CN100334251C - Vacuum film plating machine having orientation and self-control function - Google Patents
Vacuum film plating machine having orientation and self-control function Download PDFInfo
- Publication number
- CN100334251C CN100334251C CNB2004100111053A CN200410011105A CN100334251C CN 100334251 C CN100334251 C CN 100334251C CN B2004100111053 A CNB2004100111053 A CN B2004100111053A CN 200410011105 A CN200410011105 A CN 200410011105A CN 100334251 C CN100334251 C CN 100334251C
- Authority
- CN
- China
- Prior art keywords
- substrate
- vacuum
- baffle plate
- fixed
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Physical Vapour Deposition (AREA)
Abstract
The present invention relates to a vacuum coating machine with an orienting and self-control function, which belongs to an improved vacuum coater. The vacuum coating machine is characterized in that the vacuum coating machine is composed of a vacuum chamber 15 on a platform 34, a vacuum pump 33, a supporting frame 2, a base plate bracket 12 and tungsten filaments 35; an additionally installed orienting device is composed of an evaporator 1, a glass funnel 4 and a funnel bracket 3; an additionally installed film thickness controller is composed of a micro balance 13, a pressure transducer 37 and a controlling circuit; an additionally installed deposition rate controller is composed of an upper pole plate 16, a lower pole plate 23 and a direct current high-voltage power supply; a heater 17, a base plate driving device, an evaporator source and a base plate space controller are also additionally installed. The vacuum coating machine can avoid the waste caused by the dispersion of steam molecules and prevent large-granule liquid melt from influencing film quality; a film and a base plate are combined compactly and the film is uniform; the filming thickness can be controlled; the deposition rate is controlled and increased. The vacuum coating machine is improved on the basis of original equipment, and thus, the present invention has the advantages of simple equipment and small investment.
Description
Technical field
The present invention relates to vacuum coater, especially a kind of modified version vacuum plating unit with directed control and self-acting control function.
Background technology
Among the 15-20 in the past, the variation that attracts people's attention has appearred in the optical thin film plating equipment.Existing vacuum evaporation coating membrane technique generally is 10
-2Pa～10
-3Heating of metal, metallic compound or other Coating Materials in the vacuum of Pa make it evaporate in the short period of time at the utmost point, thereby purified atomic deposition is formed coatings to substrate surfaces, belong to physical vapor deposition (PVD).Inclusion-free enters owing to be coated with in the process almost, can make quality of coating very excellent.The spacing of the vacuum tightness of vacuum film coating chamber, the vaporator rate of Coating Materials, substrate and evaporation source, and substrate surface state and temperature etc. all are the factors that influences the coatings quality.
Modal existing vacuum evaporating coating machine structure such as Fig. 1, its structure has: the vacuum pump 33 that is placed on vacuum (-tight) housing 15 on the platform 34, connects by the perforate on the platform 34, place support 2 in the vacuum (-tight) housing 15, place support 2 upper ends round-meshed substrate carrier 12, place the tungsten filament 35 of substrate 14 belows in the vacuum (-tight) housing 15; Vacuum pump 33 is by space---the vacuum chamber of the perforate on the platform 34 and platform 34 and vacuum (-tight) housing 15 formation sealings.
During plated film, substrate 14 is positioned on the substrate carrier 12, and vacuum chamber is vacuumized by vacuum pump 33, and the tungsten filament 35 heating Coating Materials by energising make it evaporate in the short period of time at the utmost point again, and the atomic deposition of purified Coating Materials to substrate surface, is formed coatings.
The advantage that existing vacuum plating unit has that equipment is simple, preparation technology is easy, most material all can evaporation, but also come with some shortcomings:
1, during plated film, the volatilization of Coating Materials big area, waste will be very serious, and make every plating once all must clean bell jar.
2, coating and substrate surface bonding force too a little less than.
3, deposition speed is slower.
4, thicknesses of layers is very uneven, and thickness is difficult to control.
5, it is more serious influenced by macroscopic particles.Follow the evaporation of fusion Coating Materials drop, it is a small amount of that tungsten and other impurity molecule of the Coating Materials of fusing and evaporation simultaneously can not be deposited on the substrate surface yet fully, thereby increase roughness of film, reduce adhesive force, make density of film inhomogeneous, have tangible decomposition face in the rete between macroscopic particles and the continuous film.
Summary of the invention
The technical problem to be solved in the present invention is, overcome disadvantages of background technology, on existing vacuum evaporating coating machine basis, improve, make that the Coating Materials evaporation is more concentrated, coating and substrate surface bonding force strengthen greatly, accelerate deposition speed, thicknesses of layers more evenly and thickness can control, the density of film that is plated is more even, and purity improves, thereby can control and improve the quality of plated film.
The structure that the vacuum plating unit of orientation and self-acting control function arranged of the present invention has kept all parts of background technology, increases to have designed orienting device and 3 control device: film thickness monitoring device, deposition rate control device, substrate transmission mechanism.
Said orienting device is made up of vaporizer 1, glass funnel 4 and funnel carriage 3.Vaporizer 1 is the ellipsoid shelly, middle perforate, and tapping has depression bayonet socket 22; Glass funnel 4 is supported by funnel carriage 3, and its lower end is placed in vaporizer 1 depression bayonet socket 22 places, and its upper end is near the following and substrate 14 relative (as Fig. 2) of baffle plate pedestal 5.
Said film thickness monitoring device is made up of film thickness detecting device and baffle plate automatic control device.Film thickness detecting device is installed on the substrate carrier 12, installs a highly sensitive pressure transmitter 37 additional and pilot circuit (as Fig. 5) forms by microbalance 13.The baffle plate automatic control device is (as Fig. 3,4) comprise that there is the baffle plate pedestal 5 of plating film hole 29 at the center, be equipped with deck a 26 and deck b 24 on it, the shifting board 6 of band handler 28 can cover the plating film hole 29 on the baffle plate pedestal 5, axially have chute 25 along handler 28, be fixed with rotation axis 27 on the baffle plate pedestal 5, chute 25 is enclosed within on the rotation axis 27, spring B 7 one ends are fixed on the baffle plate pedestal 5, the other end tie point 36 is fixed on the place of handler 28 near shifting board 6 and chute 25, spring A 8 one ends are fixed on the rotation axis 27, the other end is fixed on the termination of handler 28 away from shifting board 6, electro-magnet 9 is installed in the termination of handler 28, and it is relative at the permanent magnet 10 that when baffle plate is opened, is in sustained height and be fixed in outside the bell jar with it, the coil 11 of electro-magnet 9 links to each other with pressure transmitter 37 in the microbalance 13 by pilot circuit, and pilot circuit is mainly by coil 11, microbalance 13, pressure transmitter 37, relay1 switch 38, telegraph key 42, conductive contact blade 39,40,41 and composition such as power supply.
Said deposition rate control device is by the top crown 16 and the bottom crown 23 that are fixed on the support 2, and external DC high-voltage power supply constitutes.Top crown 16 is placed horizontally on the substrate carrier 12, and bottom crown 23 is placed horizontally under the vaporizer 1.
Said substrate transmission mechanism by be installed on the electric motor 19 on the substrate carrier 12, slipping ring 30, fixed ring 32, transmission belt 18 and the ball 31 that fills up under substrate 14 formed, outside the fixed ring 32 concentric circular holes that are fixed on the substrate carrier 12, slipping ring 30 is by ball 31 concentric being positioned on the fixed ring 32, and can rotate (as Fig. 6, Fig. 7) under electric motor 19 drives by transmission belt 18.
In order further to improve the quality of plated film, the present invention can also be installed substrate temperature control unit and evaporation source and substrate pitch control unit additional.
Said substrate temperature control unit is made of the well heater 17 that is positioned at 12 of top crown 16 and substrate carrier.
Said evaporation source and substrate pitch control unit are formed with the nut 21 of heightening following and that twist on support 2 by placing respectively above the substrate carrier 12, and screw thread 20 corresponding on the support 2 only is engraved between well heater 17 place height and the baffle plate pedestal 5 place height.
The vacuum plating unit that orientation and self-acting control function are arranged of the present invention makes the film material molecular orientation that evaporates be diffused into substrate 14 surfaces, the waste of having avoided the steam molecule scattering to cause owing to installed orienting device additional; Can prevent that again oarse-grained film material melts is splashed on the substrate 14 when gasification, influence the quality of film; Simultaneously, vaporizer provides a kind of semiclosed environment, makes that the temperature of the gas molecule that each several part evaporates is approximate identical, thereby makes rete combine more evenly with substrate, and is finer and close.The present invention can and control the thickness of plated film by the film thickness monitoring measurement device; By the deposition rate control device, the degree of ionization of metallic membrane material steam is increased greatly, and make the film material steam molecule directivity that evaporates higher to a certain extent, and acceleration deposition process, by controlling and regulate the voltage between positive and negative polarities, realize that control and adjusting film material are deposited to the speed speed on the substrate; By the collaborative work of substrate transmission mechanism, substrate temperature control unit, orienting device, evaporation source and substrate pitch control unit and deposition rate control device etc., thereby guaranteed membrane uniformity, it is tightr that rete and substrate attachment are got.Six devices of the present invention's design have more than tool single function separately, but benifit is arranged mutually, the electric field that produces as positive and negative electrode in the deposition rate control device makes that also the film material steam directivity that evaporates is better, and orienting device also makes the homogeneity of rete and compactness better.The present invention simultaneously just improves on the basis of existing equipment and realizes, so equipment is simple, invests less.
Description of drawings
Fig. 1 is the vacuum plating unit structural representation of background technology.
Fig. 2 is the vacuum plating unit one-piece construction synoptic diagram of orientable control of the present invention.
Fig. 3 is a baffle part opened condition structural representation in the film thickness monitoring device of the present invention.
Fig. 4 is a baffle part closing condition structural representation in the film thickness monitoring device of the present invention.
Fig. 5 is the pilot circuit figure of film thickness detecting device of the present invention.
Fig. 6 is a substrate transmission mechanism vertical view of the present invention.
Fig. 7 is the substrate transmission mechanism longitudinal section of Fig. 6.
Embodiment
Further specify structure of the present invention and working process below in conjunction with accompanying drawing.
See Fig. 2, the structure division identical with background technology has: the vacuum pump 33 that is placed on vacuum (-tight) housing 15 on the platform 34, connects by the perforate on the platform 34, place support 2 in the vacuum (-tight) housing 15, place support 2 upper ends round-meshed substrate carrier 12, place in the vacuum (-tight) housing 15 and the tungsten filament 35 below substrate carrier 12.14 is substrate among Fig. 1, Fig. 2.
The orienting device that increases design is made of the vaporizer 1 of band depression bayonet socket 22, glass funnel 4, the tungsten filament 35 that is placed on the funnel carriage 3.
The film thickness monitoring device that increases design by on the substrate carrier 12, the quartz (controlled) oscillator amount of the declining balance 13 and the baffle plate automatic control device that have installed a highly sensitive pressure transmitter 37 and pilot circuit additional constitute.Baffle plate automatic control device wherein is made up of shifting board 6, spring A8, spring B 7 and electro-magnet 9, the permanent magnet 10 etc. of baffle plate pedestal 5, band handler 28.
The deposition rate control device that increases design is by top crown 16, bottom crown 23, and external DC high-voltage power supply constitutes.
The substrate transmission mechanism that increases design is made of electric motor 19, the slipping ring 30, fixed ring 32, transmission belt 18 and the ball 31 that fill up under substrate 14.Slipping ring 30, fixed ring 32 and ball 31 do not draw among Fig. 2.
The substrate temperature control unit that increases design is made of auxiliary heater 17.
The evaporation source that increases design and substrate pitch control unit are by heightening nut 21 and revolving the corresponding screw thread 20 with heightening nut 21 that is engraved on the pillar 2 and constitute.
Usually support 2 has three root posts, can have three so heighten nut 21.
See Fig. 2, orienting device is made up of vaporizer 1, glass funnel 4 and funnel carriage 3.Vaporizer 1 is the ellipsoid shelly, and tool depression bayonet socket 22, middle perforate; The glass funnel 4 that is placed in vaporizer 1 depression bayonet socket 22 places is dismountable, and is supported by funnel carriage 3, to make things convenient for the filling of Coating Materials; Coating Materials melts on the tungsten filament in vaporizer.During heating, the film material steam of gasification diffuses out via middle circular hole, arrives substrate 14 surfaces along glass funnel 4, and deposit is a film.
Like this, because vaporizer 1 provides a kind of semiclosed environment, film material molecule is diffused into substrate 14 surfaces, the waste of having avoided the steam molecule scattering to cause along glass funnel 4 orientations; Can prevent that again oarse-grained film material melts is splashed on the substrate 14 when gasification, influence the quality of film.Simultaneously,, make that also the temperature of the gas molecule that each several part evaporates is approximate identical, thereby make rete combine more evenly with substrate owing to the semiclosed environment in the vaporizer 1, finer and close.
The film thickness monitoring device is made up of film thickness detecting device and baffle plate automatic control device.
Film thickness detecting device is installed on the substrate carrier 12, installs a highly sensitive pressure transmitter 37 additional and pilot circuit forms by the quartz (controlled) oscillator amount of declining balance 13.
The baffle plate automatic control device is seen Fig. 3 and Fig. 4, is in sustained height by electro-magnet 9, with it and is fixed in bell jar outer permanent magnet 10 and baffle part to form.Wherein electro-magnet 9 is installed in the end of shifting board handler 28, and when baffle plate was opened, its coil 11 faced the outer permanent magnet 10 of bell jar, and the axial of two magnet is similar in a straight line at this moment; Simultaneously, this coil 11 links to each other with highly sensitive pressure transmitter 37 in the microbalance 13 by pilot circuit.Baffle part comprises baffle plate pedestal 5, shifting board 6, contains compositions such as the handler 28 of chute 25, spring A 8 and spring B 7.Spring A 8 one ends connect handler 28, and the other end is fastened on rotation axis 27 places on the baffle plate pedestal 5; Spring B 7 two ends connect handler 28 and baffle plate pedestal 5 respectively; The coefficient of elasticity k of spring B 7
BCoefficient of elasticity k greater than spring A 8
AWherein baffle plate pedestal 5 installs deck a 26 and deck b 24 additional in Fig. 3 position, and offers plating film hole 29 in the centre.
When the beginning plated film, earlier shifting board handler 28 is placed deck a 26 places (as Fig. 3-opened condition).At this moment, with telegraph key 42 closures, making current in the magnet coil 11 makes the magnetic field of its generation identical with the field direction that the outer permanent magnet 10 of bell jar produces, and promptly they will attract each other, and spring A 8 is in slight stretched state; Though spring B 7 is in the high compression state, but because its tie point 36 that is positioned on the handler 28 is very near with rotation axis 27 distances of shifting board 6, so it approaches 0 to the swinging moment of shifting board 6, and offset by the swinging moment of 26 pairs of handlers 28 of deck a fully, so it is motionless that shifting board 6 is buckled in deck a 26 places, baffle plate is in stable opened condition.When reaching the experiment required film thickness, promptly measure, and touch the highly sensitive pressure transmitter 37 of top loading by the quartz (controlled) oscillator amount of declining balance 13, with relay1 switch 38 from conductive contact film 39,40, be allocated to contact 40,41 and contact, thereby make reversal of current in the magnet coil 11.Since this moment electro-magnet 9 with the mutual repulsive interaction of permanent magnet 10, make handler 28 be pushed away deck a 26, the swinging moment of 7 pairs of shifting boards 6 of spring B increases simultaneously, and because the coefficient of elasticity of spring B is bigger, so 28 moments of handler are gone to deck b 24 places, shifting board 6 has blocked the plating film hole 29 on the baffle plate pedestal 5, and baffle plate is in closing condition, and plated film stops (as Fig. 4-closing condition).
After plated film is finished, can carry out more close control to thickness with the optical thickness monitor instrument.
See Fig. 5, pilot circuit mainly is made up of coil 11, microbalance 13, pressure transmitter 37, relay1 switch 38, telegraph key 42, conductive contact blade 39,40,41 and power supply etc.
Embodiment 4 deposition rate control device of the present invention
The deposition rate control device is by top crown 16, bottom crown 23, and external DC high-voltage power supply forms.Last bottom crown lay respectively on the well heater 17 and vaporizer 1 under.If evaporation is metallic membrane, because common metal ion band positive electricity, so top crown 16 adds negative bias, bottom crown 23 adds positive bias, and polarity indicates as Fig. 2.On original experimental installation, by adding a high-tension transformer, and after becoming high direct voltage, the silicon rectifier rectification introduces vacuum chamber, be added on the bottom crown, like this, the degree of ionization of metallic membrane material steam increases greatly, and makes the film material steam molecule directivity that evaporates higher to a certain extent, and quickens deposition process.By the voltage between control and adjusting positive and negative polarities, promptly may command and adjusting film material are deposited to the speed speed on the substrate.
See Fig. 6 and Fig. 7, the substrate transmission mechanism mainly by be installed on the small size motor 19 on the substrate carrier 12, slipping ring 30, fixed ring 32, transmission belt 18 and the ball 31 that fills up under substrate 14 formed, vertical view is seen Fig. 6, the vertical section of centre portions such as Fig. 7.Slipping ring 30 is that steel is circular, can rotate by ball 31 fixed ring 32 on substrate carrier 12; And an end of transmission belt 18 is enclosed within on the slipping ring 30, and the other end is driven and uniform rotation by small size motor 19, thereby makes the rete of substrate 14 various piece when plated film more even.
Embodiment 6 substrate temperature control units of the present invention
The substrate temperature control unit is made of the auxiliary resistance well heater 17 that is positioned at 14 of top crown 16 and substrates.By the size of current in the regulator resistor, temperature that can control basal plate 14 surfaces, that rete and substrate attachment are got is tightr thereby can be adjusted to proper temperature.
See Fig. 6, evaporation source and substrate pitch control unit can be sandwiched in substrate carrier about in the of 12 by three pairs, and twist flats on three pillars 2 and heighten nut 21 and form, wherein corresponding screw thread 20 only is engraved between well heater 17 place height and the baffle plate pedestal 5 on three pillars 2.Tighten this and three exchange high nut 21, can fixing base carriage 12; And three exchange high nut 21 by tuning simultaneously this up and down, height that can control basal plate carriage 12, thereby the spacing of control evaporation source and substrate 14.Wherein heightening nut 21 and make flats than broad, is in order to keep whole baffle plate pedestal 5 to be horizontal as far as possible.
Claims (3)
1, a kind of vacuum plating unit that orientation and self-acting control function are arranged, its structure has: the vacuum pump (33) that is placed on vacuum (-tight) housing (15) on the platform (34), connects by the perforate on the platform (34), place support (2) in the vacuum (-tight) housing (15), place support (2) upper end round-meshed substrate carrier (12), place the tungsten filament (35) below interior the substrate of vacuum (-tight) housing (15) (14); Vacuum pump (33) is by space---the vacuum chamber of the perforate on the platform (34) and platform (34) and the sealing of vacuum (-tight) housing (15) formation; It is characterized in that structure also has orienting device, film thickness monitoring device, deposition rate control device and substrate transmission mechanism;
Said orienting device is made up of vaporizer (1), glass funnel (4) and funnel carriage (3); Vaporizer (1) is the ellipsoid shelly, middle perforate, and tapping has depression bayonet socket (22); Glass funnel (4) is supported by funnel carriage (3), and its lower end is placed in vaporizer 1 depression bayonet socket (22) and locates, and its upper end is relative near the following and substrate (14) of baffle plate pedestal (5);
Said film thickness monitoring device is made up of film thickness detecting device and baffle plate automatic control device; Film thickness detecting device is installed on the substrate carrier (12), installs pressure transmitter (37) additional and pilot circuit forms by microbalance (13); The baffle plate automatic control device comprises that there is the baffle plate pedestal (5) of plating film hole (29) at the center, be equipped with deck a (26) and deck b (24) on it, the shifting board (6) of band handler (28) can cover the plating film hole (29) on the baffle plate pedestal (5), axially have chute (25) along handler (28), be fixed with rotation axis (27) on the baffle plate pedestal (5), chute (25) is enclosed within on the rotation axis (27), spring B (7) one ends are fixed on the baffle plate pedestal (5), the other end tie point (36) is fixed on the place of handler (28) near shifting board (6) and chute (25), spring A (8) one ends are fixed on the rotation axis (27), the other end is fixed on the termination of handler (28) away from shifting board (6), electro-magnet (9) is installed in the termination of handler (28), and relative at the permanent magnet (10) that is in sustained height with it and be fixed in outside the bell jar when baffle plate is opened, the coil (11) of electro-magnet (9) links to each other with pressure transmitter (37) in the microbalance (13) by pilot circuit; Pilot circuit mainly is made up of coil (11), microbalance (13), pressure transmitter (37), relay1 switch (38), telegraph key (42), conductive contact blade (39,40,41) and power supply;
Said deposition rate control device is by the top crown (16) and the bottom crown (23) that are fixed on the support (2), and external DC high-voltage power supply constitutes; Top crown (16) is placed horizontally on the substrate carrier (12), and bottom crown (23) is placed horizontally under the vaporizer (1);
Said substrate transmission mechanism by be installed on the electric motor (19) on the substrate carrier (12), slipping ring (30), fixed ring (32), transmission belt (18) and the ball (31) that fills up under substrate (14) formed, outside the concentric circular hole that is fixed on the substrate carrier (12) of fixed ring (32), slipping ring (30) is positioned on the fixed ring (32) by ball (31) is concentric, and can rotate under electric motor (19) drives by transmission belt (18).
2, according to the described vacuum plating unit that orientation and self-acting control function are arranged of claim 1, it is characterized in that structure also has the substrate temperature control unit; Said substrate temperature control unit is made of the well heater (17) that is positioned between top crown (16) and substrate carrier (12).
3, according to claim 1 or the 2 described vacuum plating units that orientation and self-acting control function are arranged, it is characterized in that structure also has evaporation source and substrate pitch control unit; Said evaporation source and substrate pitch control unit, form with the nut (21) of heightening following and that twist on support (2) by placing respectively above the substrate carrier (12), support (2) is gone up corresponding screw thread (20) and only is engraved between well heater (17) place height and baffle plate pedestal (5) the place height.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100111053A CN100334251C (en) | 2004-09-22 | 2004-09-22 | Vacuum film plating machine having orientation and self-control function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100111053A CN100334251C (en) | 2004-09-22 | 2004-09-22 | Vacuum film plating machine having orientation and self-control function |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1624191A CN1624191A (en) | 2005-06-08 |
| CN100334251C true CN100334251C (en) | 2007-08-29 |
Family
ID=34763179
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100111053A Expired - Fee Related CN100334251C (en) | 2004-09-22 | 2004-09-22 | Vacuum film plating machine having orientation and self-control function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100334251C (en) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5140678B2 (en) * | 2007-09-21 | 2013-02-06 | 株式会社アルバック | Thin film forming equipment, film thickness measuring method, film thickness sensor |
| CN101620279B (en) * | 2008-07-01 | 2011-08-24 | 鸿富锦精密工业（深圳）有限公司 | Optical coating device |
| CN101665913B (en) * | 2009-09-30 | 2012-05-23 | 东莞宏威数码机械有限公司 | Processing device used for vacuum coating |
| CN101876056B (en) * | 2010-03-23 | 2011-12-14 | 东莞宏威数码机械有限公司 | Evaporating and coating equipment |
| CN101876058B (en) * | 2010-03-23 | 2012-07-11 | 东莞宏威数码机械有限公司 | Vacuum evaporation device |
| CN101928923B (en) * | 2010-05-11 | 2012-06-27 | 赫得纳米科技(昆山)有限公司 | Vacuum sputtering coating equipment with vacuum pump protecting structure |
| CN103160788B (en) * | 2011-12-16 | 2017-06-30 | 上海大学 | Vacuum vaporation system |
| CN104294218B (en) * | 2014-10-23 | 2016-06-08 | 中国科学院上海光学精密机械研究所 | The preparation facilities of gold tin thin film and method |
| CN105177520B (en) | 2015-08-05 | 2016-06-08 | 京东方科技集团股份有限公司 | Thickness actuator and manufacture method, control method, evaporated device |
| CN105349948A (en) * | 2015-12-04 | 2016-02-24 | 贵州大学 | Novel thermal evaporation coating device and using method thereof |
| JP6617198B2 (en) * | 2016-05-13 | 2019-12-11 | 株式会社アルバック | Organic thin film manufacturing apparatus, organic thin film manufacturing method |
| CN107640909B (en) * | 2017-08-25 | 2018-10-30 | 北方夜视技术股份有限公司 | Steaming structure, method for preparing uniform film inside thin mouth, large scale glass bulb |
| CN108330462A (en) * | 2018-03-05 | 2018-07-27 | 京东方科技集团股份有限公司 | A kind of evaporation coating device and evaporation coating method |
| CN111041443A (en) * | 2018-10-11 | 2020-04-21 | 君泰创新（北京）科技有限公司 | Film coating device and film coating method |
| CN111519143B (en) * | 2020-04-26 | 2021-09-28 | 昆明理工大学 | Method and device for vacuum evaporation galvanizing on surface of high-temperature-resistant particles |
| CN117448750B (en) * | 2023-10-25 | 2024-04-19 | 南京萃智激光应用技术研究院有限公司 | Evaporation method and equipment for preparing super-hydrophobic glass based on laser transfer technology |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2743366Y (en) * | 2004-09-22 | 2005-11-30 | 吉林大学 | Vacuum film plating machine having orientation and self control function |
-
2004
- 2004-09-22 CN CNB2004100111053A patent/CN100334251C/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2743366Y (en) * | 2004-09-22 | 2005-11-30 | 吉林大学 | Vacuum film plating machine having orientation and self control function |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1624191A (en) | 2005-06-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN100334251C (en) | Vacuum film plating machine having orientation and self-control function | |
| CN105543792B (en) | Magnetic control sputtering device and magnetically controlled sputter method | |
| CN101397654B (en) | Hot filament and heat evaporation vapor deposition membrane equipment | |
| CN109136856B (en) | Film thickness monitoring device and film forming equipment | |
| CN105483652B (en) | Chemical vapor deposition unit and its application method | |
| CN106222615A (en) | High flux combined material chip and preparation method thereof, preparation facilities | |
| KR101125008B1 (en) | Downward type deposition source and deposition apparatus having the same | |
| CN208104523U (en) | Microscope carrier mechanism and evaporated device | |
| CN2743366Y (en) | Vacuum film plating machine having orientation and self control function | |
| CN201713566U (en) | Evaporation coating device | |
| CN101109071A (en) | Substrate cryogenic cooling device for manufacturing amorphous and nano microcrystalline film | |
| KR101087685B1 (en) | Vacuum evaporation device | |
| CN208844186U (en) | A kind of product clamping device of vacuum coating equipment | |
| CN106191788B (en) | Organic evaporating source for electric resistor heating type evaporation coating machine | |
| KR101020773B1 (en) | Arc ion plating apparatus | |
| CN216274344U (en) | Evaporation device for vacuum coating machine | |
| JP2018529014A (en) | Measuring assembly and method for measuring deposition rate | |
| CN102290338B (en) | Room-temperature large-area deposition production process for transparent conductive film | |
| CN206502861U (en) | A kind of yarn plating winding mechanism | |
| CN2233931Y (en) | Rotary magnetic cavity columnar multi-arc source-plain magnetic controlled sputtering source ion coater | |
| CN203890436U (en) | One-array hot wire device for preparing diamond membrane by vertical layout | |
| CN209443081U (en) | A kind of vacuum coating substrate fixed frame | |
| CN114517285B (en) | High-temperature linear evaporation source device | |
| CN217973379U (en) | Ion sputtering instrument and sample platform structure thereof | |
| CN214327861U (en) | Evaporation plating equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |