SG10201501160QA - Apparatus for liquid treatment of wafer shaped articles - Google Patents

Apparatus for liquid treatment of wafer shaped articles

Info

Publication number
SG10201501160QA
SG10201501160QA SG10201501160QA SG10201501160QA SG10201501160QA SG 10201501160Q A SG10201501160Q A SG 10201501160QA SG 10201501160Q A SG10201501160Q A SG 10201501160QA SG 10201501160Q A SG10201501160Q A SG 10201501160QA SG 10201501160Q A SG10201501160Q A SG 10201501160QA
Authority
SG
Singapore
Prior art keywords
liquid treatment
shaped articles
wafer shaped
wafer
articles
Prior art date
Application number
SG10201501160QA
Inventor
Schwarzenbacher Reinhold
Pliska Milan
Original Assignee
Lam Res Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Res Ag filed Critical Lam Res Ag
Publication of SG10201501160QA publication Critical patent/SG10201501160QA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67356—Closed carriers specially adapted for containing chips, dies or ICs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67396—Closed carriers characterised by the presence of antistatic elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/7287—Liquid level responsive or maintaining systems
    • Y10T137/7306—Electrical characteristic sensing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T279/00—Chucks or sockets
    • Y10T279/17—Socket type
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T279/00—Chucks or sockets
    • Y10T279/34—Accessory or component

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Coating Apparatus (AREA)
  • Weting (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
SG10201501160QA 2014-02-24 2015-02-13 Apparatus for liquid treatment of wafer shaped articles SG10201501160QA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US14/188,230 US9779979B2 (en) 2014-02-24 2014-02-24 Apparatus for liquid treatment of wafer shaped articles

Publications (1)

Publication Number Publication Date
SG10201501160QA true SG10201501160QA (en) 2015-09-29

Family

ID=53882919

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201501160QA SG10201501160QA (en) 2014-02-24 2015-02-13 Apparatus for liquid treatment of wafer shaped articles

Country Status (6)

Country Link
US (1) US9779979B2 (en)
JP (1) JP6562649B2 (en)
KR (1) KR102382691B1 (en)
CN (1) CN104867852B (en)
SG (1) SG10201501160QA (en)
TW (1) TWI654696B (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9768041B2 (en) 2013-08-12 2017-09-19 Veeco Precision Surface Processing Llc Collection chamber apparatus to separate multiple fluids during the semiconductor wafer processing cycle
US10707099B2 (en) 2013-08-12 2020-07-07 Veeco Instruments Inc. Collection chamber apparatus to separate multiple fluids during the semiconductor wafer processing cycle
JP6715019B2 (en) * 2016-02-09 2020-07-01 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing apparatus and substrate processing method
JP6462620B2 (en) * 2016-03-29 2019-01-30 東京エレクトロン株式会社 Substrate processing apparatus and substrate processing method
JP6820783B2 (en) * 2017-03-30 2021-01-27 東京エレクトロン株式会社 Board processing equipment
WO2018200398A1 (en) * 2017-04-25 2018-11-01 Veeco Precision Surface Processing Llc Semiconductor wafer processing chamber
KR102096967B1 (en) * 2017-11-24 2020-04-03 (주)신우에이엔티 Antistatic chuck pin, antistatic chuck body member and wafer handling unit comprising the antistatic chuck pin and the antistatic chuck body member
KR102052536B1 (en) * 2017-11-24 2019-12-05 (주)신우에이엔티 Antistatic bowl
KR102063320B1 (en) * 2017-11-29 2020-01-08 세메스 주식회사 Apparatus and Method for treating substrate
KR102139605B1 (en) * 2018-11-06 2020-08-12 세메스 주식회사 Method and apparatus for processing substrate
JP6773167B1 (en) * 2019-04-16 2020-10-21 ダイキン工業株式会社 Wafer cup

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT389959B (en) 1987-11-09 1990-02-26 Sez Semiconduct Equip Zubehoer DEVICE FOR SETTING DISC-SHAPED OBJECTS, ESPECIALLY SILICONE DISC
DE59407361D1 (en) 1993-02-08 1999-01-14 Sez Semiconduct Equip Zubehoer Carrier for disc-shaped objects
JPH09115873A (en) * 1995-10-20 1997-05-02 Mitsubishi Electric Corp Method and system for producing semiconductor
ATE211855T1 (en) 1999-04-28 2002-01-15 Sez Semiconduct Equip Zubehoer DEVICE AND METHOD FOR THE LIQUID TREATMENT OF DISK-SHAPED OBJECTS
JP3464177B2 (en) 1999-09-06 2003-11-05 沖電気工業株式会社 Semiconductor manufacturing apparatus and static electricity removing method
US6536454B2 (en) 2000-07-07 2003-03-25 Sez Ag Device for treating a disc-shaped object
CN100447943C (en) * 2003-03-20 2008-12-31 Sez股份公司 Device and method for wet treating disc-shaped articles
JP2005072559A (en) * 2003-08-05 2005-03-17 Dainippon Screen Mfg Co Ltd Device and method for processing substrate
JP2007234882A (en) * 2006-03-01 2007-09-13 Dainippon Screen Mfg Co Ltd Substrate processing apparatus, and substrate handling method
JP2008004762A (en) * 2006-06-22 2008-01-10 Nippon Valqua Ind Ltd Spin cup of wafer cleaning/drying device
KR100900628B1 (en) * 2006-09-15 2009-06-02 다이닛뽕스크린 세이조오 가부시키가이샤 Substrate processing apparatus and substrate processing method
JP4823036B2 (en) * 2006-09-15 2011-11-24 大日本スクリーン製造株式会社 Substrate processing equipment
US9190310B2 (en) * 2010-04-16 2015-11-17 Lam Research Ag Grounded chuck

Also Published As

Publication number Publication date
US9779979B2 (en) 2017-10-03
KR20150100538A (en) 2015-09-02
TW201539619A (en) 2015-10-16
CN104867852B (en) 2017-12-29
KR102382691B1 (en) 2022-04-04
US20150243543A1 (en) 2015-08-27
TWI654696B (en) 2019-03-21
JP2015173261A (en) 2015-10-01
CN104867852A (en) 2015-08-26
JP6562649B2 (en) 2019-08-21

Similar Documents

Publication Publication Date Title
ZA201608850B (en) Electrochemical liquid treatment apparatus
SG10201501160QA (en) Apparatus for liquid treatment of wafer shaped articles
SG11201702033VA (en) Apparatus and method for cleaning semiconductor wafer
KR102342131B9 (en) Substrate treatment apparatus and substrate treatment method
PL3107957T3 (en) Process for the surface treatment of plastic objects
HUE061613T2 (en) Laundry treatment apparatus
PL3666963T3 (en) Clothes treatment apparatus
PL3297975T3 (en) Method for complex treatment of phosphogypsum
SG10201502813TA (en) Substrate Processing Apparatus
SG11201610455TA (en) Method and device for surface treatment of substrates
GB2580236B (en) Apparatus for treating runoff
GB201410116D0 (en) Method of treatment
GB201401430D0 (en) Treatment process
GB2515890B (en) Apparatus for the removal of sludge
SG11201607719TA (en) Method and device for the surface treatment of substrates
PL2990385T3 (en) Method for treatment of process water
IL253028B (en) Method of treatment
GB201321102D0 (en) Apparatus for treatment of liquid
SG10201502817UA (en) Substrate Processing Apparatus
ZA201602971B (en) Apparatus & process
SG11201608771WA (en) Method and device for plasma treatment of substrates
PL3151899T3 (en) Device for the treatment of esophageal stenoses
SI3129311T1 (en) Method for displacing groups of articles horizontally
SG11201801456TA (en) Substrate treatment apparatus
GB2534681B (en) Treatment apparatus