AU4503696A - Sputtering apparatus with isolated coolant and sputtering ta rget therefor - Google Patents

Sputtering apparatus with isolated coolant and sputtering ta rget therefor

Info

Publication number
AU4503696A
AU4503696A AU45036/96A AU4503696A AU4503696A AU 4503696 A AU4503696 A AU 4503696A AU 45036/96 A AU45036/96 A AU 45036/96A AU 4503696 A AU4503696 A AU 4503696A AU 4503696 A AU4503696 A AU 4503696A
Authority
AU
Australia
Prior art keywords
sputtering
rget
therefor
isolated coolant
sputtering apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU45036/96A
Inventor
Steven D Hurwitt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Materials Research Corp
Original Assignee
Materials Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US08/439,490 external-priority patent/US6689254B1/en
Application filed by Materials Research Corp filed Critical Materials Research Corp
Publication of AU4503696A publication Critical patent/AU4503696A/en
Abandoned legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/34Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411Constructional aspects of the reactor
    • H01J37/3435Target holders (includes backing plates and endblocks)
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/34Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405Magnetron sputtering
    • H01J37/3408Planar magnetron sputtering
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/34Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3488Constructional details of particle beam apparatus not otherwise provided for, e.g. arrangement, mounting, housing, environment; special provisions for cleaning or maintenance of the apparatus
    • H01J37/3497Temperature of target
AU45036/96A 1995-05-11 1995-11-27 Sputtering apparatus with isolated coolant and sputtering ta rget therefor Abandoned AU4503696A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US439490 1995-05-11
US08/439,490 US6689254B1 (en) 1990-10-31 1995-05-11 Sputtering apparatus with isolated coolant and sputtering target therefor
PCT/US1995/015422 WO1996036065A1 (en) 1995-05-11 1995-11-27 Sputtering apparatus with isolated coolant and sputtering target therefor

Publications (1)

Publication Number Publication Date
AU4503696A true AU4503696A (en) 1996-11-29

Family

ID=23744912

Family Applications (1)

Application Number Title Priority Date Filing Date
AU45036/96A Abandoned AU4503696A (en) 1995-05-11 1995-11-27 Sputtering apparatus with isolated coolant and sputtering ta rget therefor

Country Status (5)

Country Link
EP (1) EP0824760A1 (en)
JP (1) JPH11504986A (en)
AU (1) AU4503696A (en)
CA (1) CA2218736A1 (en)
WO (1) WO1996036065A1 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005525471A (en) * 2002-05-14 2005-08-25 東京エレクトロン株式会社 Sputtering cathode adapter assembly and method
DE10312631A1 (en) * 2003-03-21 2004-10-07 Interpane Entwicklungs- Und Beratungsgesellschaft Mbh & Co.Kg Magnetron with coolant protection
WO2005007924A1 (en) * 2003-07-07 2005-01-27 Honeywell International Inc. Sputtering target constructions
JP2007520634A (en) * 2004-02-03 2007-07-26 ハネウェル・インターナショナル・インコーポレーテッド Target structure for physical vapor deposition
JP2007051337A (en) * 2005-08-18 2007-03-01 Ulvac Japan Ltd Sputtering electrode and sputtering apparatus provided with the sputtering electrode
JP5364455B2 (en) * 2009-06-08 2013-12-11 昭和電工株式会社 Magnetron sputtering system and in-line film deposition system
US9580795B2 (en) * 2013-03-05 2017-02-28 Applied Materials, Inc. Sputter source for use in a semiconductor process chamber
JP6100189B2 (en) * 2014-03-12 2017-03-22 住友重機械工業株式会社 Deposition equipment
WO2016088284A1 (en) * 2014-12-03 2016-06-09 株式会社アルバック Target assembly
JP7005896B2 (en) * 2016-12-28 2022-01-24 Jx金属株式会社 Gas flow sputtering equipment and manufacturing method of sputtering target raw material
US11158491B2 (en) * 2017-06-01 2021-10-26 Oerlikon Surface Solutions Ag, Pfäffikon Target assembly for safe and economic evaporation of brittle materials

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3945911A (en) * 1974-08-28 1976-03-23 Shatterproof Glass Corporation Cathodes for sputter-coating glass sheets or other substrates
CH664303A5 (en) * 1985-04-03 1988-02-29 Balzers Hochvakuum HOLDING DEVICE FOR TARGETS FOR CATHODE SPRAYING.
WO1992007970A1 (en) * 1990-10-31 1992-05-14 Materials Research Corporation Magnetron sputter coating method and apparatus with rotating magnet cathode
CH690805A5 (en) * 1993-05-04 2001-01-15 Unaxis Balzers Ag Magnetic-assisted atomization and vacuum treatment system herewith.

Also Published As

Publication number Publication date
CA2218736A1 (en) 1996-11-14
JPH11504986A (en) 1999-05-11
WO1996036065A1 (en) 1996-11-14
EP0824760A1 (en) 1998-02-25

Similar Documents

Publication Publication Date Title
AU2788700A (en) Magnetron sputtering method and apparatus
AU2238697A (en) Display arrangement and method
AU6809896A (en) Display assemblies
AUPN056295A0 (en) Chilling apparatus
AU9693798A (en) Protective films and coatings
IL125103A0 (en) Sputtering targets and method for the preparation thereof
AU6168394A (en) Dual ligating and dividing apparatus
AU5647494A (en) 2-debenzoyl-2-acyl taxol derivatives and methods for making same
GB2318590B (en) Magnetron cathode apparatus and method for sputtering
AU4875396A (en) Benzoyl derivatives
EP0698908A3 (en) Magnetron apparatus
AU4997597A (en) Method for fabricating sputtering targets
AU5518996A (en) An alphanumerical keyboard
AU4129196A (en) Mechanically joined sputtering target and adapter therefor
EP0698909A3 (en) Magnetron apparatus
AU696080B2 (en) Bisphenol ester derivatives
AU5885696A (en) Mineral powders with enhanced chromium solubility and prepar ation methods therefor
AU4503696A (en) Sputtering apparatus with isolated coolant and sputtering ta rget therefor
EP1026284A4 (en) Sputtering target and part for thin film-forming apparatus
AU6929796A (en) Benzoyl derivatives
AU1978497A (en) Method and apparatus for rf diode sputtering
GB2307919B (en) Sputtering apparatus
AU1183695A (en) Apparatus and method for making metal oxide sputtering targets
AU6163298A (en) Apparatus and method for sputtering a magnetron target
AU6761598A (en) Magnesium oxide sputtering apparatus