WO2013035761A1

WO2013035761A1 - Imprint apparatus, imprint method, and manufacturing method of commodities

Info

Publication number: WO2013035761A1
Application number: PCT/JP2012/072662
Authority: WO
Inventors: Akiko Iimura; Junichi Seki
Original assignee: Canon Kabushiki Kaisha
Priority date: 2011-09-05
Filing date: 2012-08-30
Publication date: 2013-03-14
Also published as: JP2013070033A

Abstract

The present invention provides an imprint apparatus which transfers a pattern of a mold onto a substrate, the apparatus including a processing unit configured to cure a resin, supplied on the substrate, while the mold is pressed against the resin, and peel the mold off the cured resin, thereby transferring the pattern of the mold onto the substrate, wherein one of a gas and a liquid which contain a fluorine compound is dissolved in the resin.

Description

DESCRIPTION

TITLE OF INVENTION IMPRINT APPARATUS, IMPRINT METHOD, AND MANUFACTURING

METHOD OF COMMODITIES

TECHNICAL FIELD

[0001] The present invention relates to an imprint apparatus, an imprint method, and a manufacturing method of commodities.

BACKGROUND ART

[0002] In a process of manufacturing, for example, a semiconductor device, an imprint apparatus which uses the imprint technology is attracting a great deal of attention as a lithography apparatus that can replace exposure apparatuses such as a stepper and a scanner. The imprint apparatus cures a resin, supplied (applied) on a substrate, while a mold (original) having a fine pattern formed on it is kept in contact with the resin, and peels the mold off the cured resin, thereby

transferring the pattern of the mold onto the substrate. Also, the photo-curing method and the heat curing method, for example, are known as methods of curing a resin (uncured resin) which fills the pattern (concave portion) of the mold.

[0003] In the imprint apparatus, when air, for example, remains (is trapped) in the pattern of the mold in filling the pattern of the mold with a resin, short shot defects are often generated (the pattern of the mold cannot be filled with a resin) . To prevent the generation of such short shot defects, Japanese Patent No. 3700001 proposes a technique of supplying, into the space between the mold and the substrate, a gas (condensable gas) which condenses by a pressure acting upon pressing the mold against the resin. An example of the condensable gas is hydrofluorocarbon ( 1 , 1 , 1 , 3 , 3-pentafluoropropane ) , as reported in

"Japanese Journal of Applied Physics 49 (2010) 06GL04 (literature 1 ) " .

[0004] Also, when curing and releasing are

performed upon pressing of the mold against the resin while pentafluoropropane is supplied into the space between the mold and the substrate, the releasing force (peeling force) reduces, as described in "J. Vac. Sci . Technol. B, Vol. 27, No. 6, pp. 2862 - 2865 (literature 2) .

[0005] However, as in the related art techniques, when an imprint process is performed in a condensable gas atmosphere, the condensable gas dissolves in the resin during the imprint process and is therefore released from the cured resin, so the pattern contracts. Especially when the amount of condensable gas dissolved in the resin locally varies (that is, the amount of condensable gas dissolved in the resin has an uneven distribution) , a distribution is generated in the amount of pattern contraction, so the transferred pattern becomes uneven. Note that literature 1 reports that compared to the case wherein an imprint process is performed in normal air atmosphere, the transferred pattern (its height) contracts (lowers) by about 20% when an imprint process is performed in a condensable gas atmosphere.

SUMMARY OF INVENTION

[0006] The present invention provides a technique advantageous in reducing the unevenness of the amount of gas or liquid dissolved in a resin, thereby

improving the evenness of a transferred pattern.

[0007] According to one aspect of the present invention, there is provided an imprint apparatus which transfers a pattern of a mold onto a substrate, the apparatus comprising: a processing unit configured to cure a resin, supplied on the substrate, while the mold is pressed against the resin, and peel the mold off the cured resin, thereby transferring the pattern of the mold onto the substrate, wherein one of a gas and a liquid which contain a fluorine compound is dissolved in the resin.

[0008] Further features of the present invention will become apparent from the following description of exemplary embodiments with reference to the attached drawings .

BRIEF DESCRIPTION OF DRAWINGS

[0009] Fig. 1 is a view showing the configuration of an imprint apparatus according to an aspect of the present invention.

[0010] Fig. 2 is a view illustrating an example of * the configuration of a mixing mechanism.

[0011] Fig. 3 is a view showing another example of the configuration of a mixing mechanism.

[0012] Fig. 4 is a view showing the configuration of an imprint apparatus according to another aspect of the present invention.

DESCRIPTION OF EMBODIMENTS

[0013] Preferred embodiments of the present

invention will be described below with reference to the accompanying drawings. Note that the same reference numerals denote the same members throughout the

drawings, and a repetitive description thereof will not be given.

[0014] Fig. 1 is a view showing the configuration of an imprint apparatus 100 according to an aspect of the present invention. The imprint apparatus 100 serves as a lithography apparatus employed in a process of manufacturing, for example, a semiconductor device, and transfers the pattern of a mold onto a substrate. In this embodiment, the imprint apparatus 100 adopts the photo-curing method of curing a resin by

irradiation with ultraviolet rays, as a resin curing method .

[0015] The imprint apparatus 100 includes a mold head 104 which holds a mold 102, a stage 108 which holds a substrate 106, a resin supply unit 110, a gas supply unit 120, and a control unit 130.

[0016] The mold 102 includes, on its surface opposed to the substrate 106, a pattern portion

(concave portion) 102a in which a pattern to be

transferred onto the substrate 106 (a resin supplied on it) is formed. The mold 102 has, for example, a

rectangular outer shape and is made of a material which transmits ultraviolet rays (for example, quartz).

[0017] The mold head 104 holds (fixes) the mold

102 by a vacuum suction force or an electrostatic force. The mold head 104 includes a driving mechanism which drives the mold 102 in the Z-direction, and has a function of pressing the mold 102 against the resin (uncured resin) on the substrate 106 (imprinting the pattern of the mold 102 on this uncured resin) by an appropriate force, and peeling the mold 102 off the resin (cured resin) on the substrate 106 (releasing the mold 102 from this cured resin) .

[0018] The substrate 106 is a substrate onto which the pattern of the mold 102 is to be transferred, and includes, for example, a single-crystal silicon wafer or an SOI (Silicon On Insulator) wafer.

[0019] The stage 108 includes a substrate chuck which holds the substrate 106, and a driving mechanism for aligning the mold 102 and the substrate 106 with each other. The driving mechanism includes, for example, a coarse driving system and a fine driving system, and drives the substrate 106 in the X- and Y- directions. The driving mechanism may also have a function of driving the substrate 106 not only in the X- and Y-directions but also in the Z-direction and the θ-direction (a rotation direction about the Z-axis), and a tilt function for correcting the tilt of the substrate 106.

[0020] The resin supply unit 110 supplies

(applies) a liquid photo-curing resin (imprint

material) onto the substrate 106 to form a resin layer RL on the substrate 106. Note that a gas (condensable gas) which condenses by a pressure acting upon pressing the mold 102 against a resin supplied from the resin supply unit 110, and reduces the releasing force by the action of segregation to the boundary between the mold 102 and the resin as the resin cures is dissolved in the resin. The condensable gas means herein a gas for promoting filling of the pattern portion 102a of the mold 102 (that is, the concave portion that forms a pattern) with the resin by the action of condensation. The practical configuration and function of the resin supply unit 110 will be described in more detail later.

[0021] The gas supply unit 120 supplies, into the space between the mold 102 and the substrate 106 (resin layer RL) , a gas (condensable gas) which condenses by a pressure acting upon pressing the mold 102 against the resin (resin layer RL) on the substrate 106. In other words, the gas supply unit 120 replaces the space between the mold 102 and the substrate 106 with a condensable gas. Under the control of the control unit 130, the gas supply unit 120 supplies a condensable gas so that it sufficiently condenses (that is, it

satisfactorily prevents the generation of short shot defects) by a pressure acting upon pressing the mold 102 against the resin on the substrate 106. In this embodiment, the gas supply unit 120 supplies a

condensable gas into the space between the mold 102 and the substrate 106 via a supply port (a pipe including it) located near this space. However, any method known to those skilled in the art can be adopted as a method of supplying a condensable gas, and a supply port for supplying a condensable gas may be formed in, for example, the mold 102. Also, the gas supply unit 120 may replace not only the space between the mold 102 and the substrate 106 but also the atmosphere of the entire apparatus (that is, the interior of a chamber which accommodates each unit of the imprint apparatus 100) with a condensable gas.

[0022] The control unit 130 includes, for example, a CPU and memory and controls the overall imprint apparatus 100 (its operation) . In this embodiment, the control unit 130 functions as a processing unit which controls each unit of the imprint apparatus 100 to perform an imprint process. In the imprint process, a resin (resin layer RL) supplied on the substrate 106 is cured while the mold 102 is pressed against the resin, and the mold 102 is peeled off the cured resin, thereby transferring the pattern of the mold 102 onto the substrate 106.

[0023] The practical configuration and function of the resin supply unit 110 will be described herein. The resin supply unit 110 includes, for example, a mixing mechanism 112 for dissolving a condensable gas in a resin, and a dispenser 114 which drops the resin

(the resin containing the condensable gas dissolved in it) supplied from the mixing mechanism 112. By

movement (scan movement or step movement) of the stage 108 while a resin is supplied from the resin supply unit 110, the resin can be applied onto the substrate 106 (each shot region defined on it) .

[0024] The mixing mechanism 112 includes a gas container (first accommodation unit) 1121 which

accommodates a condensable gas, a resin container

(second accommodation unit) 1122 which accommodates a liquid resin before the condensable gas dissolves in it, and a mixing unit 1123, as shown in Fig. 2. The mixing unit 1123 is supplied with the condensable gas

accommodated in the gas container 1121 via a pipe PP1 by opening and closing a valve VL1, and the liquid resin accommodated in the resin container 1122 via a pipe PP2 by opening and closing a valve VL2. The mixing unit 1123 mixes the condensable gas supplied from the gas container 1121 with the liquid resin supplied from the resin container 1122, thereby

dissolving the condensable gas in the resin. Also, the mixing unit 1123 supplies the resin containing the condensable gas dissolved in it to the dispenser 114 via a pipe PP3. The dispenser 114 includes, for

example, line nozzles formed by linearly arraying nozzles, and drops a resin onto the substrate 106 by about 1 picoliter using, for example, the piezo-jet scheme or the micro-solenoid scheme.

[0025] In this embodiment, the condensable gas dissolved in the resin has the property that it reduces the releasing force by the action of segregation to the interface between the mold 102 and the resin as the resin cures.

[0026] The difference between the solubility parameter of the condensable gas and that of the resin after an imprint process is desirably larger than 0.5 and, more desirably, larger than 1. This is because setting the difference in solubility parameter larger than 0.5 allows the condensable gas to easily segregate, thereby reducing the releasing force more.

[0027] The values of the solubility parameters can be used as criteria, depending on the degree of cross- linking and degree of polymerization of the resin to cure .

[0028] In this embodiment, the condensable gas dissolved in the resin has the property that it

normally exists as a gas under the internal environment

(temperature and pressure) of the imprint apparatus 100, and condenses upon an imprint process (that is, by a pressure acting upon pressing the mold 102 against the resin) .

[0029] Also, if the vapor pressure of the

condensable gas at room temperature (23°C) is lower than 0.05 MPa, the condensable gas condenses due, for example, to a small difference in pressure generated in the pipe PP1, so it becomes difficult to control the amount of supply of the condensable gas (the amount of condensable gas dissolved in the resin) . On the other hand, if the vapor pressure of the condensable gas at room temperature (23°C) is higher than 1 MPa, a

relatively high pressure is necessary to condense the condensable gas upon an imprint process at room

temperature, thus requiring a large-scale pressure- resistant apparatus. Therefore, the vapor pressure of the condensable gas is desirably from 0.05 MPa

(exclusive) to 1 MPa (exclusive) at the temperature at which an imprint process is performed. The vapor pressure of the condensable gas is more desirably around the atmospheric pressure (0.1 MPa), that is, from 0.1 MPa (exclusive) to 1 MPa (exclusive).

[0030] Also, the condensable gas desirably

condenses around room temperature (23°C) in the

atmospheric pressure (0.1 MPa). Therefore, the boiling point of the condensable gas is desirably 15°C

(inclusive) to 30°C (inclusive) . If the boiling point of the condensable gas is lower than 15°C, a large- scale temperature control mechanism which controls the temperature in the imprint apparatus 100 is required. On the other hand, if the boiling point of the

condensable gas is higher than 30°C, it is necessary to reduce the pressure in the imprint apparatus 100 or raise the temperature in the imprint apparatus 100 in order to condense the condensable gas, thus requiring a large-scale apparatus.

[0031] A fluorinated hydrocarbon having a boiling point of 15°C (inclusive) to 30°C (inclusive) is typically used as such a condensable gas.

Trichlorofluoromethane (boiling point: 24 °C) having a vapor pressure of 0.1056 MPa at room temperature (23°C) , or 1, 1, 1, 3, 3-pentafluoropropane (boiling point: 15°C) having a vapor pressure of 0.14 MPa at room temperature (23°), for example, is preferably used as the

condensable gas. The condensable gas is desirably a fluorinated hydrocarbon having a carbon number of six or less because a condensed gas having a lower surface energy and a lower molecular weight can more easily segregate .

[0032] Also, the photo-curing resin in this embodiment must be capable of dissolving the

condensable gas. The difference between the solubility parameter of the condensable gas and that of the resin after an imprint process is desirably smaller than 5 and, more desirably, smaller than 3. This is because setting a difference in solubility parameter smaller than 5 allows the condensable gas to easily dissolve in the resin before an imprint process under the internal environment (temperature and pressure) of the imprint apparatus 100. 1 , 1 , 1 , 3 , 3-pentafluoropropane as an example of the condensable gas dissolves in a general imprint acrylic resin. The solubility parameter of a general imprint acrylic resin is 8.4 (can/cm³) 0.5, and that of 1, 1, 1, 3, 3-pentafluoropropane is 6.9

( can/cm³ ) ^Λ 0.5 , so their difference is 1.5.

[0033] The operation of the imprint apparatus 100 will be described by attaching great importance to the operation of the resin supply unit 110. First, a resin (for example, an imprint acrylic resin) accommodated in the resin container 1122 is supplied to the mixing unit 1123 by opening the valve VL2. Also, a condensable gas (for example, 1, 1, 1, 3, 3-pentafluoropropane )

accommodated in the gas container 1121 is supplied to the mixing unit 1123 by opening the valve VLl. The mixing unit 1123 mixes the condensable gas supplied from the gas container 1121 with the resin supplied from the resin container 1122, thereby supplying the resin containing the condensable gas dissolved in it to the dispenser 114.

[0034] In terms of the evenness of the pattern transferred onto the substrate 106 (that is, in terms of uniforming the amount of pattern contraction) , the amount (amount of dissolution) of condensable gas dissolved in the resin is desirably set to the

saturation solubility under the internal environment of the imprint apparatus 100. However, setting the amount of condensable gas dissolved in the resin to the saturation solubility may increase the amount of contraction of the pattern transferred onto the substrate 106, thus producing residual stress in the pattern or changing the pattern shape. The inventor of the present invention conducted a close examination of this problem, and found that setting the amount of condensable gas dissolved in the resin to 30% or more of the saturation solubility makes it possible to prevent the condensable gas from dissolving in the resin during an imprint process, thereby reducing a local difference in amount of condensable gas dissolved in the resin. Note that if the amount of condensable gas dissolved in the resin is smaller than 30% of the saturation solubility, it is impossible to

satisfactorily obtain an effect of preventing the condensable gas from generating short shot defects.

[0035] Also, as the volume of the resin increases depending on the amount of condensable gas dissolved in the resin, the amount of condensable gas dissolved preferably corresponds to a volume fraction of 30% or less relative to the volume of the resin when the condensable gas has a liquid phase, in terms of pattern formation capacity. An effect of reducing the

releasing force can be satisfactorily obtained even when the condensable gas is dissolved in the resin at a volume fraction as low as about 1% relative to the volume corresponding to the saturation solubility.

[0036] The stage 108 is moved so that a target shot region (a shot region onto which the pattern of the mold 102 is to be transferred next) on the

substrate 106 is positioned below the dispenser 114, and a resin is supplied on the target shot region on the substrate 106. This forms a resin layer RL on the substrate 106 by the resin containing the condensable gas dissolved in it.

[0037] The stage 108 is then moved so that the target shot region on the substrate 106 is positioned below the mold 102, and the mold 102 is pressed against the resin supplied on the target shot region. At this time, the condensable gas is supplied from the gas supply unit 120 into the space between the mold 102 and the substrate 106 (resin layer RL) . Therefore, the mold 102 is pressed against the resin supplied on the target shot region, under the environment in which the space between the mold 102 and the substrate 106 is replaced with the condensable gas. However, since the condensable gas is dissolved in the resin in advance, it is possible to prevent the condensable gas supplied into the space between the mold 102 and the substrate 106 from newly dissolving in the resin, thereby reducing a local difference in amount of condensable gas dissolved in the resin.

[0038] The resin on the substrate 106 is cured by irradiating it with ultraviolet rays via the mold 102 while the mold 102 is pressed against the resin on the substrate 106. At this time, the condensable gas dissolved in the resin segregates to the boundary between the mold 102 and the resin as the resin cures. The mold 102 is then peeled off the cured resin on the substrate 106. This transfers the pattern of the mold 102 onto the target shot region on the substrate 106. In this process, since a local difference in amount of condensable gas dissolved in the resin is reduced so as to obtain an effect of uniformly reducing the releasing force, the transferred pattern can be prevented from becoming uneven. Also, the pattern contracts as the condensable gas dissolved in the resin is released from the cured resin. However, as described above, in this embodiment, since a local difference in amount of condensable gas dissolved in the resin is reduced, the transferred pattern can be prevented from becoming uneven .

[0039] In this manner, the imprint apparatus 100 according to this embodiment can reduce the unevenness of the amount of condensable gas dissolved in the resin, thereby improving the evenness of the pattern

transferred onto the substrate 106.

[0040] Also, the mixing mechanism 112 is not limited to the configuration shown in Fig. 2, and may have a configuration as shown in, for example, Fig. 3. Unlike the mixing mechanism 112 shown in Fig. 2, the mixing mechanism 112 shown in Fig. 3 includes no resin container 1122 but includes a mixing unit 1123 which accommodates a solid resin in advance. The mixing unit 1123 mixes the condensable gas supplied from the gas container 1121 with the solid resin accommodated in advance, thereby dissolving the condensable gas in the resin. Upon this operation, a resin which has a solid phase before the condensable gas dissolves in it can be used in an imprint process.

[0041] In the mixing mechanism 112 shown in Fig. 3, the resin component of a resist which can dissolve in a solvent, which is typified by, for example, an ArF excimer laser photoresist or an i-line photoresist, can be used as an imprint resin. More specifically, a resist containing a benzene ring or adamantyl group having a high etching resistance, or a

diazonaphthoquinone or novolak resin resist, for example, can be used. These resists can be supplied onto the substrate 106 via the dispenser 114 because their viscosities lower as the condensable gas

dissolves in them.

[0042] Also, in this embodiment, the imprint apparatus 100 dissolves a condensable gas in a resin, and supplies the resin containing the condensable gas dissolved in it onto the substrate 106 (that is, the imprint apparatus 100 includes the resin supply unit 110) . However, the imprint apparatus 100 need not always include the resin supply unit 110, as shown in Fig. 4. In this case, the supply of the resin

containing the condensable gas dissolved in it onto the substrate 106 (that is, the formation of the resin layer RL by the resin containing the condensable gas dissolved in it) is performed in the exterior of the imprint apparatus 100 by, for example, a spin coater. The imprint apparatus 100 then performs an imprint process for the substrate 106 transported from the outside (that is, the substrate 106 supplied with the resin containing the condensable gas dissolved in it) . Note that to supply the resin containing the

condensable gas dissolved in it onto the substrate 106 in the exterior of the imprint apparatus 100, it is necessary to supply (apply) a resin onto the entire surface of the substrate 106 in terms of productivity.

[0043] Although a gas which has a condensation property and reduces the releasing force is used as a preferable example in this embodiment, a gas having no condensation property may be used. In other words, an effect of uniformly reducing the releasing force can also be obtained using a gas which has no condensation property and reduces the releasing force by the action of segregation to the boundary between the mold 102 and the resin as the resin cures.

[0044] A fluorinated hydrocarbon having a boiling point of 30°C (inclusive) to 120°C (inclusive) is used as such a gas. HFC-43-10 mee, Cyclic HFC, or HFC-7100, for example, is preferably used. The condensable gas is preferably a fluorinated hydrocarbon having a carbon number of six or less because a condensed gas having a lower surface energy and a lower molecular weight can more easily segregate. The solubility parameter of the above-mentioned gas is around 5 to 7 (can/cm³) 0.5, that of an acrylic resin is around 8 (can/cm³) ^Λ0.5, and that of a novolak resin is around 9 (can/cm³) 0.5, so it is preferably that the difference in solubility parameter between this gas and these is adjusted to 0.5 or more and less than 5.

[0045] Also, the above-mentioned gas may have a liquid phase at normal temperature and normal pressure, and may be dissolved in the resin in a liquid phase in that case. At this time, the amount of liquid

dissolved in the resin preferably corresponds to a volume fraction of 30% or less relative to the volume of the resin in terms of pattern formation capacity.

[0046] A manufacturing method of devices (for example, semiconductor devices or liquid crystal

display devices) as commodities will be described below. This manufacturing method includes a step of

transferring (forming) a pattern onto a substrate (for example, a wafer, a glass plate, or a film-like

substrate) using the imprint apparatus 100. The

manufacturing method also includes a step of etching the substrate having the pattern transferred on it.

Note that in manufacturing other commodities such as pattern dot media (recording media) or optical devices, the manufacturing method includes other processing steps of processing the substrate having the pattern transferred on it, in place of an etching step. The manufacturing method of commodities according to this embodiment is more advantageous in at least one of the performance, quality, productivity, and manufacturing cost of commodities than the conventional method. [0047] While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. The scope of the following claims is to be accorded the broadest interpretation so as to encompass all such

modifications and equivalent structures and functions.

[0048] This application claims the benefit of

Japanese Patent Application Nos . 2011-193274 filed on September 5, 2011, and 2012-172303, filed on August 2, 2012, which are hereby incorporated by reference herein in their entirety.

Claims

1. An imprint apparatus which transfers a pattern of a mold onto a substrate, the apparatus comprising:

a processing unit configured to cure a resin, supplied on the substrate, while the mold is pressed against the resin, and peel the mold off the cured resin, thereby transferring the pattern of the mold onto the substrate,

wherein one of a gas and a liquid which contain a fluorine compound is dissolved in the resin.

2. The apparatus according to claim 1, wherein the one of the gas and the liquid has a carbon number of not more than six.

3. The apparatus according to claim 1, wherein the one of the gas and the liquid segregates to an

interface between the resin and the mold as the resin cures .

4. The apparatus according to claim 1, further comprising :

a supply unit configured to supply the resin containing the one of the gas and the liquid dissolved therein onto the substrate.

5. The apparatus according to claim 4, wherein the supply unit includes:

a first accommodation unit configured to accommodate the one of the gas and the liquid;

a second accommodation unit configured to accommodate a liquid resin before the one of the gas and the liquid dissolves in the resin; and

a mixing unit configured to mix the one of the gas and the liquid accommodated in the first

accommodation unit with the resin accommodated in the second accommodation unit, thereby dissolving the one of the gas and the liquid in the resin.

6. The apparatus according to claim 4, wherein the supply unit includes:

an accommodation unit configured to accommodate the one of the gas and the liquid; and

a mixing unit configured to mix the one of the gas and the liquid accommodated in the accommodation unit with a solid resin before the one of the gas and the liquid dissolves in the resin, thereby dissolving the one of the gas and the liquid in the resin.

7. The apparatus according to claim 1, wherein an amount of the one of the gas and the liquid dissolved in the resin is not less than 30% of a saturation solubility of the one of the gas and the liquid under an environment before the mold is pressed, against the resin .

8. The apparatus according to claim 1, wherein

the liquid is dissolved in the resin, and

an amount of the liquid dissolved in the resin corresponds to a volume fraction of not more than 30% relative to a volume of the resin.

9. The apparatus according to claim 1, wherein

the gas is dissolved in the resin, and

the apparatus further comprises a gas supply unit configured to supply the gas into a space between the mold and the substrate.

10. An imprint method of transferring a pattern of a mold onto a substrate, the method comprising:

a step of dissolving one of a gas and a liquid which contain a fluorine compound in a resin;

a step of supplying the resin containing the one of the gas and the liquid dissolved therein onto the substrate; and

a step of curing the resin, supplied on the substrate, while the mold is pressed against the resin, and peeling the mold off the cured resin, thereby transferring the pattern of the mold onto the substrate.

11. A manufacturing method of commodities comprising: a step of using an imprint apparatus to form a pattern of a resin onto a substrate; and

a step of processing the substrate with the pattern,

wherein the imprint apparatus transfers a pattern of a mold onto the substrate and includes