TWI677583B - Mn-Zn-W-O系濺鍍靶材及其製造方法 - Google Patents

Mn-Zn-W-O系濺鍍靶材及其製造方法 Download PDF

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TWI677583B
TWI677583B TW105102413A TW105102413A TWI677583B TW I677583 B TWI677583 B TW I677583B TW 105102413 A TW105102413 A TW 105102413A TW 105102413 A TW105102413 A TW 105102413A TW I677583 B TWI677583 B TW I677583B
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sputtering target
powder
atomic
target
item
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TW105102413A
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TW201627507A (zh
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菅原淳一
Junichi Sugawara
加守雄一
Yuichi Kamori
徳竹房重
Fusashige Tokutake
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日商迪睿合股份有限公司
Dexerials Corporation
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Abstract

本發明提供一種濺鍍靶材及其製造方法,其是Mn-Zn-W-O系濺鍍靶材,且抗裂性優異。本發明的Mn-Zn-W-O系濺鍍靶材的特徵在於:成分組成中包含Mn、Zn、W及O,且在所述濺鍍靶材的X射線繞射中,由僅包含Mn及O的錳氧化物產生的峰值的最大峰值強度PMnO 相對於由W產生的峰值的最大峰值強度PW 的比PMnO /PW 為0.027以下。

Description

Mn-Zn-W-O系濺鍍靶材及其製造方法
本發明是有關於一種Mn-Zn-W-O系濺鍍靶材及其製造方法,特別是有關於一種適合用於形成光資訊記錄媒體的記錄層的Mn-Zn-W-O系濺鍍靶材及其製造方法。
使Ar離子與包含合金或燒結體的濺鍍靶材發生碰撞的濺鍍法正在玻璃塗佈(glass coating)、半導體元件製造、平板顯示器製造、光資訊記錄媒體(記錄型光碟)的記錄層形成等廣泛的技術領域中進行。
該些技術領域之中,例如在光資訊記錄媒體的技術領域中,伴隨著所處理的資料的增大,而日益追求大容量化。此處,光資訊記錄媒體大致分為讀入專用型及記錄型,其中記錄型可分為追記型與重寫型兩種。作為追記型光碟的記錄層材料,先前以來有機色素材料得到廣泛研究,但伴隨著近年來的大容量化,無機材料亦開始得到廣泛研究。
當前,作為追記型光碟的無機系記錄層材料,鈀氧化物系材料得到實際應用,但Pd為稀有金屬,故而材料成本高,因此業界開發出錳氧化物系的材料作為以低廉的材料成本獲得充分良好的記錄特性的材料。
作為包含此種錳氧化物系的材料的記錄層,在專利文獻1中提出有包含Mn-W-Zn-O的材料的Mn系記錄層。並且,在專利文獻1中,作為使所述Mn系記錄層成膜的具體方法,揭示有在Ar氣體與O2 氣體的混合氣體環境下,對Mn靶材、Cu靶材、W靶材及Zn靶材進行共濺鍍(co-sputter)(多靶濺鍍(multi-target sputter))的技術。藉由使用專利文獻1所述的技術,可不使用作為稀有金屬的Pd,而實現包含Mn-W-Zn-O的材料的Mn系記錄層。 [現有技術文獻] [專利文獻]
[專利文獻1]國際公開第2013/183277號
[發明所欲解決之課題]
此處,作為利用濺鍍法形成如所述包含Mn-W-Zn-O的材料的Mn系記錄層般含有多種元素的層的一個方法,可舉出如專利文獻1所揭示,對包含各種元素的多個靶材進行濺鍍的多靶濺鍍法。此外,亦有將含有多種元素的一塊複合靶材作為單一靶材進行濺鍍的方法。多靶濺鍍法成為裝置大型化而成本上升的主要因素,並且存在容易產生組成偏差的缺點,因此就量產化的角度而言較佳為使用複合靶材。
所述專利文獻1已提出含有Mn的氧化物且所述Mn的氧化物的一部分或全部是以Mn的原子價未達+4的氧化物狀態存在的靶材來作為資訊記錄媒體製作用的濺鍍靶材,並且已提出較佳為在所述靶材中,以所述氧化物狀態存在的Mn的氧化物是未經熱解的Mn3 O4 。此外,已提出所述靶材亦可更包含Mn以外的金屬或所述金屬的氧化物,所述金屬是選自由Sn、Zn、Bi、Ge、Co、W、Cu及Al所組成的群組中的一種以上。
但是,專利文獻1並未提及具體的Mn-Zn-W-O系的複合濺鍍靶材。迄今為止,成分組成中包含Mn、Zn、W及O的Mn-Zn-W-O系的複合濺鍍靶材並未得到確立。
因此,本發明的目的在於提供一種Mn-Zn-W-O系濺鍍靶材及其製造方法。 [解決課題之手段]
本發明者等人為了達成所述各個目的而進行潛心研究,以Mn3 O4 粉末、ZnO粉末、W粉末作為原料,試製出Mn-Zn-W-O系濺鍍靶材。但是,根據本發明者等人的試驗表明,在所試製的Mn-Zn-W-O系濺鍍靶材中,存在抗裂性差、在濺鍍過程中產生破裂的靶材。本發明者等人潛心研究其原因之後發現,Mn-Zn-W-O系濺鍍靶材的抗裂性取決於僅包含Mn及O的錳氧化物。進一步研究後明確,若如專利文獻1所提出般在靶材中存在Mn3 O4 結晶相,則靶材的抗裂性反倒變差。而且,本發明者等人發現,藉由儘可能地排除僅包含Mn及O的錳氧化物,可改善靶材的抗裂性,從而完成了本發明。
本發明是基於本發明者等人的所述見解而成,作為用以解決所述各個課題的方法,如下所述。即, <1> 一種濺鍍靶材,其為Mn-Zn-W-O系濺鍍靶材,成分組成中包含Mn、Zn、W及O,所述濺鍍靶材的特徵在於: 由僅包含Mn及O的錳氧化物產生的峰值的最大峰值強度PMnO 相對於由W產生的峰值的最大峰值強度PW 的比PMnO /PW 為0.027以下。 所述<1>所述的Mn-Zn-W-O系濺鍍靶材可提供一種實質上不存在僅包含Mn及O的錳氧化物,而抗裂性優異的Mn-Zn-W-O系濺鍍靶材。
<2> 如所述<1>所述的濺鍍靶材,其中在所述濺鍍靶材的X射線繞射中,存在由WMnO4 結晶相產生的峰值。
<3> 如所述<1>或<2>所述的濺鍍靶材,其中由所述WMnO4 結晶相產生的峰值的最大峰值強度PWMnO 相對於所述最大峰值強度PW 的比PWMnO /PW 為0.024以上。
<4> 如所述<1>或<2>所述的濺鍍靶材,其中相對於Mn、Zn、W的合計100原子%,Mn為4原子%~40原子%,Zn為15原子%~60原子%,W為5原子%~40原子%。
<5> 如所述<1>或<2>所述的濺鍍靶材,其中所述成分組成中更包含選自由Cu、Mg、Ag、Ru、Ni、Zr、Mo、Sn、Bi、Ge、Co、Al、In、Pd、Ga、Te、V、Si、Ta、Cr、Tb所組成的群組中的單獨一種或兩種以上的元素。
<6> 如所述<5>所述的濺鍍靶材,其中選自所述群組中的單獨一種或兩種以上的元素的含有率是相對於所述濺鍍靶材的構成元素之中去除O之後的合計100原子%,為8原子%~70原子%。
<7> 一種製造方法,其是製造如所述<1>所述的Mn-Zn-W-O系濺鍍靶材的方法,特徵在於包括: 混合步驟,將包含成分含有Mn的粉末、成分含有Zn的粉末以及成分含有W的粉末的混合粉末加以濕式混合12小時以上;以及 燒結步驟,在所述混合步驟之後,以700℃以上的溫度對所述混合粉末進行燒結。 根據所述<7>所述的製造方法,可提供一種抗裂性優異的Mn-Zn-W-O系濺鍍靶材的製造方法。
<8> 如所述<7>所述的製造方法,其中所述成分含有Mn的粉末包含錳氧化物粉末,所述成分含有Zn的粉末包含鋅氧化物粉末,所述成分含有W的粉末包含金屬鎢粉末。
<9> 如所述<7>或<8>所述的製造方法,其中所述混合粉末中更包含:包含選自由Cu、Mg、Ag、Ru、Ni、Zr、Mo、Sn、Bi、Ge、Co、Al、In、Pd、Ga、Te、V、Si、Ta、Cr、Tb所組成的群組中的單獨一種或兩種以上的元素的單質或化合物的粉末。 [發明的效果]
根據本發明,可解決現有技術中的所述各個問題,從而達成所述目的,可提供一種抗裂性優異的Mn-Zn-W-O系濺鍍靶材及其製造方法。
(Mn-Zn-W-O系濺鍍靶材) 本發明的Mn-Zn-W-O系濺鍍靶材是成分組成中包含Mn、Zn、W及O的Mn-Zn-W-O系濺鍍靶材。以下,將本發明的Mn-Zn-W-O系濺鍍靶材簡稱為「靶材」,對根據本發明的靶材進行詳細說明。
<靶材> 根據本發明的一實施形態的靶材是成分組成中包含Mn、Zn、W及O,進而根據需要,包含其他成分組成。 在所述靶材的X射線繞射中,由僅包含Mn及O的錳氧化物產生的峰值的最大峰值強度PMnO 相對於由W產生的峰值的最大峰值強度PW 的比PMnO /PW 為0.027以下。
<<僅包含Mn及O的錳氧化物>> 此處,所謂僅包含Mn及O的錳氧化物,是指Mn3 O4 (氧化錳(II、III))及Mn2 O3 (氧化錳(III))等氧化錳,而將下述WMnO4 等包含Mn及O以外的元素的錳複合氧化物除外。作為錳氧化物,此外亦可舉出MnO、MnO2 、MnO3 及Mn2 O7 等。以下,在本說明書中,將錳氧化物之中僅包含Mn及O的氧化錳簡稱為「氧化錳」,將包含Mn及O以外的元素的複合氧化物稱為「錳複合氧化物」,以對兩者進行區分。在本實施形態中,重要的是靶材中實質上不存在氧化錳的結晶相,利用X射線繞射中的峰值強度來對所述氧化錳的結晶相的實質上的有無進行確定。
<<靶材的X射線繞射中的強度>> 靶材的X射線繞射光譜的獲取可按照常用方法來進行,例如利用理學(Rigaku)股份有限公司製造的SmartLab,對靶材表面進行θ-2θ掃描而獲取光譜即可。在本實施形態中,為了對靶材的特性進行確定,至少對所述由W產生的峰值的最大峰值強度PW 及由氧化錳產生的峰值的最大峰值強度PMnO 進行測定,並根據需要,對由其他結晶相產生的峰值的峰值強度進行測定。
-測定條件- X射線繞射的測定條件是根據靶材來適當確定,例如可自以下的條件範圍內選擇。 X射線源:Cu-Kα射線 輸出設定:20 kV~100 kV、10 mA~100 mA 測角範圍:2θ=5°~80° 掃描速度:1°~4°(2θ/分鐘(min)),連續掃描 發散狹縫:0.5°~2° 散射狹縫:0.5°~2° 受光狹縫:0.1 mm~0.5 mm
-峰值強度- W的繞射峰值是在40.26°±0.3°、58.27°±0.3°等的範圍內檢測到。將在該些範圍內檢測到的繞射峰值之中的最大值作為由W產生的峰值的最大峰值強度PW (單位:cps,以下相同),設為本實施形態中的基準強度。其原因在於,在根據本實施形態的靶材的X射線繞射光譜中,由W產生的峰值的最大峰值強度PW 多成為靶材中的各成分的峰值的最大峰值強度之中的最大強度。其次,對由氧化錳產生的峰值的最大峰值強度PMnO 進行說明。例如Mn3 O4 的繞射峰值是在28.88°±0.3°、59.84°±0.3°等的範圍內檢測到,在Mn2 O3 的情況下是在32.98°±0.3°、55.24°±0.3°等的範圍內檢測到。當在該些範圍內檢測到的繞射峰值之中,非偶然地檢測到氧化錳的繞射峰值時,將由氧化錳產生的峰值的峰值強度的最大值作為最大峰值強度PMnO ,當氧化錳的繞射峰值埋沒在X射線繞射光譜的背景中(例如背景強度的1.1倍以下)時,則看作未檢測到繞射峰值而將峰值強度PMnO 設為0(零)。
若比PMnO /PW 為0.027以下,則氧化錳的結晶相實質上不存在於靶材中,故而靶材的抗裂性優異。關於藉由氧化錳的結晶相實質上不存在於靶材中,而使得靶材的抗裂性優異的理由,換而言之,藉由氧化錳的結晶相非偶然地存在於靶材中而使得靶材的抗裂性變差的理論上的理由目前尚不明確,但本發明者等人認為其原因在於若燒結不充分,則會使燒結密度低而機械特性差。
如以上所述,根據本實施形態,可提供一種抗裂性優異的Mn-Zn-W-O系靶材。又,根據本實施形態的靶材特別適合用於光資訊記錄媒體的記錄層的形成,但對用途並無任何限定。
再者,作為比PMnO /PW ,若在所述範圍內則無特別限制,但較佳為0.027以下,更佳為0.01以下,最佳為0(即,未檢測到氧化錳的繞射峰值)。
<<WMnO4 結晶相>> 此處,在根據本實施形態的靶材的X射線繞射中,為了更確實地提高靶材的抗裂性,較佳為存在WMnO4 結晶相。其原因在於當燒結推進時錳並非氧化錳的形態,而變為WMnO4 的形態。WMnO4 結晶相的存在可藉由因WMnO4 結晶相而產生的峰值的存在來確定,在本實施形態中,較佳為存在由WMnO4 結晶相產生的峰值。再者,所謂存在由WMnO4 結晶相產生的峰值,是指相對於X射線繞射光譜中的背景檢測到非偶然的峰值。
-由WMnO4 結晶相產生的峰值的峰值強度PWMnO - 由WMnO4 結晶相產生的繞射峰值是在29.80°±0.3°、30.23°±0.3°等的範圍內檢測到,當將該些峰值之中的成為最大強度的峰值的強度設為最大峰值強度PWMnO 時,若比PWMnO /PW 為0.02以上,則可進一步提高靶材的抗裂性,故而較佳。此外,比PWMnO /PW 更佳為0.03以上,最佳為0.04以上。
<<成分比>> 此處,作為根據本實施形態的靶材的成分比,並無特別限制,可根據目的來適當選擇,但較佳為相對於Mn、Zn及W的合計100原子%,Mn為4原子%~40原子%,Zn為15原子%~60原子%,W為5原子%~40原子%。
<<其他成分>> 此外,根據本實施形態的靶材較佳為成分組成中更包含選自由Cu、Mg、Ag、Ru、Ni、Zr、Mo、Sn、Bi、Ge、Co、Al、In、Pd、Ga、Te、V、Si、Ta、Cr、Tb所組成的群組中的單獨一種或兩種以上的元素。例如,當將根據本實施形態的靶材用於形成資訊記錄媒體的記錄層時,可藉由使成分組成中更包含該些元素來改變透過率、反射率及記錄靈敏度,從而形成為多層構造的記錄層,故而有用。
-其他成分的成分比- 選自所述群組中的單獨一種或兩種以上的元素的含有率可相對於濺鍍靶材的構成元素之中去除O(氧)之後的合計100原子%,設為8原子%~70原子%。
再者,根據本實施形態的靶材的形狀並無任何限定,可設為圓盤狀、圓筒狀、四邊形板狀、長方形板狀、正方形板狀等任意形狀,可根據靶材的用途來適當選擇。又,關於靶材的寬度及縱深的大小(在圓形的情況下為直徑),亦可在mm級別~m級別程度的範圍內,根據靶材的用途來適當選擇。在圓形的情況下,通常,直徑為50 mm~300 mm左右。關於厚度亦同樣地,可根據用途來適當選擇,通常為1 mm~20 mm左右。
<靶材的製造方法> 其次,利用圖1,對所述根據本發明的一實施形態的靶材的製造方法進行說明。根據本發明的一實施形態的靶材的製造方法包括混合步驟(S10)及燒結步驟(S20),更包括根據需要而適當選擇的其他步驟。
<<混合步驟(S10)>> 所述混合步驟(S10)是將包含成分含有Mn的粉末、成分含有Zn的粉末以及成分含有W的粉末的混合粉末加以濕式混合12小時以上的步驟。 作為所述濕式混合的方法,並無特別限制,可根據目的來適當選擇,例如可舉出現有公知的利用球磨機(ball mill)裝置的濕式混合方法等。以下對在本步驟中進行混合的所述混合粉末及混合條件進行說明。
所述混合粉末包含成分含有Mn的粉末、成分含有Zn的粉末、以及成分含有W的粉末,且根據需要,含有其他粉末。
-成分含有Mn的粉末- 作為所述成分含有Mn的粉末,可根據目的來適當選擇,例如可舉出包含Mn單質的粉末、錳化合物粉末、錳氧化物(例如,Mn3 O4 、Mn2 O3 等)粉末等。該些粉末既可單獨使用一種,亦可同時使用兩種以上。 該些粉末之中,較佳為錳氧化物粉末,更佳為Mn3 O4 粉末。其原因在於燒結溫度與熔點的關係。 再者,作為所述成分含有Mn的粉末的平均粒徑,可根據目的來適當選擇。又,作為所述Mn3 O4 粉末的平均粒徑,亦可設為市售的3 μm~7 μm左右。
-成分含有Zn的粉末- 作為所述成分含有Zn的粉末,可根據目的來適當選擇,例如可舉出包含Zn單質的粉末、鋅化合物粉末、鋅氧化物粉末等。該些粉末既可單獨使用一種,亦可同時使用兩種以上。 該些粉末之中,較佳為鋅氧化物粉末,更佳為ZnO粉末。其原因在於燒結溫度與熔點的關係。 再者,作為所述成分含有Zn的粉末的平均粒徑,可根據目的來適當選擇。又,作為所述ZnO粉末的平均粒徑,可設為市售的1 μm~3 μm左右。
-成分含有W的粉末- 作為所述成分含有W的粉末,可根據目的來適當選擇,例如,可舉出包含W單質的粉末、鎢化合物粉末、鎢氧化物粉末等。該些粉末既可單獨使用一種,亦可同時使用兩種以上。 該些粉末之中,較佳為包含W單質的金屬鎢粉末。其目的在於使其具有導電性。 再者,作為所述成分含有W的粉末的平均粒徑,可根據目的來適當選擇。又,作為所述W粉末的平均粒徑,可設為市售的2 μm~5 μm左右。
-其他粉末- 作為所述其他粉末,可根據目的來適當選擇,例如可舉出包含選自由Cu、Mg、Ag、Ru、Ni、Zr、Mo、Sn、Bi、Ge、Co、Al、In、Pd、Ga、Te、V、Si、Ta、Cr、Tb所組成的群組中的單獨一種或兩種以上的元素的單質或化合物的粉末等。此處,亦可根據所製造的靶材的所期望的目的,使所述混合粉末中含有所述粉末。
-混合時間- 此處,在本實施形態中重要的是將所述混合粉末濕式混合12小時以上。藉由將混合時間設為12小時以上,可將混合粉末充分地混合,因此可促進燒結過程中的氧化錳的固相反應,抑制燒結後的氧化錳結晶相的殘留。並且,即使在所述範圍內,亦較佳為將混合時間設為16小時以上,更佳為設為20小時以上,最佳為設為24小時以上。雖然混合24小時後,混合的效果飽和,但混合24小時以上亦無妨。再者,雖然並不意圖限定上限,但考慮到工業上的生產率,可將混合時間的上限設定為168小時。
<<燒結步驟(S20)>> 所述燒結步驟(S20)是在所述混合步驟之後進行的步驟,是以700℃以上的溫度對所述混合粉末進行燒結的燒結步驟。
-燒結- 作為所述燒結,並無特別限制,可根據目的來適當選擇,例如可舉出在惰性氣體環境中的熱壓(hot press)、熱均壓法(HIP法;Hot Isostatic Pressing)等。
此處,在本實施形態中重要的是以700℃以上的溫度對所述混合粉末進行燒結。藉由將燒結溫度設為700℃以上,可抑制燒結後的錳氧化物結晶相的殘留。
再者,燒結時間並無特別限定,而可適當選擇,只要設為通常進行的1小時~6小時左右的燒結時間即可。
經過以上步驟而製造的Mn-Zn-W-O系濺鍍靶材在所述濺鍍靶材的X射線繞射中,由僅包含Mn及O的錳氧化物產生的峰值的最大峰值強度PMnO 相對於由W產生的峰值的最大峰值強度PW 的比PMnO /PW 為0.027以下。因此,可製造抗裂性優異的靶材。
<<其他步驟>> 作為所述其他步驟,並無特別限制,可根據目的來適當選擇,例如,可舉出混合粉末的成形步驟等。
-成形步驟- 再者,所述成形步驟在本發明中並非必須,有時是為了使靶材的形狀成形而進行。
以下,利用實施例對本發明作進一步詳細說明,但本發明絲毫不限定於以下的實施例,可在不脫離本發明的主旨的範圍內加以各種變更。 [實施例]
如下所述,製作實施例1作為根據本發明的靶材,製作比較例1、比較例2作為對照用的靶材,對抗裂性進行評估。 (實施例1) 作為原料粉末,準備以下的粉末。 純度:99.9%以上,平均粒徑:5 μm,Mn3 O4 粉末 純度:99.9%以上,平均粒徑:1.4 μm,ZnO粉末 純度:99.9%以上,平均粒徑:3 μm,W粉末 以各金屬元素的比例為Mn:W:Zn=20:30:50(原子%)的方式,秤量所述Mn3 O4 粉末、ZnO粉末及W粉末。將所秤量的各原料粉末、各原料粉末的總重量的3倍的氧化鋯球(直徑5 mm)及乙醇(alcohol)加入至塑膠容器中,利用球磨機裝置,進行濕式混合24小時。將混合粉末加以乾燥之後,使其通過孔徑500 μm的篩子。接著,在燒結溫度900℃、燒結時間2小時、壓力200 kgf/cm2 、惰性氣體環境中的條件下進行熱壓,製作實施例1的靶材。
(比較例1) 取代在實施例1中將混合時間設為24小時,而將混合時間設為2小時,除此以外,與實施例1同樣地製作比較例1的靶材。
(比較例2) 取代在實施例1中將燒結溫度設為900℃,而將燒結溫度設為600℃,除此以外,與實施例1同樣地製作比較例2的靶材。
<評估> 對在以上的實施例1及比較例1、比較例2中製作的靶材,進行(A)成分評估及(B)抗裂性評估。各評估是以如下方式進行。
(A)成分評估 對實施例1及比較例1、比較例2的靶材,利用X射線繞射法進行靶材中的成分評估。在X射線繞射時,利用理學股份有限公司製造的SmartLab,進行θ-2θ掃描,獲得X射線繞射光譜。將實施例1的X射線繞射光譜作為代表例示於圖2。再者,強度是以任意單位(a.u.)表示。表1中表示有將W的峰值的最大峰值強度記作PW ,將錳氧化物的峰值的最大峰值強度記作PMnO ,將WMnO4 結晶相的峰值的最大峰值強度記作PWMnO 時的峰值強度比。再者,當峰值埋沒於背景中時,將峰值強度設為0。試驗條件如下。 X射線源:Cu-Kα射線 輸出設定:30 kV、15 mA 測角範圍:2θ=15°~70° 掃描速度:2°(2θ/min),連續掃描 發散狹縫:1° 散射狹縫:1° 受光狹縫:0.3 mm
(B)抗裂性評估 利用In焊料,將實施例1及比較例1、比較例2的靶材接合於無氧銅製的包裝板(packing plate)。將接合後的靶材安裝至濺鍍裝置。其次,對濺鍍裝置內進行真空排氣直至1×10-4 Pa以下,導入Ar氣體及O2 氣體,將裝置內壓力設為0.3 Pa。將氧氣的分壓([O2 ]/[Ar+O2 ])設為70%。利用直流電(direct current,DC)電源施加5 W/cm2 的電力,進行30分鐘濺鍍,然後自濺鍍裝置取出靶材,肉眼觀察各個靶材中是否產生有破裂。基於下述評估基準,對靶材的抗裂性進行評估。 ○:未觀察到破裂 ×:觀察到破裂 將結果示於表1。
[表1]
根據以上結果,確認到以下情況。 在實施例1中,未產生破裂,另一方面,在比較例1、比較例2中產生有破裂。此處,在實施例1中觀測到由W、ZnO及WMnO4 產生的峰值,但未檢測到Mn3 O4 的峰值,因此可知不存在來自於原料粉末的Mn3 O4 結晶相。並且,亦未檢測到由其他的氧化錳結晶相產生的峰值。在比較例1、比較例2中,檢測到Mn3 O4 的峰值,因此可知殘留有Mn3 O4 結晶相。可認為在比較例1、比較例2中產生有破裂的原因是由於混合或燒結條件不充分,故而Mn3 O4 結晶相超出本發明條件即PMnO /PW 的閾值0.027而殘留。 [產業上之可利用性]
根據本發明,可提供一種特別適合用於形成光資訊記錄媒體的記錄層的抗裂性優異的Mn-Zn-W-O系濺鍍靶材及其製造方法。
S10‧‧‧混合步驟
S20‧‧‧燒結步驟
圖1是用以說明根據本發明的一實施形態的濺鍍靶材的製造方法的流程圖。 圖2是實施例1的濺鍍靶材的X射線繞射光譜。

Claims (8)

  1. 一種濺鍍靶材,其為Mn-Zn-W-O系濺鍍靶材,成分組成中包含Mn、Zn、W及O,所述濺鍍靶材的特徵在於:在所述濺鍍靶材的X射線繞射中,由僅包含Mn及O的錳氧化物產生的峰值的最大峰值強度PMnO相對於由W產生的峰值的最大峰值強度PW的比PMnO/PW為0.027以下,其中相對於Mn、Zn及W的合計100原子%,Mn為4原子%~40原子%,Zn為15原子%~60原子%,W為5原子%~40原子%。
  2. 如申請專利範圍第1項所述的濺鍍靶材,其中在所述濺鍍靶材的X射線繞射中,存在由WMnO4結晶相產生的峰值。
  3. 如申請專利範圍第1項或第2項所述的濺鍍靶材,其中由所述WMnO4結晶相產生的峰值的最大峰值強度PWMnO相對於所述最大峰值強度PW的比PWMnO/PW為0.024以上。
  4. 如申請專利範圍第1項或第2項所述的濺鍍靶材,其中所述成分組成中更包含選自由Cu、Mg、Ag、Ru、Ni、Zr、Mo、Sn、Bi、Ge、Co、Al、In、Pd、Ga、Te、V、Si、Ta、Cr、Tb所組成的群組中的單獨一種或兩種以上的元素。
  5. 如申請專利範圍第4項所述的濺鍍靶材,其中選自所述群組中的單獨一種或兩種以上的元素的含有率是相對於所述濺鍍靶材的構成元素之中去除O之後的合計100原子%,為8原子%~70原子%。
  6. 一種濺鍍靶材的製造方法,其是製造如申請專利範圍第1項所述的Mn-Zn-W-O系濺鍍靶材的方法,特徵在於包括:混合步驟,對包含成分含有Mn的粉末、成分含有Zn的粉末、成分含有W的粉末的混合粉末進行濕式混合12小時以上;以及燒結步驟,在所述混合步驟之後,以700℃以上的溫度對所述混合粉末進行燒結。
  7. 如申請專利範圍第6項所述的濺鍍靶材的製造方法,其中所述成分含有Mn的粉末包含錳氧化物粉末,所述成分含有Zn的粉末包含鋅氧化物粉末,所述成分含有W的粉末包含金屬鎢粉末。
  8. 如申請專利範圍第6項或第7項所述的濺鍍靶材的製造方法,其中所述混合粉末更包含:包含選自由Cu、Mg、Ag、Ru、Ni、Zr、Mo、Sn、Bi、Ge、Co、Al、In、Pd、Ga、Te、V、Si、Ta、Cr、Tb所組成的群組中的單獨一種或兩種以上的元素的單質或化合物的粉末。
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