TWI668772B - 於一埋置式固化區固化一熱可固化之材料的技術 - Google Patents

於一埋置式固化區固化一熱可固化之材料的技術 Download PDF

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TWI668772B
TWI668772B TW102146588A TW102146588A TWI668772B TW I668772 B TWI668772 B TW I668772B TW 102146588 A TW102146588 A TW 102146588A TW 102146588 A TW102146588 A TW 102146588A TW I668772 B TWI668772 B TW I668772B
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heat
curing
radiation
thermally conductive
substrate
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TW102146588A
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TW201434099A (zh
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傑洛恩 范登布蘭德
亞休克 斯利哈
安賈 海肯斯
剛瑟 德瑞森
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荷蘭Ｔｎｏ自然科學組織公司
漢高公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/1403—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the type of electromagnetic or particle radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/18—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated tools
    • B29C65/22—Heated wire resistive ribbon, resistive band or resistive strip
    • B29C65/221—Heated wire resistive ribbon, resistive band or resistive strip characterised by the type of heated wire, resistive ribbon, band or strip
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
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Abstract

本發明有關一種於一埋置式固化區固化一熱可固化材料的方法及由此方法形成的組合件。此方法包含提供一部份配置於一元件與一基材間的熱傳導條，在元件與基材間形成埋置式固化區。熱傳導條由該埋置式固化區延伸至一可獲得輻射區，其與該埋置式固化區相距且至少部分無該元件或該基材。此方法更包含在可獲得輻射區藉由電磁輻射照射該熱傳導條。藉由該熱傳導條吸收電磁輻射所產生的熱自該可獲得輻射區沿該熱傳導條的長度傳導至該埋置式固化區以藉由將自該熱傳導條發散的熱傳導至該埋置式固化區而固化該熱可固化材料。

Description

於一埋置式固化區固化一熱可固化之材料的技術 發明領域
本發明有關一種於一埋置式固化區固化一熱可固化材料的方法。本發明更有關使用一固化系統的方法。本發明更有關一種含有一基材與黏著至該基材之一元件的組合件，該元件係藉由在該元件與該基材間之埋置式固化區中形成的熱可固化材料黏著。
發明背景
典型地，一熱可固化材料藉由加熱材料，例如高於一固化溫度及/或於一固化期間而固化。典型地，固化涉及一相轉變如材料的硬化，例如歸因於分子的交聯。固化區為一相標區或體積，其中固化定位的熱可固化材料以達成其功能，例如表面黏著在一起。在“埋置式固化區”中的“埋置式”一詞為指固化區的至少部分包覆，例如固化區包埋在一組合件中，其包含遮斷物如元件及/或基材包圍固化區。
一埋置式固化區通常難以接受外部的加熱源如燈或雷射。例如描述於US2003/0162463或WO2006/126015中的解決方案為提供輻射-通透基材並經由此基材照射固 化區。然而，此僅適於當埋置式固化區可獲得到電磁輻射。例如在JP2003218281中描述的另一解決方案可為提供一內加熱源，其藉由在固化區旁埋置電阻絲並選擇性的施加電流至電阻絲以加熱之。JP2008-085287描述一相鄰連接元件的加熱電路。然而，此可能需要額外的電路及/或該電路可能對鄰近的電子元件有害。JP2001-044241描述施加熱及/或電磁波至具有接合層的IC晶片，同時壓制晶片至形成在基材上的電路上。然而，加熱IC晶片對其功能可能有害。一解決方案為在一般的情況下於埋置式固化區提供一預期的固化溫度以加熱全部的組合件，例如藉在一烘箱中烘烤組合件。然而，此一不區別的加熱可能是低效的能量及/或對可能為組合件之部分的熱敏性元件有害件。
需要一在埋置式固化區固化熱可固化材料之更通用的方法。
發明概要
在第一態樣中為提供一種於一埋置式固化區固化一熱可固化材料的方法。此方法包含提供一在遮斷物間形成之埋置式固化區間配置一熱傳導條部分。熱傳導條由埋置式固化區延伸至可獲得輻射區，其距埋置式固化區一段距離且至少部分無遮斷物。此方法更包含在可獲得輻射區藉由電磁輻射而照射熱傳導條。藉由在熱傳導條吸收電磁輻射而產生的熱由可獲得輻射區沿熱傳導條長度傳導至埋置式固化區以經由傳導自熱傳導條發散的熱至埋置式固 化區而固化熱可固化材料。
即使當不易接近直接照射的固化區，一於埋置式固化區與可獲得輻射區間延伸的熱傳導條可允許固化區經由電磁輻射的加熱。因為經由電磁輻射的吸收而產生的熱，此方法在接近可能敏感的電路不需要電流的應用。藉由使用一熱傳導條導熱至固化區以取代照射晶片本身，例如依照JP2001-044241，可防止晶片過量的熱。電磁輻射可針對在可獲得輻射區的條，其可能比加熱整個組合件有效。因此，提供一在埋置式固化區固化熱可固化材料的方法為更通用的，例如提供一能源效率同時能適合不同的情況如不透明表面包覆固化區及/或敏性電路。更進一步瞭解一熱傳導條的提供可併入一現有的設計及/或製造流程中。
在一第二態樣中，本發明提供一種用於使用一固化系統的方法，此系統包含一輻射源。此方法包含提供一基材給予該系統，該系統包含一部份配置於該基材與在該基材上之元件間的熱傳導條，該元件與該基材在其間形成一埋置式固化區，該熱傳導條由該埋置式固化區延伸至一可獲得輻射區，其與該埋置式固化區相距且至少部分無該元件或該基材。此方法更包含控制該系統以經由自該輻射源發散的電磁輻射在該可獲得輻射區照射該熱傳導條。藉由將該熱傳導條吸收電磁輻射所產生的熱自該可獲得輻射區沿該熱傳導條的長度傳導至該埋置式固化區以藉由傳導由該熱傳導條發散的熱至該埋置式固化區而固化該熱可固化材料。
依第二態樣的方法可提供相似於第一態樣方法之優點，雖然使用一含有輻射源之通用或專用的固化系統。
在一第三態樣中，提供一種含有一基材與黏著至該基材之元件的組合件，該元件係藉由在該元件與該基材間之埋置式固化區中形成的熱可固化材料黏著；其中一熱傳導條部份配置在該基材與該元件間，該熱傳導條由該埋置式固化區向可獲得輻射區延伸至與埋置式固化區該相距且至少部分無該基材或該元件；其中該熱可固化材料藉由將自該熱傳導條發散之熱傳導至該埋置式固化區而固化。
依第三態樣的組合件可例如源自第一或第二態樣的方法。
1‧‧‧熱可固化材料
2、2a、2b、2c、2d‧‧‧埋置式固化區
2’‧‧‧埋置式固化區的第二部分
3、3A、3B、3C、3a、3b、3c、3d‧‧‧熱傳導條
3i‧‧‧熱絕緣裝置
4a、4b‧‧‧熱
5‧‧‧輻射源
6‧‧‧電磁輻射
6b‧‧‧輻射
7、7a、7b、7c、7d‧‧‧可獲得輻射區
7’‧‧‧可獲得區之第一部份
9、10‧‧‧遮斷物
9b‧‧‧邊界
11‧‧‧電路元件/電通路
12‧‧‧遮罩
20‧‧‧固化系統
D‧‧‧距離
G‧‧‧固化梯度
X‧‧‧長度
Y‧‧‧寬度
Z‧‧‧厚度
本發明的裝置、系統與方法的其他特徵、態樣及優點可由後文的詳細說明、後附的申請項及附圖而更佳的瞭解。其中：圖1顯示一說明在一埋置式固化區固化熱可固化材料的方法之橫切面圖；圖2顯示熱傳導條之三實施例的頂視圖；圖3顯示一說明在多個埋置式固化區固化熱可固化材料之方法的實施例之立體圖；圖4A顯示一說明在一於一元件與一基材間的埋置式固化區固化熱可固化材料的方法之實施例的側視圖；圖4B顯示圖4A實施例經由基材的底視圖；圖5說明在介於元件與在基材上之電通路間之埋置式 固化區中固化熱可固化材料之方法的實施例側視圖；圖6A顯示一在烘箱固化之在埋置式固化區的熱可固化材料的顯微鏡影像；圖6B顯示圖6A之影像的放大圖。
圖7A顯示一經由照射熱傳導條固化之在埋置式固化區的熱可固化材料的顯微鏡影像；圖7B顯示圖7A之影像的放大圖。
圖8顯示一說明用於在埋置式固化區中固化熱可固化材料之方法的另一實施例的橫切面圖。
較佳實施例之詳細說明
除非相反的定義，在本文中使用的所有詞彙(包括技術及科學詞彙)具有熟於本發明所屬技術領域人士在閱讀本說明書前後文與附圖時通常理解之相同的意義。應更進一步瞭解，除非特別指明，如在通常使用之字典中所定義的詞應被解釋為具有與其在相關技術內容之定義一致的定義，且不能被解釋為理想化或過於正式的含意。在某些例子中，可能省略已知裝置及方法的詳細描述，以避免阻礙本發明系統與方法的描述。用於描述特定實施例的詞彙並非意欲用於限制本發明。如本文使用的單數詞“一(a)”、“一(an)”及“此(the)”，除非在文中清楚的指明，其為欲同時包括複數形式。“及/或”一詞包括附隨提及項目之一或更多的任何及所有之組合。可更瞭解“包含(comprises)”及/或“包含(comprising)”特別指明述及之特徵之存在，但未排除一或 更多其他特徵的存在或加入。在本文中提及之所有的公開刊物、專利說明書、專利及其他參考文獻以其全文併入本文參考。在有衝突處，以本發明說明書包括定義部份為准。
在本說明書中使用的“熱可固化”一詞為指任何材料當曝露至熱時可化學性及/或物理性的可固化。“化學性可固化”意指任何材料當曝露至熱時可進行化學固化或交聯反應。“物理性可固化”意指任何材料於一乾製程中在熱存在下藉由損失揮發組份如溶劑，例如有機溶劑而能夠固化。
通常，熱能可由例如輻射、傳導及/或對流提供和/或傳送。在本發明中，熱經由輻射的吸收供應至一條狀物並藉由此條的傳導性沿此條傳送。加熱一材料如一條狀物及/或熱可固化材料，可典型地導致材料溫度的上升至高於室溫，例如高於20℃的溫度。為有效固化，一高於80℃的溫度較佳，更較佳為高於100℃，最較佳為高於120℃或甚至更高，例如200℃。
固化可在一延長的時間進行，例如一固化時間可包含數秒至高達數分鐘或更長的時間，例如數小時。一固化可依供應至固化區的熱能總量而定。對於某些應用，有預期溫度的上限，例如低於熱可固化材料或其他熱-敏性元件的裂解溫度。對應地，有最少的固化時間以達到預期的固化態。一材料的固化態為累加的，例如一材料可由第一態固化至第二態並接著由第二態至第三態。一材料的固化速率可依如溫度、濕度、輻射及/或施加壓力而變。一材料當其性質改變至實現預期的功能時，例如黏著及/或傳導， 可被認為已固化。
一實施例，熱可固化材料可包括一黏著劑。一熱可固化黏著劑的功能性為將相鄰表面接合在一起。典型地，黏著劑包含一形成黏著劑的材料與一接觸材料的表面在當其固化時接著。黏著劑的固化可包含黏著劑的硬化，例如由一液態至一固態。固化亦可包含黏著劑的黏性增加。在一實施例中，一黏著劑包含藉由聚合作用而固化的化合物。且，可使用其他熱可固化黏著劑。
在又一實施例中，熱可固化材料為熱可固化導電黏著劑，亦即可導電的黏著劑。此一黏著劑通常包含一或更多的熱固性樹脂及導電粒子或由其組成。合宜的熱固性樹脂可選自環氧樹脂、苯並噁嗪樹脂、丙烯酸樹脂、雙馬來醯亞胺樹脂、氰酸酯樹脂、聚異丁烯樹脂及/或其等之組合。導電粒子可選自金屬粒子、鍍金屬的粒子或金屬合金粒子及/或其等之組合，其中該導電粒子較佳包含銅、銀、鉑、鎘、金、錫、銦、鋁、或鉬及/或其等之組合或基本上由其組成。基本上由銀組成的導電粒子為特別佳。預期地，鍍或塗覆金屬的組合包括銀塗覆的銅、銀塗覆的氮化硼及/或銀塗覆的鋁。在一可替換的實施例中，導電粒子包含碳黑、碳纖維、石墨或金屬塗覆之玻璃球如銀塗覆之玻璃及/或其等之組合或由其等組成。較佳地，導電粒子具有約3μm至約20μm的體積平均粒子大小(D50)，更較佳為約4μm至約15μm。導電粒子可具有不同的形狀，如球形及/或似片狀形狀。
在一實施例中，在一埋置於元件與基材間的固化區提供一熱可固化黏著劑，如一熱可固化導電黏著劑。一元件可例如包含一電或光學元件。此基材可包含能負載此元件的任何結構。此基材亦可包含電氣或光學功能。在一實施例中，此基材本身可為一電氣或光學元件，例如以在其間的黏著劑形成一堆疊結構。
一熱可固化材料的另一範例包括一熱可固化導電墨水，亦即一導電的墨水。此一墨水通常包含一或更多樹脂、導電粒子與一或更多溶劑或由其等組成。此導電粒子對應至前述的粒子。依在該墨水中使用的樹脂組份之化化學性質，此熱可固化導電墨水可化學的固化及/或物理的固化。典型地，導電墨水的固化可包含乾燥，例如揮發一溶劑。熱可固化導電墨水的溶劑可為易於在低至中溫揮發的有機溶劑。較佳的有機溶劑具有低於200℃的閃點。
一熱可固化導電墨水的功用可為提供一電連接。此墨水在多種基材材料如聚酯的上畫或印刷為電路。需瞭解典型地，雖然導電墨水的直接照射可能受到輻射的反射，一熱傳導條可促進能量以傳導的熱傳送至墨水。在一實施例中，熱可固化材料包含在一箔上的印刷墨水。在另一實施例中，一熱可固化導電墨水於基材間埋置的固化區為做為一電路徑。
此熱可固化導電黏著劑或熱可固化導電墨水可更包含一或更多的添加劑，如固化劑、增塑劑、油、安定劑、抗氧化劑、抗腐蝕劑、螯合劑、顏料、染料、聚合物 添加劑、去泡劑、保存劑、增稠劑、流變改質劑、保濕劑、黏著促進劑及分散劑。
在固化區提供熱可固化材料。此固化區可在遮斷物間埋置，亦即阻隔進入固化區的結構，尤其阻隔由外部能量源之電磁輻射的直接進入。例如，遮斷物可阻斷大於90百分比的來自外部源的電磁輻射。固化區因此可有效或實際的不可獲得電磁輻射。在一實施例中，來自輻射源的電磁輻射經由在輻射源與埋置式固化區間配置之遮斷物阻隔，例如一不透明元件如一晶片。熱傳導條可向埋置式固化區傳導由吸收電磁輻射產生的熱。熱可固化材料的固化因此藉由提供一延伸接近一固化區的熱傳導條而變得容易。熱傳導條較佳與熱可固化材料熱接觸以促進熱傳送。或者，此條亦可接近熱可固化材料，例如在埋置式固化區傳送輻射偏離此條的部份或全部的熱。
本發明於後文中參考附圖而更充分描述，其中顯示本發明的實施例。然而，本發明可以許多不同形式實施且不應解釋為受限於本文所說明的實施例。相反地，提供此些實施例為使本發明的揭露更詳盡及完整，且將本發明的範疇充分傳達給熟於此項技藝人士。例示實施例的說明意在配合附圖閱讀，其應被視為完整說明的部分。在圖式中，為清楚起見，系統、元件、層及區域的大小與相對大小被誇大。實施例為參考本發明之可能理想實施例與中介結構的示意圖之橫切面圖描述。
在本說明中，相關詞以及其等之衍生應解釋為有 關如所描述的或如在討論之圖示中顯示的目的。此些相關詞係為了便於描述且除非指明，不需要系統在一特定目的被解釋或操作。更要瞭解當一組件或層為被指為“在...上(on)”、“連接至(connectedto)”或“耦合至(coupledto)”另一組件或層，其為直接在其他組件或層之上、連接或耦合至其他組件或層，或可存在介入組件或層。相反地，當一組件被指為“直接在...上”、“直接連接至”或“直接耦合至”另一組件或層，其為無介入組件或層。進一步瞭解當一方法的特定步驟被指為接續於另一步驟時，其直接接著該其他步驟或在執行特定步驟前執行一或更多中間步驟。相似的標號為指相似的組件。
圖1顯示一說明在一埋置式固化區2固化熱可固化材料1的方法之橫切面圖。
本發明方法包含提供一熱傳導條3，其係部分地配置於遮斷物9與10間，其中該遮斷物9與10之間形成埋置式固化區2。熱傳導條3由埋置式固化區2延伸至可獲得輻射區7，其遠離埋置式固化區2且至少部分無遮斷物9與10。使用“至少部分無”一詞為指此條在可獲得輻射區7未被遮斷物遮蔽，特別是可獲得電磁輻射。
本發明方法更包含在可獲得輻射區7經由電磁輻射6照射熱傳導條3。因為遮斷物9、10，埋置式區2實際上不能獲得輻射6b。在熱傳導條3中藉由吸收電磁輻射6而產生的熱4a由可獲得輻射區7沿熱傳導條3的長度X經過熱傳導條3超過至少一距離D至埋置式固化區2以藉由傳導自熱 傳導條3發出的熱4b至埋置式固化區2以固化該熱可固化材料1。
在一實施例中，在該埋置式固化區2中該熱可固化材料1包含一熱可固化黏著劑，該埋置式固化區2係形成於一基材10與在該基材10之上的一元件9之間。因此，在此實施例中，該等遮斷物包含該基材及該元件。該熱傳導條3係部分地配置在該元件9與該基材10間並由該埋置式固化區2延伸超越該元件9之邊界9b至該可獲得輻射區，例如一當以輻射源5觀點看該熱傳導條3所觀察到的邊界。在該實施例中，此方法包含經由固化在該元件9與該基材10間的熱可固化黏著劑1以接合該元件9至該基材10。
圖2顯示熱傳導條3A、3B、3C之三實施例的頂視圖。實施例3A的立體圖3A’顯示在此實施例中包含一長度X、寬度Y及厚度Z之平條。此條包含一將放置於輻射可獲得區之第一部份7’與將放置於埋置式固化區的第二部分2’。部分2’及7’以沿此條的長度X彼此遠離一距離D，在此長度上熱將經由此條自可獲得輻射區傳導至埋置式固化區。
如熱傳導條之實施例3B之頂視圖所示，此條的寬度Y可變化的。在實施例3C的頂視圖中，其顯示此條之第一部分7’較寬，例如具有提供較大標的利於電磁輻射衝擊此條的優點。亦顯示實施例3C的第二部分2’較寬，例如具有在埋置式固化區提供較大表面利於發出熱的優點。此些實施例說明熱傳導條的形狀為可變的。
通常，熱傳導條為一界定沿此條之長度尺寸X在 可獲得輻射區與埋置式固化區間之熱傳導路徑的結構。此條典型包含具有遠小於長度X之寬度Y的薄結構，例如3倍或更多，典型為5倍或更多。窄條的優點為此條的熱容保持相對低且積蓄的熱相對於寬度Y更易於沿此條的長度X在可獲得輻射區與埋置式固化區間分散。典型地，此條可包含一扁平結構，例如條的寬度Y可大於厚度Z，例如為3倍或更多。一扁平條的優點為可獲得較大的面積，例如以在可獲得輻射區接受照射及/或在埋置式固化區分散熱能。或者，此條的厚度與寬度可大約相同，例如此條可成形為一線。在實施例3C中，此條可包含經由一線形的中間部份較大的區段7’與2’。
熱傳導條的尺寸可依其使用的應用而決定。典型地，條的長度X可在數百微米至高達數公分間變化。長度X主要藉由埋置式固化區與可獲得輻射區間的距離D。典型地，此條的寬度Y可在一沉積工具例如一列印機的解析度自數微米至數毫米間變化。寬度Y亦可由電磁輻射照射此條以加熱此條之圖案的解析度決定，及/或由預期的熱容或熱傳送效率而決定。典型地，條的厚度Z由沉積的材料量而決定，例如在一列印製程中由數微米至數毫米或更多。一最小厚度藉由預期之可靠的熱傳輸而決定。其他尺寸亦為可能的。此條可用一沉積作用工具沉積，如列印機。此條亦可由光刻製程(lithographic process)製成。且，其他用於提供條的方法亦可用，例如此條可包含置於埋置式固化區與可獲得輻射區間之材料的預製條。
熱傳導條的設置為用於沿條的長度X傳導熱，其中長度為指此條的最長尺寸。此相反於經此條的寬度Y或厚度Z熱傳導，其等典型不涉及於一顯著距離傳導熱。在一實施例中，埋置式固化區為距離可獲得輻射區當沿熱傳導條之熱-傳導路徑長度D量測時為大於一公分。
此條可包含一彎折或彎曲的結構，其中該熱-傳導路徑依循此結構的彎折或彎曲。此條亦可包含多熱-傳導路徑，例如分割此條。在一實施例中，此條可與元件或其電路電隔離，其亦防止熱傳遞至元件，例如當此元件為熱敏性的。或者，例如元件的電路線亦可做為熱傳導條。此具有的優點為不需要額外的條。在一實施例中，可配置一電路線且適於執行一熱傳導條的功能。例如，此電路線可在可獲得輻射區與埋置式固化區間間延伸。
一條當具有一相對高熱傳導性時可視為熱-傳導。在一實施例中，熱傳導條的熱傳導性例如沿條的長度測量為每公尺每克耳文為大於100瓦特(Watt per meter per Kelvin)，較佳每公尺每克耳文為大於150瓦特，更較佳每公尺每克耳文為大於200瓦特。對於某些應用，一較低的熱傳導性亦為足夠的，例如較佳每公尺每克耳文為高於10瓦特。熱傳導為指在單位時間內通過具特定長度X及橫切面(例如，寬度Yx厚度Z)之條且當此條沿其長度X的相對側相差一單位溫度時的熱量。典型地，熱傳導與此條的熱傳導性及橫切面積成正比而與可獲得輻射區7及埋置式固化區2間的距離D成反比。典型地，愈高的熱傳導性，由可獲得輻射區至 埋置式固化區愈快的能量傳遞。此可促進更多的能量傳送及沉積於埋置式固化區，而不是受限於可獲得輻射區中。
或者或另外，提供一具有相對低熱容或比熱的熱傳導條為有利的。典型地，對於較低的比熱，在熱傳導條的能量沉積小於用於加熱此條的本身且更多的熱通過例如至埋置式固化區。
或者或另外，使介於可獲得輻射區與埋置式固化區間之路徑D的熱漏離最小化為有利的。一解決方案為使熱傳導條至少沿路徑D的外表面與橫切面積之比例最小化。典型地，一最小的比例為相當於一具有圓形橫切面的熱傳導條，亦即桿或線形狀。可替代或額外的，在一實施例中(例如3C所示)，熱傳導條在可獲得輻射區與埋置式固化區間的路徑D提供一熱絕緣裝置3i，其設置用於防止熱由熱傳導條沿該路徑散出。此優點在於熱可更有效的在可獲得輻射區與埋置式固化區間傳送，取代部份沿路徑D損失。在一實施例中，熱絕緣裝置3i可以圍繞熱傳導條的部分之包體提供。在另一實施例中，熱絕緣裝置3i亦可在熱傳導條之上及/或下的熱絕緣層提供。
在一實施例中，此條包含熱傳導金屬或由其組成。範例可包括一含有鋁、金、銅或銀或由其組成的條。此條亦具有一提供相對高熱傳導性的優點，例如每公尺每克耳文為高於100瓦特。在一實施例中，此條可包含金屬或已固化的印刷墨水。此條可具有一優點為其易於使用一列印機施用，同時仍具有可接受的熱傳導率，例如每公尺每克耳 文為高於10瓦。在又一實施例中，墨水可經由傳導源自可獲得輻射區的熱沿黑水軌跡逐步固化。在另一實施例中，此條包含氮化鋁。此材料可提供相對高的熱傳導性之優點且同時相對的電絕緣，例如提供較少的短路風險。
能量較佳經由在可獲得輻射區吸收的電磁輻射提供給此條。此電磁輻射例如可在可見光、紫外光或紅外線波長範圍。典型地，此條在電磁輻射範圍包含一足夠高的吸收係數，例如吸收照射到該條上之至少50百分比的輻射，較佳為更多。此條較佳至少部分可獲得電磁輻射，例如至少50%之衝擊至含有此條的組合件之輻射可直接到達此條。較佳地，此條至少部分曝露至輻射。在一實施例中，可獲得輻射區通過包覆熱傳導條之通透結構照射，亦即至少部分對電磁輻射通透。此仍提供的優點在於埋置式固化區不需要直接獲得電磁輻射。
較佳地，以一方向性電磁輻射自一特定輻射源提供能量至此條。可經由使用一方向性源得到一方向性電磁輻射，例如雷射及/或藉由使用光學元件如鏡片、鏡及/或孔指向及成形輻射。此相反於一無方向性的熱，例如在一烘箱中，其中熱更均質及/或不區別的撞擊在一組合件上。較佳地，可控制電磁輻射的模式以照射一特定區域，特別是在可獲得輻射區的條。在一實施例中，電磁輻射的光源可包含一燈或雷射。例如，可導向雷射至照射此條為主，同時避免照射接近此條的熱敏性元件。在一實施例中，電磁輻射實質上僅撞擊一或更多熱傳導條，例如大於80百分比 的入射電磁輻射撞擊此條。在一實施例中，一遮罩設置於電磁輻射的光路徑上以成形一由光源投射出的模式至一或更多的條上。
圖3顯示一說明在多個埋置式固化區固化熱可固化材料之方法的實施例之立體圖。在顯示的實施例中，固化區於基材上在基材10與元件9間形成。在顯示的實施例中，提供在複數個可獲得輻射區7a、7b、7c、7d與對應之複數個埋置式固化區2a、2b、2c、2d間延伸的複數個熱傳導條3a、3b、3c、3d。雖然熱傳導條3a、3b、3c、3d顯示為分別的條，此條亦可互連，例如形成一具有多個分支的單一條。
在一實施例中，在電磁輻射6的光路徑上設置一光罩(未顯示)以選擇性的在複數個可獲得輻射區7a、7b、7c、7d指向電磁輻射6。或者，此電磁輻射6可包含例如由雷射產生的分離束。此束可撞擊複數個可獲得輻射區7a、7b、7c、7d，其可為同時、連續、或組合式例如先照射區7a與7b及接著照射區7c與7c。
圖4A顯示一說明使用一固化系統20的方法之實施例的側視圖。固化系統20包含一輻射源5。此方法包含提供一具有基材10的系統20，其在該基材10上包含一部分配置於基材10與元件9間之熱傳導條3。元件9與基材10在其間形成一埋置式固化區2。熱傳導條3由埋置式固化區2延伸至可獲得輻射區7，其遠離埋置式固化區2且至少部分無元件9或基材10。此方法更包含控制固化系統20以在可獲得輻射 區7經由自輻射源5發出的電磁輻射6照射熱傳導條3。藉由在熱傳導條3吸收電磁輻射6產生的熱4a沿熱傳導條3的長度由可獲得輻射區7傳導至埋置式固化區2以藉由傳導自熱傳導條3發散的熱4b進入埋置式固化區2而固化熱可固化材料1。
在一實施例中，輻射源5進一步用於一光刻步驟(lithographic step)中以曝露出在元件9及/或基材10上包含的電路圖案。在一實施例中，提供含有電路圖案之第一光罩及提供含有對應一或更多熱傳導條3之一或更多可獲得輻射區7的照射圖案第二光罩。
在顯示的實施例中，不是所有的熱可固化材料1為埋置於遮斷物9與10間，例如部份的熱可固化材料1延伸超越元件9的邊界9b。且，此熱可固化材料1可經由熱傳導條3加熱。在一實施例中，熱傳導條3比熱可固化材料1具有一較高的電磁輻射6之吸收係數。因此，熱傳導條3比熱可固化材料1在吸收電磁輻射6更有效。熱可固化材料1主要經由熱傳導條3加熱，而不是電磁輻射6直接吸收的結果。可瞭解此方法亦可應用至不吸收光之固化黏著劑或其他熱可固化材料。
在顯示的實施例中，電磁輻射6不僅照射熱傳導條3亦及於元件9。因為熱傳導條3的存在，熱可比藉由元件9更有效的傳送至埋置式固化區2。此意指元件9較少被加熱。在一實施例中(顯示於例如圖5中)，可放置一輻射屏蔽以覆蓋元件9免於電磁輻射6。或者或另外，電磁輻射6可以一光 罩(未顯示)或其他光學元件於輻射源5與元件9及基材間成形以選擇性的傳送及/或定向電磁輻射6至熱傳導條3的可獲得輻射區7。
圖4B顯示圖4A實施例經由基材10的底視圖。如顯示，電路元件11間提供熱傳導條3，在此例子中電路為電連接元件。在此實施例中，熱傳導條3為介於中央埋置式固化區2與二可獲得輻射區7間延伸的一元件。或者或除了專用的熱傳導條3，電路元件11亦可促進自可獲得輻射區7至埋置式固化區2的熱傳送。有利地，電路元件11不包含主動元件如電晶體，其可能因過熱而受損。因此，不同於例如使用元件本身傳送熱至埋置式固化區2的方法。
較佳地，至少50%，更較佳為至少90%之在埋置式固化區2用於固化熱可固化材料1的積蓄熱為經由熱傳導條3提供，其不論是專用於此功能及/或包含於被動電路如電連接線或軌跡中者。對於一使用電連接線為熱傳導條的實施例，可以理解的是電傳導線亦提供有利的熱-傳導性質。再者，可以理解的是一元件典型經由形成黏著劑連結接近一電連接而黏著至一基材，其可能位於一晶片之下，亦即在元件與基材間的埋置式固化區中。
圖5顯示說明在介於元件9與在基材10上之電通路11間之埋置式固化區2中固化熱可固化材料1之方法的實施例側視圖。在可獲得輻射區7衝擊電通路11的電磁輻射6可行進至於埋置式固化區2的熱可固化材料1以藉由在埋置式固化區2中的電通路11發出的熱固化熱可固化材料1。此 電通路11因此可做為一熱傳導條。
在一實施例中，熱可固化材料1為電傳導且可配置在由電通路11與元件9間形成之電路的路徑上。在此方式中，熱可固化材料1可成為電通路11的部分，同時亦提供元件9與基材10間的結合。
在一實施例中，電磁輻射6選擇性的由遮罩12屏蔽以主要在熱傳導條3的可獲得輻射區7傳遞電磁輻射6並避免元件9及/或此基材的其他部分。此可防止輻射及/或熱敏感性元件之不預期的劣化。
圖6A顯示一組合件的顯微鏡影像，其包含基材10與藉由於元件9與基材10間的埋置式固化區2形成的熱可固化材料1黏著至基材10之元件9。在此組合件中，熱可固化材料1經由將組合件置於一烘箱中於120℃下10分鐘而固化。
元件9、基材10及電通路11可具有相似於在圖5中顯示的配置。顯示的元件包含一用於黏著劑結合之測試目的之0-歐姆電阻。顯示的電通路11包含一使用網印沉積在基材上的銀軌跡。顯示的基材10包含一聚乙烯對苯二甲酸酯(PET)箔。顯示的熱可固化材料1包含一由Henkel公司取得之“HysolECCOBONDCE3103WLV”的已知導電環氧黏著劑。
圖6B顯示以比例顯示圖6A之影像的放大圖。可注意到熱固化的材料1仍包含一顆粒結構。
圖7A顯示為相似於圖6A之顯微鏡影像，除了熱可固化材料1以熱傳導條3僅照射7秒而固化。在此時間內， 以光子裝置提供一約0.1焦耳之總輻射劑量，其中使用在可見光範圍、由聚光源產生的電磁輻射於可獲得輻射區7照射此條。
在一實施例中，使用一描述於EP2349727的光子裝置照射熱傳導條3。尤其，此裝置包含一在箔表面固化一物質之固化圖樣的裝置，其包含用於在一物體平面內承載箔的載體裝置，一配置在物體平面第一側之光子輻射源以在一波長範圍內發射光子輻射，故此箔為透明的，配置於物體平面之相互相對面的第一及第二凹反射面以映射由光子輻射源發出的光子輻射至物體平面，此光子輻射源為配置在第一凹反射面及物體平面間。在又一實施例中，此光子輻射源為一具一長軸的管狀輻射器且該第一與第二反射面為沿長軸沿伸的圓柱面。在一實施例中，管狀輻射器包含一氙氣閃光灯。
亦可使用另一裝置，例如一包含電磁輻射的雷射束在可獲得輻射區選擇性導向熱傳導條。此電磁輻射亦可以其他裝置如光罩選擇性的導向。藉由選擇性的導向電磁輻射至熱傳導條，其可防止其他(例如熱敏性)元件被照射。因此，在一實施例中，輻射為指向輻射區而不是固化區(亦即在固化區所在之基材/元件的位置)。
如顯示，熱傳導條3(在此範例中亦為一傳導軌跡)為部分配置在基材10與元件9間。熱傳導條3由埋置式固化區2延伸至一可獲得輻射區7，其與埋置式固化區2有距離且至少部分無基材10或元件9。熱可固化材料1經由在可獲得 輻射區7接受、由熱傳導條3傳導及由熱傳導條3發散至埋置式固化區2的傳導熱至而固化。
圖7B顯示圖7A影像的放大圖。當與圖6B之烘箱-固化試樣比較，可注意到熱-固化材料1包含較少的顆粒結構。此可歸因於熱可固化材料1的燒結。且，做為熱傳導條3的銀軌跡顯示的燒結的徵兆。此燒結可藉由熱傳導條3周圍所經歷的高溫及/或能量釋出所反映。因由熱傳導條3發散的熱之結果，熱可固化材料1顯示為包含一固化梯度G，其中該熱可固化材料1較遠離熱傳導條3的距離為較少固化。此為與烘箱固化之組合件相比較的差異。
儘管在固化時間的大差異，圖6A、6B之烘箱固化組合件與圖7A、7B之“光子”固化組合件所得到大約相同的連接件電阻與黏著性強度。在橫切面影像中亦可觀察到其他感興趣的特徵：光子固化試樣顯示在傳導黏著劑的Ag(銀)粒子燒結且其在元件上亦顯示Sn(錫)加工的熔融。此顯示溫度達到240℃，此可由熱耦測量確定。且，在元件下方可觀察到傳導軌跡的燒結。對Cu電路亦可得黏著劑粒子的燒結與Sn的熔融。固化梯度包含相鄰熱傳導條3之燒結材料的事實為在傳統烘箱固化組合件與光子固化組合件間的進一步差異。
檢視傳導軌跡之存在的影響，可發現一結合至一箔而沒有傳導軌跡之元件並沒有導致黏著劑的燒結。注意到當在本實施例中，無額外熱傳導特性需要提供，其可能對於較大元件及/或當埋置式固化區2與可獲得輻射區7間 的距離變大時變得更需要。
圖8顯示說明用於在埋置式固化區2中一固化熱可固化材料1方法的另一實施例的橫切面圖。在此實施例中，熱傳導條3為彎曲，其包含一水平部分及一垂直部分。埋置式固化區2由基材10包圍，例如自可獲得輻射區7以一距離D分離埋置式固化區2埋置在其表面之下。例如，基材10可阻擋電磁輻射6自輻射源5對埋置式固化區2的直接照射。反而，經由在可獲得輻射區7吸收的電磁輻射6所產生的熱4a可藉由熱傳導條3沿熱傳導條3之長度朝向埋置式固化區2傳導一距離以藉由在埋置式固化區2自熱傳導條3發散的熱4b而固化熱可固化材料1。
部份顯示的實施例使用自外部導向一元件之下的熱傳導(金屬或已固化的印刷墨水)條。此條吸收經由“光子技術”產生的光，例如一燈或雷射，以轉換為熱並傳送熱至元件之下。熱因此被滯留在元間與電路間，其導致一有效的固化製程。當此基材由“光子技術”加熱時，此條在溫度上快速上升。此熱經由熱傳導條導向元件之下，接著固化黏著劑。在某些實施例中，亦可使用導電電路以達此目的，該電路亦可以導向元件之下。一額外的條因此可能為多餘的。若此基材為透明的，其可能亦可自底部提供光子能量。側向熱傳導因此並不重要，但光的高效轉換為熱可使得固化製程更有效率。此製程亦因此可應用至固化不吸收光的黏著劑。
雖然例示的實施例為顯示在埋置式固化區的熱 固化材料熟於此項技術人士可在瞭解本發明的優點後以可選擇的方法獲得相似的功能及結果。例如，熱傳導條可由一或更多的提供熱傳導之可替代元件取代。除了電磁輻射，亦可使用其他型式對加熱此條有相似功效的輻射。討論及顯示之實施例的多個元件提供特定的功效，如有效傳送熱至一非可獲得區。當然，需瞭解前述的實施例或方法之任一者可與一或更多其他的實施例或方法結合以在尋找及配合設計與優點上提供更進一步的改良。需瞭解本發明在固化黏著劑與傳導墨水上提出特別的優點，但大致上可應用在於任何需要有效供應熱至輻射-可獲得區之應用。
最後，前述討論僅欲說明本發明且不應闡釋為限制後附請求項至任何特定實施例或實施例組。因此，雖然本發明系統已參考特定例示實施例詳細描述，亦應瞭解熟於此項技術人士在未偏離後附請求項中闡述之本發明系統與方法的範疇下可進行多種修飾及變化實施。因此，本發明說明書與圖式為視為說明性且非用以限制後附請求項的範疇。
在闡釋後附請求項時，應瞭解“包含(comprising)”不排除於一特定請求項中列出者之外的其他組件或作動的存在；在一組件前的“一(a)”或“一(an)”不排除此一組件的複數個存在；在請求項中任何的參考標號不限制其範疇；數個“裝置(means)”可代表相同或不同項目或實施結構或功能；除非特別指明，任何揭露的裝置或其之部份可組合在一起或分開為其他部份。在相互不同的請求項中記載的特定段 並不意味不能利用此些手段的組合以達到利益。

Claims (12)

  1. 一種於複數之埋置式固化區固化一熱可固化材料的方法，該方法包含：提供多個熱傳導條，其等係部分地配置在遮斷物間，其中該等遮斷物形成該等埋置式固化區，該等熱傳導條係由該等埋置式固化區延伸至複數之可獲得輻射區，該等可獲得輻射區係距該等埋置式固化區一段距離且至少部分無遮斷物；在該等可獲得輻射區藉由電磁輻射照射該等熱傳導條；其中一光罩係被配置在該電磁輻射的光路徑上以選擇性的將該電磁輻射導向該複數之可獲得輻射區，其中經由電磁輻射之吸收在該等熱傳導條中所產生的熱係由該等可獲得輻射區沿該等熱傳導條之長度傳導至該等埋置式固化區，以藉由傳導發散自該等熱傳導條的熱至該等埋置式固化區中而固化該熱可固化材料，其中，至少50%之在等埋置式固化區用於固化熱該可固化材料的積蓄熱為經由該等熱傳導條提供。
  2. 如請求項1之方法，其中於該等埋置式固化區中的該熱可固化材料包含一可固化黏著劑，該等埋置式固化區係形成於一基材與在該基材上的元件間；其中該等熱傳導條係部份地配置於該元件與該基材間並自該等埋置式固化區延伸至超過該元件之邊界的該可獲得輻射區；其中該方法包含藉由於該基材與該原件間固化該熱可固化黏著劑以結合該元件至該基材。
  3. 如請求項2之方法，其中該等熱傳導條為電隔離自該元件或其電路。
  4. 如請求項1至3任一項之方法，其中該等熱傳導條具有比該熱可固化材料更高的電磁輻射吸收係數。
  5. 如請求項1至3任一項之方法，其中該熱可固化材料為電傳導的且係配置於一電路的路徑中。
  6. 如請求項1至3任一項之方法，其中該等可獲得輻射區係穿透一封閉該等熱傳導條的透明結構被照射。
  7. 如請求項1至3任一項之方法，其中該等熱傳導條包含一導熱金屬或由其組成。
  8. 如請求項1至3任一項之方法，其中該等熱傳導條具有每公尺每克耳文大於100瓦特(Watt per meter per Kelvin)之熱傳導性。
  9. 如請求項1至3任一項之方法，其中該等熱傳導條包含印刷墨水。
  10. 如請求項1至3任一項之方法，其中該等埋置式固化區當沿該等熱傳導條之熱傳導路徑長度測量時為距離該等可獲得輻射區大於1公分。
  11. 一種使用一固化系統的方法，該系統包含一輻射源，該方法包含：提供該系統一基材，該基材包含一部份地配置於該基材與在該基材上之元件間的多個熱傳導條，該元件與該基材在其間形成複數之埋置式固化區，該等熱傳導條由該等埋置式固化區延伸至複數之可獲得輻射區，該等可獲得輻射區係遠離該等埋置式固化區且至少部分無該元件或該基材；控制該系統以經由發散自該輻射源之電磁輻射在該等可獲得輻射區照射該等熱傳導條；其中一光罩係被配置在該電磁輻射的光路徑上以選擇性的將該電磁輻射導向該複數之可獲得輻射區；其中藉由該電磁輻射之吸收在該等熱傳導條中所產生的熱係自該等可獲得輻射區沿該等熱傳導條的長度傳導至該等埋置式固化區，以藉由將發散自該等熱傳導條的熱傳導至該等埋置式固化區中而固化一熱可固化材料；其中至少50%之在該等埋置式固化區用於固化熱可固化材料的積蓄熱為經由該等熱傳導條提供。
  12. 如請求項11之方法，其中該輻射源係進一步用於一光刻步驟(lithographic step)中以曝露出在該元件及/或該基材上所包含的電路圖案。
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