KR20160030367A - Laminating device for film - Google Patents

Laminating device for film Download PDF

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Publication number
KR20160030367A
KR20160030367A KR1020150125436A KR20150125436A KR20160030367A KR 20160030367 A KR20160030367 A KR 20160030367A KR 1020150125436 A KR1020150125436 A KR 1020150125436A KR 20150125436 A KR20150125436 A KR 20150125436A KR 20160030367 A KR20160030367 A KR 20160030367A
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KR
South Korea
Prior art keywords
film
substrate
laminated film
laminated
lamination
Prior art date
Application number
KR1020150125436A
Other languages
Korean (ko)
Inventor
가즈오 다카하시
마코토 오오사와
지카오 이시마루
Original Assignee
가부시키가이샤 히타치 플랜트메카닉스
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Priority to JP2014183028A priority Critical patent/JP6305884B2/en
Priority to JPJP-P-2014-183028 priority
Application filed by 가부시키가이샤 히타치 플랜트메카닉스 filed Critical 가부시키가이샤 히타치 플랜트메카닉스
Publication of KR20160030367A publication Critical patent/KR20160030367A/en

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0073Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0079Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00Ancillary operations in connection with laminating processes
    • B32B38/04Punching, slitting or perforating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0046Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by constructional aspects of the apparatus
    • B32B37/0053Constructional details of laminating machines comprising rollers; Constructional features of the rollers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00Ancillary operations in connection with laminating processes
    • B32B38/10Removing layers, or parts of layers, mechanically or chemically
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061Etching masks
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/281Applying non-metallic protective coatings by means of a preformed insulating foil
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00Ancillary operations in connection with laminating processes
    • B32B38/04Punching, slitting or perforating
    • B32B2038/045Slitting

Abstract

Provided is a film laminating device capable of reducing the rate of defective products by preventing fine cracks on laminated films caused by an exposure failure in a lamination process for forming a micropattern on a substrate. The film laminating device includes carrying means (1,3) for substrates (4a,4b,4c), separates a protective film (16) from a laminated film (9), and attaches the laminated film to the substrates (4a,4b,4c). The film laminating device further includes a film length adjusting mechanism (13) changing a film attachment length according to lengths of the substrates (4a,4b,4c), which is arranged between a knife edge unit (14) and a half-cut position in order to read the lengths of the substrates (4a,4b,4c) and change the film attachment length according to the lengths of the input substrates (4a,4b,4c). The film laminating device performs half-cutting of the laminated film (9) at a single segment position of the film attachment length by the film length adjusting mechanism (13) before a lamination process, and carries the following protective film (16) to the knife edge unit (14) installed near a lamination roll (20) by the film carrying means, without separating the protective film from the laminated film (9).

Description

[0001] LAMINATING DEVICE FOR FILM [0002]

The present invention relates to a film laminating apparatus, and more particularly to a film laminating apparatus for attaching a laminated film such as a photosensitive dry film for pattern formation to a substrate surface of a printed substrate.

BACKGROUND ART [0002] Printed substrates are undergoing a technological innovation centered on mobile devices and cellular phones, and in particular, increasing the size and weight of substrates has become an important issue.

With respect to downsizing of the substrate, the pattern formed on the substrate is made finer and the substrate is made more multilayered, and in the lightening, the substrate is being made thinner.

Here, the formation of the pattern is mainly called a photolithography process, in which a laminated film such as a photosensitive dry film is laminated on a copper clad laminate, and then exposure, development, etching or plating is performed to form a pattern.

A photosensitive dry film or the like is constituted by a laminated film mainly having a three-layer structure, in which a resist film having a photosensitive and thermosetting property is applied on a base film made of a polyester film or the like, and a protective film made of a polyethylene film or the like is laminated thereon It consists of three floors.

Hereinafter, the photosensitive dry film or the like is referred to as a laminated film.

In the lamination process of the film of the printed board production, the protective film of the laminated film is peeled off, and the laminated film is thermally bonded to the copper clad laminate by heating and pressing the resist layer from the base film by a lamination roll as a thermocompression roll .

A problem in lamination processes in performing pattern miniaturization of a printed substrate is that when a laminated film is attached to a substrate, a process of slipping and moving the base film while adsorbing or transporting the base film is carried out , There is a problem that minute scratches are generated in the base film on the adsorption face side by edges such as chamfered portions of the adsorption holes processed in the adsorption plate for adsorbing the film.

The fine scratches of the base film degrade the roughness due to scattering of ultraviolet rays at the time of exposure, and the adherence between the substrate and the resist is poor due to insufficient curing of the resist. In this resist adhesion failure, in the subsequent etching step, the etchant for dissolving copper to form a pattern enters the poorly adhered portion, resulting in defects in cutting the pattern or defects in breaking the pattern.

Further, in the method of forming a pattern by using a resist as a partition wall and performing copper plating, the lower part of the partition due to adhesion failure of the resist between the patterns is broken, the copper plating liquid penetrates between the partitions, Lt; / RTI >

As a countermeasure against micro-scratches of the base film by this adsorption, there is a structure in which the film guide before the completion of the lamination is subjected to the tilting movement of the conveying guide while maintaining the film tension behind the applying roller by the air shower nozzle and the conveying guide (See Patent Document 1).

In addition, there is a problem that, as a factor inhibiting the pattern miniaturization in the laminating process, microscopic foreign matter adheres to the resist surface adhered to the substrate.

This is caused by the fact that the resist surface from which the protective film has been peeled is wet and the floating foreign matter generated from the surrounding environment and the driving source of the apparatus is removed by the static electricity in the peeling electrification upon peeling the protective film, .

Further, when a foreign object such as a cutting chip of a resist chip and a base film generated at the time of cutting a film adheres and falls onto a substrate, foreign matter is mixed in between the resist and the substrate, resulting in poor adhesion of the resist. In this case, the same defects as the above-described resist adhesion failure occur.

As a countermeasure for preventing foreign matters from adhering to the resist surface, there has been proposed a method of peeling the release paper immediately before lamination before the film is coated (see Patent Document 2).

Japanese Patent Application Laid-Open No. 2010-173233 Japanese Patent Application Laid-Open No. 2003-225945

However, when the laminated film is laminated on the substrate, in order to attach the laminated film to the substrate in the form of a frame, it is necessary to cut the laminated film shorter than the length of the substrate in accordance with the length of the inserted substrate.

In the general film cutting method, as disclosed in Patent Document 2, during the laminating process, the back of the laminated film is cut while being held and held along the length of the laminate, and the rear of the laminated film is slid while being adsorbed.

A problem in this method is fine scratches generated in a laminated film by film adsorption.

Further, a problem of this cutting method is that chips cut from the laminated film caused by cutting fall onto the bonded substrate, causing poor adhesion.

In addition, since the blades are moved synchronously with the flowing laminated film, the retention tension of the film in the laminate is fluctuated due to the synchronization failure of the film cutting unit speed with the laminating speed due to the difference in driving source, . ≪ / RTI >

If the holding tension of the film becomes small, wrinkles may be generated due to loosening of the laminated film, and there is a possibility that the film is transferred. In addition, when the film holding tension is increased, vertical wrinkles may occur in the film flow direction, and the film may be transferred.

From this, it is a problem that the film retaining tension maintains the optimum value by the width and the thickness of the laminated film and does not fluctuate.

Further, in the laminate, the quality of holding the film, such as film cutting, does not fluctuate leads to quality improvement.

As a countermeasure for eliminating the holding tension fluctuation of the film, it is conceivable to stop the film flow at the time of cutting the film. However, the surface temperature of the roll needs to be about 110 DEG C due to the resist characteristics of the lamination roll. By stopping the flow of the film in the laminate, quality defects due to the occurrence of thermal unevenness and changes in film thickness due to penetration of the resist occur in the resist portions in contact with the lamination roll.

In the laminated film, the protective film is peeled to expose the resist surface. However, there is a problem that static electricity is generated by peeling electrification at the time of peeling, and the floating foreign matter is adhered to the resist surface by static electricity.

In addition, the protective film is peeled off by the knife edge portion, but static electricity is generated by friction charging by sliding the protective film at the edge portion of the knife, thereby attaching foreign matter to the attachment surface exposed from the edge portion of the knife edge portion.

In the production plant, it is mainstream to flow the substrate for each lot for production control. When the time for substrate injection between the lots becomes long, in the conventional laminate apparatus disclosed in Patent Document 2, In order to press-fit the substrate, the substrate is left in a state in which the front end with the resist surface is exposed.

As a result, the surface of the resist exposed on the surface of the resist is altered by adhesion of moisture, moisture absorption, or the like. As a result, in the manufacturing field, when the substrate standby time becomes long, the apparatus is switched to manual operation, and the exposed resist portions are cut and removed.

This work has a problem of lowering the production efficiency because the automatic operation is stopped and manually performed in the automatic operation line.

The present invention aims to provide a laminating apparatus which solves these problems.

The problem of fine scratches generated in the laminated film by film adsorption is solved by the laminated film according to claim 1, which is half cut before laminating at a position corresponding to one substrate-attached length, and the continuous protective film is used as the film carrying means will be.

The film retaining tension is a value obtained by maintaining the optimum value depending on the width and thickness of the laminated film and performing a half cut before laminating for the problem that it does not fluctuate so that the holding tension of the film is kept constant in the laminate, By means not being carried out during lamination.

More specifically, the present invention relates to a laminate apparatus for a film laminated film, which comprises a substrate carrying means and peels off a protective film of the laminate film and adheres to the substrate, measures the length of the substrate before lamination, A film length adjusting mechanism for changing the film attaching length according to the length of the substrate is provided between the knife edge portion and the half cut position in order to change the film attaching length, And the protective film is conveyed by the film conveying means from the laminated film to the knife edge portion provided near the lamination roll without separating the protective film from the laminated film .

The present invention also relates to a problem that a cutting chip from a laminated film dropped on a bonded substrate caused by cutting causes adherence poorly when the laminated film is half-cut according to claim 2, A fall prevention cover of a cutting chip is provided so as not to cut the chip.

Further, static electricity is generated by peeling electrification at the time of peeling off the protective film, the problem that the floating foreign matter is adhered to the resist surface by static electricity, and the protective film is slipped by the knife edge portion, The knife edge portion for peeling the protective film described in claim 3 has a mechanism for constituting a conductive member and having a mechanism for dropping static electricity generated at the peeling of the protective film to the ground of the housing .

Further, in a standby state in which no lamination operation is performed, the substrate is left in a state in which the front end of the resist is exposed in order to press the substrate. Since the surface of the resist is deformed due to adhesion of foreign matter and moisture absorption, the exposed portion of the resist is cut and removed, and the automatic operation is stopped in the automatic operation line and the operation is performed manually. With respect to the problem, in the standby state in which the lamination operation is not performed, the protection film peeling of the laminated film adhered to the next substrate is not performed until the next substrate is inserted, So that it is not exposed.

INDUSTRIAL APPLICABILITY The present invention has an effect of reducing defective products in a lamination process of forming a fine pattern on a substrate.

1. Defect reduction contents

(1) Prevention of fine scratches on the laminated film as exposure difficulties

(2) Prevention of incorporation of laminated film cutting chips which cause poor resist adhesion

(3) Preservation of film by pre-half cutting and prevention of wrinkle generation

(4) Prevention of sticking of micro-particles causing defective adhesion of resist by static electricity removal

(5) Since the resist is not exposed to the atmosphere in the substrate, foreign matter adherence and deterioration prevention

2. Other effects

Since the adsorption mechanism is not used for film transportation and film holding, by putting the apparatus into a vacuum chamber, a vacuum laminating apparatus can be easily constructed. This vacuum laminator prevents micro voids (microbubbles) that are mixed when laminating in air, contributing to the reduction of defects at the time of fine pattern formation.

1 is a side view explanatory view of a lamination apparatus according to the present invention;
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lamination apparatus.
Fig. 3 is an explanatory view during a lamination operation of a laminate apparatus according to the present invention; Fig.
4 is an explanatory view of the laminate apparatus according to the present invention before completion of the lamination operation.

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment for carrying out a laminating apparatus according to the present invention will be described with reference to the drawings.

Fig. 1 shows a side view of a laminating apparatus according to this embodiment. Fig. 1 shows a laminate film laminated on both sides of a substrate. In the film laminate section 2, a state just before lamination is shown.

The configuration of the apparatus is constituted by a substrate loading conveyor portion 1, a film laminate portion 2, a substrate carry-out conveyor portion 3, and a control device (not shown) for controlling them. Since the film laminate portion 2 is vertically symmetrical, the lower reference marks are omitted.

In Fig. 1, the substrate 4a is conveyed from the left side by a main conveyor or the like, and the substrate width direction is aligned with the film width of the laminated film 9 by a substrate aligning device (not shown) or the like. In the substrate loading conveyor unit 1, the length of the loaded substrate 4a is measured.

This object is achieved by detecting the length of the substrate 4a before laminating and determining the length of the laminated film by the information to determine the length of the laminated film 9 before the laminated film is cut into the half cut unit 10 and the cutter receiving portion 11, To cut the half cut.

The stop of the laminate position of the front end portion of the substrate 4a is set by a control device (not shown) for attaching the laminated film to the specified attaching position.

1, the laminated film 9 is drawn out from the film unwinding unit 8 by the protective film feed roll 17, and the protective film 16 is fed to the laminated film 9, .

The base film and the resist are cut in the half cut unit 10 and the cutter receiving portion 11 with the protective film 16 of the laminated film 9 remaining in the length corresponding to the length of the inserted substrate 4a. Cutting without leaving the protective film on the opposite side of the half-cut unit 10 without cutting all the thicknesses of the laminated film in this way is called a half-cut.

Here, the cutting chips generated when the laminated film 9 is half-cut are collected by the cutting chip falling prevention cover 12 provided at the lower portion thereof, and are not dropped by the attachment portion of the lamination roll 20. Further, the recovered cutting chips can be automatically discarded by suction.

In the knife edge portion 14, the protective film 16 is folded back at an acute angle to pull out the laminated film front end portion 15 from which the protective film to be bonded to the substrate 4b is peeled off.

The knife edge portion 14 is made of a conductive material so as to discharge static electricity generated when the laminated film 9 is transported or peeled off, and is connected to the housing ground by wiring, . Further, by providing a commercially available charge removing bar in combination, the charge removing effect is further improved.

The substrate 4b positioned at the laminate position and the laminated film tip end portion 15 are clamped by a clamping mechanism (not shown) of the lamination roll 20 and laminated while thermocompression is performed by a rotation drive mechanism (not shown). At this time, the laminated film 9 is pulled out by the rotation drive of the lamination roll 20. [

Further, the film unwinding unit 8 generates break torque on the film take-up shaft by a torque motor or the like to optimize the holding tension of the laminated film in laminating.

The protective film 16 is wound by the protective film winding unit 19 by taking out the protective film 16 by the protective film feed roll 17. The protective film feeding speed is controlled by the roller driving servomotor 18 so as to be synchronized with the lamination speed of the lamination roll 20.

1, the substrate 4c to which the laminated laminated film 21 is attached is taken out at the substrate conveying speed synchronized with the lamination speed, and is taken out to the apparatus of the next step.

[Example]

The laminated film 9 is taken out from the film unwinding unit 8 shown in Fig. 1 and the laminated film 9 is passed through each guide roll so that the front end of the laminated film 9 is wound around the protective film Is fixed to the unit (19).

Next, the laminated film 9 is clamped by the protective film feed roll 17. At this time, the roller position of the film pull-out adjustment unit 13 is set to the origin position where the length of the substrate attachment is the shortest, and the left end position of the roller movement.

Next, rotational torque is applied to the film unwinding unit 8 and the protective film winding unit 19 by a torque motor (not shown) in the direction of applying the holding tension to the laminated film 9.

Next, the base film and the resist layer on the side of the half cut unit 10 are half-cut by leaving the protective film of the laminated film 9 by the half cut unit 10 and the cutter receiving unit 11. [

Next, the protective film feed roll 17 is driven to rotate by the roller driving servomotor 18 to pull out the laminated film 9 and the front end portion of the knife edge portion 14 causes the laminated film front end portion 15, The laminated film 9 is pulled out by the servo motor 18 for roller driving.

With the above operation, the laminated film 9 is ready to be laminated.

1, the substrate 4a is inserted, the substrate detection sensor 5 detects the front end and the rear end of the substrate 4a, and the substrate length of the substrate 4a therebetween is detected by a conveyor By integrating the rotation amount of the roller rotation detector 7 and the diameter of the conveyor roller. The attachment length of the laminated film 9 is determined by the length of the substrate 4a and the roller position of the film pull-out adjustment unit 13 is moved from the origin by the attachment length to determine the half cut position. As a driving example of the film pull-out adjustment unit 13, both sides of a roller (not shown) are supported by a guide rail and controlled by a ball screw, a pulse motor or a servo motor.

The substrate 4b on which the substrate 4a of the substrate loading conveyor portion 1 moves to the film laminate portion 2 advances the substrate loading conveyor portion 1 in the right direction, And the conveyor roller rotation detector 7 controls the substrate 4b to stop at the position where it is joined to the laminated film front end portion 15. [

Fig. 2 shows the state at the time of starting the lamination.

The substrate 4b is sandwiched between the upper and lower rolls of the lamination roll 20 at the position of the laminated film front end portion 15 by using an air cylinder or the like not shown and the lamination roll 20 is clamped, The roll 20 is rotated. The rotation driving source starts a lamination operation using a servo motor or a speed control motor (not shown).

Fig. 3 shows the state of the substrate 4b during lamination.

Generally, the rubber surface of the lamination roll 20 is heated to about 110 DEG C, which is the manufacturer's recommendation of the laminated film 9, so that the pressing force is about 0.3 MPa and the speed Laminate the laminated film at about 3 m / min.

Here, the film holding tension is controlled by the film unwinding unit 8, and the holding of the film holding tension of the laminated film 9 becomes an important lamination condition. The film holding tension is different depending on the width and thickness of the laminated film 9 and the like, but an optimum value of a general film holding tension is about 9.8 N / film 500 mm width.

The film take-up diameter of the film take-up unit 8 is reduced by the consumption of the laminated film 9 as the embodiment of the film holding tension as the lamination condition of the fine pattern formation, The film holding tension acting on the laminated film 9 increases as the winding diameter becomes smaller.

Therefore, the film winding diameter is measured by an ultrasonic sensor or a photoelectric sensor or the like, and the torque applied to the film unwinding unit 8 as the winding diameter becomes smaller is controlled so as to decrease in proportion to the winding diameter of the laminated film 9 I do.

Fig. 4 shows the state before the lamination of the substrate 4b is completed.

The laminated film 21 is attached by the lamination roll 20 and the clamp of the lamination roll 20 is opened at the position of the lamination end by the length of the laminated film set from the length of the substrate 4a, .

At the completion of the lamination operation, the laminated film front end portion 15 controls the rotation of the protective film feed roll 17 so as to stop the film flow at the front end of the knife edge portion 14. [ The method of carrying out the control is such that the rotation amount of the protective film feed roll 17 is controlled by the roller driving servomotor 18 for a certain distance from the tip end of the knife edge portion 14 to the clamp position of the lamination roll 20 do.

1, the roller driving servomotor 18 is driven to rotate by the arrival at the laminate position of the substrate 4b to be fed next, and the laminated film front end portion 15 is sent to the laminate position, Laminate.

Although the film lamination apparatus of the present invention has been described above based on the embodiments, the present invention is not limited to the configurations described in the above-mentioned embodiments, You can change it.

Since the laminate apparatus of the film of the present invention prevents micro-scratches of the laminated film as an exposure difficulty, it has a characteristic of being capable of reducing the defective product in the lamination process of forming a fine pattern of the substrate. It can be suitably used as a laminate for a film for attaching a laminated film such as a photosensitive dry film for pattern formation to the surface of a substrate.

1: Substrate feeding conveyor section (conveying means)
2: Film laminate part
3: Substrate carrying-out conveyor section (conveying means)
4a, 4b, and 4c:
5: Substrate detection sensor
6: Positioning sensor
7: Conveyor roller rotation detector
8: Film unwinding unit
9: laminated film
10: Half-cut unit
11: Cutter accommodating portion
12: Chip chip falling prevention cover
13: Film take-out adjusting unit (film length adjusting mechanism)
14: knife edge portion
15: laminated film tip
16: Protective film
17: Protective Film Transfer Roll
18: Servo motor for roller drive
19: protective film winding unit
20: lamination roll
21: laminated finish laminated film

Claims (4)

  1. A laminate apparatus for a film to be attached to a substrate by peeling off a protective film of a laminated film and having a substrate conveying means, wherein the length of the substrate is measured before lamination, and the length of the film is changed A film length adjusting mechanism for changing the film attachment length in accordance with the length of the substrate is provided between the knife edge portion and the half cut position and the film length adjusting mechanism adjusts the position of the laminated film at a position And the continuous protective film is transferred from the laminated film to the knife edge portion provided in the vicinity of the lamination roll by the film conveying means without peeling the protective film from the laminated film. .
  2. The method according to claim 1,
    Wherein when the laminated film is half-cut, a fall prevention cover of a cutting chip for not dropping the cutting chips onto the attached substrate is provided.
  3. 3. The method according to claim 1 or 2,
    Characterized in that the knife edge portion for peeling the protective film has a mechanism which is made of a conductive member and has a mechanism for dropping static electricity generated at the peeling of the protective film to the ground of the housing.
  4. The method according to claim 1, 2, or 3,
    The protective film of the laminated film adhered to the next substrate is not peeled off until the next substrate is put in the standby state in which no lamination operation is performed, Film lamination device.
KR1020150125436A 2014-09-09 2015-09-04 Laminating device for film KR20160030367A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2014183028A JP6305884B2 (en) 2014-09-09 2014-09-09 Film laminating apparatus and operation method thereof
JPJP-P-2014-183028 2014-09-09

Publications (1)

Publication Number Publication Date
KR20160030367A true KR20160030367A (en) 2016-03-17

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Country Status (4)

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JP (1) JP6305884B2 (en)
KR (1) KR20160030367A (en)
CN (1) CN105437722B (en)
TW (1) TWI675738B (en)

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TW201615385A (en) 2016-05-01
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JP6305884B2 (en) 2018-04-04
JP2016055506A (en) 2016-04-21
CN105437722A (en) 2016-03-30

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