TWI669296B - 用於電沉積含金之層之組合物及方法 - Google Patents

用於電沉積含金之層之組合物及方法 Download PDF

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Publication number
TWI669296B
TWI669296B TW104127802A TW104127802A TWI669296B TW I669296 B TWI669296 B TW I669296B TW 104127802 A TW104127802 A TW 104127802A TW 104127802 A TW104127802 A TW 104127802A TW I669296 B TWI669296 B TW I669296B
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TW
Taiwan
Prior art keywords
gold
composition
substrate
plating
mercaptotriazole
Prior art date
Application number
TW104127802A
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English (en)
Chinese (zh)
Other versions
TW201615628A (zh
Inventor
賈那 布萊特斐爾德
勞伯特 路特
歐拉夫 寇特茲
Original Assignee
德國艾托特克公司
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First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=51390050&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TWI669296(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 德國艾托特克公司 filed Critical 德國艾托特克公司
Publication of TW201615628A publication Critical patent/TW201615628A/zh
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Publication of TWI669296B publication Critical patent/TWI669296B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/16—Regeneration of process solutions
    • C25D21/18—Regeneration of process solutions of electrolytes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/48—Electroplating: Baths therefor from solutions of gold
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
TW104127802A 2014-08-25 2015-08-25 用於電沉積含金之層之組合物及方法 TWI669296B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
??14182083.7 2014-08-25
EP14182083.7A EP2990507A1 (fr) 2014-08-25 2014-08-25 Composition, utilisation de la composition et procédé pour le dépôt galvanique de couches contenant de l'or

Publications (2)

Publication Number Publication Date
TW201615628A TW201615628A (zh) 2016-05-01
TWI669296B true TWI669296B (zh) 2019-08-21

Family

ID=51390050

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104127802A TWI669296B (zh) 2014-08-25 2015-08-25 用於電沉積含金之層之組合物及方法

Country Status (8)

Country Link
US (1) US20170159195A1 (fr)
EP (2) EP2990507A1 (fr)
JP (1) JP6726173B2 (fr)
KR (1) KR102315943B1 (fr)
CN (1) CN106661751B (fr)
SG (1) SG11201700461VA (fr)
TW (1) TWI669296B (fr)
WO (1) WO2016030290A1 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3315635B1 (fr) 2015-06-26 2020-11-04 Metalor Technologies (Japan) Corporation Solution électrolytique d'or dure comprenant un inhibiteur de substitution
CN108063219B (zh) * 2017-11-23 2020-01-10 浙江大学 一种高效液态碱金属合金电极及其制备方法和应用
US11674235B2 (en) * 2018-04-11 2023-06-13 Hutchinson Technology Incorporated Plating method to reduce or eliminate voids in solder applied without flux
CN108998817B (zh) * 2018-07-06 2021-04-16 鹤山市精工制版有限公司 一种打底镀镍液用添加剂及其应用
CN108754554B (zh) * 2018-09-18 2019-10-22 泉州益丰贵金属科技有限公司 一种镀金液及一种镀金方法
WO2023285604A1 (fr) 2021-07-15 2023-01-19 Seolfor Aktiebolag Compositions d'électrodéposition et leurs procédés de préparation

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040069641A1 (en) * 2002-09-30 2004-04-15 Shinko Electric Industries Co., Ltd. Non-cyanogen type electrolytic solution for plating gold
CN1896334A (zh) * 2005-06-02 2007-01-17 罗门哈斯电子材料有限公司 改进的金合金电解液

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4868123B2 (ja) * 2005-02-04 2012-02-01 学校法人早稲田大学 金−ニッケル系アモルファス合金めっき皮膜、電気めっき液及び電気めっき方法
JP4868121B2 (ja) * 2005-12-21 2012-02-01 学校法人早稲田大学 アモルファス金−ニッケル系合金めっき皮膜形成用電気めっき液及び電気めっき方法
CN102105623B (zh) * 2008-06-11 2013-10-02 日本高纯度化学株式会社 电镀金液和使用该电镀金液而得的金皮膜
US8608931B2 (en) * 2009-09-25 2013-12-17 Rohm And Haas Electronic Materials Llc Anti-displacement hard gold compositions
ITFI20120103A1 (it) * 2012-06-01 2013-12-02 Bluclad Srl Bagni galvanici per l'ottenimento di una lega di oro a bassa caratura e processo galvanico che utilizza detti bagni.

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040069641A1 (en) * 2002-09-30 2004-04-15 Shinko Electric Industries Co., Ltd. Non-cyanogen type electrolytic solution for plating gold
CN1896334A (zh) * 2005-06-02 2007-01-17 罗门哈斯电子材料有限公司 改进的金合金电解液

Also Published As

Publication number Publication date
SG11201700461VA (en) 2017-03-30
CN106661751A (zh) 2017-05-10
CN106661751B (zh) 2019-11-12
WO2016030290A1 (fr) 2016-03-03
EP3186413A1 (fr) 2017-07-05
JP2017527700A (ja) 2017-09-21
JP6726173B2 (ja) 2020-07-22
TW201615628A (zh) 2016-05-01
US20170159195A1 (en) 2017-06-08
KR20170046651A (ko) 2017-05-02
EP2990507A1 (fr) 2016-03-02
KR102315943B1 (ko) 2021-10-21
EP3186413B1 (fr) 2019-02-06

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