TWI644344B - Processing liquid supply device, substrate processing system, and processing liquid supply method - Google Patents

Processing liquid supply device, substrate processing system, and processing liquid supply method Download PDF

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Publication number
TWI644344B
TWI644344B TW105126375A TW105126375A TWI644344B TW I644344 B TWI644344 B TW I644344B TW 105126375 A TW105126375 A TW 105126375A TW 105126375 A TW105126375 A TW 105126375A TW I644344 B TWI644344 B TW I644344B
Authority
TW
Taiwan
Prior art keywords
processing liquid
processing
unit
opening
organic solvent
Prior art date
Application number
TW105126375A
Other languages
English (en)
Chinese (zh)
Other versions
TW201714204A (zh
Inventor
岩尾通矩
Original Assignee
思可林集團股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 思可林集團股份有限公司 filed Critical 思可林集團股份有限公司
Publication of TW201714204A publication Critical patent/TW201714204A/zh
Application granted granted Critical
Publication of TWI644344B publication Critical patent/TWI644344B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
TW105126375A 2015-09-28 2016-08-18 Processing liquid supply device, substrate processing system, and processing liquid supply method TWI644344B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015189918A JP6667241B2 (ja) 2015-09-28 2015-09-28 処理液供給装置、基板処理システムおよび処理液供給方法
JP2015-189918 2015-09-28

Publications (2)

Publication Number Publication Date
TW201714204A TW201714204A (zh) 2017-04-16
TWI644344B true TWI644344B (zh) 2018-12-11

Family

ID=58423303

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105126375A TWI644344B (zh) 2015-09-28 2016-08-18 Processing liquid supply device, substrate processing system, and processing liquid supply method

Country Status (5)

Country Link
JP (1) JP6667241B2 (ja)
KR (1) KR102184477B1 (ja)
CN (1) CN108025335B (ja)
TW (1) TWI644344B (ja)
WO (1) WO2017056617A1 (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11077461B2 (en) 2017-06-15 2021-08-03 The Boeing Company Apparatus and methods for use in applying a fluid to a surface
CN110197801A (zh) * 2019-05-14 2019-09-03 清华大学 一种基板处理液的存储装置和基板后处理设备
CN110429046A (zh) * 2019-06-19 2019-11-08 清华大学 一种用于基板干燥的流体供给装置和基板干燥设备
CN110531794A (zh) * 2019-08-30 2019-12-03 北京北方华创微电子装备有限公司 液体压力控制装置和方法、清洗液供给机构
KR102548294B1 (ko) * 2020-04-24 2023-06-28 세메스 주식회사 액 공급 유닛, 기판 처리 장치 및 액 처리 방법

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005040670A (ja) * 2003-07-24 2005-02-17 Shibaura Mechatronics Corp 塗布装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000021703A (ja) * 1998-07-02 2000-01-21 Dainippon Screen Mfg Co Ltd 処理液送給方法および装置
JP3764280B2 (ja) * 1998-09-22 2006-04-05 シーケーディ株式会社 薬液供給システム
JP2000173902A (ja) * 1998-12-08 2000-06-23 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2004273984A (ja) * 2003-03-12 2004-09-30 Dainippon Screen Mfg Co Ltd 基板処理方法および基板処理装置
JP4421956B2 (ja) * 2003-07-18 2010-02-24 芝浦メカトロニクス株式会社 基板の処理装置及び処理方法
JP4553256B2 (ja) * 2005-06-24 2010-09-29 東京エレクトロン株式会社 基板処理システム及びその制御方法
JP5854668B2 (ja) * 2011-07-07 2016-02-09 芝浦メカトロニクス株式会社 気液混合流体生成装置、気液混合流体生成方法、処理装置及び処理方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005040670A (ja) * 2003-07-24 2005-02-17 Shibaura Mechatronics Corp 塗布装置

Also Published As

Publication number Publication date
CN108025335A (zh) 2018-05-11
JP2017064582A (ja) 2017-04-06
TW201714204A (zh) 2017-04-16
JP6667241B2 (ja) 2020-03-18
KR102184477B1 (ko) 2020-11-30
KR20180031781A (ko) 2018-03-28
WO2017056617A1 (ja) 2017-04-06
CN108025335B (zh) 2021-03-19

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