TWI675730B - 切削裝置 - Google Patents

切削裝置 Download PDF

Info

Publication number
TWI675730B
TWI675730B TW105100546A TW105100546A TWI675730B TW I675730 B TWI675730 B TW I675730B TW 105100546 A TW105100546 A TW 105100546A TW 105100546 A TW105100546 A TW 105100546A TW I675730 B TWI675730 B TW I675730B
Authority
TW
Taiwan
Prior art keywords
cutting
mounting table
plate
pressure water
burr
Prior art date
Application number
TW105100546A
Other languages
English (en)
Chinese (zh)
Other versions
TW201641242A (zh
Inventor
植山博光
Hiromitsu Ueyama
栗村茂也
Shigeya Kurimura
Original Assignee
日商迪思科股份有限公司
Disco Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商迪思科股份有限公司, Disco Corporation filed Critical 日商迪思科股份有限公司
Publication of TW201641242A publication Critical patent/TW201641242A/zh
Application granted granted Critical
Publication of TWI675730B publication Critical patent/TWI675730B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D79/00—Methods, machines, or devices not covered elsewhere, for working metal by removal of material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Optics & Photonics (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Dicing (AREA)
TW105100546A 2015-02-23 2016-01-08 切削裝置 TWI675730B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015032800A JP6486711B2 (ja) 2015-02-23 2015-02-23 切削装置
JP2015-032800 2015-02-23

Publications (2)

Publication Number Publication Date
TW201641242A TW201641242A (zh) 2016-12-01
TWI675730B true TWI675730B (zh) 2019-11-01

Family

ID=56744413

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105100546A TWI675730B (zh) 2015-02-23 2016-01-08 切削裝置

Country Status (4)

Country Link
JP (1) JP6486711B2 (ja)
KR (1) KR102365979B1 (ja)
CN (1) CN105904029B (ja)
TW (1) TWI675730B (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6965126B2 (ja) * 2017-11-28 2021-11-10 株式会社ディスコ 被加工物の加工方法
CN108941772A (zh) * 2018-07-16 2018-12-07 钱浩 一种具有吸尘防震功能的金属切割机
JP2020088262A (ja) * 2018-11-29 2020-06-04 株式会社ディスコ パッケージ基板の分割方法
CN113257713B (zh) * 2021-05-11 2024-05-17 日月新半导体(苏州)有限公司 集成电路去毛刺装置、集成电路去毛刺辅助装置以及集成电路去毛刺方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007042742A (ja) * 2005-08-01 2007-02-15 Dainippon Screen Mfg Co Ltd 基板洗浄方法および基板洗浄装置
CN1962211A (zh) * 2005-11-07 2007-05-16 株式会社迪斯科 基板的切断装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63209806A (ja) * 1987-02-27 1988-08-31 株式会社日立製作所 ダイシング装置
JP2002305174A (ja) * 2001-04-06 2002-10-18 Seiko Epson Corp 半導体ウェハの洗浄方法
JP2003168659A (ja) * 2001-12-04 2003-06-13 Tokyo Seimitsu Co Ltd 高圧洗浄ノズルを有するシンギュレーション装置
JP2008060284A (ja) * 2006-08-31 2008-03-13 Matsushita Electric Ind Co Ltd 半導体基板の洗浄方法および洗浄装置
KR20090024408A (ko) * 2007-09-04 2009-03-09 삼성전자주식회사 스크라이브 래인 내의 금속 버를 제거하는 노즐을 갖는웨이퍼 소잉 장치, 웨이퍼 소잉 방법 및 이를 이용하여제작된 반도체 패키지
JP2010123823A (ja) * 2008-11-21 2010-06-03 Disco Abrasive Syst Ltd 切削装置
CN201994267U (zh) * 2010-12-31 2011-09-28 上海新阳半导体材料股份有限公司 高压水喷淋装置用喷嘴联箱
JP2014123590A (ja) * 2012-12-20 2014-07-03 Disco Abrasive Syst Ltd 洗浄装置
JP2014143322A (ja) * 2013-01-24 2014-08-07 Disco Abrasive Syst Ltd 洗浄装置、及び、洗浄方法
JP6134591B2 (ja) * 2013-06-19 2017-05-24 株式会社ディスコ パッケージ基板の加工方法及び該加工方法の実施に使用する切削装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007042742A (ja) * 2005-08-01 2007-02-15 Dainippon Screen Mfg Co Ltd 基板洗浄方法および基板洗浄装置
CN1962211A (zh) * 2005-11-07 2007-05-16 株式会社迪斯科 基板的切断装置

Also Published As

Publication number Publication date
KR102365979B1 (ko) 2022-02-22
JP2016157723A (ja) 2016-09-01
CN105904029B (zh) 2019-08-16
CN105904029A (zh) 2016-08-31
TW201641242A (zh) 2016-12-01
JP6486711B2 (ja) 2019-03-20
KR20160102889A (ko) 2016-08-31

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