TWI674043B - 印刷配線板 - Google Patents

印刷配線板 Download PDF

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Publication number
TWI674043B
TWI674043B TW104100717A TW104100717A TWI674043B TW I674043 B TWI674043 B TW I674043B TW 104100717 A TW104100717 A TW 104100717A TW 104100717 A TW104100717 A TW 104100717A TW I674043 B TWI674043 B TW I674043B
Authority
TW
Taiwan
Prior art keywords
resin
resin composition
printed wiring
wiring board
solder resist
Prior art date
Application number
TW104100717A
Other languages
English (en)
Chinese (zh)
Other versions
TW201540138A (zh
Inventor
Shigeo Nakamura
中村茂雄
Genjin Mago
真子玄迅
Original Assignee
Ajinomoto Co., Inc.
日商味之素股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ajinomoto Co., Inc., 日商味之素股份有限公司 filed Critical Ajinomoto Co., Inc.
Publication of TW201540138A publication Critical patent/TW201540138A/zh
Application granted granted Critical
Publication of TWI674043B publication Critical patent/TWI674043B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
TW104100717A 2014-02-19 2015-01-09 印刷配線板 TWI674043B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014-029832 2014-02-19
JP2014029832A JP6761224B2 (ja) 2014-02-19 2014-02-19 プリント配線板、半導体装置及び樹脂シートセット

Publications (2)

Publication Number Publication Date
TW201540138A TW201540138A (zh) 2015-10-16
TWI674043B true TWI674043B (zh) 2019-10-01

Family

ID=53852785

Family Applications (2)

Application Number Title Priority Date Filing Date
TW108126622A TWI708528B (zh) 2014-02-19 2015-01-09 樹脂薄片
TW104100717A TWI674043B (zh) 2014-02-19 2015-01-09 印刷配線板

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW108126622A TWI708528B (zh) 2014-02-19 2015-01-09 樹脂薄片

Country Status (4)

Country Link
JP (1) JP6761224B2 (ja)
KR (3) KR102290572B1 (ja)
CN (3) CN113068320A (ja)
TW (2) TWI708528B (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6852332B2 (ja) * 2015-10-28 2021-03-31 味の素株式会社 接着フィルム
JP6728760B2 (ja) * 2016-02-25 2020-07-22 味の素株式会社 支持体付き樹脂シート
JP6748663B2 (ja) * 2017-03-31 2020-09-02 太陽インキ製造株式会社 硬化性組成物、ドライフィルム、硬化物およびプリント配線板
JP6825580B2 (ja) * 2018-01-12 2021-02-03 味の素株式会社 プリント配線板の製造方法
CN113068313A (zh) * 2021-03-05 2021-07-02 江西展耀微电子有限公司 一种线路板的制作方法及其制作的线路板、电子设备

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070221400A1 (en) * 2006-03-27 2007-09-27 Fujitsu Limited Multilayer interconnection substrate, semiconductor device, and solder resist
TW200938044A (en) * 2007-10-15 2009-09-01 Shinko Electric Ind Co Method for manufacturing wiring board
US20100132982A1 (en) * 2008-12-02 2010-06-03 Samsung Electro-Mechanics Co., Ltd. Package substrate including solder resist layer having pattern parts and method of fabricating the same
US7859110B2 (en) * 2006-04-28 2010-12-28 Sumitomo Bakelite Co., Ltd. Solder resist material, wiring board using the solder resist material, and semiconductor package
US20110108982A1 (en) * 2009-11-09 2011-05-12 Hynix Semiconductor Inc. Printed circuit board
JP2012146990A (ja) * 2012-02-22 2012-08-02 Sumitomo Bakelite Co Ltd 多層回路基板、多層回路基板の製造方法および半導体装置
US20120250268A1 (en) * 2009-12-14 2012-10-04 Taiyo Holdings Co., Ltd. Photosensitive resin composition, dry film thereof, and printed wiring board using them
JP2013102062A (ja) * 2011-11-09 2013-05-23 Ibiden Co Ltd 半導体実装部材及びその製造方法
JP2013247333A (ja) * 2012-05-29 2013-12-09 Kyocer Slc Technologies Corp 配線基板およびその製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1226752C (zh) * 2001-01-29 2005-11-09 捷时雅株式会社 介电体用复合颗粒、超微颗粒复合树脂颗粒、介电体形成用组合物及其用途
JP3914239B2 (ja) * 2005-03-15 2007-05-16 新光電気工業株式会社 配線基板および配線基板の製造方法
JP5352175B2 (ja) 2008-03-26 2013-11-27 太陽ホールディングス株式会社 感光性樹脂組成物及びその硬化物、並びにその硬化物からなるソルダーレジスト層を有するプリント配線基板
JP4473935B1 (ja) * 2009-07-06 2010-06-02 新光電気工業株式会社 多層配線基板
JP6123152B2 (ja) * 2010-12-08 2017-05-10 味の素株式会社 樹脂組成物
JP2012198361A (ja) * 2011-03-22 2012-10-18 Fujifilm Corp 感光性組成物、感光性フィルム、永久パターン形成方法、永久パターン、及びプリント基板
JP2013115171A (ja) * 2011-11-28 2013-06-10 Hitachi Chemical Co Ltd プリント配線板及びその製造方法並びに熱硬化性樹脂組成物
WO2014010204A1 (ja) * 2012-07-13 2014-01-16 日本化薬株式会社 アルカリ現像型樹脂、それを用いた感光性樹脂組成物

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070221400A1 (en) * 2006-03-27 2007-09-27 Fujitsu Limited Multilayer interconnection substrate, semiconductor device, and solder resist
US7859110B2 (en) * 2006-04-28 2010-12-28 Sumitomo Bakelite Co., Ltd. Solder resist material, wiring board using the solder resist material, and semiconductor package
TW200938044A (en) * 2007-10-15 2009-09-01 Shinko Electric Ind Co Method for manufacturing wiring board
US20100132982A1 (en) * 2008-12-02 2010-06-03 Samsung Electro-Mechanics Co., Ltd. Package substrate including solder resist layer having pattern parts and method of fabricating the same
US20110108982A1 (en) * 2009-11-09 2011-05-12 Hynix Semiconductor Inc. Printed circuit board
US20120250268A1 (en) * 2009-12-14 2012-10-04 Taiyo Holdings Co., Ltd. Photosensitive resin composition, dry film thereof, and printed wiring board using them
JP2013102062A (ja) * 2011-11-09 2013-05-23 Ibiden Co Ltd 半導体実装部材及びその製造方法
JP2012146990A (ja) * 2012-02-22 2012-08-02 Sumitomo Bakelite Co Ltd 多層回路基板、多層回路基板の製造方法および半導体装置
JP2013247333A (ja) * 2012-05-29 2013-12-09 Kyocer Slc Technologies Corp 配線基板およびその製造方法

Also Published As

Publication number Publication date
CN113068320A (zh) 2021-07-02
KR102290572B1 (ko) 2021-08-19
JP2015154064A (ja) 2015-08-24
TW201941670A (zh) 2019-10-16
CN113038700A (zh) 2021-06-25
CN104853538A (zh) 2015-08-19
TWI708528B (zh) 2020-10-21
KR20150098216A (ko) 2015-08-27
KR20210100574A (ko) 2021-08-17
KR102572916B1 (ko) 2023-09-01
KR20220144351A (ko) 2022-10-26
JP6761224B2 (ja) 2020-09-23
TW201540138A (zh) 2015-10-16

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