SG11201700461VA - Composition, use thereof and method for electrodepositing gold containing layers - Google Patents
Composition, use thereof and method for electrodepositing gold containing layersInfo
- Publication number
- SG11201700461VA SG11201700461VA SG11201700461VA SG11201700461VA SG11201700461VA SG 11201700461V A SG11201700461V A SG 11201700461VA SG 11201700461V A SG11201700461V A SG 11201700461VA SG 11201700461V A SG11201700461V A SG 11201700461VA SG 11201700461V A SG11201700461V A SG 11201700461VA
- Authority
- SG
- Singapore
- Prior art keywords
- composition
- containing layers
- gold containing
- electrodepositing gold
- electrodepositing
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/48—Electroplating: Baths therefor from solutions of gold
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/16—Regeneration of process solutions
- C25D21/18—Regeneration of process solutions of electrolytes
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP14182083.7A EP2990507A1 (fr) | 2014-08-25 | 2014-08-25 | Composition, utilisation de la composition et procédé pour le dépôt galvanique de couches contenant de l'or |
PCT/EP2015/069234 WO2016030290A1 (fr) | 2014-08-25 | 2015-08-21 | Composition, son utilisation et procédé d'électrodéposition de couches contenant de l'or |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201700461VA true SG11201700461VA (en) | 2017-03-30 |
Family
ID=51390050
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201700461VA SG11201700461VA (en) | 2014-08-25 | 2015-08-21 | Composition, use thereof and method for electrodepositing gold containing layers |
Country Status (8)
Country | Link |
---|---|
US (1) | US20170159195A1 (fr) |
EP (2) | EP2990507A1 (fr) |
JP (1) | JP6726173B2 (fr) |
KR (1) | KR102315943B1 (fr) |
CN (1) | CN106661751B (fr) |
SG (1) | SG11201700461VA (fr) |
TW (1) | TWI669296B (fr) |
WO (1) | WO2016030290A1 (fr) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107709628B (zh) * | 2015-06-26 | 2020-06-16 | 美泰乐科技(日本)股份有限公司 | 用于电解硬质金镀敷液的防置换剂和包含其的电解硬质金镀敷液 |
CN108063219B (zh) * | 2017-11-23 | 2020-01-10 | 浙江大学 | 一种高效液态碱金属合金电极及其制备方法和应用 |
US11674235B2 (en) * | 2018-04-11 | 2023-06-13 | Hutchinson Technology Incorporated | Plating method to reduce or eliminate voids in solder applied without flux |
CN108998817B (zh) * | 2018-07-06 | 2021-04-16 | 鹤山市精工制版有限公司 | 一种打底镀镍液用添加剂及其应用 |
CN108754554B (zh) * | 2018-09-18 | 2019-10-22 | 泉州益丰贵金属科技有限公司 | 一种镀金液及一种镀金方法 |
EP4370732A1 (fr) | 2021-07-15 | 2024-05-22 | Seolfor Aktiebolag | Compositions d'électrodéposition et leurs procédés de préparation |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004176171A (ja) * | 2002-09-30 | 2004-06-24 | Shinko Electric Ind Co Ltd | 非シアン電解金めっき液 |
JP4868123B2 (ja) * | 2005-02-04 | 2012-02-01 | 学校法人早稲田大学 | 金−ニッケル系アモルファス合金めっき皮膜、電気めっき液及び電気めっき方法 |
SG127854A1 (en) * | 2005-06-02 | 2006-12-29 | Rohm & Haas Elect Mat | Improved gold electrolytes |
JP4868121B2 (ja) * | 2005-12-21 | 2012-02-01 | 学校法人早稲田大学 | アモルファス金−ニッケル系合金めっき皮膜形成用電気めっき液及び電気めっき方法 |
JP4719822B2 (ja) * | 2008-06-11 | 2011-07-06 | 日本高純度化学株式会社 | 電解金めっき液及びそれを用いて得られた金皮膜 |
US8608931B2 (en) * | 2009-09-25 | 2013-12-17 | Rohm And Haas Electronic Materials Llc | Anti-displacement hard gold compositions |
ITFI20120103A1 (it) * | 2012-06-01 | 2013-12-02 | Bluclad Srl | Bagni galvanici per l'ottenimento di una lega di oro a bassa caratura e processo galvanico che utilizza detti bagni. |
-
2014
- 2014-08-25 EP EP14182083.7A patent/EP2990507A1/fr not_active Withdrawn
-
2015
- 2015-08-21 SG SG11201700461VA patent/SG11201700461VA/en unknown
- 2015-08-21 KR KR1020177004453A patent/KR102315943B1/ko active IP Right Grant
- 2015-08-21 EP EP15753055.1A patent/EP3186413B1/fr active Active
- 2015-08-21 US US15/327,389 patent/US20170159195A1/en not_active Abandoned
- 2015-08-21 WO PCT/EP2015/069234 patent/WO2016030290A1/fr active Application Filing
- 2015-08-21 CN CN201580044927.8A patent/CN106661751B/zh active Active
- 2015-08-21 JP JP2017511313A patent/JP6726173B2/ja active Active
- 2015-08-25 TW TW104127802A patent/TWI669296B/zh active
Also Published As
Publication number | Publication date |
---|---|
EP2990507A1 (fr) | 2016-03-02 |
JP6726173B2 (ja) | 2020-07-22 |
US20170159195A1 (en) | 2017-06-08 |
CN106661751B (zh) | 2019-11-12 |
TWI669296B (zh) | 2019-08-21 |
EP3186413A1 (fr) | 2017-07-05 |
CN106661751A (zh) | 2017-05-10 |
TW201615628A (zh) | 2016-05-01 |
KR102315943B1 (ko) | 2021-10-21 |
JP2017527700A (ja) | 2017-09-21 |
WO2016030290A1 (fr) | 2016-03-03 |
EP3186413B1 (fr) | 2019-02-06 |
KR20170046651A (ko) | 2017-05-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
IL304772A (en) | Antibodies, uses and methods | |
SG11201608711RA (en) | Material itq-55, method for preparation and use | |
HK1200505A1 (en) | Gold electroplating method and hard gold preparation method | |
HK1209442A1 (en) | Film for biosensors and preparation method | |
SG11201607359XA (en) | Polishing composition, polishing method, and method for producing substrate | |
EP2927210A4 (fr) | Plastifiants, composition de résine, et leur procédé de fabrication | |
SG11201702215RA (en) | Polishing composition, method for manufacturing same, and polishing method | |
SG11201700461VA (en) | Composition, use thereof and method for electrodepositing gold containing layers | |
SG11201608128UA (en) | Polishing composition and polishing method | |
RS62071B1 (sr) | Bioaktivni protein, njegova primena i postupak za proizvodnju | |
SG11201607461PA (en) | Polishing composition and polishing method using the same | |
GB201412213D0 (en) | Material,composition and method | |
PT3305675T (pt) | Embalagem | |
HK1243437A1 (zh) | 一類三肽化合物及其製備方法與應用 | |
GB201520255D0 (en) | Composition and method | |
EP3196272A4 (fr) | Matériau de polissage, composition pour le polissage, et procédé de polissage | |
PL3158017T3 (pl) | Żywica, skład i zastosowanie | |
GB201705822D0 (en) | Proppant composition and method | |
GB201405715D0 (en) | Methods, apparatus and materials | |
IL246870B (en) | Method for preparing 1-alkyl-3-difluoromethyl-5-fluoro-1h-pyrazole-4-carbaldehydes and 1-alkyl-3-difluoromethyl-5-fluoro-1h-pyrazole-4-carboxylates | |
IL247797A0 (en) | A device for measuring sugar and a method for its use | |
ZA201503784B (en) | Tunneling method | |
IL250223B (en) | A method for the preparation of the pyrimidine-1-ol compound, and its intermediates | |
SG10202105363YA (en) | Sunshade apparatus and method for its use. | |
PT3240897T (pt) | Complexo multicamadas, método de fabrico e utilização do complexo |