JP2015173261A - ウエハ状の物品の液体処理用装置 - Google Patents
ウエハ状の物品の液体処理用装置 Download PDFInfo
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- JP2015173261A JP2015173261A JP2015028115A JP2015028115A JP2015173261A JP 2015173261 A JP2015173261 A JP 2015173261A JP 2015028115 A JP2015028115 A JP 2015028115A JP 2015028115 A JP2015028115 A JP 2015028115A JP 2015173261 A JP2015173261 A JP 2015173261A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67356—Closed carriers specially adapted for containing chips, dies or ICs
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67396—Closed carriers characterised by the presence of antistatic elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/7287—Liquid level responsive or maintaining systems
- Y10T137/7306—Electrical characteristic sensing
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T279/00—Chucks or sockets
- Y10T279/17—Socket type
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T279/00—Chucks or sockets
- Y10T279/34—Accessory or component
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Coating Apparatus (AREA)
- Weting (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Description
Claims (22)
- ウエハ状の物品を処理する装置であって、
前記ウエハ状の物品上で実施される処理動作中に、所定の直径のウエハ状の物品を保持し回転させるよう適合されたスピンチャックと、
前記スピンチャックを囲む液体回収体と、
を備え、
前記液体回収体は、第1の内面を備え、前記第1の内面は第1の導電材料からなり、前記回収体はさらに、前記第1の導電材料をグランドに接続するための第1の導電経路を備える、装置。 - 請求項1に記載の装置であって、前記液体回収体は、少なくとも2つのレベルを備え、前記スピンチャックは、前記少なくとも2つのレベルのうち選択された1つで、前記スピンチャック上に設置されたウエハを位置決めするために、前記液体回収体に対して垂直に移動可能である、装置。
- 請求項1に記載の装置であって、前記スピンチャックに対向する、前記液体回収体の前記第1の内面以外の面は、非導電性プラスチック製である、装置。
- 請求項3に記載の装置であって、前記非導電性プラスチックは、ポリテトラフルオロエチレン(PTFE)、パーフルオロアルコキシ(PFA)、ポリフェニレンサルファイド(PPS)、ポリエーテルエーテルケトン(PEEK)、ポリスチレン/ポリエチルスチレン(PS/PES)、エチレン−テトラフルオロエチレン共重合体(ETFE)、フッ化ビニリデン(PVDF)、クロロトリフルオロエチレン単独重合体(PCTFE)、フッ素化エチレンプロピレン(FEP)、およびエチレン−クロロトリフルオロエチレン共重合体(ECTFE)からなる群より選ばれる1つ以上の部材を含む、装置。
- 請求項4に記載の装置であって、前記非導電性プラスチックはPCTFEを含む、装置。
- 請求項1に記載の装置であって、前記液体回収体は内向きのバッフルを備え、前記第1の導電材料は前記内向きバッフルにはめ込まれている、装置。
- 請求項2に記載の装置であって、前記液体回収体は、前記少なくとも2つのレベルのうち最も上のレベルに内向きバッフルを備え、前記第1の導電材料は前記内向きバッフルにはめ込まれている、装置。
- 請求項1に記載の装置であって、前記第1の導電材料は導電性高分子である、装置。
- 請求項1に記載の装置であって、前記第1の導電材料はステンレス鋼である、装置。
- 請求項1に記載の装置であって、前記第1の導電材料は、前記液体回収体の前記第1の内面に周方向に配置された複数の導電素子を備える、装置。
- 請求項1に記載の装置であって、前記スピンチャックは、処理されるウエハ状の物品を支持するために適合かつ位置決めされた複数のピンアセンブリを備え、少なくとも1つの前記ピンアセンブリは、化学的に不活性な材料で形成され、また一端に導電性インレーを含み、前記インレーは、軸受要素を物理的かつ電気的に係合するよう適合された、装置。
- 請求項11に記載の装置であって、前記軸受要素は導電性ニードル軸受である、装置。
- ウエハ状の物品を処理する装置で用いられる液体回収体であって、
前記ウエハ状の物品上で実施される処理動作中に、所定の直径のウエハ状の物品を保持し回転させるよう適合されたスピンチャックを囲むように構成され、前記液体回収体は第1の内面を備え、前記第1の内面は第1の導電材料からなり、前記回収体はさらに、前記第1の導電材料をグランドに接続する第1の導電経路を備える、液体回収体。 - 請求項13に記載の液体回収体であって、さらに、前記液体回収体とスピンチャックとの間の相対的垂直移動によりスピンチャックが位置決めされてよい、少なくとも2つの処理レベルを規定する内部構造を備える、液体回収体。
- 請求項13に記載の液体回収体であって、前記液体回収体の前記第1の内面以外の内向き面は、非導電性プラスチック製である、液体回収体。
- 請求項15に記載の液体回収体であって、前記非導電性プラスチックは、ポリテトラフルオロエチレン(PTFE)、パーフルオロアルコキシ(PFA)、ポリフェニレンサルファイド(PPS)、ポリエーテルエーテルケトン(PEEK)、ポリスチレン/ポリエチルスチレン(PS/PES)、エチレン−テトラフルオロエチレン共重合体(ETFE)、フッ化ビニリデン(PVDF)、クロロトリフルオロエチレン単独重合体(PCTFE)、フッ素化エチレンプロピレン(FEP)、およびエチレン−クロロトリフルオロエチレン共重合体(ECTFE)からなる群より選ばれる1つ以上の部材を含む、液体回収体。
- 請求項16に記載の液体回収体であって、前記非導電性プラスチックはPCTFEを含む、液体回収体。
- 請求項13に記載の液体回収体であって、さらに、内向きのバッフルを備え、前記第1の導電材料は前記内向きバッフルにはめ込まれている、液体回収体。
- 請求項14に記載の液体回収体であって、さらに、前記少なくとも2つのレベルのうち最も上のレベルに内向きバッフルを備え、前記第1の導電材料は前記内向きバッフルにはめ込まれている、液体回収体。
- 請求項13に記載の液体回収体であって、前記第1の導電材料は導電性高分子である、液体回収体。
- 請求項13に記載の液体回収体であって、前記第1の導電材料はステンレス鋼である、液体回収体。
- 請求項13に記載の液体回収体であって、前記第1の導電材料は、前記第1の内面に周方向に配置された複数の導電素子を備える、液体回収体。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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US14/188,230 | 2014-02-24 | ||
US14/188,230 US9779979B2 (en) | 2014-02-24 | 2014-02-24 | Apparatus for liquid treatment of wafer shaped articles |
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JP2015173261A true JP2015173261A (ja) | 2015-10-01 |
JP6562649B2 JP6562649B2 (ja) | 2019-08-21 |
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JP2015028115A Active JP6562649B2 (ja) | 2014-02-24 | 2015-02-17 | ウエハを処理する装置およびその装置で用いられる液体回収体 |
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US (1) | US9779979B2 (ja) |
JP (1) | JP6562649B2 (ja) |
KR (1) | KR102382691B1 (ja) |
CN (1) | CN104867852B (ja) |
SG (1) | SG10201501160QA (ja) |
TW (1) | TWI654696B (ja) |
Cited By (3)
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JP2018170436A (ja) * | 2017-03-30 | 2018-11-01 | 東京エレクトロン株式会社 | 基板処理装置 |
KR20190060415A (ko) * | 2017-11-24 | 2019-06-03 | (주)신우에이엔티 | 대전 방지용 바울 |
KR20190062856A (ko) * | 2017-11-29 | 2019-06-07 | 세메스 주식회사 | 기판 처리 장치 및 방법 |
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US9768041B2 (en) | 2013-08-12 | 2017-09-19 | Veeco Precision Surface Processing Llc | Collection chamber apparatus to separate multiple fluids during the semiconductor wafer processing cycle |
US10707099B2 (en) | 2013-08-12 | 2020-07-07 | Veeco Instruments Inc. | Collection chamber apparatus to separate multiple fluids during the semiconductor wafer processing cycle |
JP6715019B2 (ja) * | 2016-02-09 | 2020-07-01 | 株式会社Screenホールディングス | 基板処理装置および基板処理方法 |
JP6462620B2 (ja) * | 2016-03-29 | 2019-01-30 | 東京エレクトロン株式会社 | 基板処理装置および基板処理方法 |
WO2018200398A1 (en) * | 2017-04-25 | 2018-11-01 | Veeco Precision Surface Processing Llc | Semiconductor wafer processing chamber |
KR102096967B1 (ko) * | 2017-11-24 | 2020-04-03 | (주)신우에이엔티 | 대전 방지용 척 핀, 대전 방지용 척 바디 부재 및 상기 대전 방지용 척 핀과 상기 대전 방지용 척 바디 부재를 포함하는 기판 처리 유닛 |
KR102139605B1 (ko) * | 2018-11-06 | 2020-08-12 | 세메스 주식회사 | 기판 처리 방법 및 기판 처리 장치 |
JP6773167B1 (ja) * | 2019-04-16 | 2020-10-21 | ダイキン工業株式会社 | ウェハーカップ |
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- 2015-02-17 JP JP2015028115A patent/JP6562649B2/ja active Active
- 2015-02-17 CN CN201510086331.6A patent/CN104867852B/zh active Active
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JP2018170436A (ja) * | 2017-03-30 | 2018-11-01 | 東京エレクトロン株式会社 | 基板処理装置 |
KR20190060415A (ko) * | 2017-11-24 | 2019-06-03 | (주)신우에이엔티 | 대전 방지용 바울 |
KR102052536B1 (ko) | 2017-11-24 | 2019-12-05 | (주)신우에이엔티 | 대전 방지용 바울 |
KR20190062856A (ko) * | 2017-11-29 | 2019-06-07 | 세메스 주식회사 | 기판 처리 장치 및 방법 |
KR102063320B1 (ko) | 2017-11-29 | 2020-01-08 | 세메스 주식회사 | 기판 처리 장치 및 방법 |
Also Published As
Publication number | Publication date |
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US9779979B2 (en) | 2017-10-03 |
KR20150100538A (ko) | 2015-09-02 |
TW201539619A (zh) | 2015-10-16 |
CN104867852B (zh) | 2017-12-29 |
KR102382691B1 (ko) | 2022-04-04 |
US20150243543A1 (en) | 2015-08-27 |
TWI654696B (zh) | 2019-03-21 |
CN104867852A (zh) | 2015-08-26 |
SG10201501160QA (en) | 2015-09-29 |
JP6562649B2 (ja) | 2019-08-21 |
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