TWI660060B - 氣流濺鍍裝置及濺鍍靶材原料的製造方法 - Google Patents

氣流濺鍍裝置及濺鍍靶材原料的製造方法 Download PDF

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Publication number
TWI660060B
TWI660060B TW106145564A TW106145564A TWI660060B TW I660060 B TWI660060 B TW I660060B TW 106145564 A TW106145564 A TW 106145564A TW 106145564 A TW106145564 A TW 106145564A TW I660060 B TWI660060 B TW I660060B
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TW
Taiwan
Prior art keywords
sputtering
target
flat
pair
airflow
Prior art date
Application number
TW106145564A
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English (en)
Chinese (zh)
Other versions
TW201827632A (zh
Inventor
Takashi Kosho
小庄孝志
Hideo Takami
高見英生
Yuichiro Nakamura
中村祐一郎
Mikio TAKECHI
武智幹雄
Tomohiro Mikami
三上智廣
Original Assignee
Jx Nippon Mining & Metals Corporation
日商Jx金屬股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by Jx Nippon Mining & Metals Corporation, 日商Jx金屬股份有限公司 filed Critical Jx Nippon Mining & Metals Corporation
Publication of TW201827632A publication Critical patent/TW201827632A/zh
Application granted granted Critical
Publication of TWI660060B publication Critical patent/TWI660060B/zh

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Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11BINFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/84Processes or apparatus specially adapted for manufacturing record carriers
    • G11B5/851Coating a support with a magnetic layer by sputtering

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
TW106145564A 2016-12-28 2017-12-25 氣流濺鍍裝置及濺鍍靶材原料的製造方法 TWI660060B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-256657 2016-12-28
JP2016256657A JP7005896B2 (ja) 2016-12-28 2016-12-28 ガスフロースパッタリング装置及びスパッタリングターゲット原料の製造方法

Publications (2)

Publication Number Publication Date
TW201827632A TW201827632A (zh) 2018-08-01
TWI660060B true TWI660060B (zh) 2019-05-21

Family

ID=62708037

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106145564A TWI660060B (zh) 2016-12-28 2017-12-25 氣流濺鍍裝置及濺鍍靶材原料的製造方法

Country Status (5)

Country Link
JP (2) JP7005896B2 (https=)
CN (1) CN110100042B (https=)
SG (1) SG10202105751VA (https=)
TW (1) TWI660060B (https=)
WO (1) WO2018123550A1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009066497A (ja) * 2007-09-12 2009-04-02 Bridgestone Corp 光触媒酸化チタン薄膜及びその製造方法
JP2012144793A (ja) * 2011-01-13 2012-08-02 Sumitomo Heavy Ind Ltd ターゲット、およびこれを備えた成膜装置
JP2013147711A (ja) * 2012-01-20 2013-08-01 Renesas Electronics Corp 気相成長装置
WO2013136962A1 (ja) * 2012-03-15 2013-09-19 Jx日鉱日石金属株式会社 磁性材スパッタリングターゲット及びその製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU4503696A (en) * 1995-05-11 1996-11-29 Materials Research Corporation Sputtering apparatus with isolated coolant and sputtering ta rget therefor
JP2004183022A (ja) 2002-12-02 2004-07-02 Ulvac Japan Ltd ターゲット装置及びスパッタリング装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009066497A (ja) * 2007-09-12 2009-04-02 Bridgestone Corp 光触媒酸化チタン薄膜及びその製造方法
JP2012144793A (ja) * 2011-01-13 2012-08-02 Sumitomo Heavy Ind Ltd ターゲット、およびこれを備えた成膜装置
JP2013147711A (ja) * 2012-01-20 2013-08-01 Renesas Electronics Corp 気相成長装置
WO2013136962A1 (ja) * 2012-03-15 2013-09-19 Jx日鉱日石金属株式会社 磁性材スパッタリングターゲット及びその製造方法

Also Published As

Publication number Publication date
JP2021127524A (ja) 2021-09-02
TW201827632A (zh) 2018-08-01
CN110100042A (zh) 2019-08-06
JP2018109206A (ja) 2018-07-12
CN110100042B (zh) 2021-12-07
SG10202105751VA (en) 2021-07-29
JP7005896B2 (ja) 2022-01-24
WO2018123550A1 (ja) 2018-07-05

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