JP7366521B2 - 半導体装置、及びその製造方法 - Google Patents

半導体装置、及びその製造方法 Download PDF

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Publication number
JP7366521B2
JP7366521B2 JP2018039192A JP2018039192A JP7366521B2 JP 7366521 B2 JP7366521 B2 JP 7366521B2 JP 2018039192 A JP2018039192 A JP 2018039192A JP 2018039192 A JP2018039192 A JP 2018039192A JP 7366521 B2 JP7366521 B2 JP 7366521B2
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insulating film
interlayer insulating
solvent
semiconductor device
ppm
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Japanese (ja)
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JP2018160665A (ja
Inventor
智恵 湯ノ口
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Asahi Kasei Corp
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Asahi Kasei Corp
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/66—Conductive materials thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/121—Arrangements for protection of devices protecting against mechanical damage
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9413—Dispositions of bond pads on encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H10W74/117—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations the substrate having spherical bumps for external connection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts

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  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Materials For Photolithography (AREA)
  • Formation Of Insulating Films (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
JP2018039192A 2017-03-22 2018-03-06 半導体装置、及びその製造方法 Active JP7366521B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2023116021A JP7607089B2 (ja) 2017-03-22 2023-07-14 半導体装置、及びその製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017056225 2017-03-22
JP2017056225 2017-03-22

Related Child Applications (1)

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JP2023116021A Division JP7607089B2 (ja) 2017-03-22 2023-07-14 半導体装置、及びその製造方法

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JP2018160665A JP2018160665A (ja) 2018-10-11
JP7366521B2 true JP7366521B2 (ja) 2023-10-23

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JP2018039192A Active JP7366521B2 (ja) 2017-03-22 2018-03-06 半導体装置、及びその製造方法
JP2023116021A Active JP7607089B2 (ja) 2017-03-22 2023-07-14 半導体装置、及びその製造方法

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US (1) US10354932B2 (https=)
JP (2) JP7366521B2 (https=)
TW (1) TWI691525B (https=)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7241502B2 (ja) * 2018-10-18 2023-03-17 旭化成株式会社 感光性樹脂組成物、硬化レリーフパターンの製造方法
JP7370229B2 (ja) * 2018-12-28 2023-10-27 旭化成株式会社 半導体装置、及びその製造方法
JP7267812B2 (ja) * 2019-03-29 2023-05-02 太陽ホールディングス株式会社 感光性樹脂組成物、ドライフィルム、硬化物、および電子部品
KR102888048B1 (ko) * 2019-11-19 2025-11-20 듀폰스페셜티머터리얼스코리아 유한회사 감광성 수지 조성물 및 이로부터 제조된 절연막
KR102669551B1 (ko) * 2020-02-20 2024-05-28 스미또모 베이크라이트 가부시키가이샤 감광성 수지 조성물의 제조 방법
WO2021172421A1 (ja) * 2020-02-28 2021-09-02 富士フイルム株式会社 硬化性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、及び、半導体デバイス
TWI904246B (zh) * 2020-09-29 2025-11-11 日商富士軟片股份有限公司 樹脂組成物、硬化物、積層體、硬化物的製造方法及半導體元件
TWI825626B (zh) * 2021-03-26 2023-12-11 日商富士軟片股份有限公司 感光性樹脂組成物、硬化物、積層體、硬化物的製造方法及半導體元件
KR20240031210A (ko) * 2021-07-05 2024-03-07 가부시끼가이샤 레조낙 감광성 수지 조성물, 영구 레지스트, 영구 레지스트의 형성 방법, 및 영구 레지스트용 경화막의 검사 방법
CN113759046A (zh) * 2021-09-23 2021-12-07 上海彤程电子材料有限公司 气相色谱-质谱联用检测光刻胶膜中丙二醇甲醚醋酸酯的方法及半导体器件的加工工艺
WO2025182048A1 (ja) * 2024-02-29 2025-09-04 Ｈｄマイクロシステムズ株式会社 感光性樹脂組成物、パターン硬化物の製造方法、パターン硬化物、及び電子部品
WO2025182050A1 (ja) * 2024-02-29 2025-09-04 Ｈｄマイクロシステムズ株式会社 感光性樹脂組成物、パターン硬化物の製造方法、パターン硬化物、及び電子部品

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000043439A1 (fr) 1999-01-21 2000-07-27 Asahi Kasei Kabushiki Kaisha Ester d'acide polyamique
JP2004006452A (ja) 2002-05-31 2004-01-08 Hitachi Ltd 半導体装置
JP2010155895A (ja) 2008-12-26 2010-07-15 Asahi Kasei E-Materials Corp 組成物、組成物からなる塗膜、塗膜を含む積層体、及び積層体を組み込んだ電子機器
JP2013038270A (ja) 2011-08-09 2013-02-21 Fujitsu Ltd 電子装置及びその製造方法
WO2013111241A1 (ja) 2012-01-25 2013-08-01 日立化成デュポンマイクロシステムズ株式会社 ポリイミド前駆体及びそれを用いた樹脂組成物
WO2017038664A1 (ja) 2015-08-31 2017-03-09 富士フイルム株式会社 組成物、硬化膜、硬化膜の製造方法、半導体デバイスの製造方法および半導体デバイス

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5815309B2 (ja) 2011-07-05 2015-11-17 旭化成イーマテリアルズ株式会社 アルカリ可溶性重合体、それを含む感光性樹脂組成物、及びその用途
JP2017523134A (ja) * 2014-05-30 2017-08-17 ダウ コーニング コーポレーションＤｏｗ Ｃｏｒｎｉｎｇ Ｃｏｒｐｏｒａｔｉｏｎ モノアミノシラン化合物
CN107407876A (zh) 2015-03-06 2017-11-28 东丽株式会社 感光性树脂组合物及电子部件

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000043439A1 (fr) 1999-01-21 2000-07-27 Asahi Kasei Kabushiki Kaisha Ester d'acide polyamique
JP2004006452A (ja) 2002-05-31 2004-01-08 Hitachi Ltd 半導体装置
JP2010155895A (ja) 2008-12-26 2010-07-15 Asahi Kasei E-Materials Corp 組成物、組成物からなる塗膜、塗膜を含む積層体、及び積層体を組み込んだ電子機器
JP2013038270A (ja) 2011-08-09 2013-02-21 Fujitsu Ltd 電子装置及びその製造方法
WO2013111241A1 (ja) 2012-01-25 2013-08-01 日立化成デュポンマイクロシステムズ株式会社 ポリイミド前駆体及びそれを用いた樹脂組成物
WO2017038664A1 (ja) 2015-08-31 2017-03-09 富士フイルム株式会社 組成物、硬化膜、硬化膜の製造方法、半導体デバイスの製造方法および半導体デバイス

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US10354932B2 (en) 2019-07-16
JP2018160665A (ja) 2018-10-11
JP2023138531A (ja) 2023-10-02
TWI691525B (zh) 2020-04-21
US20180342432A1 (en) 2018-11-29
JP7607089B2 (ja) 2024-12-26
TW201841989A (zh) 2018-12-01

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