TWI687971B - 基板處理裝置及基板處理方法 - Google Patents

基板處理裝置及基板處理方法 Download PDF

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Publication number
TWI687971B
TWI687971B TW106109910A TW106109910A TWI687971B TW I687971 B TWI687971 B TW I687971B TW 106109910 A TW106109910 A TW 106109910A TW 106109910 A TW106109910 A TW 106109910A TW I687971 B TWI687971 B TW I687971B
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TW
Taiwan
Prior art keywords
substrate
shielding plate
processing liquid
processing
nozzle
Prior art date
Application number
TW106109910A
Other languages
English (en)
Chinese (zh)
Other versions
TW201802870A (zh
Inventor
小林信雄
笹平幸之介
山崎克弘
Original Assignee
芝浦機械電子裝置股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 芝浦機械電子裝置股份有限公司 filed Critical 芝浦機械電子裝置股份有限公司
Publication of TW201802870A publication Critical patent/TW201802870A/zh
Application granted granted Critical
Publication of TWI687971B publication Critical patent/TWI687971B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/041—Cleaning travelling work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
TW106109910A 2016-03-31 2017-03-24 基板處理裝置及基板處理方法 TWI687971B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2016-073352 2016-03-31
JP2016073352 2016-03-31
JP2017-040452 2017-03-03
JP2017040452A JP6934732B2 (ja) 2016-03-31 2017-03-03 基板処理装置及び基板処理方法

Publications (2)

Publication Number Publication Date
TW201802870A TW201802870A (zh) 2018-01-16
TWI687971B true TWI687971B (zh) 2020-03-11

Family

ID=60044245

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106109910A TWI687971B (zh) 2016-03-31 2017-03-24 基板處理裝置及基板處理方法

Country Status (4)

Country Link
JP (1) JP6934732B2 (ko)
KR (1) KR102091726B1 (ko)
CN (1) CN107275260B (ko)
TW (1) TWI687971B (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7045867B2 (ja) * 2018-01-26 2022-04-01 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法
JP7149118B2 (ja) * 2018-07-03 2022-10-06 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
FR3085603B1 (fr) * 2018-09-11 2020-08-14 Soitec Silicon On Insulator Procede pour le traitement d'un susbtrat soi dans un equipement de nettoyage monoplaque
JP6979935B2 (ja) * 2018-10-24 2021-12-15 三菱電機株式会社 半導体製造装置および半導体製造方法
JP7353079B2 (ja) * 2019-07-04 2023-09-29 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
TWI756850B (zh) * 2019-09-30 2022-03-01 日商芝浦機械電子裝置股份有限公司 基板處理裝置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW480555B (en) * 1999-10-19 2002-03-21 Tokyo Electron Ltd Substrate processing apparatus and substrate processing
JP2003045838A (ja) * 2001-07-26 2003-02-14 Dainippon Screen Mfg Co Ltd 基板処理装置ならびに基板処理装置に備えられた回転板および周囲部材の洗浄方法
US20130104940A1 (en) * 2011-10-27 2013-05-02 Tokyo Electron Limited Liquid processing apparatus, liquid processing method, and storage medium
TW201541542A (zh) * 2014-03-28 2015-11-01 Screen Holdings Co Ltd 基板處理裝置及基板處理方法
TWI520795B (zh) * 2007-10-17 2016-02-11 荏原製作所股份有限公司 基板洗淨裝置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3698567B2 (ja) 1998-10-23 2005-09-21 大日本スクリーン製造株式会社 基板処理装置
JP3808719B2 (ja) * 2001-04-17 2006-08-16 大日本スクリーン製造株式会社 基板処理装置
JP4074814B2 (ja) * 2002-01-30 2008-04-16 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
JP4494840B2 (ja) * 2003-06-27 2010-06-30 大日本スクリーン製造株式会社 異物除去装置、基板処理装置および基板処理方法
JP4762098B2 (ja) * 2006-09-28 2011-08-31 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
US9640383B2 (en) * 2011-08-26 2017-05-02 Tokyo Electron Limited Liquid treatment apparatus and liquid treatment method
JP6017999B2 (ja) * 2013-03-15 2016-11-02 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
KR101579507B1 (ko) * 2013-05-08 2015-12-22 세메스 주식회사 기판 처리 장치
JP6215748B2 (ja) * 2014-03-28 2017-10-18 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP6626762B2 (ja) * 2016-03-30 2019-12-25 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW480555B (en) * 1999-10-19 2002-03-21 Tokyo Electron Ltd Substrate processing apparatus and substrate processing
JP2003045838A (ja) * 2001-07-26 2003-02-14 Dainippon Screen Mfg Co Ltd 基板処理装置ならびに基板処理装置に備えられた回転板および周囲部材の洗浄方法
TWI520795B (zh) * 2007-10-17 2016-02-11 荏原製作所股份有限公司 基板洗淨裝置
US20130104940A1 (en) * 2011-10-27 2013-05-02 Tokyo Electron Limited Liquid processing apparatus, liquid processing method, and storage medium
TW201541542A (zh) * 2014-03-28 2015-11-01 Screen Holdings Co Ltd 基板處理裝置及基板處理方法

Also Published As

Publication number Publication date
TW201802870A (zh) 2018-01-16
CN107275260B (zh) 2021-08-24
JP2017188665A (ja) 2017-10-12
KR20170113388A (ko) 2017-10-12
CN107275260A (zh) 2017-10-20
KR102091726B1 (ko) 2020-03-20
JP6934732B2 (ja) 2021-09-15

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