TWI654696B - 晶圓形物品的液體處理設備 - Google Patents

晶圓形物品的液體處理設備

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TWI654696B
TWI654696B TW104104923A TW104104923A TWI654696B TW I654696 B TWI654696 B TW I654696B TW 104104923 A TW104104923 A TW 104104923A TW 104104923 A TW104104923 A TW 104104923A TW I654696 B TWI654696 B TW I654696B
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conductive
wafer
liquid collector
scope
deflector
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萊霍 史沃森巴契
米蘭 普利斯卡
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奧地利商蘭姆研究股份公司
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    • HELECTRICITY
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    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
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    • HELECTRICITY
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    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
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    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67063Apparatus for fluid treatment for etching
    • H01L21/67075Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
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    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735Closed carriers
    • H01L21/67396Closed carriers characterised by the presence of antistatic elements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • HELECTRICITY
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    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00Fluid handling
    • Y10T137/7287Liquid level responsive or maintaining systems
    • Y10T137/7306Electrical characteristic sensing
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T279/00Chucks or sockets
    • Y10T279/17Socket type
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
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  • Engineering & Computer Science (AREA)
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  • Condensed Matter Physics & Semiconductors (AREA)
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  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Weting (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Coating Apparatus (AREA)

Abstract

本發明係關於一種晶圓形物品的處理設備,包含一旋轉夾盤,用以在預定直徑之晶圓形物品上進行處理操作期間,支撐該晶圓形物品並使其旋轉。一液體收集器係環繞該旋轉夾盤,且包含第一內表面。該第一內表面包含第一導電材質。該收集器更包含第一導電路徑以使該第一導電材質接地。

Description

晶圓形物品的液體處理設備
本發明係關於晶圓形物品之液體處理設備。
在製造積體電路期間,半導體晶圓需經歷各種濕式處理階段。為了能容納此等製程,一單一晶圓可能由與可旋轉之載體相關聯之夾盤以相對於一個以上之處理流體噴嘴的方式所支撐。支撐晶圓之夾盤例如在美國專利號第4,903,717、5,513,668、6,435,200以及6,536,454中所述。
眾所皆知,半導體晶圓處理可在晶圓表面上增長不欲之靜電荷。例如美國專利號第7,335,090中描述具有支撐銷之旋轉夾盤,該等支撐銷係由導電樹脂所製成、且與一不銹鋼軸桿相關連,而依序由徑向金屬軸承所支撐。共同持有之審查中的美國公開案號第2011/0254236中描述具有導電夾盤銷的夾盤以及將夾盤銷與夾盤驅動及舉升單元之軸桿相連接的導電路徑。
雖然透過抓持銷來提供與晶圓邊緣相接觸的導電路徑被假設是解決了不欲之晶圓電荷的問題,本發明人意外的發現了晶圓之電荷即使在缺乏晶圓與夾盤之間的實體接觸仍會發生,在晶圓處理期間的各種階段均可能發生。且本發明人也意外地發現即使在晶圓與連接於夾盤的固定結構(但與夾盤本身分開)之間,晶圓之不欲電荷仍可能發生。
因此,在一態樣而言,本發明係關於晶圓形物品之處理設備,其包含旋轉夾盤,用以對該晶圓形物品處理操作期間支撐並旋轉預定直徑之晶圓形物品,以及環繞該旋轉夾盤之液體收集器。該液體收集器包含第一內表面,其中該第一內表面包含第一導電材質,且其中該收集器更包含第一導電路徑以使該第一導電材質接地。
根據本發明之設備的較佳實施例中,該液體收集器包含至少兩個階層,且其中該旋轉夾盤可相對於該液體收集器而垂直移動,俾使將位於該旋轉夾盤上之晶圓定位於該至少兩階層的所選之一處。
根據本發明之設備的較佳實施例中,其中除了該第一內表面以外,面向該旋轉夾盤之該液體收集器之表面係由非導電性塑膠所製成。
根據本發明之設備的較佳實施例中,其中該非導電性塑膠包含一或多個構件,該等構件係選自下列組成之群組:聚四氟乙烯(PTFE,polytetrafluoroethylene)、全氟烷氧基(PFA,perfluoroalkoxy)、聚伸苯基硫化物(PPS,polyphenylenesulfide)、聚醚醚酮(PEEK,polyetheretherketone)、聚苯乙烯/聚乙基苯乙烯(PS/PES,polystyrene/polyethylstyrene)、乙烯四氟乙烯(ETFE,ethylene tetrafluoroethylene)、聚亞乙烯基氟化物(PVDF,polyvinylidene fluoride)、氯三氟乙烯的均聚物(PCTFE,homopolymer of chlorotrifluoroethylene)、氟化乙烯丙烯(FEP,fluorinated ethylene propylene)、及乙烯氯三氟乙烯(ECTFE,ethylene chlorotrifluoroethylene)。
根據本發明之設備的較佳實施例中,其中該非導電性塑膠包含PCTFE。
根據本發明之設備的較佳實施例中,該液體收集器包含向內引導之擋板,且其中該第一導電材料係鑲嵌於該向內引導之擋板內。
根據本發明之設備的較佳實施例中,其中該液體收集器包含位於該至少兩個階層之最上面階層的向內引導之擋板,且其中該第一導電材料係鑲嵌於該向內引導之擋板內。
根據本發明之設備的較佳實施例中,該第一導電材料為導電聚合物。
根據本發明之設備的較佳實施例中,該第一導電材料為不銹鋼。
根據本發明之設備的較佳實施例中,該第一導電材料包含配置在該液體收集器之該第一內表面周圍之複數個導電元件。
根據本發明之設備的較佳實施例中,該旋轉夾盤包含複數個銷組件,其配置及定位係用以支撐欲進行處理之晶圓形物品,其中該銷組件中至少一個係由化學性惰性材料所形成,且在其一端包含導電鑲嵌物,該鑲嵌物係用以實體電性接合一軸承元件。
根據本發明之設備的較佳實施例中,該軸承元件為導電滾針軸承。
在另一態樣中,本發明係關於一種用於晶圓形物品處理設備之液體收集器,該液體收集器係用以環繞旋轉夾盤,該旋轉夾盤乃用以在預定直徑之晶圓形物品上進行處理操作期間,支撐該晶圓形物品並使其旋轉。該液體收集器包含第一內表面,其中該第一內表面包含第一導電材質,且其中該收集器更包含第一導電路徑以使該第一導電材質接地。
根據本發明之液體收集器的較佳實施例中,其中更包含界定至少兩處理階層之內部結構,該處理階層為旋轉夾盤可能在該液體收集器以及旋轉夾盤之間相對垂直移動的定位處。
根據本發明之液體收集器的較佳實施例中,除了該第一內表面之外,該液體收集器之朝內表面係由非導電性塑膠所製成。
根據本發明之液體收集器的較佳實施例中,該非導電性塑膠包含一或多個構件,該等構件係選自下列組成之群組:聚四氟乙烯(PTFE,polytetrafluoroethylene)、全氟烷氧基(PFA,perfluoroalkoxy)、聚伸苯基硫化物(PPS,polyphenylenesulfide)、聚醚醚酮(PEEK,polyetheretherketone)、聚苯乙烯/聚乙基苯乙烯(PS/PES,polystyrene/polyethylstyrene)、乙烯四氟乙烯(ETFE,ethylene tetrafluoroethylene)、聚亞乙烯基氟化物(PVDF,polyvinylidene fluoride)、氯三氟乙烯的均聚物(PCTFE,homopolymer of chlorotrifluoroethylene)、氟化乙烯丙烯(FEP,fluorinated ethylene propylene)、及乙烯氯三氟乙烯(ECTFE,ethylene chlorotrifluoroethylene)。
根據本發明之液體收集器的較佳實施例中,該非導電性塑膠包含PCTFE。
根據本發明之液體收集器的較佳實施例中,該收集器更包含向內引導之擋板,且該第一導電材料係鑲嵌於該向內引導之擋板內。
根據本發明之液體收集器的較佳實施例中,該收集器更包含位於該至少兩個階層之最上面階層的向內引導之擋板,且其中該第一導電材料係鑲嵌於該向內引導之擋板內。
根據本發明之液體收集器的較佳實施例中,該第一導電材料為導電聚合物。
根據本發明之液體收集器的較佳實施例中,該第一導電材料為不銹鋼。
根據本發明之液體收集器的較佳實施例中,該第一導電材料包含配置在該第一內表面周圍之複數個導電元件。
在圖1中,液體收集器係包含四個主要元件,也就是底座元件10、頂部元件20、第一中間元件30以及第二中間元件40。圖1中看不到的另一半液體收集器大致上是顯示出來的那部分液體收集器的鏡像。
在本實施例中,液體收集器為一可分離模組元件的組件,如共同持有之審查中的美國專利申請號第13/849,072中所詳述。然而,在本實施例的內容中,各種元件並非需要彼此可互相分離,需要的話,任兩個或更多個元件可形成為一體。
圖1之收集器組件亦包含上導流片50、中導流片60以及下導流片70,其結構及功能將會在下面詳加描述。
對於熟悉該技藝者而言,圖1使用之收集器組件乃環繞旋轉夾盤,例如用於半導體晶圓之單一晶圓濕式處理的那些,其係顯示於目前的圖4中,且於例如美國專利號第4,903,717以及7,837,803中說明。此等旋轉夾盤係設計用來支撐目前使用及現今發展中之直徑300mm及400mm的預定直徑之晶圓。旋轉夾盤可相對於收集器而在三個收集器階層的每一個以及最上方之裝載/卸載位置之間移動。收集器組件以及旋轉夾盤的相對移動可藉由相對於固定的收集器組件而升高及降低旋轉夾盤來達成,或者也可藉由相對於固定的旋轉夾盤而升高及降低收集器組件來達成,或者以相反方向或是以相同方向不同速度同時升高及降低旋轉夾盤及收集器組件兩者來達成。
因此,最下面的處理階層乃對應於旋轉夾盤使其上表面大約與底座元件10之徑向內上邊緣15齊平的位置。自該邊緣開始傾斜的傾斜表面係用來收集晶圓表面飛濺下來的液體,並將其引導至底座元件的排水口。
導流片70亦會引導液體向下且向外的朝向底座元件10之排水口,且更進一步界定了本身與第二中間元件40之下部面向表面(lower facing surface)之間的間隙,透過該間隙,排氣可能被抽入收集器組件之外排放管。
中間處理階層乃對應於旋轉夾盤使其上表面大約與第二中間元件40之徑向內邊緣45齊平的位置。自該邊緣開始傾斜的傾斜表面類似地係用來收集晶圓表面飛濺下來的液體,並將其引導至第二中間元件40的排水口。
在此例中,中間導流片60亦會將液體向下且向外引導朝向第二中間元件40之排水口,且更進一步界定了本身與第一中間元件30之下部面向表面(lower facing surface)之間的間隙,透過該間隙,排氣可能被抽入收集器組件之外排放管。
類似地,上部處理階層乃對應於旋轉夾盤使其上表面大約與第一中間元件30之徑向內邊緣35齊平的位置。自該邊緣開始傾斜的傾斜表面類似地係用來收集晶圓表面飛濺下來的液體,並將其引導至第一中間元件30的排水口32。
在此例中,上導流片50亦會將液體向下且向外引導朝向第一中間元件30之排水口,且更進一步界定了本身與頂部元件20之下部面向表面(lower facing surface)之間的間隙,透過該間隙,排氣可能被抽入收集器組件之外排放管。
收集器組件的各種元件,尤其是在半導體晶圓處理期間常會與腐蝕性強的化學物接觸的那些元件,較佳是由化學惰性材料製成,例如包含一或多個構件的塑膠,該等構件係選自下列組成之群組:聚四氟乙烯(PTFE,polytetrafluoroethylene)、全氟烷氧基(PFA,perfluoroalkoxy)、聚伸苯基硫化物(PPS,polyphenylenesulfide)、聚醚醚酮(PEEK,polyetheretherketone)、聚苯乙烯/聚乙基苯乙烯(PS/PES,polystyrene/polyethylstyrene)、乙烯四氟乙烯(ETFE,ethylene tetrafluoroethylene)、聚亞乙烯基氟化物(PVDF,polyvinylidene fluoride)、氯三氟乙烯的均聚物(PCTFE,homopolymer of chlorotrifluoroethylene)、氟化乙烯丙烯(FEP,fluorinated ethylene propylene)、及乙烯氯三氟乙烯(ECTFE,ethylene chlorotrifluoroethylene)。
在沒有結合額外材料而使其成為導電性的情況下,該等材料亦為非導電性。然而本發明人發現,當非導電性液體倒在旋轉晶圓上以進行清洗時,不僅是晶圓會被電性充電,連同例如導流片之面朝內的收集器元件亦會被電性充電至一顯著程度。具體而言,本發明人測出晶圓與其周圍之收集器元件之間的電荷高達5000 V。因此,即使晶圓已透過夾盤接地,仍可能發生放電的情形,例如共同持有之審查中的美國專利公開號第2011/0254236所述。
來自周圍之液體收集器結構的靜電感應會造成晶圓表面帶電令人意外,因為熟悉本技藝者原本認為靜電感應(電荷分離)係因兩個非導電性材料之間的摩擦而產生的。然而兩個非導電性材料之間的摩擦需要兩材料彼此接觸。由於液體收集器並不會接觸晶圓,因此在其本身以及晶圓之間並不會產生摩擦,發現收集器藉由靜電感應仍可使晶圓表面帶電實在令人驚訝,且確實導致某些案例在晶圓上產生非常高的表面電荷。
半導體晶圓之靜電荷為一日益受到關注的問題,由於每一接續的技術節點均伴隨著對可容許之最大靜電荷的更嚴格要求,該靜電荷不僅會累積在形成於晶圓本身上的裝置及結構上,也會累積在處理設備的表面上。例如,預定於2018年使用之18奈米技術節點中,其形成於晶圓上之半導體裝置上的最大可容許靜電荷係限定為0.08nC,也就是約8 V/cm,一個非常低程度的靜電荷。
習知上,半導體晶圓上的靜電荷係利用位於處理腔室上方之離子棒技術(ionization bar technique)而減輕,例如美國專利號第6,432,727中所述。然而此項技術對於資本支出以及維護費用的觀點來看都是所費不貲。
在本實施例中,上導流片50配置有導電元件81,如圖2~4所示。導電元件81可能例如是以複數個圓周排列之導電元件、或一導電環、或兩者兼有的形式呈現,如圖3所示。導電元件81可能被契合至形成於導流片50中的一個對應凹槽,故其上表面可外露並與導流片50之上表面齊平。或者,導電元件81可能定位於導流片50的內部,只有其內邊緣部分外露,或者如果導流片50之包覆材料的厚度夠低的話,就完全沒有外露的部分。
導電元件較佳係由導電聚合物所製,但亦可由不銹金屬製成,例如不銹鋼。
如圖4所示,導電元件81係透過由一個以上之導電元件83所形成之導電路徑而電性接地(例如機架)。
圖4亦顯示旋轉夾盤1以預定方向支撐晶圓於其上,該方向較佳係使晶圓的主要表面水平或是在水平±20˚放置。旋轉夾盤1可能例如是根據柏努力定律操作之夾盤,例如美國專利號第4,903,717中所描述。
夾盤1包含一系列之抓持銷3,在本實施例中為6個,雖然圖4中只看得到4個。抓持銷3乃預防晶圓側向滑落夾盤。在本實施例中,抓持銷3的上部亦提供在晶圓W下方的支撐,因此本夾盤不需根據柏努力定律操作,亦不需在晶圓下方供應氣墊。具體而言,如同在共同持有之審查中美國專利公開號第2011/0254236中的更詳細描述,每一抓持銷3包含一最上方抓持部,其係自柱狀銷基座垂直延伸而大致沿著與柱狀銷基座之旋轉軸偏移的軸。每一最上方抓持部進一步包含設計用來容納晶圓之周圍邊緣的側凹部或切口,如下所詳述。
如圖5所示,抓持銷3向上突出通過形成於夾盤蓋5中的孔,該夾盤蓋5乃安裝於夾盤1之基體9處。
抓持銷3係藉由環形齒輪7而共同地繞著其柱狀軸旋轉,環形齒輪7乃與夾盤1同軸旋轉並且與所有抓持銷3同時嚙合。該等偏心抓持銷因此便在徑向內關閉位置(晶圓固定處)以及徑向外開啟位置(晶圓卸放處)之間一致的移動。從基座突出的抓持銷3包含偏心最上部而與晶圓相接觸,該基座的安裝係用以繞著其中心軸而樞轉移動。具體而言,環形齒輪7係放置於基體9的底面的中心上,並同時透過其周圍輪齒而與形成於每一銷3基座上的輪齒相嚙合。銷3乃均勻分佈在旋轉夾盤1的周圍,至少提供3個此等銷、較佳有6個。
給定夾盤1係設計用來支撐特定直徑之晶圓。當銷3之抓持表面位於其徑向內關閉位置時,會因此描繪出該直徑的圓。目前商業生產之晶圓用夾盤係設計用來支撐200mm或300mm的晶圓,而450mm的晶圓則會是下一世代。
如圖5所示,夾盤1之蓋5係透過其外周圍之環狀凸條5-1而座落於夾盤基體9的外緣上,俾使在基體9的上表面與蓋5的下表面之間提供一內間隙。
本實施例之內間隙係容納環形齒輪7以及下面將詳述之其他元件。當夾盤被體現為柏努力夾盤時,此內間隙可額外用來當作氣體配送腔室,供應蓋5所提供之開口陣列,如共同持有之審查中的美國專利公開號第2011/0254236中所述。
如圖5所示,每一抓持銷3包含從組成抓持銷3之基座的齒輪3-1延伸之軸桿,該軸桿係旋轉地被接收於蓋5的內孔內,且帶著上述偏心配置在該軸桿之旋轉軸的抓持銷。每一抓持銷3均被滾針軸承3-3及相關聯之螺旋彈簧3-5促使向上往蓋5移動,其每一個均位於基體9的外向上延伸周圍邊緣內所形成之凹槽內。
藉由環形齒輪7的協助而旋轉抓持銷3的軸桿,抓持銷從夾盤1之旋轉軸的徑向距離可改變。已知例如於美國專利號第4,903,717以及5,513,668的描述中得知利用機械裝置來提供齒輪以及夾盤體的相對移動以旋轉偏心設置之銷。
根據共同持有之審查中美國專利公開號第2011/0254236中所描述之裝置,一個以上之抓持銷3係由靜電耗散或導電材料所製成,例如導電塑膠,俾使通過導電銷組件且沿著建置於夾盤內之導電路徑而耗散靜電荷。或者,不銹鋼或類似物之導電鑲嵌物3-7係填裝入抓持銷3之主要軸桿中的盲孔內,並暴露在與導電滾針軸承3-3接觸的抓持銷底部。
放電路徑繼續通過金屬彈簧3-5而到固定在基體9的導電板9-1及9-3,最終接地。
夾盤體的蓋5習知係以絕緣材料製成,雖然蓋與晶圓並無接觸,且雖然本實施例提供了從晶圓往抓持銷且通過抓持銷的導電路徑,在晶圓上仍亦可引起靜電荷。因此,本實施例中的蓋5的製成係俾使包含面對晶圓的導電性材料以及提供從導電材料往接地方向的導電路徑。
因此,再度參照圖5,提供另一導電路徑,其係從夾盤蓋5(或者由導電材料製成之該蓋的一部份)延伸到安裝於蓋5底面之上彈簧座5-3,接著再透過螺旋彈簧5-5以及安裝於導電條9-3之下彈簧座5-7,從那裡此路徑便與上述說明之前一路徑相同。在圖5中,需進一步注意到每一彈簧5-5均通過形成於環形齒輪7中的各別開口。更不待言,在第一及第二導電路徑中所涉及之每一前述元件,其本身整體或部分導電而足以建立所述之路徑。
若需要的話,上下彈簧座5-3及5-7可採取環狀或是複數個環狀區段的形態而例如位於與夾盤之旋轉軸共軸之處,以容納複數個彈簧5-5。
因此,夾盤1可選擇性地提供至少一個額外的導電路徑,通過彈簧座5-3、彈簧5-5、彈簧座5-7以及導電條9-3,也可選擇性地從一個以上之抓持銷3通過滾針軸承3-3、螺旋彈簧3-5、彈簧座9-1以及導電條9-3。藉由例如電性連接至相關聯工具框架或另一合適接地,上述每一導電路徑可能例如通往夾盤馬達,接著電性接地。
吾人應理解,除了金屬元件之外或是取代金屬元件,任何具有足夠電性連接特性之相當導電塑膠材料均可能用來形成前述之導電路徑。例如,合適的導電塑膠材料包含例如市場上商標名稱為SIMONA PVDF-EL的併有導電碳之聚二氟乙烯,據報導稱其於測試方法 DIN IEC 60093下,展現出體積電阻及表面電阻分別為 ≤ 106 ohm*cm 以及 ≤ 106 ohm。其他相當導電塑膠材料包含例如市面上商標名稱為 Fluon LM-ETFE AH-3000之碳填充乙烯四氟乙烯,以及例如杜邦販售之商標名稱為VESPEL CR-6110的碳纖維填充全氟烷氧基,其包含碳纖維片及聚合物層的組成,且據信在該等層的方向上展現出體積電阻及表面電阻分別約為 10-1 ohm*cm 以及 10-1 ohm,在垂直於該等層的方向上,則分別展現出約為 100 ohm*cm 以及 101 ohm。
雖然本發明係以其數個較佳實施例來加以說明,然而吾人應瞭解該等實施例僅供說明之用,不該作為限制由所附之申請專利範圍的真實範圍及精神所給予的保護範圍。
1‧‧‧旋轉夾盤
3‧‧‧抓持銷
3-1‧‧‧齒輪
3-3‧‧‧滾針軸承
3-5‧‧‧螺旋彈簧
3-7‧‧‧導電鑲嵌物
5‧‧‧蓋
5-1‧‧‧環狀凸條
5-3‧‧‧上彈簧座
5-5‧‧‧螺旋彈簧
5-7‧‧‧下彈簧座
7‧‧‧環形齒輪
9‧‧‧基體
9-1‧‧‧導電板
9-3‧‧‧導電條
10‧‧‧底座元件
15‧‧‧徑向內上邊緣
20‧‧‧頂部元件
30‧‧‧第一中間元件
35‧‧‧徑向內邊緣
40‧‧‧第二中間元件
45‧‧‧徑向內邊緣
50‧‧‧上導流片
60‧‧‧中導流片
70‧‧‧下導流片
81‧‧‧導電元件
83‧‧‧導電元件
在閱讀對本發明之較佳實施例的下列詳細說明以及參照所附的圖式之後,本發明之其他目標、特徵以及優點將變得更加明顯。其中:
圖1顯示一軸向剖面透視圖,說明根據本發明之第一實施例的液體收集器;
圖2顯示一放大圖,說明圖1指定的細節II;
圖3顯示一透視圖,說明顯示於圖1中之液體收集器的上導流片50;
圖4顯示一軸向剖面透視圖,貫穿根據本發明之第一實施例的設備;以及
圖5顯示一放大圖,說明圖4指定的細節V。

Claims (20)

  1. 一種晶圓處理設備,該晶圓處理設備包含:旋轉夾盤,用以在晶圓上進行處理操作期間,支撐該晶圓並使其旋轉;以及環繞該旋轉夾盤之液體收集器,其中該液體收集器包含:導流片,包含內導電環、以及在徑向上從該內導電環延伸至該導流片之外周圍邊緣的複數個導電元件,以及第一導電元件,與該複數個導電元件連接並且用以使該內導電環接地,該複數個導電元件不包含該第一導電元件,以及該液體收集器不接觸該晶圓。
  2. 如申請專利範圍第1項之晶圓處理設備,其中:該液體收集器包含至少兩個階層;以及該旋轉夾盤可相對於該液體收集器而垂直移動,以將位於該旋轉夾盤上之該晶圓定位於該至少兩個階層的所選之一處。
  3. 如申請專利範圍第1項之晶圓處理設備,其中面向該旋轉夾盤之該液體收集器之元件係由非導電性塑膠所製成。
  4. 如申請專利範圍第3項之晶圓處理設備,其中該非導電性塑膠包含一或多個材料,該等材料係選自下列組成之群組:聚四氟乙烯(PTFE,polytetrafluoroethylene)、全氟烷氧基(PFA,perfluoroalkoxy)、聚伸苯基硫化物(PPS,polyphenylenesulfide)、聚醚醚酮(PEEK,polyetheretherketone)、聚苯乙烯/聚乙基苯乙烯(PS/PES,polystyrene/polyethylstyrene)、乙烯四氟乙烯(ETFE,ethylene tetrafluoroethylene)、聚亞乙烯基氟化物(PVDF,polyvinylidene fluoride)、氯三氟乙烯的均聚物(PCTFE,homopolymer of chlorotrifluoroethylene)、氟化乙烯丙烯(FEP,fluorinated ethylene propylene)、及乙烯氯三氟乙烯(ECTFE,ethylene chlorotrifluoroethylene)。
  5. 如申請專利範圍第4項之晶圓處理設備,其中該非導電性塑膠包含PCTFE。
  6. 如申請專利範圍第1項之晶圓處理設備,其中:該導流片為向內引導之擋板;以及該內導電環與該複數個導電元件係鑲嵌於該向內引導之擋板內。
  7. 如申請專利範圍第2項之晶圓處理設備,其中:該導流片為位於該至少兩個階層之最上面階層的向內引導之擋板;以及該內導電環與該複數個導電元件係鑲嵌於該向內引導之擋板內。
  8. 如申請專利範圍第1項之晶圓處理設備,其中:該內導電環與該複數個導電元件包含第一導電材料;以及該第一導電材料為導電聚合物。
  9. 如申請專利範圍第1項之晶圓處理設備,其中:該內導電環與該複數個導電元件包含第一導電材料;以及該第一導電材料為不銹鋼。
  10. 如申請專利範圍第1項之晶圓處理設備,其中:該旋轉夾盤包含複數個銷組件,其配置及定位係用以支撐該晶圓;該複數個銷組件中的一或多個包含抓持銷;該複數個銷組件中的至少一個係由化學性惰性材料所形成,且在其一端包含導電鑲嵌物;該導電鑲嵌物係用以實體電性接合一軸承元件;該旋轉夾盤包含第一放電路徑以及第二放電路徑;該第一放電路徑包含該導電鑲嵌物、該抓持銷、該軸承元件、第一彈簧、以及複數個導電板;以及該第二放電路徑包含蓋、複數個彈簧座、第二彈簧、以及該複數個導電板中的一個。
  11. 如申請專利範圍第10項之晶圓處理設備,其中該軸承元件為導電滾針軸承。
  12. 一種用於預定直徑之晶圓之處理設備之液體收集器,該液體收集器包含:導流片,配置為環繞旋轉夾盤,該旋轉夾盤乃用以在晶圓上進行處理操作期間,支撐該晶圓並使其旋轉,其中該導流片在該處理操作期間不接觸該晶圓,且其中該導流片包含內導電環、以及在徑向上從該內導電環延伸至該導流片之外周圍邊緣的複數個導電元件;排放管,配置在比該導流片更低之該液體收集器的階層,並且在徑向上從該導流片向外配置;以及第一導電元件,與該複數個導電元件中的至少一個連接,並且用以使該內導電環接地,其中該第一導電元件延伸圍繞該排放管的一部分,且其中該複數個導電元件不包含該第一導電元件。
  13. 如申請專利範圍第12項之用於預定直徑之晶圓之處理設備之液體收集器,其中更包含界定至少兩處理階層之內部結構,該旋轉夾盤係設置成藉由相對於該液體收集器的該旋轉夾盤之垂直移動而定位在該等處理階層。
  14. 如申請專利範圍第12項之用於預定直徑之晶圓之處理設備之液體收集器,其中該液體收集器之朝內元件係由非導電性塑膠所製成。
  15. 如申請專利範圍第14項之用於預定直徑之晶圓之處理設備之液體收集器,其中該非導電性塑膠包含一或多個材料,該等材料係選自下列組成之群組:聚四氟乙烯(PTFE,polytetrafluoroethylene)、全氟烷氧基(PFA,perfluoroalkoxy)、聚伸苯基硫化物(PPS,polyphenylenesulfide)、聚醚醚酮(PEEK,polyetheretherketone)、聚苯乙烯/聚乙基苯乙烯(PS/PES,polystyrene/polyethylstyrene)、乙烯四氟乙烯(ETFE,ethylene tetrafluoroethylene)、聚亞乙烯基氟化物(PVDF,polyvinylidene fluoride)、氯三氟乙烯的均聚物(PCTFE,homopolymer of chlorotrifluoroethylene)、氟化乙烯丙烯(FEP,fluorinated ethylene propylene)、及乙烯氯三氟乙烯(ECTFE,ethylene chlorotrifluoroethylene)。
  16. 如申請專利範圍第15項之用於預定直徑之晶圓之處理設備之液體收集器,其中該非導電性塑膠包含PCTFE。
  17. 如申請專利範圍第12項之用於預定直徑之晶圓之處理設備之液體收集器,其中:該導流片為向內引導之擋板;以及該內導電環與該複數個導電元件係鑲嵌於該向內引導之擋板內。
  18. 如申請專利範圍第13項之用於預定直徑之晶圓之處理設備之液體收集器,其中:該導流片為位於該至少兩個階層之最上面階層的向內引導之擋板;以及該內導電環與該複數個導電元件係鑲嵌於該向內引導之擋板內。
  19. 如申請專利範圍第12項之用於預定直徑之晶圓之處理設備之液體收集器,其中:該內導電環與該複數個導電元件包含第一導電材料;以及該第一導電材料為導電聚合物。
  20. 如申請專利範圍第12項之用於預定直徑之晶圓之處理設備之液體收集器,其中:該內導電環與該複數個導電元件包含第一導電材料;以及該第一導電材料為不銹鋼。
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