TWI688487B - 板處理裝置及板處理方法 - Google Patents
板處理裝置及板處理方法 Download PDFInfo
- Publication number
- TWI688487B TWI688487B TW108113769A TW108113769A TWI688487B TW I688487 B TWI688487 B TW I688487B TW 108113769 A TW108113769 A TW 108113769A TW 108113769 A TW108113769 A TW 108113769A TW I688487 B TWI688487 B TW I688487B
- Authority
- TW
- Taiwan
- Prior art keywords
- processed
- mark
- processing
- board
- plate
- Prior art date
Links
- 238000012545 processing Methods 0.000 title claims abstract description 55
- 238000003672 processing method Methods 0.000 title claims description 10
- 238000000034 method Methods 0.000 claims description 25
- 230000008569 process Effects 0.000 claims description 13
- 230000007246 mechanism Effects 0.000 claims description 11
- 238000003825 pressing Methods 0.000 claims description 8
- 238000010330 laser marking Methods 0.000 claims description 2
- 238000005530 etching Methods 0.000 description 11
- 239000002184 metal Substances 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 238000003384 imaging method Methods 0.000 description 5
- 230000001681 protective effect Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010191 image analysis Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000007726 management method Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
- B05C9/08—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation
- B05C9/12—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation the auxiliary operation being performed after the application
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/435—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/02—Local etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31105—Etching inorganic layers
- H01L21/31111—Etching inorganic layers by chemical means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
- H01L21/32133—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only
- H01L21/32135—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by vapour etching only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67282—Marking devices
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Laser Beam Processing (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018-090122 | 2018-05-08 | ||
JP2018090122A JP2019196511A (ja) | 2018-05-08 | 2018-05-08 | 板処理装置及び板処理方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201946790A TW201946790A (zh) | 2019-12-16 |
TWI688487B true TWI688487B (zh) | 2020-03-21 |
Family
ID=68480610
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW108113769A TWI688487B (zh) | 2018-05-08 | 2019-04-19 | 板處理裝置及板處理方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2019196511A (ko) |
KR (1) | KR102554316B1 (ko) |
CN (1) | CN110453221B (ko) |
TW (1) | TWI688487B (ko) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114599149B (zh) * | 2022-05-10 | 2022-07-15 | 四川英创力电子科技股份有限公司 | 一种用于hdi板的双面精密打靶的装置及方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200926342A (en) * | 2007-09-25 | 2009-06-16 | Dainippon Screen Mfg | Method of forming alignment mark |
JP2014205286A (ja) * | 2013-04-12 | 2014-10-30 | 信越化学工業株式会社 | スクリーン印刷方法及びスクリーン印刷装置 |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2717707B2 (ja) * | 1989-07-14 | 1998-02-25 | 株式会社村田製作所 | スクリーン印刷方法、印刷版の製造方法及びそれらのための装置 |
JP2000008184A (ja) * | 1998-06-24 | 2000-01-11 | Toppan Printing Co Ltd | 多層導電膜のエッチング方法 |
JP2001052605A (ja) * | 1999-08-04 | 2001-02-23 | Toppan Printing Co Ltd | 高精細シャドウマスク及びその製造方法 |
JP2001068843A (ja) * | 1999-08-30 | 2001-03-16 | Taiyo Yuden Co Ltd | 半田ペースト印刷方法,半田ペースト印刷装置及び半田ペースト印刷用マスク |
JP4485667B2 (ja) * | 2000-08-21 | 2010-06-23 | パナソニック株式会社 | 部品実装装置のオフセット測定用基板及び部品実装装置のオフセット測定方法 |
JP2002322576A (ja) * | 2001-04-24 | 2002-11-08 | Toppan Printing Co Ltd | シヤドウマスクの製造方法 |
JP3962713B2 (ja) * | 2003-09-30 | 2007-08-22 | キヤノン株式会社 | アライメントマークの形成方法、およびデバイスが構成される基板 |
JP2006272625A (ja) * | 2005-03-28 | 2006-10-12 | Fujitsu Hitachi Plasma Display Ltd | 印刷位置制御装置 |
JP5018062B2 (ja) * | 2006-12-15 | 2012-09-05 | 株式会社日立プラントテクノロジー | ハンダボール印刷装置 |
US8021563B2 (en) * | 2007-03-23 | 2011-09-20 | Alpha & Omega Semiconductor, Ltd | Etch depth determination for SGT technology |
CN100527000C (zh) * | 2007-08-31 | 2009-08-12 | 上海微电子装备有限公司 | 对准系统和对准标记 |
JP2010003939A (ja) * | 2008-06-23 | 2010-01-07 | Fujitsu Ltd | 基板の製造方法、基板の製造装置及び基板 |
CN102653391B (zh) * | 2012-04-19 | 2015-02-25 | 苏州含光微纳科技有限公司 | 一种金属微小结构的加工方法 |
CN102681360A (zh) * | 2012-04-24 | 2012-09-19 | 合肥芯硕半导体有限公司 | 激光成像系统中实现电路板两面曝光图形对准的对位方法 |
JP5906398B2 (ja) * | 2013-01-29 | 2016-04-20 | パナソニックIpマネジメント株式会社 | スクリーン印刷装置及びスクリーン印刷装置におけるマスク位置決め方法 |
CN105092898B (zh) * | 2014-05-04 | 2018-03-09 | 中芯国际集成电路制造(北京)有限公司 | 半导体检测结构及形成方法、检测方法 |
US20170104158A1 (en) * | 2014-06-05 | 2017-04-13 | Sharp Kabushiki Kaisha | Vapor deposition method and vapor deposition apparatus |
CN104439698B (zh) * | 2014-11-26 | 2016-08-24 | 北京凌云光技术有限责任公司 | 用于激光加工系统的标定方法及装置 |
KR102552275B1 (ko) * | 2015-07-31 | 2023-07-07 | 삼성디스플레이 주식회사 | 마스크 제조방법 |
CN105355636B (zh) * | 2015-08-20 | 2018-10-09 | 苏州科阳光电科技有限公司 | 半导体图像传感器件的制造方法 |
CN105502284A (zh) * | 2015-12-10 | 2016-04-20 | 上海集成电路研发中心有限公司 | 一种晶圆背面对准的工艺集成方法 |
CN107414306B (zh) * | 2016-05-20 | 2019-07-23 | 上海和辉光电有限公司 | 一种金属掩膜制备方法 |
JP6723648B2 (ja) * | 2016-07-27 | 2020-07-15 | 住友重機械工業株式会社 | 位置検出装置及び位置検出方法 |
-
2018
- 2018-05-08 JP JP2018090122A patent/JP2019196511A/ja active Pending
-
2019
- 2019-04-17 KR KR1020190044759A patent/KR102554316B1/ko active IP Right Grant
- 2019-04-19 TW TW108113769A patent/TWI688487B/zh active
- 2019-04-23 CN CN201910329477.7A patent/CN110453221B/zh not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200926342A (en) * | 2007-09-25 | 2009-06-16 | Dainippon Screen Mfg | Method of forming alignment mark |
JP2014205286A (ja) * | 2013-04-12 | 2014-10-30 | 信越化学工業株式会社 | スクリーン印刷方法及びスクリーン印刷装置 |
Also Published As
Publication number | Publication date |
---|---|
JP2019196511A (ja) | 2019-11-14 |
CN110453221A (zh) | 2019-11-15 |
KR20190128556A (ko) | 2019-11-18 |
TW201946790A (zh) | 2019-12-16 |
CN110453221B (zh) | 2021-08-20 |
KR102554316B1 (ko) | 2023-07-10 |
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