TWI669837B - 發光裝置 - Google Patents

發光裝置 Download PDF

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Publication number
TWI669837B
TWI669837B TW104107889A TW104107889A TWI669837B TW I669837 B TWI669837 B TW I669837B TW 104107889 A TW104107889 A TW 104107889A TW 104107889 A TW104107889 A TW 104107889A TW I669837 B TWI669837 B TW I669837B
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TW
Taiwan
Prior art keywords
type side
electrode pad
light
side electrode
type
Prior art date
Application number
TW104107889A
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English (en)
Chinese (zh)
Other versions
TW201603335A (zh
Inventor
梅津典雄
松村孝
Original Assignee
日商迪睿合股份有限公司
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Publication of TW201603335A publication Critical patent/TW201603335A/zh
Application granted granted Critical
Publication of TWI669837B publication Critical patent/TWI669837B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
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    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
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    • H01L33/38—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
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    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
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    • H01L33/64—Heat extraction or cooling elements
    • H01L33/641—Heat extraction or cooling elements characterized by the materials
TW104107889A 2014-03-12 2015-03-12 發光裝置 TWI669837B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014048750 2014-03-12
JPJP2014-048750 2014-03-12

Publications (2)

Publication Number Publication Date
TW201603335A TW201603335A (zh) 2016-01-16
TWI669837B true TWI669837B (zh) 2019-08-21

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TW104107889A TWI669837B (zh) 2014-03-12 2015-03-12 發光裝置

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JP (1) JP2015188078A (ko)
KR (1) KR102348352B1 (ko)
CN (1) CN106233479B (ko)
TW (1) TWI669837B (ko)
WO (1) WO2015137414A1 (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107170880B (zh) * 2017-07-14 2019-09-27 上海天马微电子有限公司 发光单元及显示装置
JP6942589B2 (ja) * 2017-09-27 2021-09-29 旭化成株式会社 半導体発光装置および紫外線発光モジュール
CN111179750A (zh) * 2019-12-12 2020-05-19 武汉华星光电技术有限公司 显示面板的结构和其制作方法
TWI773538B (zh) * 2021-09-24 2022-08-01 友達光電股份有限公司 自發光裝置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1471179A (zh) * 2002-07-05 2004-01-28 ��ķ�ɷ����޹�˾ 半导体发光器件

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