TWI675738B - Film laminating device and operating method thereof - Google Patents

Abstract

The technical problem of the present invention is to provide a thin film stacking device, which can prevent the damage of the product in the stacking process of forming a fine pattern of a substrate by preventing the micro damage of the multilayer film which is an obstacle to exposure, and the like.

The solution of the present invention is a film lamination device, which is provided with a substrate (4a, 4b, 4c) carrying means (1, 3), and after peeling off the protective film (16) of the laminated film (9), it is pasted. The lamination device of a thin film attached to a substrate (4a, 4b, 4c) is characterized in that: in order to measure the length of the substrate (4a, 4b, 4c) before lamination, the thickness of the substrate (4a, 4b, 4c) is determined according to the The length changes the film attachment length. Between the blade portion (14) and the half-cut position, a film length adjustment mechanism (13) is provided which changes the film attachment length according to the length of the substrate (4a, 4b, 4c). The film length adjusting mechanism (13) half-cuts the laminated film (9) before laminating at a position where the substrate is attached with a length of one piece, and the continuous protective film (16) is provided by the film conveying means until it is set in the laminated layer. The blade portion (14) near the roller (20) is conveyed without peeling the protective film (16) from the laminated film (9).

Description

Thin film lamination device and operation method thereof

The present invention relates to a thin film stacking device, and more particularly, to a thin film stacking device and a method for operating the same for laminating a thin film such as a photosensitive dry film for pattern formation on a substrate surface of a printed substrate.

Printed circuit boards are mainly in portable devices, mobile phones, etc., and are currently undergoing technological innovation. In particular, miniaturization and weight reduction of substrates has become an important issue. Miniaturization of the substrate involves miniaturization of a pattern formed on the substrate and multilayering of the substrate, and weight reduction involves reduction in thickness of the substrate.

The formation of the above-mentioned pattern is mainly to form a pattern by a so-called photolithography process, which is to laminate a laminated film such as a photosensitive dry film on a copper-clad laminated board, and then perform exposure, development, etching, or plating.

The photosensitive dry film and the like are mainly composed of a laminated film having a three-layer structure. A photosensitive / thermosetting photoresist layer is coated on a base film composed of a polyester film and the like, and then laminated thereon. A protective film made of a polyethylene film or the like is composed of three layers.

Hereinafter, a photosensitive dry film and the like are referred to as a laminated film.

In the lamination process of manufacturing a thin film of a printed substrate, the protective film of the lamination film is peeled off, and then the lamination roller as a thermocompression roller is used to heat and pressurize the photoresist layer from the base film, and then to the copper clad laminate. Process for thermocompression bonding laminated films.

In terms of miniaturizing the pattern of the printed substrate, a problem in the lamination process is that in the step of adhering the laminating film to the substrate while adhering the laminating film to the substrate, or adhering and holding the base film while sliding the film. The edge of the chamfered portion or the like of the suction hole of the suction plate of the suction film may cause a slight damage to the base film on the suction surface side.

The fine damage of this base film reduces the illuminance due to the scattering of ultraviolet rays and the like during exposure, and the photoresist is hardened insufficiently, resulting in poor adhesion between the substrate and the photoresist. This photoresist has poor adhesion. In the subsequent etching process, the etchant that melts copper to form a pattern will invade the poor adhesion portion, resulting in the failure of the pattern being cut or the disconnection of the pattern.

In addition, using a photoresist as a partition wall and forming a pattern by copper plating standing up, the lower part of the partition wall is damaged due to poor adhesion of the photoresist between the patterns, and the copper plating solution penetrates between the partition walls, resulting in There is a problem that the patterns are short-circuited.

As a countermeasure against the fine damage of the base film caused by the adsorption, it is proposed to use a film holding before the lamination is completed, and use an air bath nozzle and a transport guide to maintain the film tension behind the sticking roller, A countermeasure against a structure that moves synchronously on the transport guide (see Patent Document 1).

In addition, as a factor hindering the miniaturization of the pattern in the build-up process, there is a problem that minute foreign matter adheres to the photoresist surface attached to the substrate.

This is because the photoresist surface is wet after the protective film is peeled off, and the floating foreign matter generated from the surrounding environment and the driving source of the device is electrostatically adsorbed because the charged static electricity is peeled off when the protective film is peeled off. On the photoresist surface.

In addition, if foreign matter such as photoresist fragments generated when the film is cut, and cut fragments of the base film are dropped on the attached substrate, the foreign materials are mixed between the photoresist and the substrate, resulting in poor adhesion of the photoresist. Condition. In this case, the same troubles as those of the photoresist adhesion failure described above are caused.

As a countermeasure for preventing a foreign substance from adhering to a photoresist surface, a method of attaching a release paper before lamination and peeling off immediately before coating a film has been proposed (see Patent Document 2).

[Prior technical literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2010-173233

[Patent Document 2] Japanese Patent Laid-Open No. 2003-225945

However, when the laminated film is laminated on the substrate, the laminated film is attached to the substrate in a frame shape. Therefore, the laminated film must be cut to be shorter than the length of the substrate in accordance with the length of the substrate to be inserted.

A general film cutting method is disclosed in Patent Document 2. During the lamination process, the rear of the laminated film is sucked and held while being cut according to the length of the substrate, and the rear of the laminated film is sucked while sliding.

The problem with this method is the micro damage caused by the laminated film caused by the adsorption film.

In addition, the problem with this cutting method is that the cutting debris derived from the laminated film that is generated by the cutting is dropped on the attached substrate, resulting in poor adhesion.

In addition, although the laminated film under convection moves the cutting edge synchronously and cuts it, the synchronization of the lamination speed and the speed of the film cutting unit caused by the different driving sources is poor. Situations that cause problems with attachment quality.

If the holding tension of the film is reduced, wrinkles may be generated due to relaxation of the laminated film, and the film may be transferred. In addition, if the film holding tension is increased, longitudinal wrinkles may occur in the film flow direction and the film may be transferred.

Therefore, there is a problem in maintaining the tension of the film, and keeping the width, thickness, etc. of the laminated film at an optimal value without changing it.

In addition, the quality of the film can be improved without maintaining the film's tension variation due to cutting of the film in the laminate.

It is conceivable to prevent the film from flowing when the film is cut as a countermeasure against the change in the holding tension of the film. However, according to the photoresist characteristics of the laminated roller, the surface temperature of the roller must be about 110 ° C. Since the flow of the film is stopped during the lamination, the photoresist part in contact with the lamination roll may cause poor quality due to thermal unevenness and a change in film thickness due to photoresist bleeding.

The laminated film is formed by peeling off the protective film and exposing the photoresist surface. However, static electricity is generated due to peeling and charging during peeling, which causes the problem of floating foreign matter adhering to the photoresist surface due to static electricity.

In addition, although the protective film is peeled off at the blade portion, since the protective film is slid at the blade portion, static electricity is generated due to frictional electrification, and the adhesion surface exposed from the tip of the blade portion causes a problem of foreign matter adhesion.

In the production plant, it is mainstream to run off the substrates for each batch for production management. If the time required to insert substrates between batches becomes longer, as in the conventional multilayer device disclosed in Patent Document 2, the front end of the multilayer film in standby Since it is supposed to be crimped to the substrate, it is in standby state with the front end portion of the photoresist surface attached.

Therefore, the exposed surface of the photoresist is deteriorated due to adhesion of foreign matter and moisture absorption. Therefore, at the manufacturing site, if the substrate standby time becomes longer, the device will be switched to manual operation, and the exposed photoresist part will be cut and removed.

This operation involves the problem that the automatic operation is stopped on the automatic operation production line and manual operation is performed, which reduces the production efficiency inherently.

An object of the present invention is to provide a lamination device and an operating method thereof that solves the above problems.

For the problem of fine damage to the laminated film caused by film adsorption, as described in claim 1, the laminated film is half-cut before being laminated at the position where the substrate is attached one piece in length, and continuous Protective films are addressed as a means of film handling.

The tension of the film is kept at the optimal value in accordance with the width and thickness of the laminated film, so that it does not change. The reason is that a half-cut is performed before the lamination, and the film is maintained at a constant tension during the lamination. And, the solution of not cutting the film in the laminated layer to solve it.

More specifically, the present invention relates to a thin film stacking device, which includes a substrate conveying method, and a thin film stacking device for attaching a thin film to a thin film stacking portion of a substrate after peeling off a protective film of the multilayer film and laminating the protective film. The length of the substrate is measured before lamination, and the film attachment length is changed according to the length of the substrate. The film length adjustment mechanism is provided between the blade and the half-cut position to change the film attachment length according to the length of the substrate. By using the film length adjustment mechanism, the laminated film is cut in half before being laminated at a position where the substrate is attached with a length of one component, and the continuous protective film is passed through the film conveying means until it is located near the blade edge of the laminated roller. The protective film is peeled from the laminated film and conveyed.

In addition, the cutting fragments originating from the laminated film that are caused by cutting fall on the attached substrate and cause a problem of poor adhesion. A product for pulling out the half-cut position in the vertical direction is provided below the half-cut position. When the layer film is cut in half, the generated cutting chips are not allowed to fall to the cover member on the attached substrate to prevent the cutting chips from falling, so as to solve the problem.

Here, the thin film lamination section is a conveying means which is disposed vertically symmetrically to hold the substrate, and the laminated film can be laminated on both sides of the substrate.

Furthermore, when the protective film is peeled off, static electricity is generated due to the peeling of the electrification, the problem of floating foreign matter adhering to the photoresist surface due to static electricity, and the static electricity generated by frictional electrification due to the sliding of the protective film at the blade edge makes the photoresist The problem of adhering floating foreign matter on the agent surface is solved by the blade part of the protective film composed of a conductive member and having a mechanism to guide the static electricity generated when the protective film is peeled off to the ground of the frame to solve it. .

In addition, with regard to the following problem: in the standby state where the lamination operation is not performed, since it is assumed that the substrate is crimped to the substrate, and the front end portion of the photoresist paste is exposed, the standby position is caused by the adhesion and absorption of foreign matter. Wet etc. cause the surface of the photoresist to deteriorate. Therefore, it is necessary to cut and remove the exposed photoresist part. This operation is to stop the automatic operation on the automatic operation production line and perform manual operations to produce production efficiency. The problem of reduction is the protection of the laminated film attached to the next substrate by the operating method of the laminated device as described in claim 3, more specifically, in a standby state in which the laminated operation is not performed. Thin film peeling is not implemented until the next substrate is put in, and it is possible to solve the problem without exposing the adhesive surface such as the photoresist surface.

The present invention has the effect of reducing the defective condition of a product in a lamination process for forming fine patterns on a substrate.

1. Contents to reduce adverse conditions

(1) Preventing micro damage of the laminated film that becomes an obstacle to exposure

(2) Prevent the lamination of the laminated film, which causes poor adhesion of the photoresist,

(3) Make the film uniform tension and prevent wrinkles by cutting in half beforehand

(4) By removing static electricity, prevent the adhesion of tiny foreign matter that causes poor adhesion of the photoresist

(5) Since the photoresist is not exposed during substrate standby, foreign matter can be prevented from adhering and deteriorating

2. Other effects

Since the film handling and film holding do not use an adsorption mechanism, this device can be easily placed in a vacuum chamber to form a lamination device in a vacuum. This vacuum lamination device can prevent micro voids mixed during lamination in the atmosphere, and is beneficial to reduce the problem when forming fine patterns.

1‧‧‧ Substrate is put into the conveyor belt section (conveyance means)

2‧‧‧ thin film laminated section

3‧‧‧ Substrate Unloading Conveyor Section (Conveyance Means)

4a, 4b, 4c‧‧‧ substrate

5‧‧‧ substrate detection sensor

6‧‧‧Position sensor

7‧‧‧ Conveyor rotation detector

8‧‧‧ Film Unwinding Unit

9‧‧‧ laminated film

10‧‧‧ Half Cut Unit

11‧‧‧ Cutting knife bearing

12‧‧‧ Prevents cutting debris from falling off the cover

13‧‧‧ film pull-out adjustment unit (film length adjustment mechanism)

14‧‧‧Blade part

15‧‧‧ laminated film front end

16‧‧‧ protective film

17‧‧‧ protective film transport roller

18‧‧‧Roller drive servo motor

19‧‧‧ protective film winding unit

20‧‧‧Laminated roll

21‧‧‧Laminated laminated film

[Fig. 1] A side explanatory view showing a multilayer device of the present invention.

[Fig. 2] Fig. 2 is an explanatory diagram showing a lamination operation at the start of the lamination apparatus of the present invention.

[Fig. 3] Fig. 3 is an explanatory diagram showing a layering operation of the layering device of the present invention.

[Fig. 4] Fig. 4 is an explanatory diagram showing a layering operation of the layering device of the present invention before the layering operation is completed.

[Types for Implementing Invention]

In the following, the types of the laminated device for implementing the present invention and its operating method will be described with reference to the drawings.

FIG. 1 is a side view showing the laminated device of this type, showing a type in which a laminated film is laminated on both sides of the substrate, and in a thin film laminated portion 2, the state before lamination is shown.

The structure of the apparatus is constituted by a substrate loading and unloading belt unit 1, a film lamination unit 2, a substrate loading and unloading belt unit 3, and a control device (not shown) that controls these. In addition, since the thin film laminated portion 2 is vertically symmetrical, the symbols on the lower side are omitted.

In FIG. 1, the substrate 4 a is carried in from a conveyer belt or the like previously manufactured on the left side. The substrate 4 a is aligned in the substrate width direction in accordance with the film width of the laminated film 9 by a substrate alignment device or the like (not shown). The length of the substrate 4a to be loaded is measured in the substrate loading belt 1.

This purpose is to detect the length of the substrate 4a before lamination, and use this information to determine the length of the lamination film. Before the layer is cut by a half-cut unit 10 and a cutting blade receiver 11.

The stop of the lamination position at the front end of the substrate 4a is set by a control device (not shown) in order to attach the lamination film to the designated attachment position.

In the film laminating section 2 of FIG. 1, the laminated film 9 is pulled out from the film unwinding unit 8 to protect the film transporting roller 17, and the laminated film 9 is conveyed by the feeding of the protective film 16.

The half-cut unit 10 and the cutting blade receiver 11 leave the protective film 16 of the laminated film 9, and cut off the base film and the photoresist to a length corresponding to the attached length of the substrate 4 a to be inserted. In this way, instead of cutting the entire thickness of the laminated film, cutting is performed while leaving the protective film on the opposite side of the half-cut unit 10, so it is called half-cut.

Here, the cutting fragments generated when the laminated film 9 is half-cut are collected, and the cutting fragments are provided at the lower part to be recovered without falling off the cover 12 without being dropped on the attaching portion of the laminated roller 20. The construction. In addition, the recovered cutting debris can be suctioned for automatic disposal.

At the blade portion 14, the protective film 16 is folded back into an acute angle, and the front end 15 of the laminated film after the protective film is bonded to the substrate 4b is pulled out.

The material of the blade portion 14 is a conductive member used to remove static electricity generated when the laminated film 9 is transported and processed or the protective film is peeled. The conductive member is used to connect the frame to the ground to allow static electricity to flow away. structure. In addition, by using a commercially available antistatic rod Improve static elimination effect.

The substrate 4b and the front end 15 of the laminated film positioned at the lamination position are clamped by a clamping mechanism (not shown) of the lamination roll 20, and laminated by thermocompression bonding by a rotation driving mechanism (not shown). At this time, the laminated film 9 is pulled out by the rotation driving of the laminated roller 20.

The film unwinding unit 8 generates a braking torque to the film unwinding shaft by a torque motor or the like, and optimizes the holding tension of the laminated film during lamination.

The winding of the protective film 16 is performed by pulling the protective film 16 out by the protective film transporting roller 17 and winding it by the protective film winding unit 19 for recovery. This protective film conveying speed is controlled to be synchronized with the laminating speed of the laminating roller 20 by the roller driving servo motor 18.

The substrate carrying-out belt section 3 in FIG. 1 receives the substrate 4 c to which the laminated film 21 is attached at a substrate carrying-out belt speed that matches the laminating speed, and carries it out to a device in the next process.

[Example]

In order to prepare for operation, the laminated film 9 is pulled out from the film unwinding unit 8 shown in FIG. 1, the laminated film 9 is passed through each guide roller, and the front end of the laminated film 9 is fixed to the protective film winding unit 19. on.

Next, the laminated film 9 is clamped and fixed by the protective film conveying roller 17. At this time, the roll position of the film pull-out adjustment unit 13 is set at the origin position which is the shortest position of the substrate attachment length, and is also the left end position of the roll movement.

Next, the film unwinding unit 8 and the protective film winding unit 19 are applied to the film unwinding unit 8 and the protective film winding unit 19 by a torque motor or the like, and a rotational torque is applied in a direction in which the laminated film 9 is kept under tension.

Next, the base film and the photoresist layer on the side of the half-cutting unit 10 are half-cut with the half-cutting unit 10 and the cutter support 11, leaving the protective film of the laminated film 9.

Next, the protective film conveying roller 17 is driven by a roller driving servo motor 18 to rotate and pull out the laminated film 9 so that the leading end of the blade portion 14 and the laminated film front end 15 are aligned. The motor 18 pulls out the laminated film 9.

With the above operations, preparation for laminating the laminated film 9 is completed.

At the start of the operation, the substrate 4a is put in from the left side of FIG. It is detected by the integration with the belt roll diameter. The length of the substrate 4a is used to determine the attaching length of the laminated film 9, and the roll position of the film pull-out adjustment unit 13 is moved from the origin to determine the half-cut position. As a driving example of the film pull-out adjustment unit 13, both sides of a roller (not shown) may be supported by a guide rail, and controlled by a ball screw and a pulse motor or a servo motor.

The substrate 4b moved from the substrate 4a of the substrate feeding and conveying belt section 1 to the film stacking section 2 is advanced to the right side of the substrate feeding and conveying belt section 1, and the substrate front end positioning sensor 6 detects the front end of the substrate. The belt conveyor roller rotation detector 7 is placed and controlled so that the substrate 4b is stopped at the bonding position with the front end 15 of the laminated film.

Figure 2 shows the state at the start of the stacking.

Using an air cylinder or the like, the upper and lower rolls of the laminating roll 20 are used to sandwich the substrate 4b at the position of the front end 15 of the laminating film, and the laminating roll 20 is used to hold the laminating roll 20. The laminating roll 20 is rotationally driven while being held. The rotation drive source uses a servo motor or a speed control motor (not shown) to start the stacking operation.

FIG. 3 shows a state in which the substrate 4b is laminated.

Lamination conditions vary depending on the thickness of the substrate and the characteristics of the laminated film, but in general, the rubber surface of the laminated roller 20 is heated to about 110 ° C, which is recommended by the manufacturer of the laminated film 9, under a pressure of about 0.3 The laminated film was laminated at a speed of about 3 m / min at MPa.

Here, the film unwinding unit 8 is used to control the film holding tension, and the constant film holding tension of the laminated film 9 is an important laminating condition. The film holding tension varies with the width and thickness of the laminated film 9, but the optimum value for the general film holding tension is based on approximately 9.8 N / 500 mm width of the film.

As an example of the film maintaining tension of the laminated condition for the formation of fine patterns, the film winding diameter of the film winding unit 8 is gradually reduced due to the consumption of the laminated film 9. Therefore, if the torque motor of the film winding unit 8 is controlled, When the constant torque is fixed, as the winding diameter becomes smaller, the film holding tension acting on the laminated film 9 increases.

Therefore, the film roll is measured with an ultrasonic sensor or a photo sensor. The diameter is controlled such that the torque acting on the film unwinding unit 8 decreases in proportion to the winding diameter of the laminated film 9 as the winding diameter becomes smaller.

FIG. 4 shows a state before the lamination of the substrate 4b is completed.

The laminated film 21 having been laminated is attached by the laminated roller 20, and the laminated film 20 is released at the laminated end position by the laminated film attaching length set by the length of the substrate 4a to end the laminated operation.

At the end of the lamination operation, the front end 15 of the laminated film controls the rotation of the protective film transport roller 17 to stop the film at the front end of the blade portion 14. In the implementation method, the rotation amount of the protective film conveying roller 17 is controlled by a roller driving servo motor 18 with respect to a certain distance from the front end of the blade portion 14 to the clamping position of the laminating roller 20.

As shown in FIG. 1, when the substrate 4b to be loaded next arrives at the lamination position, the roller driving servo motor 18 is rotated to drive the front end 15 of the lamination film to the lamination position, and lamination is started in the same manner as described above.

The film lamination device and the operating method of the film according to the present invention have been described based on the examples, but the present invention is not limited to the structure described in the above embodiment, and can be applied to the scope without departing from the spirit thereof. Make appropriate changes.

[Industrial availability]

The thin film stacking device of the present invention and the operating method thereof can prevent the micro damage of the laminated film which becomes an obstacle to exposure, and has the characteristics of reducing the defective state of the product in the lamination process for forming a fine pattern on a substrate, so it can be suitably used. Used on the surface of a substrate For lamination of a film to which a laminated film such as a photosensitive dry film for pattern formation is attached.

Claims (3)

A thin film stacking device includes a substrate conveying means and a thin film stacking device for attaching a thin film to a thin film stacking portion of a substrate after peeling off a protective film of the multilayer film, and is characterized in that: The length of the film is changed according to the length of the substrate to be inserted. Between the blade and the half-cut position, a film length adjustment mechanism is provided to change the length of the film according to the length of the substrate. The adjustment mechanism half-cuts the laminated film before laminating it at the position where the substrate is attached one piece in length. The continuous protective film is transferred to the blade edge near the laminating roller by the film conveying means, and the protective film is not peeled from the laminated film. It is transported under the ground, and a cut-off prevention piece is provided under the half-cut position. The cut-off prevention piece prevents half-cutting of the laminated film which is pulled out in the vertical direction from the half-cut position. The blade portion that is dropped on the attached substrate and peeled off the protective film is made of a conductive member, and There is a mechanism for static electricity generated when the protective film is peeled off, etc., and the wiring connection frame is grounded to escape this static electricity. The thin film lamination apparatus according to claim 1, wherein the thin film lamination section is a conveyance means that is vertically symmetrically disposed to hold the substrate. A method for operating a thin film lamination device includes a substrate conveying method and a thin film lamination portion attached to the substrate after the protective film of the laminated film is peeled off, and is characterized in that in order to measure the length of the substrate before lamination, The film attachment length is changed in accordance with the length of the substrate to be inserted. Between the blade portion and the half-cut position, a film length adjustment mechanism for changing the film attachment length according to the substrate length is provided, and the film length adjustment mechanism is provided. The laminated film is cut in half at the position where the substrate is attached with a length of one piece, and the continuous protective film is transferred to the blade edge near the laminated roller by the film conveying method without peeling the protective film from the laminated film. It is transported, and a cut-off prevention piece is provided below the half-cut position, and the cut-off prevention piece does not cut the generated cut pieces when the laminated film drawn in the vertical direction of the half-cut position is cut in half. The blade portion to which the protective film is peeled on the attached substrate is made of a conductive member and has a The static electricity generated when the protective film is peeled off, and the mechanism for grounding the wiring connection frame to escape this static electricity. In the standby state without the lamination operation, the protective film of the laminated film attached to the next substrate is peeled off. The substrate is not implemented until it is put in, and the attachment surface such as a photoresist surface is not exposed.