TWI650410B - 矽晶圓硏磨用組成物 - Google Patents
矽晶圓硏磨用組成物 Download PDFInfo
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- TWI650410B TWI650410B TW103117769A TW103117769A TWI650410B TW I650410 B TWI650410 B TW I650410B TW 103117769 A TW103117769 A TW 103117769A TW 103117769 A TW103117769 A TW 103117769A TW I650410 B TWI650410 B TW I650410B
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- polishing
- silicon wafer
- polymer
- containing polymer
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- 150000002825 nitriles Chemical class 0.000 description 1
- GSGDTSDELPUTKU-UHFFFAOYSA-N nonoxybenzene Chemical compound CCCCCCCCCOC1=CC=CC=C1 GSGDTSDELPUTKU-UHFFFAOYSA-N 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- ZPIRTVJRHUMMOI-UHFFFAOYSA-N octoxybenzene Chemical compound CCCCCCCCOC1=CC=CC=C1 ZPIRTVJRHUMMOI-UHFFFAOYSA-N 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 235000020232 peanut Nutrition 0.000 description 1
- LQPLDXQVILYOOL-UHFFFAOYSA-I pentasodium;2-[bis[2-[bis(carboxylatomethyl)amino]ethyl]amino]acetate Chemical compound [Na+].[Na+].[Na+].[Na+].[Na+].[O-]C(=O)CN(CC([O-])=O)CCN(CC(=O)[O-])CCN(CC([O-])=O)CC([O-])=O LQPLDXQVILYOOL-UHFFFAOYSA-I 0.000 description 1
- 229960003330 pentetic acid Drugs 0.000 description 1
- 229960005323 phenoxyethanol Drugs 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 description 1
- XZGOQALCCBZAKK-UHFFFAOYSA-N piperidine hexahydrate Chemical compound O.O.O.O.O.O.N1CCCCC1 XZGOQALCCBZAKK-UHFFFAOYSA-N 0.000 description 1
- 229920002401 polyacrylamide Polymers 0.000 description 1
- 229920002239 polyacrylonitrile Polymers 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 125000003367 polycyclic group Chemical group 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 239000003755 preservative agent Substances 0.000 description 1
- 230000002335 preservative effect Effects 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- 125000002572 propoxy group Chemical group [*]OC([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 1
- 125000005767 propoxymethyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])[#8]C([H])([H])* 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 235000019423 pullulan Nutrition 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 238000007127 saponification reaction Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 229910000030 sodium bicarbonate Inorganic materials 0.000 description 1
- 235000017557 sodium bicarbonate Nutrition 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 235000017550 sodium carbonate Nutrition 0.000 description 1
- HLWRUJAIJJEZDL-UHFFFAOYSA-M sodium;2-[2-[bis(carboxymethyl)amino]ethyl-(carboxymethyl)amino]acetate Chemical compound [Na+].OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC([O-])=O HLWRUJAIJJEZDL-UHFFFAOYSA-M 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 125000000547 substituted alkyl group Chemical group 0.000 description 1
- 125000000020 sulfo group Chemical group O=S(=O)([*])O[H] 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 125000004434 sulfur atom Chemical group 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 229920001059 synthetic polymer Polymers 0.000 description 1
- 239000011975 tartaric acid Substances 0.000 description 1
- 235000002906 tartaric acid Nutrition 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 229910001428 transition metal ion Inorganic materials 0.000 description 1
- 150000003852 triazoles Chemical class 0.000 description 1
- 229960001124 trientine Drugs 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000003039 volatile agent Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
- B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1436—Composite particles, e.g. coated particles
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
- H01L21/02024—Mirror polishing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Composite Materials (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013120328 | 2013-06-07 | ||
| JP2013-120328 | 2013-06-07 | ||
| JP2014-010836 | 2014-01-23 | ||
| JP2014010836 | 2014-01-23 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201510197A TW201510197A (zh) | 2015-03-16 |
| TWI650410B true TWI650410B (zh) | 2019-02-11 |
Family
ID=52007952
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW103117769A TWI650410B (zh) | 2013-06-07 | 2014-05-21 | 矽晶圓硏磨用組成物 |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US20160122591A1 (OSRAM) |
| EP (1) | EP3007213B1 (OSRAM) |
| JP (2) | JP6037416B2 (OSRAM) |
| KR (1) | KR102239045B1 (OSRAM) |
| CN (1) | CN105264647B (OSRAM) |
| SG (1) | SG11201508398TA (OSRAM) |
| TW (1) | TWI650410B (OSRAM) |
| WO (1) | WO2014196299A1 (OSRAM) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6403324B2 (ja) * | 2014-12-25 | 2018-10-10 | 花王株式会社 | シリコンウェーハ用研磨液組成物 |
| JP6366139B2 (ja) * | 2014-12-25 | 2018-08-01 | 花王株式会社 | シリコンウェーハ用研磨液組成物の製造方法 |
| EP3258483A4 (en) * | 2015-02-12 | 2018-02-28 | Fujimi Incorporated | Method for polishing silicon wafer and surface treatment composition |
| US10748778B2 (en) | 2015-02-12 | 2020-08-18 | Fujimi Incorporated | Method for polishing silicon wafer and surface treatment composition |
| CN107735471B (zh) * | 2015-07-10 | 2021-02-12 | 费罗公司 | 用于抛光有机聚合物基眼用基材的浆液组合物和添加剂以及方法 |
| JP6801964B2 (ja) * | 2016-01-19 | 2020-12-16 | 株式会社フジミインコーポレーテッド | 研磨用組成物及びシリコン基板の研磨方法 |
| US11332640B2 (en) | 2016-02-29 | 2022-05-17 | Fujimi Incorporated | Polishing composition and polishing method using same |
| JP6880047B2 (ja) * | 2016-09-21 | 2021-06-02 | 株式会社フジミインコーポレーテッド | 表面処理組成物 |
| KR20190134692A (ko) * | 2017-03-31 | 2019-12-04 | 가부시키가이샤 후지미인코퍼레이티드 | 연마용 조성물 |
| JP6916039B2 (ja) * | 2017-06-05 | 2021-08-11 | Ａｔシリカ株式会社 | 研磨用組成物 |
| US11421131B2 (en) | 2017-11-06 | 2022-08-23 | Fujimi Incorporated | Polishing composition and method for producing same |
| JP7353051B2 (ja) * | 2019-03-26 | 2023-09-29 | 株式会社フジミインコーポレーテッド | シリコンウェーハ研磨用組成物 |
| JP7356248B2 (ja) * | 2019-03-28 | 2023-10-04 | 株式会社フジミインコーポレーテッド | リンス用組成物およびリンス方法 |
| CN110922897B (zh) * | 2019-11-18 | 2024-03-08 | 宁波日晟新材料有限公司 | 一种用于硅化合物的低雾值无损伤抛光液及其制备方法 |
| JP7512035B2 (ja) * | 2019-12-24 | 2024-07-08 | ニッタ・デュポン株式会社 | 研磨用組成物 |
| JP7752601B2 (ja) * | 2020-03-13 | 2025-10-10 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
| WO2021182155A1 (ja) * | 2020-03-13 | 2021-09-16 | 株式会社フジミインコーポレーテッド | 研磨用組成物および研磨方法 |
| JP7562453B2 (ja) | 2021-03-12 | 2024-10-07 | キオクシア株式会社 | 研磨液、研磨装置、及び研磨方法 |
| EP4355836A4 (en) * | 2021-06-14 | 2025-04-09 | Entegris, Inc. | SANDING HARD SUBSTRATES |
| CN118985038A (zh) | 2022-03-23 | 2024-11-19 | 福吉米株式会社 | 研磨用组合物 |
| JPWO2024195575A1 (OSRAM) * | 2023-03-20 | 2024-09-26 | ||
| WO2025115883A1 (ja) * | 2023-11-28 | 2025-06-05 | 大阪有機化学工業株式会社 | 研磨組成物 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200942602A (en) * | 2007-11-14 | 2009-10-16 | Showa Denko Kk | Polishing composition |
| TW201346017A (zh) * | 2012-04-17 | 2013-11-16 | Kao Corp | 矽晶圓用研磨液組合物 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100447551B1 (ko) * | 1999-01-18 | 2004-09-08 | 가부시끼가이샤 도시바 | 복합 입자 및 그의 제조 방법, 수계 분산체, 화학 기계연마용 수계 분산체 조성물 및 반도체 장치의 제조 방법 |
| KR20010046395A (ko) * | 1999-11-12 | 2001-06-15 | 안복현 | 연마용 조성물 |
| KR100663781B1 (ko) * | 2003-01-31 | 2007-01-02 | 히다치 가세고교 가부시끼가이샤 | Ｃμρ연마제 및 연마방법 |
| US20090093118A1 (en) | 2005-04-14 | 2009-04-09 | Showa Denko K.K. | Polishing composition |
| US20070175104A1 (en) | 2005-11-11 | 2007-08-02 | Hitachi Chemical Co., Ltd. | Polishing slurry for silicon oxide, additive liquid and polishing method |
| JPWO2008013226A1 (ja) * | 2006-07-28 | 2009-12-17 | 昭和電工株式会社 | 研磨組成物 |
| JP2008091524A (ja) * | 2006-09-29 | 2008-04-17 | Fujifilm Corp | 金属用研磨液 |
| JP2008181955A (ja) * | 2007-01-23 | 2008-08-07 | Fujifilm Corp | 金属用研磨液及びそれを用いた研磨方法 |
| KR101564676B1 (ko) * | 2008-02-01 | 2015-11-02 | 가부시키가이샤 후지미인코퍼레이티드 | 연마용 조성물 및 이를 이용한 연마 방법 |
| US20110081780A1 (en) * | 2008-02-18 | 2011-04-07 | Jsr Corporation | Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method |
| US8652350B2 (en) * | 2008-02-27 | 2014-02-18 | Jsr Corporation | Chemical mechanical polishing aqueous dispersion, chemical mechanical polishing method using the same, and method of recycling chemical mechanical polishing aqueous dispersion |
| CN105368397B (zh) * | 2008-04-23 | 2017-11-03 | 日立化成株式会社 | 研磨剂、研磨剂组件及使用该研磨剂的基板研磨方法 |
| JP5413456B2 (ja) * | 2009-04-20 | 2014-02-12 | 日立化成株式会社 | 半導体基板用研磨液及び半導体基板の研磨方法 |
| WO2011008658A1 (en) | 2009-07-15 | 2011-01-20 | Lam Research Corporation | Materials and systems for advanced substrate cleaning |
| EP2500929B1 (en) * | 2009-11-11 | 2018-06-20 | Kuraray Co., Ltd. | Slurry for chemical mechanical polishing and polishing method for substrate using same |
| JP4772156B1 (ja) | 2010-07-05 | 2011-09-14 | 花王株式会社 | シリコンウエハ用研磨液組成物 |
| KR101907229B1 (ko) * | 2011-02-03 | 2018-10-11 | 니타 하스 인코포레이티드 | 연마용 조성물 및 그것을 이용한 연마 방법 |
| SG11201405091TA (en) * | 2012-02-21 | 2014-09-26 | Hitachi Chemical Co Ltd | Polishing agent, polishing agent set, and substrate polishing method |
-
2014
- 2014-05-02 WO PCT/JP2014/062176 patent/WO2014196299A1/ja not_active Ceased
- 2014-05-02 CN CN201480032514.3A patent/CN105264647B/zh active Active
- 2014-05-02 KR KR1020157034595A patent/KR102239045B1/ko active Active
- 2014-05-02 EP EP14807048.5A patent/EP3007213B1/en active Active
- 2014-05-02 SG SG11201508398TA patent/SG11201508398TA/en unknown
- 2014-05-02 US US14/895,318 patent/US20160122591A1/en not_active Abandoned
- 2014-05-02 JP JP2015521346A patent/JP6037416B2/ja active Active
- 2014-05-21 TW TW103117769A patent/TWI650410B/zh active
-
2016
- 2016-07-08 JP JP2016135649A patent/JP6360108B2/ja active Active
-
2017
- 2017-05-23 US US15/602,679 patent/US10745588B2/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200942602A (en) * | 2007-11-14 | 2009-10-16 | Showa Denko Kk | Polishing composition |
| TW201346017A (zh) * | 2012-04-17 | 2013-11-16 | Kao Corp | 矽晶圓用研磨液組合物 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2014196299A1 (ja) | 2014-12-11 |
| KR20160013896A (ko) | 2016-02-05 |
| EP3007213A1 (en) | 2016-04-13 |
| CN105264647B (zh) | 2018-01-09 |
| CN105264647A (zh) | 2016-01-20 |
| EP3007213A4 (en) | 2017-02-22 |
| JP2016201557A (ja) | 2016-12-01 |
| US20160122591A1 (en) | 2016-05-05 |
| EP3007213B1 (en) | 2020-03-18 |
| US10745588B2 (en) | 2020-08-18 |
| TW201510197A (zh) | 2015-03-16 |
| JPWO2014196299A1 (ja) | 2017-02-23 |
| KR102239045B1 (ko) | 2021-04-12 |
| JP6037416B2 (ja) | 2016-12-07 |
| US20170253767A1 (en) | 2017-09-07 |
| JP6360108B2 (ja) | 2018-07-18 |
| SG11201508398TA (en) | 2015-11-27 |
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