテリアルズ株式会社 アルカリ可溶性重合体、それを含む感光性樹脂組成物、及びその用途
JP6019550B2 (ja) 2011-08-09 2016-11-02 富士通株式会社 電子装置の製造方法
JPWO2013111241A1 (ja) 2012-01-25 2015-05-11 日立化成デュポンマイクロシステムズ株式会社 ポリイミド前駆体及びそれを用いた樹脂組成物
JP2017523134A (ja) * 2014-05-30 2017-08-17 ダウ コーニング コーポレーションＤｏｗ Ｃｏｒｎｉｎｇ Ｃｏｒｐｏｒａｔｉｏｎ モノアミノシラン化合物

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201638663A (zh) * 2015-03-06 2016-11-01 東麗股份有限公司 感光性樹脂組成物及電子零件
TW201710390A (zh) * 2015-08-31 2017-03-16 Fujifilm Corp 組成物、硬化膜、硬化膜的製造方法、半導體元件的製造方法及半導體元件

Also Published As

Publication number Publication date
US10354932B2 (en) 2019-07-16
JP2018160665A (ja) 2018-10-11
JP2023138531A (ja) 2023-10-02
US20180342432A1 (en) 2018-11-29
JP7607089B2 (ja) 2024-12-26
JP7366521B2 (ja) 2023-10-23
TW201841989A (zh) 2018-12-01

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