TWI678746B - 半導體製造裝置以及半導體裝置的製造方法 - Google Patents

半導體製造裝置以及半導體裝置的製造方法 Download PDF

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Publication number
TWI678746B
TWI678746B TW107130824A TW107130824A TWI678746B TW I678746 B TWI678746 B TW I678746B TW 107130824 A TW107130824 A TW 107130824A TW 107130824 A TW107130824 A TW 107130824A TW I678746 B TWI678746 B TW I678746B
Authority
TW
Taiwan
Prior art keywords
wafer
lighting device
field
lighting
illumination
Prior art date
Application number
TW107130824A
Other languages
English (en)
Chinese (zh)
Other versions
TW201929113A (zh
Inventor
小橋英晴
Hideharu Kobashi
Original Assignee
日商捷進科技有限公司
Fasford Technology Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商捷進科技有限公司, Fasford Technology Co., Ltd. filed Critical 日商捷進科技有限公司
Publication of TW201929113A publication Critical patent/TW201929113A/zh
Application granted granted Critical
Publication of TWI678746B publication Critical patent/TWI678746B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0438—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0616—Monitoring of warpages, curvatures, damages, defects or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting

Landscapes

  • Die Bonding (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Wire Bonding (AREA)
TW107130824A 2017-09-19 2018-09-03 半導體製造裝置以及半導體裝置的製造方法 TWI678746B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017178969A JP7010633B2 (ja) 2017-09-19 2017-09-19 半導体製造装置および半導体装置の製造方法
JP2017-178969 2017-09-19

Publications (2)

Publication Number Publication Date
TW201929113A TW201929113A (zh) 2019-07-16
TWI678746B true TWI678746B (zh) 2019-12-01

Family

ID=65770976

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107130824A TWI678746B (zh) 2017-09-19 2018-09-03 半導體製造裝置以及半導體裝置的製造方法

Country Status (4)

Country Link
JP (1) JP7010633B2 (enExample)
KR (1) KR102130386B1 (enExample)
CN (1) CN109524320B (enExample)
TW (1) TWI678746B (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7151642B2 (ja) * 2019-06-28 2022-10-12 住友電気工業株式会社 面発光レーザ、その製造方法およびその検査方法
JP7377655B2 (ja) * 2019-09-19 2023-11-10 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法
JP7296835B2 (ja) * 2019-09-19 2023-06-23 株式会社ディスコ ウェーハの処理方法、及び、チップ測定装置
CN111029268A (zh) * 2019-12-23 2020-04-17 中芯长电半导体（江阴）有限公司 一种打线机台
JP7437987B2 (ja) * 2020-03-23 2024-02-26 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法
CN112992692B (zh) * 2021-05-19 2021-07-20 佛山市联动科技股份有限公司 一种全自动切割引线的方法及系统
JP7635075B2 (ja) * 2021-05-28 2025-02-25 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法
WO2025144103A1 (en) * 2023-12-27 2025-07-03 Semiconductor Technologies & Instruments Pte Ltd System and method for inspecting devices for internal defects at about sidewalls thereof caused by wafer singulation processes

Citations (4)

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TW201120436A (en) * 2009-12-04 2011-06-16 Delta Electronics Inc A apparatus and method for inspecting inner defect of substrate
CN102565090A (zh) * 2010-11-01 2012-07-11 先进自动器材有限公司 用于检查光伏衬底的方法
CN106920762A (zh) * 2015-12-24 2017-07-04 捷进科技有限公司 半导体制造装置、半导体器件的制造方法及芯片贴装机
JP2017147258A (ja) * 2016-02-15 2017-08-24 ファスフォードテクノロジ株式会社 ダイボンダおよび半導体装置の製造方法

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JPS5538003A (en) * 1978-09-08 1980-03-17 Hitachi Ltd Rectilinear pattern detecting device
JP2003185593A (ja) * 2001-12-21 2003-07-03 Nec Electronics Corp ウェーハ外観検査装置
DE112005001294T5 (de) * 2004-06-04 2007-04-26 Tokyo Seimitsu Co., Ltd. Halbleiteroberflächenprüfungsvorrichtung sowie Beleuchtungsverfahren
JP5924267B2 (ja) * 2010-12-14 2016-05-25 株式会社ニコン 検査方法、検査装置、露光管理方法、露光システムおよび半導体デバイスの製造方法
JP5277266B2 (ja) * 2011-02-18 2013-08-28 株式会社日立ハイテクインスツルメンツ ダイボンダ及び半導体製造方法
JP2013197226A (ja) * 2012-03-19 2013-09-30 Hitachi High-Tech Instruments Co Ltd ダイボンディング方法及びダイボンダ
JP2014060249A (ja) * 2012-09-18 2014-04-03 Hitachi High-Tech Instruments Co Ltd ダイボンダ、および、ダイの位置認識方法
KR101431917B1 (ko) 2012-12-27 2014-08-27 삼성전기주식회사 반도체 패키지의 검사장비
TWI570823B (zh) * 2013-08-14 2017-02-11 新川股份有限公司 半導體製造裝置以及半導體裝置的製造方法
JP6483152B2 (ja) * 2014-12-05 2019-03-13 株式会社アルバック 基板監視装置、および、基板監視方法
JP6683500B2 (ja) * 2016-02-24 2020-04-22 株式会社ディスコ 検査装置及びレーザー加工装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201120436A (en) * 2009-12-04 2011-06-16 Delta Electronics Inc A apparatus and method for inspecting inner defect of substrate
CN102565090A (zh) * 2010-11-01 2012-07-11 先进自动器材有限公司 用于检查光伏衬底的方法
CN102565090B (zh) 2010-11-01 2016-08-03 先进自动器材有限公司 用于检查光伏衬底的方法
CN106920762A (zh) * 2015-12-24 2017-07-04 捷进科技有限公司 半导体制造装置、半导体器件的制造方法及芯片贴装机
JP2017147258A (ja) * 2016-02-15 2017-08-24 ファスフォードテクノロジ株式会社 ダイボンダおよび半導体装置の製造方法

Also Published As

Publication number Publication date
JP7010633B2 (ja) 2022-01-26
KR20190032195A (ko) 2019-03-27
CN109524320B (zh) 2023-03-24
KR102130386B1 (ko) 2020-07-06
TW201929113A (zh) 2019-07-16
JP2019054203A (ja) 2019-04-04
CN109524320A (zh) 2019-03-26

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