TWI649297B - 化合物、光可固化組成物、及藉由使用該光可固化組成物製造圖案膜、光學組件、電路板、電子組件之方法，及經固化之產物 - Google Patents

化合物、光可固化組成物、及藉由使用該光可固化組成物製造圖案膜、光學組件、電路板、電子組件之方法，及經固化之產物 Download PDF

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Publication number
TWI649297B
TWI649297B TW103116083A TW103116083A TWI649297B TW I649297 B TWI649297 B TW I649297B TW 103116083 A TW103116083 A TW 103116083A TW 103116083 A TW103116083 A TW 103116083A TW I649297 B TWI649297 B TW I649297B
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Taiwan
Prior art keywords
photocurable composition
component
film
meth
pattern
Prior art date
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TW103116083A
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English (en)
Chinese (zh)
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TW201443000A (zh
Inventor
伊藤俊樹
本間猛
米澤詩織
佐藤仁至
川陽司
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日商佳能股份有限公司
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Publication of TW201443000A publication Critical patent/TW201443000A/zh
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Publication of TWI649297B publication Critical patent/TWI649297B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C217/00—Compounds containing amino and etherified hydroxy groups bound to the same carbon skeleton
    • C07C217/02—Compounds containing amino and etherified hydroxy groups bound to the same carbon skeleton having etherified hydroxy groups and amino groups bound to acyclic carbon atoms of the same carbon skeleton
    • C07C217/04—Compounds containing amino and etherified hydroxy groups bound to the same carbon skeleton having etherified hydroxy groups and amino groups bound to acyclic carbon atoms of the same carbon skeleton the carbon skeleton being acyclic and saturated
    • C07C217/06—Compounds containing amino and etherified hydroxy groups bound to the same carbon skeleton having etherified hydroxy groups and amino groups bound to acyclic carbon atoms of the same carbon skeleton the carbon skeleton being acyclic and saturated having only one etherified hydroxy group and one amino group bound to the carbon skeleton, which is not further substituted
    • C07C217/08—Compounds containing amino and etherified hydroxy groups bound to the same carbon skeleton having etherified hydroxy groups and amino groups bound to acyclic carbon atoms of the same carbon skeleton the carbon skeleton being acyclic and saturated having only one etherified hydroxy group and one amino group bound to the carbon skeleton, which is not further substituted the oxygen atom of the etherified hydroxy group being further bound to an acyclic carbon atom
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C217/00—Compounds containing amino and etherified hydroxy groups bound to the same carbon skeleton
    • C07C217/02—Compounds containing amino and etherified hydroxy groups bound to the same carbon skeleton having etherified hydroxy groups and amino groups bound to acyclic carbon atoms of the same carbon skeleton
    • C07C217/04—Compounds containing amino and etherified hydroxy groups bound to the same carbon skeleton having etherified hydroxy groups and amino groups bound to acyclic carbon atoms of the same carbon skeleton the carbon skeleton being acyclic and saturated
    • C07C217/28—Compounds containing amino and etherified hydroxy groups bound to the same carbon skeleton having etherified hydroxy groups and amino groups bound to acyclic carbon atoms of the same carbon skeleton the carbon skeleton being acyclic and saturated having one amino group and at least two singly-bound oxygen atoms, with at least one being part of an etherified hydroxy group, bound to the carbon skeleton, e.g. ethers of polyhydroxy amines
    • C07C217/40—Compounds containing amino and etherified hydroxy groups bound to the same carbon skeleton having etherified hydroxy groups and amino groups bound to acyclic carbon atoms of the same carbon skeleton the carbon skeleton being acyclic and saturated having one amino group and at least two singly-bound oxygen atoms, with at least one being part of an etherified hydroxy group, bound to the carbon skeleton, e.g. ethers of polyhydroxy amines having at least two singly-bound oxygen atoms, with at least one being part of an etherified hydroxy group, bound to the same carbon atom of the carbon skeleton, e.g. amino-ketals, ortho esters
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
    • G02B1/12—Optical coatings produced by application to, or surface treatment of, optical elements by surface treatment, e.g. by irradiation
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0079—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/68—Organic materials, e.g. photoresists
    • H10P14/683—Organic materials, e.g. photoresists carbon-based polymeric organic materials, e.g. polyimides, poly cyclobutene or PVC
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/28—Dry etching; Plasma etching; Reactive-ion etching of insulating materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/69—Etching of wafers, substrates or parts of devices using masks for semiconductor materials
    • H10P50/691—Etching of wafers, substrates or parts of devices using masks for semiconductor materials for Group V materials or Group III-V materials
    • H10P50/692—Etching of wafers, substrates or parts of devices using masks for semiconductor materials for Group V materials or Group III-V materials characterised by their composition, e.g. multilayer masks or materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Optics & Photonics (AREA)
  • Polymerisation Methods In General (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Toxicology (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
TW103116083A 2013-05-09 2014-05-06 化合物、光可固化組成物、及藉由使用該光可固化組成物製造圖案膜、光學組件、電路板、電子組件之方法，及經固化之產物 TWI649297B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013099551 2013-05-09
JP2013-099551 2013-05-09

Publications (2)

Publication Number Publication Date
TW201443000A TW201443000A (zh) 2014-11-16
TWI649297B true TWI649297B (zh) 2019-02-01

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW103116083A TWI649297B (zh) 2013-05-09 2014-05-06 化合物、光可固化組成物、及藉由使用該光可固化組成物製造圖案膜、光學組件、電路板、電子組件之方法，及經固化之產物

Country Status (6)

Country Link
US (1) US9593170B2 (https=)
JP (1) JP6333050B2 (https=)
KR (1) KR101811116B1 (https=)
CN (1) CN105189448B (https=)
TW (1) TWI649297B (https=)
WO (1) WO2014181533A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6584074B2 (ja) * 2014-02-26 2019-10-02 キヤノン株式会社 光硬化性組成物、硬化物、これを用いた、パターン形状を有する膜の製造方法、光学部品の製造方法、回路基板の製造方法、電子部品の製造方法
JP6624808B2 (ja) 2014-07-25 2019-12-25 キヤノン株式会社 光硬化性組成物、これを用いた硬化物パターンの製造方法、光学部品の製造方法、回路基板の製造方法
JP6324363B2 (ja) * 2014-12-19 2018-05-16 キヤノン株式会社 インプリント用光硬化性組成物、これを用いた膜の製造方法、光学部品の製造方法、回路基板の製造方法、電子部品の製造方法
WO2016098345A1 (en) * 2014-12-19 2016-06-23 Canon Kabushiki Kaisha Photocurable composition for imprint, method for producing film using the same, method for producing optical component using the same, method for producing circuit board using the same, and method for producing electronic component using the same
JP6779611B2 (ja) * 2014-12-19 2020-11-04 キヤノン株式会社 インプリント用光硬化性組成物、硬化膜の製造方法、光学部品の製造方法、回路基板の製造方法、電子部品の製造方法
JP2016164977A (ja) * 2015-02-27 2016-09-08 キヤノン株式会社 ナノインプリント用液体材料、ナノインプリント用液体材料の製造方法、硬化物パターンの製造方法、光学部品の製造方法、回路基板の製造方法、および電子部品の製造方法
US11194247B2 (en) 2018-01-31 2021-12-07 Canon Kabushiki Kaisha Extrusion control by capillary force reduction

Citations (4)

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US20060094882A1 (en) * 2004-11-03 2006-05-04 Toyota Jidosha Kabushiki Kaisha Ambient-temperature molten salts and process for producing the same
US20070020183A1 (en) * 2005-07-15 2007-01-25 Heiko Schirmer Perfluoroalkyl-containing complexes, process for their production as well as their use
JP2010114209A (ja) * 2008-11-05 2010-05-20 Fujifilm Corp 光ナノインプリント用硬化性組成物、硬化物およびその製造方法
WO2013035761A1 (en) * 2011-09-05 2013-03-14 Canon Kabushiki Kaisha Imprint apparatus, imprint method, and manufacturing method of commodities

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DE2306464C3 (de) 1973-02-09 1982-02-25 Hoechst Ag, 6000 Frankfurt Teilfluorierte Aminoäther und Verfahren zu ihrer Herstellung
GB8621793D0 (en) 1986-09-10 1986-10-15 Ici Plc Coating compositions
DE3837506A1 (de) 1988-11-04 1990-05-10 Hoechst Ag Verfahren zur herstellung von oligomeren des hexafluorpropenoxids
US6323361B1 (en) 1997-04-17 2001-11-27 Corning Inc. Photocurable halofluorinated acrylates
US6818203B2 (en) 2000-08-11 2004-11-16 Schering Aktiengesellschaft Use of perfluoroalkyl-containing metal complexes as contrast media in MR-imaging for visualization of plaque, tumors and necroses
US20030201429A1 (en) 2002-04-30 2003-10-30 Mingqian He Low loss electro-optic polymers and devices made therefrom
JP2005532595A (ja) 2002-07-10 2005-10-27 チバ　スペシャルティ　ケミカルズ　ホールディング　インコーポレーテッド ドライフィルムレジストのための熱安定性光硬化性樹脂組成物
JP4770354B2 (ja) 2005-09-20 2011-09-14 日立化成工業株式会社 光硬化性樹脂組成物及びこれを用いたパターン形成方法
JP2011111553A (ja) * 2009-11-27 2011-06-09 Fujifilm Corp インプリント用硬化性組成物、硬化物および硬化物の製造方法
JP5567419B2 (ja) 2010-06-29 2014-08-06 富士フイルム株式会社 光インプリント用硬化性組成物およびそれを用いた硬化物の製造方法
TWI471693B (zh) 2011-11-10 2015-02-01 Canon Kk 光可固化組成物，及使用彼之圖案化方法
JP5932501B2 (ja) 2012-06-06 2016-06-08 キヤノン株式会社 硬化性組成物、及びこれを用いるパターン形成方法
JP6278645B2 (ja) * 2012-09-24 2018-02-14 キヤノン株式会社 光硬化性組成物及びこれを用いた膜の製造方法
JP5857014B2 (ja) 2012-09-27 2016-02-10 富士フイルム株式会社 光インプリント用硬化性組成物、パターン形成方法およびパターン

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060094882A1 (en) * 2004-11-03 2006-05-04 Toyota Jidosha Kabushiki Kaisha Ambient-temperature molten salts and process for producing the same
US20070020183A1 (en) * 2005-07-15 2007-01-25 Heiko Schirmer Perfluoroalkyl-containing complexes, process for their production as well as their use
JP2010114209A (ja) * 2008-11-05 2010-05-20 Fujifilm Corp 光ナノインプリント用硬化性組成物、硬化物およびその製造方法
WO2013035761A1 (en) * 2011-09-05 2013-03-14 Canon Kabushiki Kaisha Imprint apparatus, imprint method, and manufacturing method of commodities

Also Published As

Publication number Publication date
JP2014237632A (ja) 2014-12-18
JP6333050B2 (ja) 2018-05-30
WO2014181533A1 (en) 2014-11-13
US20160108142A1 (en) 2016-04-21
TW201443000A (zh) 2014-11-16
CN105189448B (zh) 2017-05-24
CN105189448A (zh) 2015-12-23
US9593170B2 (en) 2017-03-14
KR101811116B1 (ko) 2017-12-20
KR20160003236A (ko) 2016-01-08

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