TWI670214B - 容器搬送設備 - Google Patents

容器搬送設備 Download PDF

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Publication number
TWI670214B
TWI670214B TW105113735A TW105113735A TWI670214B TW I670214 B TWI670214 B TW I670214B TW 105113735 A TW105113735 A TW 105113735A TW 105113735 A TW105113735 A TW 105113735A TW I670214 B TWI670214 B TW I670214B
Authority
TW
Taiwan
Prior art keywords
container
support
carrier
support body
large container
Prior art date
Application number
TW105113735A
Other languages
English (en)
Chinese (zh)
Other versions
TW201700371A (zh
Inventor
吉岡秀郎
山崎貴文
Original Assignee
日商大福股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商大福股份有限公司 filed Critical 日商大福股份有限公司
Publication of TW201700371A publication Critical patent/TW201700371A/zh
Application granted granted Critical
Publication of TWI670214B publication Critical patent/TWI670214B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G35/00—Mechanical conveyors not otherwise provided for
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G37/00—Combinations of mechanical conveyors of the same kind, or of different kinds, of interest apart from their application in particular machines or use in particular manufacturing processes
    • B65G37/005—Combinations of mechanical conveyors of the same kind, or of different kinds, of interest apart from their application in particular machines or use in particular manufacturing processes comprising two or more co-operating conveying elements with parallel longitudinal axes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/22—Devices influencing the relative position or the attitude of articles during transit by conveyors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H10P72/0608—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1918—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1921—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by substrate supports
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3216—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations using a general scheme of a conveying path within a factory
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3218—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3222—Loading to or unloading from a conveyor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3408—Docking arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
    • B65G2201/02—Articles
    • B65G2201/0235—Containers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
    • B65G2201/02—Articles
    • B65G2201/0297—Wafer cassette

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Warehouses Or Storage Devices (AREA)
  • Branching, Merging, And Special Transfer Between Conveyors (AREA)
  • Supplying Of Containers To The Packaging Station (AREA)
  • Robotics (AREA)
TW105113735A 2015-05-14 2016-05-03 容器搬送設備 TWI670214B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015098947A JP6332133B2 (ja) 2015-05-14 2015-05-14 容器搬送設備
JP2015-098947 2015-05-14

Publications (2)

Publication Number Publication Date
TW201700371A TW201700371A (zh) 2017-01-01
TWI670214B true TWI670214B (zh) 2019-09-01

Family

ID=57276148

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105113735A TWI670214B (zh) 2015-05-14 2016-05-03 容器搬送設備

Country Status (6)

Country Link
US (1) US10081494B2 (https=)
JP (1) JP6332133B2 (https=)
KR (1) KR102450289B1 (https=)
CN (1) CN106144468B (https=)
SG (1) SG10201603438QA (https=)
TW (1) TWI670214B (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10672639B2 (en) 2016-12-07 2020-06-02 Taiwan Semiconductor Manufacturing Co., Ltd. Method for automatic sending cassette pod
US10409814B2 (en) * 2017-01-26 2019-09-10 International Business Machines Corporation Network common data form data management
JP6769336B2 (ja) * 2017-02-23 2020-10-14 株式会社ダイフク 物品搬送車
US10622236B2 (en) * 2017-08-30 2020-04-14 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus and method for handling wafer carrier doors
US10734268B1 (en) * 2017-08-30 2020-08-04 Murata Machinery, Ltd. Modularity of Tec-Cell, FOUP and substrate containers and carriers
JP6969512B2 (ja) 2018-07-05 2021-11-24 株式会社ダイフク 物品搬送装置
EP4371667A3 (en) * 2019-05-03 2024-07-31 Gen-Probe Incorporated Receptacle transport system for an analytical system
TWI855237B (zh) * 2021-02-28 2024-09-11 艾迪森科技有限公司 半導體晶圓盒滾輪式運輸結構系統
US11822257B2 (en) * 2021-03-12 2023-11-21 Gudeng Precision Industrial Co., Ltd. Reticle storage pod and method for securing reticle
US20230016251A1 (en) * 2021-07-15 2023-01-19 Taiwan Semiconductor Manufacturing Company, Ltd. Compound fork device and system including the same
CN114873304B (zh) * 2022-03-30 2023-01-31 西南交通大学 一种适用于不同货物包装尺寸的车载巷道式装载装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201641231A (zh) * 2015-03-26 2016-12-01 村田機械股份有限公司 物品之支撐裝置及支撐方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09221203A (ja) * 1996-02-19 1997-08-26 Hitachi Ltd 自動搬送システム
JP3832293B2 (ja) 2001-08-31 2006-10-11 株式会社ダイフク 荷保管設備
JP4474922B2 (ja) * 2004-01-07 2010-06-09 シンフォニアテクノロジー株式会社 ロードポート装置
JP5131558B2 (ja) * 2008-12-02 2013-01-30 株式会社ダイフク 物品搬送装置
JP5207079B2 (ja) * 2009-09-28 2013-06-12 株式会社ダイフク 容器搬送設備
JP5321913B2 (ja) * 2009-12-07 2013-10-23 株式会社ダイフク 物品保管設備
JP5522477B2 (ja) * 2010-12-17 2014-06-18 株式会社ダイフク 搬送設備
JP6047228B2 (ja) * 2013-03-15 2016-12-21 株式会社日立国際電気 基板処理装置、半導体装置の製造方法およびプログラム
US9142437B2 (en) * 2013-04-10 2015-09-22 Globalfoundries Inc. System for separately handling different size FOUPs
SG11201600344RA (en) * 2013-09-27 2016-04-28 Murata Machinery Ltd Article support device and method for placing two types of articles on support device
JP6052209B2 (ja) * 2014-03-11 2016-12-27 株式会社ダイフク 容器搬送設備
JP6233340B2 (ja) * 2015-03-26 2017-11-22 村田機械株式会社 ストッカ及び物品の支持方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201641231A (zh) * 2015-03-26 2016-12-01 村田機械股份有限公司 物品之支撐裝置及支撐方法

Also Published As

Publication number Publication date
KR102450289B1 (ko) 2022-09-30
KR20160134507A (ko) 2016-11-23
SG10201603438QA (en) 2016-12-29
JP6332133B2 (ja) 2018-05-30
US20160336209A1 (en) 2016-11-17
CN106144468B (zh) 2019-10-18
JP2016216137A (ja) 2016-12-22
US10081494B2 (en) 2018-09-25
TW201700371A (zh) 2017-01-01
CN106144468A (zh) 2016-11-23

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