TWI672800B - 半導體裝置的製造方法，基板處理裝置，氣體供給系統及記錄媒體 - Google Patents
半導體裝置的製造方法，基板處理裝置，氣體供給系統及記錄媒體 Download PDFInfo
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- TWI672800B TWI672800B TW104136160A TW104136160A TWI672800B TW I672800 B TWI672800 B TW I672800B TW 104136160 A TW104136160 A TW 104136160A TW 104136160 A TW104136160 A TW 104136160A TW I672800 B TWI672800 B TW I672800B
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Chemical Vapour Deposition (AREA)
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Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014234401 | 2014-11-19 | ||
| JP2014-234401 | 2014-11-19 | ||
| JP2015-185891 | 2015-09-18 | ||
| JP2015185891A JP6100854B2 (ja) | 2014-11-19 | 2015-09-18 | 半導体装置の製造方法、基板処理装置、ガス供給システムおよびプログラム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201637135A TW201637135A (zh) | 2016-10-16 |
| TWI672800B true TWI672800B (zh) | 2019-09-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW104136160A TWI672800B (zh) | 2014-11-19 | 2015-11-03 | 半導體裝置的製造方法，基板處理裝置，氣體供給系統及記錄媒體 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6100854B2 (enExample) |
| KR (1) | KR101822238B1 (enExample) |
| TW (1) | TWI672800B (enExample) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
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| KR101960763B1 (ko) * | 2016-11-03 | 2019-03-21 | 주식회사 유진테크 | 저온 에피택셜층 형성방법 |
| JP2018113322A (ja) | 2017-01-11 | 2018-07-19 | 株式会社日立国際電気 | 半導体装置の製造方法、プログラムおよび基板処理装置 |
| JP6778139B2 (ja) * | 2017-03-22 | 2020-10-28 | 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ | 半導体装置の製造方法、基板処理装置およびプログラム |
| KR102325148B1 (ko) | 2017-03-31 | 2021-11-10 | 가부시키가이샤 코쿠사이 엘렉트릭 | 반도체 장치의 제조 방법, 기판 처리 장치 및 컴퓨터 프로그램 |
| JP6777624B2 (ja) | 2017-12-28 | 2020-10-28 | 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ | 半導体装置の製造方法、基板処理装置、およびプログラム |
| JP7058575B2 (ja) * | 2018-09-12 | 2022-04-22 | 株式会社Kokusai Electric | 半導体装置の製造方法、基板処理方法、基板処理装置、およびプログラム |
| JP7199286B2 (ja) * | 2019-03-29 | 2023-01-05 | 東京エレクトロン株式会社 | 基板処理装置 |
| JP7065818B2 (ja) * | 2019-10-28 | 2022-05-12 | 株式会社Kokusai Electric | 半導体装置の製造方法、基板処理方法、基板処理装置、およびプログラム |
| KR102328573B1 (ko) * | 2020-01-17 | 2021-11-17 | 성균관대학교산학협력단 | C-free 할로겐 기반의 가스를 이용한 실리콘 산화막 대비 높은 식각 선택비를 갖는 실리콘 질화막 건식 식각 방법 |
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| JP2016105457A (ja) | 2016-06-09 |
| JP6100854B2 (ja) | 2017-03-22 |
| KR20160059952A (ko) | 2016-05-27 |
| TW201637135A (zh) | 2016-10-16 |
| KR101822238B1 (ko) | 2018-01-25 |
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