TWI684237B - 載置台及電漿處理裝置 - Google Patents

載置台及電漿處理裝置 Download PDF

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Publication number
TWI684237B
TWI684237B TW104142306A TW104142306A TWI684237B TW I684237 B TWI684237 B TW I684237B TW 104142306 A TW104142306 A TW 104142306A TW 104142306 A TW104142306 A TW 104142306A TW I684237 B TWI684237 B TW I684237B
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TW
Taiwan
Prior art keywords
mounting table
ring member
positioning member
table body
electrode body
Prior art date
Application number
TW104142306A
Other languages
English (en)
Chinese (zh)
Other versions
TW201637120A (zh
Inventor
邊見篤
南雅人
佐佐木芳彦
Original Assignee
日商東京威力科創股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 日商東京威力科創股份有限公司 filed Critical 日商東京威力科創股份有限公司
Publication of TW201637120A publication Critical patent/TW201637120A/zh
Application granted granted Critical
Publication of TWI684237B publication Critical patent/TWI684237B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Analytical Chemistry (AREA)
  • Plasma Technology (AREA)
  • Chemical Vapour Deposition (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Drying Of Semiconductors (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
TW104142306A 2014-12-26 2015-12-16 載置台及電漿處理裝置 TWI684237B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014265519A JP6380094B2 (ja) 2014-12-26 2014-12-26 載置台及びプラズマ処理装置
JP2014-265519 2014-12-26

Publications (2)

Publication Number Publication Date
TW201637120A TW201637120A (zh) 2016-10-16
TWI684237B true TWI684237B (zh) 2020-02-01

Family

ID=56296290

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104142306A TWI684237B (zh) 2014-12-26 2015-12-16 載置台及電漿處理裝置

Country Status (4)

Country Link
JP (1) JP6380094B2 (ko)
KR (1) KR101885416B1 (ko)
CN (1) CN105742147B (ko)
TW (1) TWI684237B (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020177785A (ja) * 2019-04-17 2020-10-29 日本電産株式会社 プラズマ処理装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6165274A (en) * 1997-10-31 2000-12-26 Canon Kabushiki Kaisha Plasma processing apparatus and method
US6283130B1 (en) * 1995-05-30 2001-09-04 Anelva Corporation Plasma cleaning method and placement area protector used in the method
JP2004055703A (ja) * 2002-07-18 2004-02-19 Matsushita Electric Ind Co Ltd プラズマ処理装置およびプラズマ処理方法
CN102956431A (zh) * 2011-08-26 2013-03-06 东京毅力科创株式会社 环状屏蔽部件、其构成零件和基板载置台

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3279038B2 (ja) * 1994-01-31 2002-04-30 ソニー株式会社 プラズマ装置およびこれを用いたプラズマ処理方法
KR19980021870U (ko) * 1996-10-24 1998-07-15 문정환 반도체 에칭장치의 페데스탈어셈블리
JP4782733B2 (ja) * 2007-06-12 2011-09-28 東京エレクトロン株式会社 載置台およびそれを用いたプラズマ処理装置
JP5227197B2 (ja) * 2008-06-19 2013-07-03 東京エレクトロン株式会社 フォーカスリング及びプラズマ処理装置
JP5650935B2 (ja) * 2009-08-07 2015-01-07 東京エレクトロン株式会社 基板処理装置及び位置決め方法並びにフォーカスリング配置方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6283130B1 (en) * 1995-05-30 2001-09-04 Anelva Corporation Plasma cleaning method and placement area protector used in the method
US6165274A (en) * 1997-10-31 2000-12-26 Canon Kabushiki Kaisha Plasma processing apparatus and method
JP2004055703A (ja) * 2002-07-18 2004-02-19 Matsushita Electric Ind Co Ltd プラズマ処理装置およびプラズマ処理方法
CN102956431A (zh) * 2011-08-26 2013-03-06 东京毅力科创株式会社 环状屏蔽部件、其构成零件和基板载置台

Also Published As

Publication number Publication date
CN105742147B (zh) 2018-01-26
JP2016127079A (ja) 2016-07-11
KR20160079689A (ko) 2016-07-06
KR101885416B1 (ko) 2018-08-03
JP6380094B2 (ja) 2018-08-29
TW201637120A (zh) 2016-10-16
CN105742147A (zh) 2016-07-06

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