TWI677585B - Organic thin film forming apparatus and organic thin film forming method - Google Patents
Organic thin film forming apparatus and organic thin film forming method Download PDFInfo
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- 239000010409 thin film Substances 0.000 title claims abstract description 91
- 238000000034 method Methods 0.000 title claims description 14
- 239000010408 film Substances 0.000 claims abstract description 137
- 230000008020 evaporation Effects 0.000 claims abstract description 104
- 238000001704 evaporation Methods 0.000 claims abstract description 104
- 239000011368 organic material Substances 0.000 claims abstract description 63
- 238000010438 heat treatment Methods 0.000 claims abstract description 60
- 238000004519 manufacturing process Methods 0.000 claims abstract description 50
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 33
- 238000005259 measurement Methods 0.000 claims description 38
- 230000000903 blocking effect Effects 0.000 claims description 25
- 238000006243 chemical reaction Methods 0.000 claims description 16
- 238000013459 approach Methods 0.000 claims description 3
- 239000000758 substrate Substances 0.000 description 11
- 230000003247 decreasing effect Effects 0.000 description 3
- 230000003111 delayed effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 150000002894 organic compounds Chemical class 0.000 description 2
- 230000008022 sublimation Effects 0.000 description 2
- 238000000859 sublimation Methods 0.000 description 2
- 238000004364 calculation method Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
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- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
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- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
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Abstract
提供一種能夠安定地放出蒸氣之有機薄膜製造裝置。係為對於蒸發容器(33)供給熱而加熱有機材料(37)並使蒸氣放出的有機薄膜製造裝置(10),根據被形成在成膜對象物(15)處之有機薄膜的成長速度來求取出代表有機材料(37)之溫度的算出溫度,對於蒸發容器(33)之測定溫度和算出溫度作比較,使供給至蒸發容器(33)處之熱的供給速度因應於溫度偏差而變化。由於熱的變動係為小,因此蒸氣之放出係為安定。由於若是測定成長速度接近目標之成長速度則將熱量之變化縮小,因此蒸氣之放出係為安定。 Provided is an organic thin film manufacturing apparatus capable of stably emitting vapor. It is an organic thin film manufacturing device (10) for heating an organic material (37) by supplying heat to an evaporation container (33) and releasing steam, and is calculated based on the growth rate of an organic thin film formed on a film formation object (15). The calculated temperature representing the temperature of the organic material (37) is taken out, and the measured temperature of the evaporation container (33) is compared with the calculated temperature, so that the supply speed of the heat supplied to the evaporation container (33) changes in accordance with the temperature deviation. Since the change in heat is small, the release of steam is stable. Since the change in heat is reduced if the growth rate is measured close to the target growth rate, the release of steam is stable.
Description
本發明,係有關於形成有機薄膜之技術,特別是有關對於有機薄膜之成長速度作控制並形成有機薄膜之技術。 The present invention relates to a technology for forming an organic thin film, and particularly to a technology for controlling the growth rate of an organic thin film and forming an organic thin film.
圖4之元件符號100,係為先前技術之有機薄膜製造裝置,並具備有真空槽113。在真空槽113之內部,係被配置有蒸發源112。 The reference numeral 100 in FIG. 4 is an organic thin film manufacturing apparatus of the prior art, and is provided with a vacuum tank 113. An evaporation source 112 is arranged inside the vacuum tank 113.
蒸發源112,係具備有蒸發容器133,在蒸發容器133之上方位置處,係成為使被搬入至真空槽113之內部的成膜對象基板115作通過或者是被作配置。 The evaporation source 112 is provided with an evaporation container 133, and at a position above the evaporation container 133, the film formation target substrate 115 carried into the vacuum tank 113 is passed or arranged.
蒸發容器133係為中空,在其之中空的內部,係被配置有由粉體狀之有機化合物所成的有機材料137。 The evaporation container 133 is hollow, and an organic material 137 made of a powdery organic compound is arranged in the hollow inside.
在蒸發容器133處,係被設置有加熱裝置134,加熱裝置134係被與加熱電源145作連接。 A heating device 134 is provided at the evaporation container 133, and the heating device 134 is connected to a heating power source 145.
藉由真空排氣裝置128來將真空槽113之內部作真空排氣而形成真空氛圍,並藉由加熱電源145來對加熱裝置134通電而使其發熱,作了發熱的加熱裝置134,係將蒸發容器133加熱而使其升溫,被配置在蒸發容器133之內部的有機材料137係藉由作了升溫的蒸發容器133而被作加熱。 The inside of the vacuum tank 113 is evacuated by the vacuum exhaust device 128 to form a vacuum atmosphere, and the heating device 134 is energized by the heating power source 145 to generate heat, and the heating device 134 that generates heat is used as a heating device. The evaporation container 133 is heated to raise the temperature, and the organic material 137 disposed inside the evaporation container 133 is heated by the heated evaporation container 133.
若是有機材料137被升溫至蒸發溫度以上,則係蒸發(亦包含昇華),多量之有機材料137的蒸氣係被放出至蒸發容器133內。 If the organic material 137 is heated above the evaporation temperature, it is evaporated (including sublimation), and a large amount of the vapor of the organic material 137 is released into the evaporation container 133.
在蒸發容器133之與成膜對象基板115相對面的位置處,係被設置有放出孔138,所產生了的蒸氣,係從放出孔138而被放出至真空槽113之內部,若是到達成膜對象基板115之表面,則在該部份處,有機材料137之薄膜係成長。 At the position of the evaporation container 133 opposite to the film formation target substrate 115, a discharge hole 138 is provided, and the generated vapor is discharged from the discharge hole 138 into the vacuum tank 113. If the film is reached, On the surface of the target substrate 115, a thin film of the organic material 137 grows at the portion.
在此有機薄膜製造裝置100中,於真空槽113之外部,係被配置有對於有機材料137之薄膜的成長速度作控制之成長速度控制電路114。 In the organic thin film manufacturing apparatus 100, a growth rate control circuit 114 that controls the growth rate of the thin film of the organic material 137 is arranged outside the vacuum tank 113.
若是對於成長速度控制電路114之對於成長速度作控制的處理程序作說明,則在真空槽113之內部,係被設置有膜厚感測器131,膜厚感測器131,係與被設置在成長速度控制電路114內之膜厚測定器141作連接。 If the processing procedure for controlling the growth rate by the growth rate control circuit 114 is described, a film thickness sensor 131 is provided inside the vacuum tank 113, and the film thickness sensor 131 is provided at The film thickness measuring device 141 in the growth rate control circuit 114 is connected.
膜厚感測器131,係被配置在成膜對象基板115之側方位置處,從蒸發源112所放出的有機材料137之蒸氣,係到達成膜對象基板115和膜厚感測器131處,並成 為在成膜對象基板115和膜厚感測器131處而使薄膜成長,代表膜厚感測器131所檢測出的膜厚之訊號,係被輸出至膜厚測定器141處,膜厚測定器141,係根據被輸入了的膜厚而求取出薄膜之成長速度。所求取出的代表成長速度之訊號,係作為測定訊號而被輸出至速度偏差檢測器142處。 The film thickness sensor 131 is disposed at the side of the film formation target substrate 115, and the vapor from the organic material 137 emitted from the evaporation source 112 is connected to the film target substrate 115 and the film thickness sensor 131. And into In order to grow the thin film on the film formation target substrate 115 and the film thickness sensor 131, a signal representing the film thickness detected by the film thickness sensor 131 is output to the film thickness measuring device 141 for film thickness measurement. The device 141 obtains the growth rate of the taken-out film according to the input film thickness. The obtained signal representing the growth rate is output to the speed deviation detector 142 as a measurement signal.
在成膜對象基板115之表面上所成長的薄膜之理想的成長速度,係被預先求取出來,並轉換為膜厚感測器131之表面的成長速度而作為基準值來記憶在記憶裝置143中,從記憶裝置143係輸出代表基準值之基準訊號,並被輸入至速度偏差檢測器142中。 The ideal growth rate of the thin film grown on the surface of the film formation target substrate 115 is obtained in advance and converted into the growth rate of the surface of the film thickness sensor 131 and stored in the memory device 143 as a reference value. The reference signal representing the reference value is output from the memory device 143, and is input to the speed deviation detector 142.
在速度偏差檢測器142處,係將代表被輸入了的基準訊號所代表之值(正負之符號與絕對值)和被輸入了的測定訊號所代表之值之間的大小關係和兩者之差之值求取出來,身為附加有符號之絕對值的代表偏差之偏差訊號,係被從速度偏差檢測器142而輸出至加熱電源145處。 At the speed deviation detector 142, the magnitude relationship between the value represented by the input reference signal (positive and negative signs and absolute value) and the value represented by the input measurement signal, and the difference between the two When the value is obtained, the deviation signal representing the deviation, which is an absolute value with a sign, is output from the speed deviation detector 142 to the heating power source 145.
當偏差訊號為代表相較於基準訊號所代表之成長速度係以測定訊號所代表之成長速度為更快的情況時,加熱電源145,係使輸出至加熱裝置134處之電流減少,而使蒸發源112之內部的有機材料137之蒸氣產生量減少,而成為使成膜對象基板115和膜厚感測器131之成長速度變慢。 When the deviation signal represents that the growth rate represented by the measurement signal is faster than the growth rate represented by the reference signal, heating the power supply 145 reduces the current output to the heating device 134 and causes evaporation. The amount of vapor generated by the organic material 137 inside the source 112 is reduced, and the growth rate of the film formation target substrate 115 and the film thickness sensor 131 is slowed.
另一方面,當相較於基準訊號所代表之成長速度係以測定訊號所代表之成長速度之值為更慢的情況 時,係使輸出至加熱裝置134處之電流增加,而使蒸發源112之內部的有機材料137之蒸氣產生量增加,而成為使成膜對象基板115和膜厚感測器131之成長速度變快。 On the other hand, when the growth rate represented by the benchmark signal is slower than the growth rate represented by the benchmark signal At this time, the current output to the heating device 134 is increased, and the amount of vapor generated by the organic material 137 inside the evaporation source 112 is increased, so that the growth rate of the film formation target substrate 115 and the film thickness sensor 131 is changed. fast.
如此這般,藉由對於供給至加熱裝置134處之電流值作調節,從有機材料137所產生的蒸氣量之變動係被縮小,蒸氣產生量係被維持為一定值,其結果,成長速度係被維持於基準值。 In this way, by adjusting the value of the current supplied to the heating device 134, the variation in the amount of steam generated from the organic material 137 is reduced, and the amount of steam generated is maintained at a constant value. As a result, the growth rate is It is maintained at the reference value.
被作增加之電流量和被作減少之電流量,係與偏差之值成正比,當偏差之絕對值為大的情況時,係以使偏差更快接近於0的方式來作控制。 The amount of current being increased and the amount of current being reduced are proportional to the value of the deviation. When the absolute value of the deviation is large, the control is made to make the deviation closer to 0 faster.
然而,在上述先前技術之有機薄膜製造裝置100中,就算是改變從加熱電源145所供給至加熱裝置134處之電流值,也會有蒸發容器133之溫度變化會相對於電流值之變化而有所延遲的問題。 However, in the organic thin film manufacturing apparatus 100 of the above-mentioned prior art, even if the current value supplied from the heating power source 145 to the heating device 134 is changed, the temperature change of the evaporation container 133 may be changed relative to the current value change. Delayed issue.
又,就算是將此種容器溫度之延遲作了解決,也有著相對於蒸發容器133之溫度變化而有機材料137之溫度變化有所延遲的問題,特別是,當藉由電流值之調節而使蒸發容器133之溫度與能夠得到所期望之蒸發速度的目標溫度作了接近時,所供給的電流值之變化係會過大,而無法安定成為目標溫度,其結果,蒸發速度係會變動。 In addition, even if the delay of the temperature of such a container is solved, there is a problem that the temperature change of the organic material 137 is delayed relative to the temperature change of the evaporation container 133, especially when it is adjusted by the current value. When the temperature of the evaporation container 133 is close to the target temperature at which the desired evaporation rate can be obtained, the change in the value of the supplied current is too large to stabilize to the target temperature, and as a result, the evaporation rate varies.
[專利文獻1]WO2015/182090 [Patent Document 1] WO2015 / 182090
本發明,係為了解決上述先前技術之問題而創作者,其目的,係在於提供一種能夠得到安定的蒸發速度之有機薄膜製造裝置。 The present invention was created by the present invention to solve the problems of the prior art, and an object thereof is to provide an organic thin film manufacturing apparatus capable of obtaining a stable evaporation rate.
為了解決上述課題,本發明,一種有機薄膜製造裝置,其特徵為,係具備有:真空槽;和蒸發容器,係被配置有有機材料,並被加熱而將前述有機材料之蒸氣放出至前述真空槽內;和加熱裝置,係對於前述蒸發容器供給熱並進行加熱;和成長速度控制器,係對於前述蒸氣之放出作控制,前述成長速度控制器,係具備有:熱量控制器,係對於前述加熱裝置所供給至前述蒸發容器處之熱量作控制;和成長速度測定器,係對於從前述蒸發容器所放出的前述有機材料之蒸氣在成膜對象物上成長的有機薄膜之成長速度作測定,並作為測定成長速度而輸出;和溫度測定器,係對於前述蒸發容器之溫度作測定,並作為測定溫度而輸出;和速度偏差檢測器,係求取出身為被輸入的前述測定成長速度與預先所設定了的基準速度之間之偏差之速度偏差;和轉換器,係被設置有將前述速度偏差轉換為代表前述有機材料之溫度的算出溫度之轉換關係;和 溫度偏差檢測器,係求取出身為被輸入了的前述算出溫度與前述測定溫度之間之偏差之溫度偏差,並根據前述溫度偏差之值,而以使前述測定溫度會接近前述算出溫度的方式,來使前述加熱裝置所供給至前述蒸發容器處之熱量改變,前述轉換關係,係以使供給至前述蒸發容器處之熱量的變化速度因應於前述溫度偏差之值來作變更的方式,而被作設定。 In order to solve the above-mentioned problems, the present invention is an organic thin film manufacturing apparatus, comprising: a vacuum tank; and an evaporation container configured with an organic material and heated to release the vapor of the organic material to the vacuum. Inside the tank; and a heating device, which supplies heat to the evaporation container and heats it; and a growth rate controller, which controls the release of the steam, and the growth rate controller, which includes: a heat controller, The heat supplied by the heating device to the evaporation container is controlled; and the growth rate measuring device measures the growth rate of the organic thin film on which the vapor of the organic material released from the evaporation container grows on the film-forming object, And output as the measured growth rate; and a temperature measuring device that measures the temperature of the evaporation container and outputs it as the measured temperature; and a speed deviation detector that takes out the previously measured measured growth rate and Speed deviation of the deviation between the set reference speed; and the converter, is There is set the speed deviation converting the organic materials represented by the temperature of the temperature calculating conversion relationship; and The temperature deviation detector obtains a temperature deviation which is a deviation between the inputted calculated temperature and the measured temperature, and makes the measured temperature approach the calculated temperature based on the value of the temperature deviation. In order to change the amount of heat supplied to the evaporation container by the heating device, the conversion relationship is changed so that the rate of change in the amount of heat supplied to the evaporation container is changed in accordance with the value of the temperature deviation. Make settings.
本發明,係為一種有機薄膜製造裝置,其中,在前述成長速度控制器處,係預先被設定有基準溫度和變更溫度,藉由前述成長速度控制器,而求取出將對於前述速度偏差而乘算了比例係數後的值加算至前述基準溫度處之比例溫度,前述轉換關係,係被設定為當前述比例溫度之值係較前述變更溫度之值而更接近前述基準溫度之值時,將前述算出溫度設為較前述比例溫度而更接近前述基準溫度之溫度。 The present invention is an organic thin film manufacturing apparatus, in which a reference temperature and a change temperature are set in advance at the growth rate controller, and the growth rate controller is used to obtain the multiplied value for the speed deviation. The value after calculating the proportionality coefficient is added to the proportional temperature at the aforementioned reference temperature, and the aforementioned conversion relationship is set so that when the value of the aforementioned proportional temperature is closer to the value of the aforementioned reference temperature than the value of the aforementioned changed temperature, the aforementioned The calculated temperature is set to a temperature closer to the reference temperature than the proportional temperature.
又,本發明,係為一種有機薄膜製造裝置,其中,前述轉換關係,係被設定為當前述比例溫度之值係較前述變更溫度之值而更遠離前述基準溫度之值時,將前述算出溫度設為較前述比例溫度而更遠離前述基準溫度之溫度。 In addition, the present invention is an organic thin film manufacturing apparatus, wherein the conversion relationship is set to calculate the temperature when the value of the proportional temperature is further from the reference temperature than the value of the change temperature. It is set to a temperature farther from the reference temperature than the proportional temperature.
本發明,係為一種有機薄膜製造裝置,其中,在前述成長速度控制器處,係預先被設定有基準溫度和變更溫度,藉由前述成長速度控制器,而求取出將對於前述速度偏差而乘算了比例係數後的值加算至前述基準溫度處之比例溫度,前述轉換關係,係被設定為當前述比例溫度之值 係較前述變更溫度之值而更遠離前述基準溫度之值時,將前述算出溫度設為較前述比例溫度而更遠離前述基準溫度之溫度。 The present invention is an organic thin film manufacturing apparatus, in which a reference temperature and a change temperature are set in advance at the growth rate controller, and the growth rate controller is used to obtain the multiplied value for the speed deviation. The value after calculating the proportionality coefficient is added to the proportional temperature at the aforementioned reference temperature, and the aforementioned conversion relationship is set as the value of the aforementioned proportional temperature When the value is farther from the reference temperature than the value of the change temperature, the calculated temperature is set to a temperature farther from the reference temperature than the proportional temperature.
本發明,係為一種有機薄膜製造裝置,其中,前述加熱裝置,係藉由以供給至前述蒸發容器處之熱來加熱前述蒸發容器並使其升溫,來加熱前述有機材料。 The present invention is an organic thin film manufacturing apparatus, wherein the heating device heats the evaporation container with the heat supplied to the evaporation container and heats the evaporation container to heat the organic material.
又,本發明,係為一種有機薄膜製造裝置,其中,前述蒸發容器,係被配置在前述真空槽之內部。 The present invention is an organic thin film manufacturing apparatus, wherein the evaporation container is disposed inside the vacuum tank.
本發明,係為一種有機薄膜製造裝置,其中,係具備有:放出孔,係被配置在前述真空槽內,並使前述蒸氣被放出;和膜厚感測器,係藉由前述蒸氣而被形成有前述有機薄膜,根據前述膜厚感測器上之前述有機薄膜之膜厚,前述測定成長速度係被求取出來,該有機薄膜製造裝置,並具備有:閘門,係在遮斷場所和到達場所之間移動,該遮斷場所,係位於前述放出孔和前述膜厚感測器之間,該到達場所,係與前述遮斷場所相異,構成為:當前述閘門為位置於前述遮斷場所處時,前述蒸氣,係能夠到達前述成膜對象物處,但無法到達前述膜厚感測器處,當前述閘門為位置於前述到達場所處時,前述蒸氣,係能夠到達前述成膜對象物和前述膜厚感測器處。 The present invention is an organic thin film manufacturing apparatus, which includes: a discharge hole, which is arranged in the vacuum tank and allows the vapor to be released; and a film thickness sensor, which is evacuated by the vapor. The organic thin film is formed, and based on the film thickness of the organic thin film on the film thickness sensor, the measured growth rate is obtained. The organic thin film manufacturing apparatus is provided with a shutter, which is located at a blocking place and Moving between arrival places, the blocking place is located between the release hole and the film thickness sensor, and the arriving place is different from the blocking place, and is formed when the gate is located in the blocking place. In the case of an interruption site, the vapor can reach the film formation object, but cannot reach the film thickness sensor. When the gate is located at the arrival site, the vapor can reach the film formation. The object and the film thickness sensor.
本發明,係為一種有機薄膜製造裝置,其中,在由前述閘門為位置於前述遮斷場所處的遮斷期間和前述閘門為位置於前述到達場所處之到達期間所成的一個周期中,係被設置有使前述測定溫度被設為一定值之期間。 The present invention is an organic thin film manufacturing apparatus, wherein, during a blocking period where the gate is located at the blocking place and a period during which the gate is arriving at the reaching place, A period is provided in which the measurement temperature is set to a constant value.
本發明,係為一種有機薄膜製造方法,其係為使被供給有熱而被加熱的蒸發容器將被配置在前述蒸發容器中之有機材料加熱並從前述有機材料來產生蒸氣而使前述蒸氣到達成膜對象物之表面以形成有機薄膜之有機薄膜製造方法,其特徵為:對於身為前述成膜對象物上之前述有機薄膜之成長速度之測定成長速度和身為前述蒸發容器之溫度之測定溫度作測定,求取出身為預先所設定了的基準速度和所測定了的前述測定成長溫度之間之差之速度偏差,藉由將前述速度偏差之值對於溫度而附加有關連性的轉換關係,來將前述速度偏差轉換為算出溫度,以使前述測定溫度會接近前述算出溫度的方式,來使供給至前述蒸發容器處之熱量改變,將供給至前述蒸發容器之熱量的變化速度,設為與溫度偏差之值相對應的值,該溫度偏差,係為前述算出溫度和身為所測定出的前述蒸發容器之溫度之測定溫度之間的偏差。 The present invention relates to a method for manufacturing an organic thin film, in which an evaporation container heated by being supplied with heat heats an organic material disposed in the evaporation container and generates steam from the organic material to reach the vapor. An organic thin film manufacturing method for forming an organic thin film on the surface of a film forming object, which is characterized by measuring the growth rate of the organic thin film on the film forming object and measuring the growth speed and the temperature of the evaporation container. The temperature is measured, and the speed deviation between the preset reference speed and the measured growth temperature is determined. The relationship between the speed deviation and the temperature is added to the correlation relationship. To convert the speed deviation into a calculated temperature so that the measured temperature is close to the calculated temperature, to change the amount of heat supplied to the evaporation container, and set the rate of change of the heat supplied to the evaporation container to The value corresponding to the value of the temperature deviation, which is the calculated temperature and measured as described above. The deviation between the measured temperatures of the temperature of the evaporation vessel.
本發明,係為一種有機薄膜製造方法,其中,係預先被設定有基準溫度和變更溫度,算出身為將對於前述速度偏差而乘算了比例係數後的結果加算至前述基準溫度處之溫度的比例溫度,當前述比例溫度之值係較前述變更溫度之值而更接近前述基準溫度時,前述轉換關係,係將前述速度偏差轉換為身為較前述比例溫度而更接近前述基準溫度之溫度之前述算出溫度。 The present invention is a method for manufacturing an organic thin film, in which a reference temperature and a change temperature are set in advance, and a temperature calculated by adding a result obtained by multiplying a proportionality coefficient to the speed deviation to the temperature at the reference temperature is calculated. Proportional temperature. When the value of the proportional temperature is closer to the reference temperature than the value of the change temperature, the conversion relationship is to convert the speed deviation into a temperature closer to the reference temperature than the proportional temperature. The temperature was calculated as described above.
本發明,係為一種有機薄膜製造方法,其中,當前述比例溫度之值係較前述變更溫度之值而更遠離前述基準溫 度時,前述轉換關係,係將前述速度偏差,轉換為身為設為較前述比例溫度而更遠離前述基準溫度之溫度之前述算出溫度。 The invention is a method for manufacturing an organic thin film, wherein when the value of the proportional temperature is farther from the reference temperature than the value of the change temperature, When the temperature is in degrees, the aforementioned conversion relationship is converted from the aforementioned speed deviation into the aforementioned calculated temperature which is set at a temperature farther from the reference temperature than the proportional temperature.
本發明,係為一種有機薄膜製造方法,其中,係預先被設定有基準溫度和變更溫度,算出身為將對於前述速度偏差而乘算了比例係數後的結果加算至前述基準溫度處之溫度的比例溫度,當前述比例溫度之值係較前述變更溫度之值而更遠離前述基準溫度時,前述轉換關係,係將前述速度偏差轉換為身為較前述比例溫度而更遠離前述基準溫度之溫度之前述算出溫度。 The present invention is a method for manufacturing an organic thin film, in which a reference temperature and a change temperature are set in advance, and a temperature calculated by adding a result obtained by multiplying a proportionality coefficient to the speed deviation to the temperature at the reference temperature is calculated. Proportional temperature. When the value of the proportional temperature is farther from the reference temperature than the value of the change temperature, the conversion relationship is to convert the speed deviation into a temperature that is further away from the reference temperature than the proportional temperature. The temperature was calculated as described above.
本發明,係為一種有機薄膜製造方法,其中,係對於被配置有使前述蒸氣產生之前述有機材料的前述蒸發容器之溫度作測定,並設為前述測定溫度,根據在膜厚感測器處所成長的前述有機薄膜之成長速度,來求取出前述測定成長速度。 The present invention relates to a method for manufacturing an organic thin film, wherein the temperature of the evaporation container in which the organic material for generating the vapor is arranged is measured, and the measurement temperature is set as the temperature at which the film thickness sensor is located. The growth rate of the grown organic thin film is obtained by taking out the measured growth rate.
本發明,係為一種有機薄膜製造方法,其中,係藉由使供給至加熱前述蒸發容器而對於前述有機材料進行加熱之加熱裝置處的電力之變化速度作變更,來使供給至前述蒸發容器處之熱量的變化速度作變更。 The present invention is a method for manufacturing an organic thin film, wherein the supply rate to the evaporation container is changed by changing the rate of change of electric power supplied to a heating device that heats the evaporation container and heats the organic material. The rate of change of heat is changed.
本發明,係為一種有機薄膜製造方法,其中,係設置在遮斷場所和到達場所之間移動之閘門,該遮斷場所,係位於前述蒸氣所被放出之放出孔和前述膜厚感測器之間之場所,而前述蒸氣能夠到達前述成膜對象物處但無法到達前述膜厚感測器處,該到達場所,係為與前述遮斷場所相 異之場所,而前述蒸氣能夠到達前述成膜對象物和前述膜厚感測器處,係交互設置有遮斷期間和到達期間,該遮斷期間,係使前述閘門位置於前述遮斷場所處,而使前述蒸氣到達前述成膜對象物處但是並不到達前述膜厚感測器處,該到達期間,係使前述閘門位置於前述到達場所處,而使前述蒸氣到達前述成膜對象物和前述膜厚感測器處。 The invention relates to a method for manufacturing an organic thin film, wherein a gate for moving between a blocking place and an arrival place is provided, and the blocking place is located in a discharge hole where the steam is discharged and the film thickness sensor. The place where the vapor can reach the film-forming object but cannot reach the film thickness sensor, the place of arrival is the same as the place where the film is cut off. In a different place, and the vapor can reach the film-forming object and the film thickness sensor, a blocking period and an arrival period are set alternately, and the blocking period is such that the gate position is at the blocking position , So that the vapor reaches the film formation object but does not reach the film thickness sensor, during the arrival period, the gate is positioned at the arrival place, and the vapor reaches the film formation object and The aforementioned film thickness sensor.
又,本發明,係為一種有機薄膜製造方法,其中,在由前述遮斷期間和鄰接於前述遮斷期間之前述到達期間所成的一個周期中,設置將前述測定溫度設為一定值之期間。 The present invention is a method for producing an organic thin film, wherein a period for setting the measurement temperature to a constant value is set in a cycle formed by the interruption period and the arrival period adjacent to the interruption period. .
若依據本發明,則由於係對於藉由熱傳導來使有機材料升溫的蒸發容器之測定溫度、和根據測定成長速度所求取出的代表有機材料之溫度之算出溫度,此兩者間作比較,並對於使加熱裝置供給至蒸發容器處的熱量之變化速度作控制,因此,熱量之變化速度係成為不會變得過大或過小,蒸氣係被從有機材料而安定地放出。 According to the present invention, since the measured temperature of the evaporation container that heats up the organic material by heat conduction and the calculated temperature of the representative organic material temperature obtained from the measured growth rate are compared, the two are compared, and The rate of change of the heat supplied to the evaporation vessel by the heating device is controlled, so that the rate of change of the heat does not become too large or too small, and the vapor is stably emitted from the organic material.
又,在基於先前技術所進行的控制方法中,係難以相對於特定之材料或外部攪亂而針對成長速度作控制,但是,若依據本發明,則係成為能夠進行並不會被材料或外部攪亂所影響的控制。 In the control method based on the prior art, it is difficult to control the growth rate with respect to a specific material or external disturbance. However, according to the present invention, it can be performed without being disturbed by the material or external disturbance. Affected controls.
10‧‧‧有機薄膜製造裝置 10‧‧‧Organic thin film manufacturing equipment
13‧‧‧真空槽 13‧‧‧Vacuum tank
14‧‧‧成長速度控制器 14‧‧‧Growth speed controller
15‧‧‧成膜對象物 15‧‧‧ Film forming object
16‧‧‧熱量控制器 16‧‧‧ Thermal controller
17‧‧‧溫度算出器 17‧‧‧Temperature calculator
31‧‧‧膜厚感測器 31‧‧‧ film thickness sensor
32‧‧‧溫度測定器 32‧‧‧Temperature Tester
33‧‧‧蒸發容器 33‧‧‧Evaporation container
35‧‧‧閘門 35‧‧‧Gate
37‧‧‧有機材料 37‧‧‧ Organic Materials
40‧‧‧成長速度測定器 40‧‧‧Growth Tester
41‧‧‧膜厚測定器 41‧‧‧ Film Thickness Tester
42‧‧‧速度偏差檢測器 42‧‧‧speed deviation detector
44‧‧‧轉換器 44‧‧‧ converter
45‧‧‧溫度偏差檢測器 45‧‧‧Temperature deviation detector
46‧‧‧加熱電源 46‧‧‧Heating power
49‧‧‧記憶裝置 49‧‧‧memory device
[圖1]係為用以對於本發明之有機薄膜製造裝置作說明的區塊圖。 FIG. 1 is a block diagram for explaining an organic thin film manufacturing apparatus of the present invention.
[圖2]係為用以對於算出溫度和比例溫度之差異作說明之圖表。 [Fig. 2] A graph for explaining the difference between the calculated temperature and the proportional temperature.
[圖3]係為對於時間與測定溫度之的關係作展示之圖表。 [Figure 3] A graph showing the relationship between time and measured temperature.
[圖4]係為用以對於先前技術之有機薄膜製造裝置作說明的區塊圖。 4 is a block diagram for explaining an organic thin film manufacturing apparatus of the prior art.
[圖5]係為用以對於間歇控制之有機薄膜製造裝置作說明的區塊圖。 FIG. 5 is a block diagram for explaining an organic thin film manufacturing apparatus for intermittent control.
[圖6]係為對於有機薄膜製造裝置之成膜對象物上的成長速度與測定溫度之相對於時間之經過的關係之其中一例作展示之圖表。 [Fig. 6] It is a graph showing an example of the relationship between the growth rate on the film-forming object of the organic thin film manufacturing apparatus and the passage of the measured temperature with respect to time.
圖1之元件符號10,係代表本發明之有機薄膜製造裝置。 The reference numeral 10 in FIG. 1 represents an organic thin film manufacturing apparatus of the present invention.
此有機薄膜製造裝置10,係具備有真空槽13,在真空槽13之內部,係被配置有蒸發源12。 This organic thin film manufacturing apparatus 10 includes a vacuum tank 13, and an evaporation source 12 is disposed inside the vacuum tank 13.
蒸發源12,係具備有中空之蒸發容器33,在其之中空的部分,係被配置有由粉體狀之有機化合物所成的有機材料37。 The evaporation source 12 includes a hollow evaporation container 33, and an organic material 37 made of a powdery organic compound is arranged in the hollow portion.
有機薄膜製造裝置10,係具備有主控制裝置 30、和成長速度控制器14。 Organic thin film manufacturing apparatus 10 including a main control device 30, and the growth rate controller 14.
主控制裝置30,係對於成長速度控制器14作控制,成長速度控制器14,係對於從蒸發容器33所放出至真空槽13之內部的蒸氣之放出速度(每單位時間中所放出的蒸氣之量)作控制。 The main control device 30 controls the growth rate controller 14 and the growth rate controller 14 is a rate of release of steam (the amount of steam emitted per unit time from the evaporation container 33 to the inside of the vacuum tank 13). Amount) for control.
在蒸發源12處,係被設置有加熱裝置34。成長速度控制器14,係具備有熱量控制器16,加熱裝置34,若是藉由從被配置在熱量控制器16處之加熱電源46而被供給電力,則係將蒸發容器33加熱而使其升溫,藉由作了升溫的蒸發容器33,來藉由熱傳導而將內部之有機材料37加熱。 A heating device 34 is provided at the evaporation source 12. The growth rate controller 14 includes a heat controller 16 and a heating device 34. If power is supplied from a heating power source 46 disposed at the heat controller 16, the evaporation vessel 33 is heated to raise the temperature thereof. The organic material 37 inside is heated by heat conduction through the heated evaporation container 33.
於此,加熱裝置34,若是藉由加熱電源46而被通電,則會發熱,並藉由熱傳導而加熱蒸發容器33來使其升溫。 Here, if the heating device 34 is energized by the heating power source 46, it generates heat, and heats the evaporation container 33 by heat conduction to increase the temperature.
在真空槽13處,係被連接有真空排氣裝置28,若是真空排氣裝置28動作而使真空槽13之內部被作真空排氣,則在真空槽13之內部係被形成有真空氛圍。 A vacuum exhaust device 28 is connected to the vacuum tank 13. If the vacuum exhaust device 28 is operated and the inside of the vacuum tank 13 is evacuated, a vacuum atmosphere is formed inside the vacuum tank 13.
蒸發容器33之內部,係藉由此真空排氣裝置28或者是其他的真空排氣裝置而被作真空排氣,並被形成有真空氛圍。有機材料37,在被放置於真空氛圍中的狀態下,若是藉由加熱裝置34而被升溫至有機材料37之蒸發溫度(於此,在蒸發溫度中係包含昇華溫度)以上之溫度,則係從有機材料37而產生蒸氣。 The inside of the evaporation container 33 is evacuated by the vacuum exhaust device 28 or another vacuum exhaust device, and a vacuum atmosphere is formed. When the organic material 37 is placed in a vacuum atmosphere, if the organic material 37 is heated to a temperature higher than the evaporation temperature of the organic material 37 by the heating device 34 (herein, the evaporation temperature includes the sublimation temperature), Vapor is generated from the organic material 37.
此時,若是真空槽13之內部的真空氛圍和蒸發容器33之內部的真空氛圍被作連接,則蒸發容器33所產 生的有機材料37之蒸氣,係從蒸發容器33而被放出至真空槽13之內部。於此,在蒸發容器33之頂板處,係被形成有蒸氣放出孔38,由於蒸發容器33係被配置在真空槽13之內部,真空槽13之內部的真空氛圍和蒸發容器33之內部的真空氛圍係被作連接,因此,從有機材料37所產生之蒸氣,係通過蒸氣放出孔38來從蒸發容器33之內部而被放出至真空槽13之內部。 At this time, if the vacuum atmosphere inside the vacuum tank 13 and the vacuum atmosphere inside the evaporation container 33 are connected, the product produced by the evaporation container 33 The vapor of the raw organic material 37 is discharged from the evaporation container 33 into the vacuum tank 13. Here, a vapor release hole 38 is formed on the top plate of the evaporation container 33. Since the evaporation container 33 is disposed inside the vacuum tank 13, the vacuum atmosphere inside the vacuum tank 13 and the vacuum inside the evaporation container 33 are formed. The atmosphere is connected. Therefore, the vapor generated from the organic material 37 is released from the inside of the evaporation container 33 to the inside of the vacuum tank 13 through the vapor release hole 38.
在真空槽13之內部的從蒸發容器33而放出之蒸氣所到達之成膜位置處,係配置了被配置有成膜對象物之裝置,或者是係配置了使成膜對象物通過成膜位置之裝置。於此,在蒸氣所到達之成膜位置處,係作為被配置有成膜對象物之裝置而被設置有基板支持器39,以元件符號15所標示之成膜對象物,係被保持於基板支持器39處。 The film formation position reached by the vapor emitted from the evaporation container 33 inside the vacuum tank 13 is a device provided with a film formation object or a film formation object is passed through the film formation position Of the device. Here, at the film-forming position reached by the vapor, a substrate holder 39 is provided as a device on which the film-forming object is arranged, and the film-forming object indicated by the element symbol 15 is held on the substrate. 39 supports.
在成長速度控制器14處,係被連接有對於被形成在表面上的薄膜之膜厚作測定的膜厚感測器31。 A film thickness sensor 31 for measuring the film thickness of a thin film formed on the surface is connected to the growth rate controller 14.
膜厚感測器31,係被配置在真空槽13之內部的不會對朝向成膜對象物15之蒸氣的到達作遮蔽並且從蒸氣放出孔38所放出之蒸氣能夠到達膜厚感測器31處的位置處。故而,從被配置在真空槽內之相同的蒸氣放出源(於此,係為蒸發容器33)所放出之蒸氣,係到達成膜對象物15和膜厚感測器31處。 The film thickness sensor 31 is disposed inside the vacuum tank 13 and does not shield the vapor reaching the film formation object 15 from reaching, and the vapor emitted from the vapor release hole 38 can reach the film thickness sensor 31. Everywhere. Therefore, the vapor emitted from the same vapor emission source (here, the evaporation container 33) arranged in the vacuum tank is connected to the film object 15 and the film thickness sensor 31.
在真空槽13之內部,係被設置有閘門35。 A gate 35 is provided inside the vacuum tank 13.
閘門35,係被與馬達36作連接,馬達36,係藉由馬達控制裝置51而被作控制。 The gate 35 is connected to a motor 36, and the motor 36 is controlled by a motor control device 51.
若是對於控制程序作說明,則馬達控制裝置51,係被與主控制裝置30作連接,並構成為若是主控制裝置30藉由馬達控制裝置51而使馬達36動作,則閘門35係在真空槽13內移動而能夠變更位置。在此例中,閘門35,係構成為能夠位置在位於膜厚感測器31與蒸氣放出孔38之間之遮斷場所處,並且能夠從遮斷場所而移動並位置在與遮斷場所相異之場所處。 If the control program is described, the motor control device 51 is connected to the main control device 30, and if the main control device 30 operates the motor 36 through the motor control device 51, the gate 35 is in the vacuum tank The position can be changed by moving within 13. In this example, the gate 35 is configured to be able to be located at an interruption place between the film thickness sensor 31 and the vapor release hole 38, and can be moved from the interruption place and positioned at a position opposite to the interruption place. Different places.
在閘門35為位置於遮斷場所處時,從蒸氣放出孔38所放出的蒸氣,就算是到達至成膜對象物15處,也不會到達膜厚感測器31處,就算是有機薄膜在成膜對象物15處成長,有機薄膜也不會在膜厚感測器31處成長。 When the gate 35 is located at the blocking place, the vapor emitted from the vapor release hole 38 will not reach the film thickness sensor 31 even if it reaches the film formation object 15, even if the organic thin film is in the The film formation target 15 grows, and the organic thin film does not grow on the film thickness sensor 31.
另一方面,若是閘門35從遮斷場所而移動並位置於與遮斷場所相異之場所處,則從蒸氣放出孔38所放出的蒸氣,係到達成膜對象物15和膜厚感測器31處,有機薄膜係在成膜對象物15之表面和膜厚感測器31之表面上成長。將使有機薄膜在成膜對象物15之表面和膜厚感測器31之表面上成長的閘門35之場所,稱作「到達場所」。 On the other hand, if the shutter 35 moves from the blocking place and is located at a place different from the blocking place, the steam emitted from the steam release hole 38 is tied to the film object 15 and the film thickness sensor. At 31 points, the organic thin film is grown on the surface of the film formation object 15 and the surface of the film thickness sensor 31. The place where the shutter 35 grows the organic thin film on the surface of the film formation object 15 and the surface of the film thickness sensor 31 is referred to as an "arrival place".
當從蒸氣放出孔38所放出的蒸氣到達至成膜對象物15和膜厚感測器31處時,被形成於膜厚感測器31處之有機薄膜的成長速度(假設「成長速度」係身為每單位時間之膜厚增加量)和被形成於成膜對象物15處之有機薄膜的成長速度,係存在有比例關係,該比例常數之值,係根據預先所測定了的膜厚測定值和測定時間而已被算出。當閘門35從遮斷位置而作移動時,被形成於成膜對象物15 處之有機薄膜的膜厚和成長速度,係可根據被形成於膜厚感測器31處之有機薄膜的膜厚和成長速度而算出。在以下之說明中,假設閘門35係為並非位置在遮斷場所處。 When the vapor released from the vapor release hole 38 reaches the film formation object 15 and the film thickness sensor 31, the growth rate of the organic thin film formed at the film thickness sensor 31 (assuming "growth speed" is There is a proportional relationship between the growth rate of the film thickness per unit time) and the growth rate of the organic thin film formed at 15 film-forming objects. The value of the proportionality constant is measured based on the film thickness measured in advance. The value and measurement time have been calculated. When the shutter 35 moves from the blocking position, it is formed on the film formation object 15 The film thickness and growth rate of the organic thin film can be calculated from the film thickness and growth rate of the organic thin film formed at the film thickness sensor 31. In the following description, it is assumed that the gate 35 is not located at the blocking place.
成長速度控制器14,係具備有膜厚測定器41,膜厚感測器31係被與膜厚測定器41作連接。 The growth rate controller 14 includes a film thickness measuring device 41, and the film thickness sensor 31 is connected to the film thickness measuring device 41.
膜厚感測器31,係將與所附著了的有機薄膜之膜厚相對應的訊號輸出至膜厚測定器41處,膜厚測定器41,係根據被輸入了的代表膜厚之訊號、和測定時間,來求取出膜厚感測器31上之膜厚的成長速度,並且將代表其之值的訊號,作為膜厚感測器31之成長速度而輸出,藉由膜厚測定器41,身為成膜對象物15之成長速度的測定成膜速度係被求取出來。 The film thickness sensor 31 outputs a signal corresponding to the film thickness of the attached organic thin film to the film thickness measuring device 41. The film thickness measuring device 41 is based on the input signal representing the film thickness, and The measurement time is used to obtain the growth rate of the film thickness on the film thickness sensor 31, and a signal representing the value is output as the growth rate of the film thickness sensor 31. With the film thickness sensor 41, Measurement of the growth rate of the film-forming object 15 The film-forming speed was obtained.
故而,係藉由膜厚感測器31和膜厚測定器41,來構成測定成膜對象物15上之薄膜之成長速度並將測定值作為測定成長速度而輸出的成長速度測定器。圖1之元件符號40,係代表成長速度測定器。 Therefore, the film thickness sensor 31 and the film thickness measuring device 41 constitute a film growth rate measuring device that measures the growth rate of the thin film on the film formation object 15 and outputs the measured value as the measurement growth rate. The reference numeral 40 in FIG. 1 represents a growth rate measuring device.
成長速度控制器14,係具備有溫度算出器17。溫度算出器17,係具備有速度偏差檢測器42,代表測定成長速度之訊號,係被輸入至速度偏差檢測器42處。 The growth rate controller 14 includes a temperature calculator 17. The temperature calculator 17 is provided with a speed deviation detector 42 which is a signal representing a measurement of the growth rate, and is input to the speed deviation detector 42.
速度偏差檢測器42,例如係在記憶裝置49中而預先設定有代表成膜對象物15之成長速度之基準值的基準速度,藉由速度偏差檢測器42,身為測定成長速度與基準速度之間之差之速度偏差(於此,「偏差」之值假設係為由絕對值和代表正負的符號所成者)係被求取出來,代 表所求取出的速度偏差之訊號係被輸出。關於基準速度,在溫度算出器17處,係被設置有記憶裝置49,基準速度,係被記憶在記憶裝置49中,並從記憶裝置49而被輸出至速度偏差檢測器42處。 The speed deviation detector 42 is, for example, a memory device 49 in which a reference speed representing a reference value representing the growth rate of the film-forming object 15 is set in advance. The speed deviation detector 42 measures the growth speed and the reference speed. The speed deviation (here, the value of "deviation" is assumed to be formed by the absolute value and the sign representing positive and negative) is calculated and substituted The speed deviation signal obtained from the meter is output. Regarding the reference speed, a memory device 49 is provided at the temperature calculator 17. The reference speed is stored in the memory device 49 and is output from the memory device 49 to the speed deviation detector 42.
當從膜厚測定器41而對於速度偏差檢測器42輸入了代表膜厚感測器31之成長速度之訊號的情況時,係亦可將膜厚感測器31之成長速度的基準值作為基準速度而預先設定在速度偏差檢測器42處。 When a signal representing the growth rate of the film thickness sensor 31 is input to the speed deviation detector 42 from the film thickness measuring device 41, the reference value of the growth rate of the film thickness sensor 31 may be used as a reference. The speed is set in advance at the speed deviation detector 42.
溫度算出器17,係具備有轉換器44,又,成長速度控制器14,係具備有熱量控制器16。 The temperature calculator 17 includes a converter 44, and the growth rate controller 14 includes a heat controller 16.
代表速度偏差之訊號,係被輸出至轉換器44處。 A signal representing the speed deviation is output to the converter 44.
速度偏差和有機材料之溫度之間的關係,係已預先被求出,並作為代表將速度偏差轉換為代表有機材料37之溫度的算出溫度之轉換關係,而被設置在轉換器44中。 The relationship between the speed deviation and the temperature of the organic material has been obtained in advance, and is set in the converter 44 as a conversion relationship representing the calculated temperature that converts the speed deviation into the temperature representing the organic material 37.
轉換器44,係將被輸入了的訊號所代表之速度偏差,藉由轉換關係來轉換為代表有機材料37之溫度的算出溫度,並將代表算出溫度之訊號輸出至熱量控制器16處。算出溫度,由於係根據測定成長速度而被求取出來,因此,算出溫度係代表有機材料之溫度。 The converter 44 converts the speed deviation represented by the input signal into a calculated temperature representing the temperature of the organic material 37 through a conversion relationship, and outputs a signal representing the calculated temperature to the heat controller 16. The calculated temperature is obtained based on the measured growth rate. Therefore, the calculated temperature represents the temperature of the organic material.
在熱量控制器16處,係被設置有溫度偏差檢測器45,代表算出溫度之訊號,係被輸入至溫度偏差檢測器45處。 A temperature deviation detector 45 is provided at the heat controller 16, and a signal representing a calculated temperature is input to the temperature deviation detector 45.
在蒸發容器33處,係被設置有溫度測定器32,藉由溫度測定器32,蒸發容器33之溫度係被作測定,代表測定溫 度之訊號,係從溫度測定器32而被輸出至熱量控制器16處,代表測定溫度之訊號,係被輸入至溫度偏差檢測器45處。溫度偏差檢測器45,係算出溫度偏差,該溫度偏差,係由被輸入了的算出溫度與測定溫度之差、和代表算出溫度與測定溫度之間之大小關係的正負之符號,而構成之。於此,溫度測定器32係為熱電偶。 A temperature measuring device 32 is provided at the evaporation container 33. With the temperature measuring device 32, the temperature of the evaporation container 33 is measured and represents the measured temperature. The signal of degree is output from the temperature measuring device 32 to the thermal controller 16 and the signal representing the measured temperature is input to the temperature deviation detector 45. The temperature deviation detector 45 calculates a temperature deviation, and the temperature deviation is constituted by a sign representing the magnitude of the relationship between the calculated temperature and the measured temperature and the sign of the magnitude relationship between the calculated temperature and the measured temperature. Here, the temperature measuring device 32 is a thermocouple.
熱量控制器16,係對於加熱裝置34供給電力,從加熱裝置34來將熱供給至有機材料37處,而使有機材料37升溫,又,熱量控制器16,係基於所算出的溫度偏差,來使供給至加熱裝置34處之電力作增減,並以使被形成於成膜對象物15處之有機薄膜之成長速度會成為基準速度的方式,來對於加熱裝置34所供給至有機材料37處的熱量之變化速度(所謂變化速度,係為所供給之熱的變化量/時間)之大小作控制。 The heat controller 16 supplies power to the heating device 34 and supplies heat from the heating device 34 to the organic material 37 to raise the temperature of the organic material 37. The heat controller 16 is based on the calculated temperature deviation. The power supplied to the heating device 34 is increased or decreased, and the organic thin film formed at the film-forming object 15 is grown at a reference speed so that the heating device 34 is supplied to the organic material 37. The change rate of the amount of heat (the so-called change rate is the change amount / time of the supplied heat) is controlled.
例如,當加熱裝置34所供給之熱量,係以身為一定值之變化速度Q1(cal/秒)來增加或者是減少時,係以使成長速度會成為基準速度的方式,而被變更為相異之值之變化速度Q2(cal/秒)(Q1≠Q2)。 For example, when the amount of heat supplied by the heating device 34 is increased or decreased at a rate of change Q 1 (cal / sec) which is a constant value, the growth rate is changed to a reference rate, and is changed to The rate of change of the different values Q 2 (cal / s) (Q 1 ≠ Q 2 ).
於此,代表溫度偏差之訊號係被輸入至加熱電源46處,基於溫度偏差之值、和算出溫度與測定溫度之間的大小關係,從加熱電源46所輸出的電力之對於加熱裝置34的供給量之變化速度(=所供給之電力之變化量/時間)係被作變更。藉由使電力供給量之變化速度被作變更,加熱裝置34所供給至有機材料37處之熱量的變化速度 係被變更。 Here, a signal representing a temperature deviation is input to the heating power source 46. Based on the value of the temperature deviation and the magnitude relationship between the calculated temperature and the measured temperature, the power output from the heating power source 46 is supplied to the heating device 34. The rate of change of the amount (= change amount / time of the supplied power) is changed. By changing the rate of change in the amount of power supplied, the rate of change in the amount of heat supplied to the organic material 37 by the heating device 34 The system was changed.
如此這般,在本發明中,係藉由熱量控制器16,來對於轉換器44所算出的算出溫度與藉由溫度測定器32所測定出的測定溫度作比較,並因應於所求取出的溫度偏差來使被供給至加熱裝置34處的電力之變化速度被作變更,算出溫度,由於係變化為與測定成長速度之值相對應的值,因此,熱量控制器16,係將值會有所變化的算出速度作為可變性之比較對象溫度,而求取出身為比較對象溫度與測定溫度之間之差的溫度偏差,並對於電力之變化速度作控制。 In this way, in the present invention, the thermal controller 16 is used to compare the calculated temperature calculated by the converter 44 with the measured temperature measured by the temperature measuring device 32, and take it out in accordance with the required value. The temperature deviation changes the rate of change of the electric power supplied to the heating device 34, and calculates the temperature. Since the change is a value corresponding to the value of the measured growth rate, the heat controller 16 changes the value to The changed calculation speed is used as the variability comparison target temperature, and the temperature deviation that is the difference between the comparison target temperature and the measurement temperature is obtained, and the speed of power change is controlled.
亦可並非採用基於溫度偏差所進行之控制,而是基於速度偏差來變更供給熱量之變化速度。 Instead of using control based on temperature deviation, it is also possible to change the rate of change of the supplied heat based on the speed deviation.
若是對於該控制之內容作說明,則首先,被輸入至速度偏差檢測器42中之基準速度,係為當身為使蒸發容器33內之有機材料37以所期望之蒸發速度來蒸發的理想之溫度之基準溫度時,在成膜對象物15之表面上所成長的有機薄膜之成長速度。 If the content of this control is explained, first, the reference speed inputted into the speed deviation detector 42 is ideal when the organic material 37 in the evaporation container 33 is evaporated at a desired evaporation rate. At the reference temperature of the temperature, the growth rate of the organic thin film grown on the surface of the film formation object 15.
故而,當成長速度測定器40所輸出的測定成長速度為與基準速度相等時,從速度偏差檢測器42係輸出代表0之值的速度偏差,藉由轉換器44,速度偏差係被轉換為與基準溫度相等之值之算出溫度,並被輸入至熱量控制器16處。 Therefore, when the measured growth speed output from the growth speed measuring device 40 is equal to the reference speed, a speed deviation representing a value of 0 is output from the speed deviation detector 42, and the speed deviation is converted into The calculated temperature having the same reference temperature is input to the heat controller 16.
若是假設蒸發容器33之溫度與蒸發容器33之內部的有機材料37之溫度係為相等,則當速度偏差之值為 0時,由於蒸發容器33之溫度係身為基準溫度,因此,測定溫度係成為基準溫度,算出溫度與測定溫度之溫度偏差係成為0。 If it is assumed that the temperature of the evaporation container 33 is equal to the temperature of the organic material 37 inside the evaporation container 33, the value of the speed deviation is At 0, since the temperature of the evaporation container 33 is the reference temperature, the measurement temperature is the reference temperature, and the temperature deviation between the calculated temperature and the measurement temperature is 0.
與此相異地,當蒸發容器33之溫度與蒸發容器33之內部的有機材料37之溫度係並非為相等的情況時,就算是在速度偏差之值為0時,算出溫度與測定溫度之溫度偏差也不會成為0。當測定溫度為較算出溫度而更高的情況時,係以使測定溫度降低的方式,來變更熱量之變化速度,當測定溫度為較算出溫度而更低的情況時,係以使測定溫度上升的方式,來變更熱量之變化速度。 In contrast, when the temperature of the evaporation container 33 and the temperature of the organic material 37 inside the evaporation container 33 are not equal, even if the speed deviation value is 0, the temperature deviation between the calculated temperature and the measured temperature is calculated. It will not become 0. When the measurement temperature is higher than the calculated temperature, the rate of change of heat is changed so that the measurement temperature is decreased. When the measurement temperature is lower than the calculated temperature, the measurement temperature is increased. Way to change the rate of change of heat.
如此這般,加熱電源46,係以和溫度偏差之符號以及大小相對應的變化速度,來使供給至加熱裝置34處之電力作變化,當溫度偏差之大小為0時,變化速度係成為0,正在供給之電力的大小係並不會被變更,而被作維持。 In this way, the heating power source 46 changes the power supplied to the heating device 34 with a change rate corresponding to the sign and magnitude of the temperature deviation. When the temperature deviation is 0, the change rate becomes 0. The size of the power being supplied will not be changed but maintained.
各偏差,係藉由符號和絕對值所構成,關於速度偏差,亦同樣的,係成為能夠基於其之符號來得知測定成長速度與基準速度之何者係為較大。 Each deviation is composed of a sign and an absolute value, and the speed deviation is also the same, and it is possible to know which of the measured growth speed and the reference speed is larger based on the sign.
當速度偏差係代表測定成長速度為較基準速度而更大時,被設置在轉換器44處之轉換關係,係被設定為會將速度偏差轉換為會使加熱裝置34所供給的熱量之變化速度縮小的算出溫度。 When the speed deviation represents that the measured growth rate is greater than the reference speed, the conversion relationship set at the converter 44 is set to convert the speed deviation into a change speed that causes the heat supplied by the heating device 34 Reduce the calculated temperature.
當速度偏差係代表測定成長速度為較基準速度而更小時,轉換關係,係被設定為會將速度偏差轉換為會使加熱 裝置34所供給的熱量之變化速度增大的算出溫度。其結果,溫度變化係變大。 When the speed deviation represents that the measured growth speed is smaller than the reference speed, the conversion relationship is set to convert the speed deviation into a heating The calculated temperature at which the rate of change of the heat supplied by the device 34 increases. As a result, the temperature change becomes large.
更具體而言,在成長速度控制器14處,係預先被設定有變更溫度,若是將把對於速度偏差而乘算了預先所設定的比例係數後的結果加算至基準溫度處後之值,作為比例溫度,則轉換關係,當根據被輸入了的速度偏差所算出之比例溫度係較所設定了的變更溫度而更接近基準溫度的情況時,係將對於所輸入了的速度偏差作轉換之算出溫度,設為較根據速度偏差所算出的比例溫度而更接近基準溫度之溫度。其結果,溫度變化係變小。 More specifically, the growth speed controller 14 is set with a change temperature in advance. If the speed deviation is multiplied by a pre-set scaling factor, the value is added to the reference temperature as the value. Proportional temperature is a conversion relationship. When the proportional temperature calculated based on the input speed deviation is closer to the reference temperature than the set change temperature, the calculated speed deviation is converted. The temperature is set to a temperature closer to the reference temperature than the proportional temperature calculated from the speed deviation. As a result, the temperature change system becomes small.
當根據所輸入了的速度偏差而算出的比例溫度係為與所設定了的變更溫度相同之溫度的情況時,算出溫度係被設為基準溫度。 When the proportional temperature calculated from the input speed deviation is the same temperature as the set change temperature, the calculated temperature is set as the reference temperature.
變更溫度,係分別被設定為較基準溫度而更高溫之溫度和較基準溫度而更低溫之溫度,較基準溫度而更高溫之比例溫度,係被與較基準溫度而更高溫之變更溫度作比較,較基準溫度而更低溫之比例溫度,係被與較基準溫度而更低溫之變更溫度作比較。 The change temperature is set to a temperature higher than the reference temperature and a temperature lower than the reference temperature, and a proportional temperature higher than the reference temperature is compared with a change temperature higher than the reference temperature. The proportional temperature lower than the reference temperature is compared with the change temperature lower than the reference temperature.
又,轉換關係,當根據被輸入了的速度偏差所算出之比例溫度係較所設定了的變更溫度而更遠離基準溫度的情況時,係將對於所輸入了的速度偏差作轉換之算出溫度,設為較根據該速度偏差所算出的比例溫度而更遠離基準溫度之溫度。 In the conversion relationship, when the proportional temperature calculated based on the input speed deviation is further away from the reference temperature than the set change temperature, the calculated temperature is converted from the input speed deviation. It is set to a temperature farther from the reference temperature than the proportional temperature calculated from the speed deviation.
在圖2之圖表中,針對此關係作展示。此圖2 之圖表之橫軸,係代表速度偏差,橫軸之原點之值,係為當速度偏差為0時之比例溫度與算出溫度,亦即是代表基準溫度。故而,縱軸,係代表身為比例溫度與基準溫度之差或者是身為變更溫度與基準溫度之差之溫度。 This relationship is shown in the graph in Figure 2. This figure 2 The horizontal axis of the graph represents the speed deviation, and the value of the origin of the horizontal axis is the proportional temperature and the calculated temperature when the speed deviation is 0, that is, the reference temperature. Therefore, the vertical axis represents the temperature between the difference between the proportional temperature and the reference temperature or the difference between the change temperature and the reference temperature.
此圖2之圖表,係對於速度偏差乃身為從基準速度而將測定成長速度作了減算後的值並且亦身為附有正負符號之絕對值的情況(速度偏差=基準速度-測定成長速度)作展示。圖2中之符號S,係為代表速度偏差和從根據該速度偏差所求取出的比例溫度而將基準溫度作了減算後的溫度之間之關係的曲線,符號H,係為代表速度偏差之關係的直線。 The graph in FIG. 2 is a case where the speed deviation is a value obtained by subtracting the measured growth speed from the reference speed and also an absolute value with a sign (the speed deviation = the reference speed-the measured growth speed). ) For display. The symbol S in FIG. 2 is a curve representing the relationship between the speed deviation and the temperature obtained by subtracting the reference temperature from the proportional temperature obtained from the speed deviation, and the symbol H is a curve representing the relationship between the speed deviation Relationship of straight lines.
符號T1,係為較基準溫度而更高溫側之變更溫度與基準溫度之間之差的溫度,符號T2,係為較基準溫度而更低溫側之變更溫度與基準溫度之間之差的溫度。符號E1、E2,係為乘算上比例係數所求取出的比例溫度和根據轉換關係所求取出的算出溫度為賦予相同之值的變更溫度之速度偏差,曲線S和直線H,係在點(E1,T1)和點(E2,T2)處而交叉。 The symbol T 1 is the difference between the reference temperature and the change temperature at the higher temperature side and the reference temperature. The symbol T 2 is the difference between the reference temperature and the change temperature at the lower temperature side and the reference temperature. temperature. The symbols E 1 and E 2 are the speed deviations of the proportional temperature obtained by multiplying the proportional coefficient and the calculated temperature obtained according to the conversion relationship as the change temperature giving the same value. The curve S and the straight line H are in Points (E 1 , T 1 ) and points (E 2 , T 2 ) intersect.
所算出的比例溫度為較變更溫度而更接近原點(基準溫度)之縱軸的範圍,係為較溫度T1、T2而更接近原點之溫度範圍,賦予該溫度範圍之速度偏差,係成為較賦予變更溫度之速度偏差E1、E2而更接近原點之範圍。而,在該範圍之速度偏差中,在根據相同之速度偏差而求取出算出溫度與基準溫度之間之差和比例溫度與基準溫度 之間之差時,算出溫度會成為較比例溫度而更接近原點。 The calculated proportional temperature is the range of the vertical axis closer to the origin (reference temperature) than the changed temperature. It is a temperature range closer to the origin than the temperatures T 1 and T 2, and the speed deviation is given to the temperature range. This is a range closer to the origin than the speed deviations E 1 and E 2 given to the change temperature. In the speed deviation in this range, when the difference between the calculated temperature and the reference temperature and the difference between the proportional temperature and the reference temperature are obtained based on the same speed deviation, the calculated temperature becomes closer to the proportional temperature than the proportional temperature. origin.
故而,當有機材料37之溫度為較變更溫度而更接近基準溫度的情況時,被供給至加熱裝置34處之熱量的變化,係成為較以與速度偏差成正比之大小來變化的情況時而更小,而成為不會有使有機材料37超過使速度偏差成為0之溫度地而變化的情況。 Therefore, when the temperature of the organic material 37 is closer to the reference temperature than the changed temperature, the change in the amount of heat supplied to the heating device 34 is a case where the change is more than a change proportional to the speed deviation. It becomes smaller, and there is a case where the organic material 37 does not change beyond a temperature at which the speed deviation becomes zero.
所算出的比例溫度為較變更溫度而更遠離原點(基準溫度)之縱軸的範圍,係為較溫度T1、T2而更遠離原點之溫度範圍,賦予該溫度範圍之速度偏差,係成為較賦予變更溫度之速度偏差E1、E2而更遠離原點之範圍。而,在該範圍之速度偏差中,在根據相同之速度偏差而求取出算出溫度與基準溫度之間之差和比例溫度與基準溫度之間之差時,算出溫度會成為較比例溫度而更遠離原點。 The calculated proportional temperature is a range farther from the vertical axis of the origin (reference temperature) than the changed temperature. It is a temperature range farther from the origin than the temperatures T 1 and T 2, and the speed deviation is given to this temperature range. This is a range farther from the origin than the speed deviations E 1 and E 2 given to the change temperature. In the speed deviation in this range, when the difference between the calculated temperature and the reference temperature and the difference between the proportional temperature and the reference temperature are obtained based on the same speed deviation, the calculated temperature becomes farther than the proportional temperature. origin.
故而,當有機材料37之溫度為從基準溫度而遠離的情況時,被供給至加熱裝置34處之熱量的變化量,係成為較以與速度偏差成正比之大小來變化的情況時而更大,有機材料37係成為快速地接近會使速度偏差成為0之溫度,因此,有機材料37之溫度係會更快地安定。 Therefore, when the temperature of the organic material 37 is away from the reference temperature, the amount of change in the amount of heat supplied to the heating device 34 becomes larger than when the temperature is changed by a magnitude proportional to the speed deviation. Since the organic material 37 is rapidly approaching the temperature at which the speed deviation becomes zero, the temperature of the organic material 37 is stabilized more quickly.
圖3(a)之圖表,係對於當測定溫度從較基準溫度而更低溫之狀態起來接近基準溫度的情況作展示,該圖(b)之圖表,係對於當測定溫度從較基準溫度而更高溫之狀態起來接近基準溫度的情況作展示,代表時間與測定溫度間之關係的曲線,最終係與代表基準溫度之直線相互一致。 The graph in Fig. 3 (a) shows the case where the measured temperature approaches the reference temperature when the temperature is lower than the reference temperature. The graph in Fig. 3 (b) shows the case where the measured temperature changes from the reference temperature. The situation where the high temperature is close to the reference temperature is shown, and the curve representing the relationship between time and the measured temperature finally coincides with the straight line representing the reference temperature.
又,在本實施例中,成長速度測定器40所輸出的代表測定成長速度之訊號,係藉由濾波器48而使高頻成分被除去,並被輸入至溫度算出器17中之速度偏差檢測器42處,速度偏差之值係成為不會作不必要的變動。 In this embodiment, the signal representing the measured growth rate output from the growth rate measuring device 40 is obtained by removing high-frequency components through the filter 48 and inputting it to the speed deviation detection in the temperature calculator 17. At the device 42, the value of the speed deviation is such that no unnecessary changes are made.
又,在本發明中,係可將加熱電源46所輸出的電力之控制作間歇性的進行,亦可構成為以一定時間間隔來對於膜厚感測器31上之成長速度作測定並輸出測定成長速度。於此情況,並不對於成長速度作測定之時間,由於係並不需要在膜厚感測器31表面上使有機薄膜成長,因此,係只要在並不對於成長速度作測定的時間中,使閘門35位置在遮斷場所處,並在進行測定時使其從遮斷場所而移動並在膜厚感測器31上使薄膜成長即可,由於有機薄膜在膜厚感測器31上而成長的時間係變短,因此膜厚感測器31之壽命係變長。 Further, in the present invention, the control of the power output from the heating power supply 46 may be performed intermittently, or it may be configured to measure and output the growth rate on the film thickness sensor 31 at a certain time interval. Growth rate. In this case, there is no time for measuring the growth rate. Since it is not necessary to grow the organic thin film on the surface of the film thickness sensor 31, the system only needs to make the time during which the growth rate is not measured. The shutter 35 is located at the blocking place, and it is allowed to move from the blocking place during measurement and grow the film on the film thickness sensor 31. The organic thin film is grown on the film thickness sensor 31. Since the time period is shorter, the lifetime of the film thickness sensor 31 is longer.
若是使用圖5來對於進行間歇控制之有機薄膜製造裝置作說明,則此有機薄膜製造裝置10A,係為在圖1之有機薄膜製造裝置10處設置有開閉控制器43的裝置,當蒸氣正到達相同種類之成膜對象物15處的期間中,閘門35係被作開閉,在閉狀態時,蒸氣係並不會到達膜厚感測器31處,在開狀態時,蒸氣係會到達膜厚感測器31處,而構成為相較於位置在相同之真空槽13內的成膜對象物15,蒸氣會到達膜厚感測器31的時間會變短。 If FIG. 5 is used to describe an organic thin film manufacturing apparatus that performs intermittent control, this organic thin film manufacturing apparatus 10A is a device provided with an on-off controller 43 at the organic thin film manufacturing apparatus 10 of FIG. 1 when the vapor is reaching During the period of 15 places of the same type of film formation object, the gate 35 is opened and closed. In the closed state, the vapor system does not reach the film thickness sensor 31. In the open state, the vapor system reaches the film thickness. At the sensor 31, the time taken for the vapor to reach the film thickness sensor 31 is shorter than that of the film formation object 15 located in the same vacuum tank 13.
在記憶裝置49中,係被記憶有使閘門35被開啟之到達期間的時間、和使閘門35被關閉之遮斷期間的時 間,並作為設定時間而被輸出至開閉控制器43處,開閉控制器43,係經由主控制裝置30,來對於馬達控制裝置51輸出控制訊號,閘門35之開閉係被作控制。 In the memory device 49, a time period during which the shutter 35 is opened and a time period during which the shutter 35 is closed are memorized. It is output to the opening / closing controller 43 as a set time. The opening / closing controller 43 outputs a control signal to the motor control device 51 via the main control device 30, and the opening and closing of the gate 35 is controlled.
在到達期間中,閘門35係被開啟,當蒸氣會到達而有機薄膜係在膜厚感測器31之表面上成長時,根據到達期間之時間、和在到達期間之間所形成的薄膜之膜厚,係能夠求取出膜厚感測器31和成膜對象物15之測定成長速度。 During the arrival period, the gate 35 is opened. When the vapor arrives and the organic thin film grows on the surface of the film thickness sensor 31, the film formed according to the time of the arrival period and the thin film formed between the arrival period. The thickness refers to the measurement growth rate at which the film thickness sensor 31 and the film formation object 15 can be obtained.
所求取出的測定成長速度,係被與基準速度作比較,速度偏差和算出溫度係被求取出來,溫度偏差係被輸出至加熱電源46處,被供給至加熱裝置34處的電力係被作變更。 The measured measured growth rate is compared with the reference speed. The speed deviation and the calculated temperature are obtained. The temperature deviation is output to the heating power source 46 and the electric power system to the heating device 34 is made. change.
故而,被供給至加熱裝置34處之電力,係成為在到達期間中會被變更,並且在遮斷期間中係被維持於作了變更後之值。 Therefore, the electric power supplied to the heating device 34 is changed during the arrival period, and is maintained at the changed value during the interruption period.
在膜厚感測器31之表面上,於到達期間之開始時刻處,薄膜之成長係開始,在該到達期間之結束時刻處,薄膜之成長係停止。 On the surface of the film thickness sensor 31, the growth of the thin film is started at the beginning of the arrival period, and the growth of the thin film is stopped at the end of the arrival period.
測定成長速度,係可在一個的到達期間之開始時刻起直到結束時刻為止之間被作測定,亦可構成為將複數之到達期間之膜厚測定值作平均並求取出測定成長速度。 The growth rate can be measured from the start time of one arrival period to the end time, or it can be configured to average the film thickness measurement values of a plurality of arrival periods and obtain the measured growth rate.
於此,有機薄膜製造裝置10A,假設係構成為基於到達期間中之膜厚增加量,而在到達期間之結束時刻處算出測定成長速度,並將被輸入至成長速度控制器14中 之測定成長速度之值,於每一到達期間之結束時刻處而作變更。 Here, it is assumed that the organic thin film manufacturing apparatus 10A is configured to calculate the measured growth rate at the end of the arrival period based on the film thickness increase amount during the arrival period, and input the measured growth rate to the growth rate controller 14. The value of the measured growth rate is changed at the end of each arrival period.
圖6之圖表,係對於該有機薄膜製造裝置10A之成膜對象物上的成長速度與測定溫度之相對於時間之經過的關係之其中一例作展示。 The graph of FIG. 6 shows an example of the relationship between the growth rate on the film-forming object of the organic thin film manufacturing apparatus 10A and the elapsed time with respect to the measurement temperature.
在此圖6之圖表中,係將到達期間和鄰接於該到達期間之下一個的遮斷期間,作為一個周期,並例如在身為一個周期中之到達期間的開始時刻之第1時刻t1處開始膜厚之測定,並在身為到達期間的結束時刻之的第2時刻t2處結束膜厚之測定,而根據所成長了的膜厚與測定時間,來求取出測定成長速度,所求取出的測定成長速度之值,係在第2時刻t2處被輸出至溫度算出器17處,並被與基準速度作比較,速度偏差和算出速度,係依此順序而被求取出來,算出溫度係被與測定溫度作比較,溫度偏差係被求取出來。 In the graph of FIG. 6, the arrival period and the interruption period next to the arrival period are taken as a cycle, and for example, the first time t 1 is the start time of the arrival period in a cycle. The measurement of the film thickness is started, and the measurement of the film thickness is ended at the second time t 2 which is the end time of the arrival period, and the measured growth rate is obtained based on the grown film thickness and measurement time. The measured value of the measured growth rate is output to the temperature calculator 17 at the second time t 2 and compared with the reference speed. The speed deviation and the calculated speed are obtained in this order. The calculated temperature is compared with the measured temperature, and the temperature deviation is obtained.
之後,為了將與溫度偏差相對應之大小的電力供給至加熱裝置34處,於測定成長速度被求取出來的第2時刻t2處,被供給至加熱裝置34處之電力的變化速度之大小係被作變更。 Thereafter, in order to supply electric power of a magnitude corresponding to the temperature deviation to the heating device 34, at a second time t 2 at which the growth rate is measured, the magnitude of the rate of change of the electric power supplied to the heating device 34 is determined. The system was changed.
於此,在第2時刻t2處所求取出的測定成長速度,假設若是為較基準速度(相對於成膜對象物之基準速度)而更小,則在第2時刻t2處,由於算出溫度之值係增加,測定溫度係成為較算出溫度而更低溫,因此,供給電力係增加,測定溫度係上升。 In contrast, in the second time t2 taken place seeking measured growth rate, as compared to the reference speed if it is assumed (with respect to the reference speed of the object to be film) and smaller at the second time t 2, since the calculated temperature The value system increases and the measurement temperature system becomes lower than the calculated temperature. Therefore, the power supply system increases and the measurement temperature system increases.
直到在下一個的一個周期處而求取出測定成 長速度之第4時刻t4為止,在加熱裝置34處,由於係被供給有相同之值的電力,因此,若是經過某一定之時間,則測定溫度係成為被保持於一定值。亦即是,在遮斷期間中,係被設置有使升溫被停止而使測定溫度被維持於一定值之保持期間,在遮斷期間之下一個的到達期間開始之第3時刻t3之前的特定時刻、或者是在第5時刻t5之前之特定時刻處,保持期間係被開始。 Until the fourth time t 4 at which the growth rate is measured at the next cycle, the same value of power is supplied to the heating device 34. Therefore, if a certain period of time has elapsed, the temperature is measured. The system is kept at a certain value. That is, during the interruption period, a holding period is provided in which the temperature rise is stopped and the measurement temperature is maintained at a constant value, and the period before the third time t 3 at which the arrival period immediately following the interruption period starts is provided. At a specific time or at a specific time before the fifth time t 5 , the holding period is started.
之後,在從下一個的一個周期之起始之第3時刻t3起直到第4時刻t4為止的到達期間中,測定溫度係被維持於在之前的一個周期之最後處所被保持的值。 Thereafter, since the value of T 3 in the last place of a previous cycle is maintained from the start of a third time period until the next period of time T reaches the first 4. 4, it is maintained at a temperature of measurement.
另一方面,由於相對於蒸發容器33的溫度變化之有機材料37的溫度變化係會延遲,因此,就算是測定溫度被保持於某一定值,測定成長速度也會持續增加。 On the other hand, since the temperature change of the organic material 37 with respect to the temperature change of the evaporation container 33 is delayed, even if the measurement temperature is maintained at a certain value, the measurement growth rate continues to increase.
因此,在第4時刻t4處所求取出之測定成長速度,係變得較基準速度而更大,與之前之一個周期相反地,被供給至加熱裝置34處之電力係減少,測定溫度係降低。 Therefore, the measured growth rate obtained at the fourth time t 4 becomes larger than the reference speed. In contrast to the previous cycle, the power system supplied to the heating device 34 decreases and the measured temperature system decreases. .
如此這般,在一個周期中,僅於一定時間(於此,係為遮斷期間中之除了保持期間以外的期間)中測定溫度會變化,在其他的時間中,則係被維持於一定溫度,故而,當在下一個的一個周期中而求取出了測定成長速度時,測定成長速度和基準速度之間之差係成為會變小。 In this way, in one cycle, the measured temperature changes only at a certain time (here, the period other than the holding period during the interruption period), and it is maintained at a certain temperature during other times Therefore, when the measured growth rate is obtained in the next cycle, the difference between the measured growth rate and the reference rate becomes smaller.
在上述各實施例中,雖然蒸發容器33係被配置在真空槽13之內部,但是,係亦可被配置在真空槽13之 外部。 In each of the above embodiments, although the evaporation container 33 is arranged inside the vacuum tank 13, it may be arranged in the vacuum tank 13. external.
又,在上述實施例中,雖係構成為:在加熱裝置34處係使用有電阻加熱加熱器,藉由熱傳導,蒸發容器33係被加熱,進而,有機材料37係藉由起因於熱傳導而作了升溫的蒸發容器33而被加熱並升溫,藉由對於加熱裝置34之發熱量作控制,來對於有機材料37之溫度作控制,但是,係亦可構成為:在加熱裝置34處使用紅外線燈管來藉由熱輻射而加熱蒸發容器33,或者是在蒸發容器33處流動感應電流而直接加熱蒸發容器33。 Moreover, in the above-mentioned embodiment, although the structure is such that a resistance heating heater is used at the heating device 34, the evaporation container 33 is heated by heat conduction, and the organic material 37 is caused by heat conduction. The heated evaporation vessel 33 is heated and heated, and the temperature of the organic material 37 is controlled by controlling the amount of heat generated by the heating device 34. However, it is also possible to use an infrared lamp at the heating device 34 The tube heats the evaporation container 33 by heat radiation, or directly heats the evaporation container 33 by flowing an induced current at the evaporation container 33.
另外,上述說明中之「蒸發速度」,係指蒸氣之每單位時間的放出量,而並非為代表蒸氣之飛行速度。 In addition, the "evaporation speed" in the above description refers to the amount of steam emitted per unit time, and does not represent the flying speed of steam.
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