CN103361608A - Evaporation device - Google Patents

Evaporation device Download PDF

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Publication number
CN103361608A
CN103361608A CN2013100950508A CN201310095050A CN103361608A CN 103361608 A CN103361608 A CN 103361608A CN 2013100950508 A CN2013100950508 A CN 2013100950508A CN 201310095050 A CN201310095050 A CN 201310095050A CN 103361608 A CN103361608 A CN 103361608A
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Prior art keywords
evaporation
crucible
valve
temperature
deposition material
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CN2013100950508A
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CN103361608B (en
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大工博之
菊地昌弘
松本祐司
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Hitachi Zosen Corp
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Hitachi Zosen Corp
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C23C14/542—Controlling the film thickness or evaporation rate
    • C23C14/545—Controlling the film thickness or evaporation rate using measurement on deposited material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/243—Crucibles for source material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/26—Vacuum evaporation by resistance or inductive heating of the source

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

The invention provides an evaporation device. Evaporation is performed under minimum limit temperature of a crucible necessary for a specified evaporation rate, when evaporation material (24) in the crucible (22) reduces and the evaporation amount (formation of evaporation particles supplied from the crucible (22)) of the evaporation material (24) from the crucible reduces and thereby leading to reduction of the evaporation rate, and to maintain the specified evaporation rate and in the circumstance that the aperture of a flow control valve (19) is largened sharply, a target heating temperature of the crucible rises with an incremental quantity. The result is that the evaporation amount of the evaporation material (24) form the crucible (22) increases, and the specified evaporation rate is maintained. By enabling the target temperature to rise with an incremental quantity successively, not only thermal degradation of the evaporation material (24) can be prevented and the evaporation material (24) can be used to the end, but can also reduce residues of the evaporation material (24) to a minimum value.

Description

Evaporation coating device
Technical field
The present invention relates to the evaporation coating device for the metal electrode wiring of evaporation metal film, organic material film, solar cell and display panel etc., organic EL luminescent layer etc.
Background technology
Usually, form the employed evaporation such as said film 10 -4Carry out under the high vacuum more than the Pa.For example in the vacuum deposition apparatus shown in Japanese Patent Publication communique JP 2004-91858 number, in vacuum chamber (vacuum vessel), be provided with crucible and by the evaporation substrate, this crucible is reeled and electric heater is installed and contains deposition material.After in to vacuum chamber, carrying out vacuum exhaust and reaching above-mentioned high vacuum, make deposition material fusing evaporation in the crucible by the electric heater heating crucible, and the deposition material of fusing is attached to by the evaporation substrate, thereby form film.Usually controlled by the Heating temperature of crucible by the evaporation speed of evaporation substrate (amount of the deposition material of time per unit evaporation) to described.But, even crucible temperature is stable, because the thermal conduction of the deposition material in the crucible etc. cause that temperature is slowly transmitted etc., so evaporation speed is difficult to stablize.Therefore, for example Japanese Patent Publication communique JP 2010-242202 number is disclosed like that, in the stream of vapor molecule, flow rate regulating valve is set, by making above-mentioned evaporation rate stabilization to flow rate regulating valve near the signal feedback of the film thickness sensor that arranges the substrate (film thickness gauge).
When adopting the mode of above-mentioned flow rate regulating valve, even crucible temperature is high temperature increasing steam output owing to controlling with valve, thus not only vaporator rate can keep stable, and can be with materials'use in the crucible to minimum.But, under the high temperature during long-time heating, in the situation of the deposition material that adopts poor heat stability, can thermal degradation when occur and can not obtain properties of materials.Otherwise, when crucible temperature was made as low temperature, the steam output of deposition material reduced, even adopted flow rate regulating valve, also can produce the problem of the evaporation speed that is difficult to long-time stable maintenance regulation, but also the retained material that has produced in the crucible becomes many and the problem waste deposition material.
Summary of the invention
The object of the present invention is to provide a kind of thermal degradation when that can prevent deposition material and with the residual evaporation coating device that drops to Schwellenwert of deposition material.
To achieve these goals, the evaporation coating device of the present invention's the first mode is attached to by on the evaporation member deposition material of evaporation in vacuum tank, and described evaporation coating device is characterised in that and comprises: crucible, heat described deposition material and make its evaporation; And stream, described in will be from the deposition material of described crucible evaporation to described vacuum tank guided by the evaporation member, be provided with the temperature sensor for detection of the temperature of described crucible, be provided with the valve that possesses the regulation function at described stream, in described vacuum tank, be provided with for detection of described by the thickness watch-dog of the thickness of evaporation member, and be provided with controller, utilize the detected thickness of described thickness watch-dog to detect described by the evaporation speed of evaporation member, regulate the aperture of described valve so that described evaporation speed becomes the evaporation speed of regulation, and detect the velocity of variation of the aperture of described valve, when described velocity of variation surpasses steady change rate under the state of the evaporation speed be stabilized in regulation, the design temperature of described crucible is risen with increment, thereby increase the evaporation amount of described deposition material.
According to said structure, utilize the detected thickness of thickness watch-dog to detect by the evaporation speed of evaporation member, and the aperture of variable valve is so that described evaporation speed reach the evaporation speed of regulation.And, when the deposition material in the crucible reduces, because steam output reduces, therefore tune up for the evaporation speed of the keeping regulation aperture with valve, reach the steady change rate when above at the velocity of variation of the aperture of described valve, make the temperature rising specified temperature of crucible, increase from the steam output of the deposition material of crucible.Like this, having avoided to be the situation that realizes the evaporation speed of regulation with the regulation of valve.In addition by temperature is risen with increment successively, can prevent the thermal degradation when of deposition material and with the residual Schwellenwert that drops to of deposition material.
The present invention's the second mode is on the basis of the first mode, when controller is processed the design temperature that makes crucible and is risen with increment, design temperature after will rising in the limit keeps the aperture of certain hour limit variable valve, through behind the described certain hour, when the velocity of variation of the aperture of described valve surpasses the steady change rate, the design temperature of described crucible is further risen with described increment.
According to said structure, when the temperature of crucible was risen with increment, described temperature was held certain hour, and the temperature hysteresis of crucible rises in the described certain hour, and lagging behind from the steam output of the deposition material of crucible increases.So, within a certain period of time, the steam output of the deposition material corresponding with the temperature rising of increment increases, thereby the velocity of variation of the aperture of valve is diminished, and perhaps valve changes to closing direction.At this moment, when the temperature based on the crucible of above-mentioned increment rises the increase part of steam output of the deposition material that brings when not enough, the velocity of variation of the aperture of valve keeps surpassing the steady change rate.Therefore, the design temperature of crucible is further risen with described increment, the temperature of crucible rises so that the temperature of described increment is interim successively thus.
Third Way of the present invention is on the basis of the first mode or the second mode, controller is controlled, under the state that valve cuts out, make the design temperature of crucible rise to the minimum temperature of the evaporation speed that described valve obtains stipulating under the aperture of regulation, when the detected temperatures of crucible rises to described minimum temperature, described valve is opened to the setting aperture, the evaporation speed of regulation to obtain stipulating of beginning valve.
According to said structure, at first under original state, make the temperature of crucible rise to the minimum temperature of the evaporation speed that valve obtains stipulating under the aperture of regulation, and under described state, valve is opened to the aperture of described regulation, the evaporation speed that the aperture adjustment of beginning valve obtains stipulating.By beginning evaporation from minimum temperature as mentioned above, deposition material effectively can be used at last.In addition, if be the steam output that high temperature increases deposition material with the Temperature Setting of crucible at first, can produce thermal degradation when and can not obtain the characteristic of deposition material.
In addition, the cubic formula of the present invention is on the basis of the first mode any one mode to the Third Way, and controller is controlled, when the detected temperatures of crucible rises to the degradation temperatures of deposition material, when valve is further opened, finish to utilize crucible evaporation deposition material.
According to said structure, when under the temperature of crucible rises to the state of degradation temperatures of deposition material, further opening valve, the evaporation speed that judgement can not obtain stipulating and finish evaporation.
Evaporation coating device of the present invention passes through when the velocity of variation of the aperture of valve surpasses the steady change rate, the temperature of crucible is risen with increment, increase the steam output from the deposition material of crucible, having avoided to be the situation that realizes the evaporation speed of regulation with the regulation of valve.According to the present invention, rise with increment successively by making temperature in addition, can not only prevent the thermal degradation when of deposition material, and can be with the residual Schwellenwert that drops to of deposition material.
Description of drawings
Fig. 1 is the structure iron of the embodiment of evaporation coating device of the present invention.
Fig. 2 is the control block diagram of the valve opening control device of same evaporation coating device.
Fig. 3 is the control block diagram of the crucible heater control device of same evaporation coating device.
Fig. 4 is the schema of the action of the same evaporation coating device of explanation.
Fig. 5 is the figure of characteristic of evaporation speed, crucible temperature, the valve opening of the same evaporation coating device of expression.
Embodiment
Fig. 1 is the structure iron of the embodiment of evaporation coating device of the present invention.As shown in Figure 1, in vacuum chamber (vacuum tank/evaporation container) 11, be provided with deposited chamber 13, in described deposited chamber 13, in vacuum atmosphere to surface (lower surface) the evaporation evaporation particle (deposition material of evaporation, for example organic EL Material) of glass substrate (by an example of evaporation member) 12.Vacuum chamber 11 is formed with the vacuum port 14 that vacuum chamber is formed vacuum atmosphere by vacuum unit (not shown).The top of vacuum chamber 11 is provided with the workpiece keeper 15 that keeps glass substrate 12.Illustrated evaporation coating device is the evaporation coating device of the evaporation type that makes progress (upwards deposition), the lower surface of the glass substrate 12 that keeps towards workpiece keeper 15 from the below (by the evaporation face) evaporation evaporation particle.
The bottom of vacuum chamber 11 is provided with for the materials conveyance pipe (guiding an example of the stream of evaporation particle to glass substrate) 17 to glass substrate 12 guiding evaporation particles.And, the relative configuration of lower surface of the peristome 17a of materials conveyance pipe 17 and glass substrate 12.Be provided with the gate 18 of open and close type between the peristome 17a of materials conveyance pipe 17 and the workpiece keeper 15, described gate 18 can stop evaporation particle to arrive glass substrate 12.
In the outside of vacuum chamber 11, materials conveyance pipe 17 is provided with a flowrate control valve (example of the valve of the aperture of adjusting stream; Control valve) 19.By the aperture of adjust flux control valve 19, can control the flow of evaporation particle.Reel on above-mentioned materials transfer lime 17 and the flowrate control valve 19 primary heater 20 is installed.Materials conveyance pipe 17 and flowrate control valve 19 utilize primary heater 20 to be heated to form the projecting temperature of temperature.
In the outside of vacuum chamber 11, crucible (material storage container) 22 upstream extremities that are arranged on materials conveyance pipe 17 are on materials conveyance pipe 17 middle distance vacuum chamber 11 positions farthest.Reel on the crucible 22 secondary heater (crucible heater) 23 is installed.Utilize described secondary heater 23, the deposition material 24 of taking in the crucible 22 is heated and forms evaporation particle, and the evaporation particle of formation is supplied to materials conveyance pipe 17.
Be provided with thickness watch-dog 26 with workpiece keeper 15 adjacency in deposited chamber 13, described thickness watch-dog 26 is for detection of the thickness of the deposition material of evaporation on the glass substrate 12.Crucible 22 is provided with temperature sensor 27, to detect the temperature of described crucible 22, is specially the internal temperature of crucible 22, i.e. the temperature of deposition material 24.
Be provided with valve opening control device 29 and crucible heater control device 30 in the outside of vacuum chamber 11.
[valve opening control device 29]
As depicted in figs. 1 and 2, to the data of valve opening control device 29 input by thickness watch-dog 26 detected thickness, and from minimum temperature arriving signal and the evaporation stop signal of the deposition material 24 of crucible heater control device 30 outputs.In addition, utilize valve opening control device 29, the electrical signal that is equivalent to valve opening 0～100% to flowrate control valve 19 delivery valve aperture instruction L(), and to the crucible heater control device rapid rising signals of 30 delivery valve apertures and evaporation end signal, and to outside (host computer of management evaporation operation etc.) output evaporation end signal.In Fig. 2, for simplicity of illustration, about accompanying drawing, repeat to have represented a crucible heater control device 30.
As shown in Figure 2, valve opening control device 29 has evaporation rate detection section 31, evaporation detection of end section 32, valve opening control part 33, shutter opening and closing section 34, valve opening velocity of variation test section 35, valve steady change rate test section 36 and the rapid rise detection of valve opening section 37.Wherein, evaporation rate detection section 31 obtains evaporation particle to the evaporation speed R of glass substrate 12 based on the variation of the thickness information of inputting from thickness watch-dog 26.When the information by thickness watch-dog 26 input is that thickness is when becoming required evaporation thickness, as the vapor-deposited film that has formed necessary thickness, evaporation detection of end section 32 is to the outside output evaporation end signal of crucible heater control device 30, valve opening control part 33 and valve opening control device 29.
(valve opening control part 33)
Valve opening control part 33 in the valve opening control device 29 has following function.
(a) when not inputting the minimum temperature arriving signal of deposition materials 24 or having inputted the evaporation stop signal from crucible heater control device 30, or when having inputted the evaporation end signal from evaporation detection of end section 32, be used for making the valve opening instruction L(of valve full cut-off to be equivalent to the electrical signal of valve opening 0% to flowrate control valve 19 outputs).
(b) at the minimum temperature arriving signal of having inputted deposition material 24 from crucible heater control device 30, namely inputted expression deposition material 24 when being heated to raise the temperature to the signal of the minimum temperature that is suitable for vapor deposition treatment, the valve opening instruction L of the aperture that is used for making valve slowly be opened to regulation to flowrate control valve 19 outputs (for example 70%).
(c) when flowrate control valve 19 is opened to the aperture of described regulation (valve opening instruction L becomes the opening value of regulation), obtain the deviation of evaporation speed Re with the evaporation speed R that is obtained by evaporation rate detection section 31 of predefined regulation, come control valve opening instruction L to eliminate described deviation.
(shutter opening and closing section 34)
The aperture that shutter opening and closing section 34 confirms based on the flowrate control valve 19 of valve opening instruction L, and the aperture of flowrate control valve 19 during less than the aperture of described regulation (for example 70%) with gate 18 full cut-offs, reach the aperture of regulation (for example 70%) when above with gate 18 standard-sized sheets.
(valve opening velocity of variation test section 35)
Flowrate control valve 19 is followed the carrying out of vapor deposition treatment, usually valve opening is controlled to be slowly to become large.According to valve opening instruction L, valve opening velocity of variation test section 35 is obtained variation (being called " valve opening velocity of variation ") the Δ Z of the valve opening of time per unit.
ΔZ←Z/t
Wherein, Z: valve opening
T: elapsed time
(valve steady change rate test section 36)
As mentioned above, flowrate control valve 19 is followed the carrying out of vapor deposition treatment, usually valve opening is controlled to be slowly to become large.Under the state of the evaporation speed that is stabilized in regulation by the 31 detected evaporation speed R of evaporation rate detection section, valve steady change rate test section 36 utilizes from the valve opening instruction L of valve opening control part 33 inputs, and the rising of obtaining the valve opening of time per unit changes (being called " valve steady change rate ") Δ Z1.
ΔZ1←Z1/t1
Wherein, Z1: the valve opening during the evaporation rate stabilization
T1: the elapsed time during the evaporation rate stabilization
(the rapid rise detection of valve opening section 37)
When valve opening velocity of variation test section 35 detected valve opening velocity of variation Δ Z sharply rise than valve steady change rate test section 36 detected valve steady change rate Δ Z1 (Δ Z＞＞Δ Z1), the rapid rise detection of valve opening section 37 is to the rapid rising signals of crucible heater control device 30 delivery valve apertures.For example, although depend on valve opening-evaporation speed characteristic (because deposition material changes), at valve steady change rate Δ Z1=1, when valve opening velocity of variation Δ Z=2 is above, the rapid rising signals of delivery valve aperture.
[crucible heater control device 30]
As shown in figures 1 and 3, the temperature of inputting by temperature sensor 27 detected crucibles 22 to crucible heater control device 30 is the temperature of deposition material 24, and from the rapid rising signals of valve opening and evaporation end signal that valve opening control device 29 is exported, input in addition the evaporation commencing signal from the outside.In addition, utilize crucible heater control device 30, minimum temperature arriving signal and evaporation stop signal to valve opening control device 29 output deposition materials 24, be used for reaching electrical instruction and the energising stop instruction of regulation (fixing) temperature to primary heater 20 outputs, the secondary heater 23 output energising amount instruction E(of this export-oriented electric are equivalent to the electrical signal of energising amount 0～100%), and to outside output evaporation stop signal.In Fig. 3, for simplicity of illustration, about accompanying drawing, repeat to have represented a valve opening control device 29.
As shown in Figure 3, crucible heater control device 30 comprises: the target Heating temperature configuration part 42 of sequential (sequence) section 41, crucible 22, crucible temperature control part 43, minimum temperature arrive test section 44 and degradation temperatures test section 45.
(time prelude 41)
The time prelude 41 have following function.
(a) in order to begin vapor deposition treatment during from outside input evaporation commencing signal, the output electrical instruction is so that primary heater 20 reaches regulation (fix) temperature, and commencing signals are heated in 42 transmissions to target Heating temperature configuration part.
During (b) from valve opening control device 29 input evaporation end signal, or during from degradation temperatures test section 45 input evaporation stop signal, 42 send the heating stop signals to target Heating temperature configuration part, and to primary heater 20 output energising stop instructions.
(target Heating temperature configuration part 42)
Target Heating temperature configuration part 42 has following function.
(a) from the time during prelude 41 input heating commencing signal, will be set as for the target Heating temperature of crucible 22 minimum temperature (for example about valve opening Z=70%, the temperature of the irreducible minimum of the evaporation speed Re degree that can obtain stipulating) of regulation.
(b) from the time during prelude 41 input heating stop signal, the target Heating temperature is set as below the deposition material 24 unvaporized temperature.
(c) reach the minimum temperature of described regulation when above when the temperature by temperature sensor 27 detected crucibles 22, monitor the rapid rising signals of valve opening that whether exists from 29 outputs of valve opening control device.And, when having inputted the rapid rising signals of valve opening, again following setting.
Target Heating temperature=target Heating temperature+X(℃)
Also depending on the Heating temperature of deposition material-evaporation speed characteristic (changing according to deposition material) as the temperature X of increment, for example is (to be roughly 1 ℃) below 3 ℃.In addition, when X was too high, evaporation speed mostly occurred greatly and sharply changes, and the situation of evaporation speed can occur to control with valve as the temperature (ascending temperature) of increment.
(d) again after the target setting Heating temperature, only at specific time T(minute) in, stop to monitor whether there is the rapid rising signals of valve opening, do not carry out the again setting of target temperature.Consider the whole necessary time of the heat throughout deposition material that utilizes temperature X to append, suitably set described specific time T(roughly 1 minute).
(crucible temperature control part 43)
Crucible temperature control part 43 has following function.
(a) obtain the deviation of the target Heating temperature set by target Heating temperature configuration part 42 and the temperature of crucible 22, and export energising amount instruction E to eliminate described deviation to the secondary heater 23 that is used for heating crucible.
(b) when from valve opening control device 29 input evaporation end signal, or when having inputted the evaporation stop signal from degradation temperatures test section 45, stop the energising (energising amount instruction E is 0%) of secondary heater 23.
(minimum temperature arrives test section 44)
When making the temperature of temperature sensor 27 detected crucibles 22, the heating that utilizes secondary heater 23 reaches predetermined minimum temperature, thereby during the temperature-stable of crucible 22, minimum temperature arrives test section 44 to the minimum temperature arriving signal of valve opening control device 29 output deposition materials 24.
(degradation temperatures test section 45)
When the temperature of temperature sensor 27 detected crucibles 22 reaches more than the degradation temperatures of deposition material 24, and when having inputted the rapid rising signals of valve opening from valve opening control device 29, degradation temperatures test section 45 is judged as does not have residual deposition material 24 in the crucible 22.Then, to the time prelude 41, crucible temperature control part 43, valve opening control device 29 and outside output evaporation stop signal.
[controller]
Utilize above-mentioned functions, valve opening control device 29 and crucible heater control device 30 consist of controller, and this controling appliance has following function: utilize thickness watch-dog 26 detected thickness to detect evaporation particle to the evaporation speed of glass substrate 12; The aperture of adjust flux control valve 19 is so that detected evaporation speed becomes the evaporation speed of regulation; Temperature according to temperature sensor 27 detected crucibles 22 is the Heating temperature of deposition material 24, regulates the energising amount of secondary heater 23, and the Heating temperature of control crucible 22 is the Heating temperature of deposition material 24; Detect the valve opening velocity of variation Δ Z of flowrate control valve 19, when described valve opening velocity of variation Δ Z becomes valve steady change rate Δ Z1 under the state of the evaporation speed that is stabilized in regulation when above, with X ℃ of the goal-setting temperature rising of crucible 22 and increase the evaporation amount of deposition material 24.
[action during evaporation]
With reference to Fig. 4 and Fig. 5 the action of said structure when the evaporation is described.
Step-1
To crucible heater control device 30 input evaporation commencing signal the time, to primary heater 20 energisings, 19 are warming up to specified temperature to the downstream side to the major general from flowrate control valve.
Step-2
Crucible heater control device 30 is to secondary heater 23 energising and crucible 22 is warmed up to the minimum temperature of afore mentioned rules.
Step-3
Crucible heater control device 30 confirms whether the temperature of crucible 22 is stabilized in minimum temperature.
Step-4
When the temperature-stable of crucible 22, crucible heater control device 30 forms the minimum temperature arriving signals and it is outputed to valve opening control device 29.Like this, valve opening control device 29 is opened to regulation aperture (for example 70%) with flowrate control valve 19, and flowrate control valve 19 is when being opened to the aperture of described regulation, gate 18 standard-sized sheets.
Step-5,6
Valve opening control device 29 carries out the valve opening adjustment, so that current evaporation speed R roughly becomes regulation evaporation speed Re.
Like this, shown in the elapsed time " A-B " of Fig. 5, the evaporation rate stabilization, and the aperture of flowrate control valve 19 slowly becomes large.
Step-7
Valve steady change rate Δ Z1 when the current evaporation speed R of valve opening control device 29 assurances roughly becomes regulation evaporation speed Re and evaporation rate stabilization.
Step-8
Valve opening control device 29 carries out the valve opening adjustment, so that current evaporation speed R roughly becomes regulation evaporation speed Re.
Step-9
Valve opening control device 29 confirms whether current evaporation thickness equals required evaporation thickness, output evaporation end signal when confirming that both are equal.Thus, flowrate control valve 19 full cut-offs stop in addition to primary heater 20 and secondary heater 23 power supplies.
Step-10
Current evaporation thickness does not reach in the situation of required evaporation thickness in step-9, and valve opening control device 29 is obtained valve opening velocity of variation Δ Z.
Shown in the elapsed time " B-C " of Fig. 5, when the deposition material 24 in the crucible 22 reduced, the steam output of deposition material 24 reduced, and it is large that the aperture of flowrate control valve 19 sharply becomes therewith accordingly.
Step-11
Valve opening control device 29 confirms whether valve opening velocity of variation Δ Z sharply increases than the valve steady change rate Δ Z1 that obtains.Particularly, when the aperture of flowrate control valve 19 began sharply to rise shown in the elapsed time " B-C " of Fig. 5, be valve opening velocity of variation Δ Z when sharply increasing than the valve steady change rate Δ Z1 that obtains, valve opening control device 29 is to the rapid rising signals of crucible heater control device 30 delivery valve apertures.Otherwise, turn back to step-8.
Step-12
Crucible heater control device 30 confirms whether the temperature of crucible 22 reaches more than the degradation temperatures of deposition material 24.And, crucible heater control device 30 is inputted the rapid rising signals of valve opening from valve opening control device 29, and the temperature of crucible 22 reaches the degradation temperatures of deposition material 24 when above, further open flowrate control valve 19 if judge, the then residual disappearance of deposition material 24, the evaporation speed Re that can not obtain stipulating, thus the evaporation stop signal sent to valve opening control device 29.Like this, flowrate control valve 19 full cut-offs stop to primary heater 20 and secondary heater 23 power supplies evaporation being stopped in addition.The moment of Fig. 5 " F " has represented the situation of this moment.
Step-13
In the temperature of crucible 22 during less than the degradation temperatures of deposition material 24, such as the moment " C " of Fig. 5 with constantly shown in " D ", crucible heater control device 30 makes X ℃ of the Heating temperature rising (for example 1 ℃) of crucible 22, and keeps this state T minute (for example 1 minute).At this moment, valve opening control device 29 carries out the valve opening adjustment, so that current evaporation speed R roughly becomes regulation evaporation speed Re.Then turn back to step-10.
Shown in the moment " E " of Fig. 5, by carrying out above-mentioned steps-11～step-13, observation is from the variable quantity of the moment " D " beginning valve opening after T minute, if there is not rapid variation, be that valve opening velocity of variation Δ Z equates with the valve steady change rate Δ Z1 that obtains in the interval in elapsed time " A-B " or less, the temperature and the original state that then do not change crucible 22 are proceeded evaporation.
As mentioned above, if begin evaporation under the temperature of the necessary minimum of evaporation speed Re of stipulating, it is large that valve opening velocity of variation Δ Z sharply becomes, and namely evaporation speed is about to reduction, then make successively the rising of target Heating temperature as X ℃ of specified temperature, and keep evaporation speed.And, during the elapsed time of Fig. 5 " E-F ", repeat the supervision of aperture of flowrate control valve 19 and the temperature that judges whether need to improve crucible 22.
According to above-mentioned the present embodiment, under the temperature of crucible 22 of the necessary minimum of evaporation speed Re of regulation, carry out evaporation, when valve opening velocity of variation Δ Z surpasses valve steady change rate Δ Z1, be that crucible 22 interior deposition materials 24 tail off, tail off from the steam output of the deposition material 24 of crucible 22 (formation volume of the evaporation particle that namely should supply with from crucible 22), thereby evaporation rate reduction, thereby when making the aperture of flowrate control valve 19 sharply become large for the evaporation speed of keeping regulation, X ℃ of the target temperature rising of crucible 22 increases from the steam output of the deposition material 24 of crucible 22.Like this, can keep the evaporation speed Re of regulation, and can avoid and the regulation of flowrate control valve 19 can not be arrived the evaporation speed Re that realizes described regulation.In addition, rise successively temperature X ℃ that stipulates by making target temperature, can not only prevent the thermal degradation when of deposition material 24, and deposition material 24 can be used at last, therefore can make the residual Schwellenwert that drops to of deposition material 24.In addition, if be the steam output that high temperature increases deposition material 24 with the Temperature Setting of crucible 22 at first, then thermal degradation whens occur and can not obtain the needed characteristic of deposition material 24 in deposition material 24.
In addition, according to the present embodiment, behind X ℃ of the temperature ascending temperature by making crucible 22 described temperature is kept certain hour (T minute), the rise variation of the steam output that can bring deposition material 24 of the temperature hysteresis of deposition material 24.Like this, behind certain hour (T minute), increase with the steam output of crucible 22 ascending temperature X ℃ corresponding deposition material 24, therefore, the valve opening velocity of variation Δ Z of flowrate control valve 19 diminishes, or flowrate control valve 19 changes to closing direction.When the temperature of crucible 22 rises the increase part of steam output that bring, deposition material 24 when not enough, valve opening velocity of variation Δ Z surpasses valve steady change rate Δ Z1, and the temperature of crucible 22 further rises X ℃.Like this, the temperature of crucible 22 is by temperature X ℃ of interim the rising.
In addition, according to the present embodiment, at first under original state, when being risen to the valve opening Z=70% left and right sides, the temperature of crucible 22 obtains the temperature minimum temperature of the minimum of regulation evaporation speed Re degree, under the described state, flowrate control valve 19 is opened to described aperture 70%, and begins the aperture adjustment of control valve 19 for the flow that obtains regulation evaporation speed Re.That is, begin evaporation by the minimum temperature of the necessary crucible 22 of evaporation speed from regulation, deposition material 24 effectively can be used at last.
In the present embodiment, consisted of the upwards evaporation type (upwards deposition) of lower surface (by the evaporation face) the evaporation evaporation particle of the glass substrate 12 that workpiece keeper 15 is kept from the below, also can adopt selective evaporation direction not towards structure, i.e. side deposition or to the structure of deposit.

Claims (5)

1. an evaporation coating device is attached to by on the evaporation member deposition material of evaporation in vacuum tank, and described evaporation coating device is characterised in that and comprises:
Crucible heats described deposition material and makes its evaporation; And
Stream, described in will be from the deposition material of described crucible evaporation to described vacuum tank are guided by the evaporation member,
Be provided with the temperature sensor for detection of the temperature of described crucible,
Be provided with the valve that possesses the regulation function at described stream,
In described vacuum tank, be provided with for detection of described by the thickness watch-dog of the thickness of evaporation member,
And be provided with controller, utilize the detected thickness of described thickness watch-dog to detect described by the evaporation speed of evaporation member, regulate the aperture of described valve so that described evaporation speed becomes the evaporation speed of regulation, and detect the velocity of variation of the aperture of described valve, when described velocity of variation surpasses steady change rate under the state of the evaporation speed be stabilized in regulation, the design temperature of described crucible is risen with increment, thereby increase the evaporation amount of described deposition material.
2. evaporation coating device according to claim 1, it is characterized in that, when controller is processed the design temperature that makes crucible and is risen with increment, design temperature after will rising in the limit keeps the aperture of certain hour limit variable valve, through behind the described certain hour, when the velocity of variation of the aperture of described valve surpasses the steady change rate, the design temperature of described crucible is further risen with described increment.
3. evaporation coating device according to claim 1 and 2, it is characterized in that, controller is controlled, under the state that valve cuts out, make the design temperature of crucible rise to the minimum temperature of the evaporation speed that described valve obtains stipulating under the aperture of regulation, when the detected temperatures of crucible rises to described minimum temperature, described valve is opened to the setting aperture, the evaporation speed of regulation to obtain stipulating of beginning valve.
4. evaporation coating device according to claim 1 and 2 is characterized in that, controller is controlled, and when the detected temperatures of crucible rises to the degradation temperatures of deposition material, when valve is further opened, finishes to utilize crucible evaporation deposition material.
5. evaporation coating device according to claim 3 is characterized in that, controller is controlled, and when the detected temperatures of crucible rises to the degradation temperatures of deposition material, when valve is further opened, finishes to utilize crucible evaporation deposition material.
CN201310095050.8A 2012-03-29 2013-03-22 Evaporation coating device Active CN103361608B (en)

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CN104775095A (en) * 2014-01-15 2015-07-15 三星显示有限公司 Evaporating apparatus, method for measuring evaporation speed using the same
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CN110199050A (en) * 2017-01-31 2019-09-03 应用材料公司 Material deposition arrangement, vacuum deposition system and its method
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CN103361608B (en) 2016-09-21
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TWI573885B (en) 2017-03-11
JP2013204101A (en) 2013-10-07

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