SG10202105751VA - Gas flow sputtering device and method for producing sputtering target raw material - Google Patents

Gas flow sputtering device and method for producing sputtering target raw material

Info

Publication number
SG10202105751VA
SG10202105751VA SG10202105751VA SG10202105751VA SG10202105751VA SG 10202105751V A SG10202105751V A SG 10202105751VA SG 10202105751V A SG10202105751V A SG 10202105751VA SG 10202105751V A SG10202105751V A SG 10202105751VA SG 10202105751V A SG10202105751V A SG 10202105751VA
Authority
SG
Singapore
Prior art keywords
raw material
gas flow
producing
target raw
sputtering target
Prior art date
Application number
SG10202105751VA
Other languages
English (en)
Inventor
Takashi Kosho
Hideo Takami
Yuichiro Nakamura
Mikio Takechi
Tomohiro Mikami
Original Assignee
Jx Nippon Mining & Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jx Nippon Mining & Metals Corp filed Critical Jx Nippon Mining & Metals Corp
Publication of SG10202105751VA publication Critical patent/SG10202105751VA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
    • G11B5/851—Coating a support with a magnetic layer by sputtering

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
SG10202105751VA 2016-12-28 2017-12-11 Gas flow sputtering device and method for producing sputtering target raw material SG10202105751VA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016256657A JP7005896B2 (ja) 2016-12-28 2016-12-28 ガスフロースパッタリング装置及びスパッタリングターゲット原料の製造方法

Publications (1)

Publication Number Publication Date
SG10202105751VA true SG10202105751VA (en) 2021-07-29

Family

ID=62708037

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10202105751VA SG10202105751VA (en) 2016-12-28 2017-12-11 Gas flow sputtering device and method for producing sputtering target raw material

Country Status (5)

Country Link
JP (2) JP7005896B2 (https=)
CN (1) CN110100042B (https=)
SG (1) SG10202105751VA (https=)
TW (1) TWI660060B (https=)
WO (1) WO2018123550A1 (https=)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU4503696A (en) * 1995-05-11 1996-11-29 Materials Research Corporation Sputtering apparatus with isolated coolant and sputtering ta rget therefor
JP2004183022A (ja) 2002-12-02 2004-07-02 Ulvac Japan Ltd ターゲット装置及びスパッタリング装置
JP2009066497A (ja) 2007-09-12 2009-04-02 Bridgestone Corp 光触媒酸化チタン薄膜及びその製造方法
JP5460619B2 (ja) * 2011-01-13 2014-04-02 住友重機械工業株式会社 ターゲット、およびこれを備えた成膜装置
JP2013147711A (ja) 2012-01-20 2013-08-01 Renesas Electronics Corp 気相成長装置
JP5876138B2 (ja) 2012-03-15 2016-03-02 Ｊｘ金属株式会社 磁性材スパッタリングターゲット及びその製造方法

Also Published As

Publication number Publication date
JP2021127524A (ja) 2021-09-02
TW201827632A (zh) 2018-08-01
TWI660060B (zh) 2019-05-21
CN110100042A (zh) 2019-08-06
JP2018109206A (ja) 2018-07-12
CN110100042B (zh) 2021-12-07
JP7005896B2 (ja) 2022-01-24
WO2018123550A1 (ja) 2018-07-05

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