TWI661005B - 聚醯胺酸、聚醯亞胺、樹脂膜及覆金屬積層板 - Google Patents

聚醯胺酸、聚醯亞胺、樹脂膜及覆金屬積層板 Download PDF

Info

Publication number
TWI661005B
TWI661005B TW104131994A TW104131994A TWI661005B TW I661005 B TWI661005 B TW I661005B TW 104131994 A TW104131994 A TW 104131994A TW 104131994 A TW104131994 A TW 104131994A TW I661005 B TWI661005 B TW I661005B
Authority
TW
Taiwan
Prior art keywords
polyimide
diamine
mol
metal
layer
Prior art date
Application number
TW104131994A
Other languages
English (en)
Chinese (zh)
Other versions
TW201612243A (en
Inventor
安藤智典
柴崎拓也
安達康弘
須藤芳樹
森亮
Original Assignee
日商日鐵化學材料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商日鐵化學材料股份有限公司 filed Critical 日商日鐵化學材料股份有限公司
Publication of TW201612243A publication Critical patent/TW201612243A/zh
Application granted granted Critical
Publication of TWI661005B publication Critical patent/TWI661005B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/088—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Laminated Bodies (AREA)
TW104131994A 2014-09-30 2015-09-30 聚醯胺酸、聚醯亞胺、樹脂膜及覆金屬積層板 TWI661005B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014202479 2014-09-30
JP2014-202479 2014-09-30

Publications (2)

Publication Number Publication Date
TW201612243A TW201612243A (en) 2016-04-01
TWI661005B true TWI661005B (zh) 2019-06-01

Family

ID=55630354

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104131994A TWI661005B (zh) 2014-09-30 2015-09-30 聚醯胺酸、聚醯亞胺、樹脂膜及覆金屬積層板

Country Status (3)

Country Link
JP (2) JP6559027B2 (ja)
TW (1) TWI661005B (ja)
WO (1) WO2016052316A1 (ja)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI725138B (zh) 2016-04-01 2021-04-21 日商三菱化學股份有限公司 樹脂組合物
WO2018061727A1 (ja) * 2016-09-29 2018-04-05 新日鉄住金化学株式会社 ポリイミドフィルム、銅張積層板及び回路基板
JP7212480B2 (ja) * 2017-09-29 2023-01-25 日鉄ケミカル＆マテリアル株式会社 ポリイミドフィルム、金属張積層板及び回路基板
CN110241389A (zh) * 2018-03-08 2019-09-17 日铁化学材料株式会社 蒸镀掩模、蒸镀掩模形成用聚酰胺酸、蒸镀掩模形成用层叠体及蒸镀掩模的制造方法
TWI678285B (zh) * 2019-04-09 2019-12-01 臻鼎科技股份有限公司 覆金屬板的製作方法
JP7320254B2 (ja) * 2019-08-21 2023-08-03 河村産業株式会社 面状発熱体
JP2021155763A (ja) * 2020-03-25 2021-10-07 株式会社ジャパンディスプレイ 蒸着マスクの製造方法
KR102447652B1 (ko) * 2020-11-24 2022-09-28 피아이첨단소재 주식회사 유전특성이 개선된 폴리이미드 필름 및 그 제조방법
CN113667120B (zh) * 2021-07-13 2022-07-29 中化学科学技术研究有限公司 一种聚酰亚胺及其制备方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101121819A (zh) * 2007-09-27 2008-02-13 湖北省化学研究院 改性马来酰亚胺封端型聚酰亚胺树脂组合物及其应用
TW200918615A (en) * 2007-10-23 2009-05-01 Chisso Corp Inkjet ink

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0291125A (ja) * 1988-09-29 1990-03-30 Nippon Steel Chem Co Ltd シリコーンポリイミド及びその製造方法
JPH04304234A (ja) * 1991-04-02 1992-10-27 Hitachi Ltd 熱可塑型ポリエーテルイミドおよびそれを用いた電子装置
JP3279757B2 (ja) * 1993-08-03 2002-04-30 ジェイエスアール株式会社 液晶配向剤および液晶表示素子
JP2000080165A (ja) * 1998-09-02 2000-03-21 Du Pont Toray Co Ltd 共重合ポリイミドフィルム、その製造方法およびこれを基材とした金属配線板
JP4052876B2 (ja) * 2002-05-24 2008-02-27 三井化学株式会社 寸法安定性に優れるポリイミド金属積層板及びその製造方法
JP2006137868A (ja) * 2004-11-12 2006-06-01 Du Pont Toray Co Ltd ポリイミドフィルムおよびフレキシブル回路基板
JP5632426B2 (ja) * 2012-07-31 2014-11-26 株式会社有沢製作所 ポリアミック酸及び非熱可塑性ポリイミド樹脂

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101121819A (zh) * 2007-09-27 2008-02-13 湖北省化学研究院 改性马来酰亚胺封端型聚酰亚胺树脂组合物及其应用
TW200918615A (en) * 2007-10-23 2009-05-01 Chisso Corp Inkjet ink

Also Published As

Publication number Publication date
TW201612243A (en) 2016-04-01
JP2019194346A (ja) 2019-11-07
WO2016052316A1 (ja) 2016-04-07
JP2016069646A (ja) 2016-05-09
JP6559027B2 (ja) 2019-08-14

Similar Documents

Publication Publication Date Title
TWI661005B (zh) 聚醯胺酸、聚醯亞胺、樹脂膜及覆金屬積層板
TWI577715B (zh) 聚醯亞胺、樹脂膜及金屬包覆積層體
TWI634986B (zh) 覆銅積層板、印刷配線板及其使用方法
JP6767759B2 (ja) ポリイミド、樹脂フィルム及び金属張積層板
TWI814908B (zh) 覆金屬積層板和電路基板
JP2016188298A (ja) ポリイミド、樹脂フィルム、金属張積層体及び回路基板
JP7212515B2 (ja) 金属張積層板及び回路基板
JP6403460B2 (ja) 金属張積層体、回路基板及びポリイミド
JP2015127117A (ja) 金属張積層体及び回路基板
JP6267509B2 (ja) ポリアミド酸組成物、ポリイミド、樹脂フィルム及び金属張積層体
JP4571043B2 (ja) 積層体及びその製造方法
JP2015193117A (ja) 金属張積層体及び回路基板
JP2015127118A (ja) 金属張積層体及び回路基板
JP5547874B2 (ja) ポリイミド樹脂
JP2020015237A (ja) 金属張積層板の製造方法及び回路基板の製造方法
TW202237705A (zh) 聚醯亞胺、金屬包覆層疊板及電路基板
JP2015160852A (ja) ポリアミド酸組成物、ポリイミド、樹脂フィルム及び金属張積層体
JP6767751B2 (ja) ポリアミド酸、ポリイミド、樹脂フィルム及び金属張積層板
JP6558755B2 (ja) ポリアミド酸、ポリイミド、樹脂フィルム及び金属張積層板
CN111385967B (zh) 柔性电路基板用金属包覆层叠板及柔性电路基板
TWI762725B (zh) 覆金屬層疊板及電路基板
JP2024046788A (ja) 回路基板の製造方法
TW202337957A (zh) 聚醯亞胺系樹脂前驅物
CN118063769A (zh) 聚酰亚胺系树脂
TW202346424A (zh) 可撓性配線基板用聚醯亞胺前驅體組合物、聚醯亞胺膜及聚醯亞胺金屬積層體

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees