TWI664681B - Mounting head and mounting device using the same - Google Patents

Mounting head and mounting device using the same Download PDF

Info

Publication number
TWI664681B
TWI664681B TW104127800A TW104127800A TWI664681B TW I664681 B TWI664681 B TW I664681B TW 104127800 A TW104127800 A TW 104127800A TW 104127800 A TW104127800 A TW 104127800A TW I664681 B TWI664681 B TW I664681B
Authority
TW
Taiwan
Prior art keywords
crimping
formal
attachment
heating block
head
Prior art date
Application number
TW104127800A
Other languages
English (en)
Chinese (zh)
Other versions
TW201616585A (zh
Inventor
Noboru Asahi
朝日昇
Yoshinori Miyamoto
宮本芳範
Shimpei AOKI
青木進平
Masatsugu NIMURA
仁村将次
Original Assignee
Toray Engineering Co., Ltd.
日商東麗工程股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Engineering Co., Ltd., 日商東麗工程股份有限公司 filed Critical Toray Engineering Co., Ltd.
Publication of TW201616585A publication Critical patent/TW201616585A/zh
Application granted granted Critical
Publication of TWI664681B publication Critical patent/TWI664681B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/731—Location prior to the connecting process
    • H01L2224/73101—Location prior to the connecting process on the same surface
    • H01L2224/73103—Bump and layer connectors
    • H01L2224/73104—Bump and layer connectors the bump connector being embedded into the layer connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
TW104127800A 2014-08-25 2015-08-25 Mounting head and mounting device using the same TWI664681B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014-170788 2014-08-25
JP2014170788 2014-08-25

Publications (2)

Publication Number Publication Date
TW201616585A TW201616585A (zh) 2016-05-01
TWI664681B true TWI664681B (zh) 2019-07-01

Family

ID=55399693

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104127800A TWI664681B (zh) 2014-08-25 2015-08-25 Mounting head and mounting device using the same

Country Status (4)

Country Link
JP (1) JP6591426B2 (ko)
KR (1) KR20170076652A (ko)
TW (1) TWI664681B (ko)
WO (1) WO2016031806A1 (ko)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3310147B1 (en) * 2015-06-15 2019-09-11 FUJI Corporation Component mounting machine
TWI673805B (zh) * 2017-01-30 2019-10-01 日商新川股份有限公司 安裝裝置以及安裝系統
JP2019050341A (ja) * 2017-09-12 2019-03-28 東レエンジニアリング株式会社 圧着ヘッドおよび実装装置
JP6467488B1 (ja) * 2017-11-29 2019-02-13 アサヒ・エンジニアリング株式会社 電子部品の実装装置
JP6484370B1 (ja) * 2018-05-31 2019-03-13 アサヒ・エンジニアリング株式会社 電子部品実装装置
JP6566457B1 (ja) * 2018-12-19 2019-08-28 アサヒ・エンジニアリング株式会社 電子部品の実装装置
JP6624472B1 (ja) * 2018-12-26 2019-12-25 アサヒ・エンジニアリング株式会社 電子部品の実装装置
KR20200114573A (ko) 2019-03-29 2020-10-07 삼성전자주식회사 칩 본딩 장비, 본딩 툴 어셈블리 교체 시스템 및 칩 본딩 장비를 이용한 반도체 장치 제조 방법
KR20200126269A (ko) 2019-04-29 2020-11-06 삼성전자주식회사 접합헤드 및 이를 구비하는 접합 장치
CN113793894B (zh) * 2021-08-20 2024-03-29 宁波大学 一种squid芯片压焊装置与压焊方法
CN116435229B (zh) * 2023-06-14 2023-08-29 北京中科同志科技股份有限公司 芯片压接装置及芯片压力烧结炉

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201245031A (en) * 2011-04-20 2012-11-16 Ushio Electric Inc Method for bonding work and apparatus for bonding work

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0786336A (ja) * 1993-09-10 1995-03-31 Fujitsu Ltd ボンディング装置
JP5122192B2 (ja) * 2007-07-04 2013-01-16 パナソニック株式会社 半導体素子実装装置
JP2010034423A (ja) * 2008-07-30 2010-02-12 Fujitsu Ltd 加圧加熱装置及び方法
JP2010232234A (ja) * 2009-03-26 2010-10-14 Toray Eng Co Ltd 実装装置および実装方法
JP2013026370A (ja) * 2011-07-20 2013-02-04 Shibaura Mechatronics Corp 電子部品の実装装置及び実装方法
JP5512723B2 (ja) * 2012-03-16 2014-06-04 ルネサスエレクトロニクス株式会社 電子部品の実装方法および装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201245031A (en) * 2011-04-20 2012-11-16 Ushio Electric Inc Method for bonding work and apparatus for bonding work

Also Published As

Publication number Publication date
JP6591426B2 (ja) 2019-10-16
JPWO2016031806A1 (ja) 2017-08-10
TW201616585A (zh) 2016-05-01
KR20170076652A (ko) 2017-07-04
WO2016031806A1 (ja) 2016-03-03

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