TWI643922B - 接著劑組成物及接著薄膜 - Google Patents
接著劑組成物及接著薄膜 Download PDFInfo
- Publication number
- TWI643922B TWI643922B TW106108756A TW106108756A TWI643922B TW I643922 B TWI643922 B TW I643922B TW 106108756 A TW106108756 A TW 106108756A TW 106108756 A TW106108756 A TW 106108756A TW I643922 B TWI643922 B TW I643922B
- Authority
- TW
- Taiwan
- Prior art keywords
- adhesive composition
- weight
- styrene
- meth
- acrylate
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J109/00—Adhesives based on homopolymers or copolymers of conjugated diene hydrocarbons
- C09J109/06—Copolymers with styrene
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/385—Acrylic polymers
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012-236023 | 2012-10-25 | ||
JP2012236023 | 2012-10-25 | ||
JP2013117298 | 2013-06-03 | ||
JP2013-117298 | 2013-06-03 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201726867A TW201726867A (zh) | 2017-08-01 |
TWI643922B true TWI643922B (zh) | 2018-12-11 |
Family
ID=50885985
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW106108756A TWI643922B (zh) | 2012-10-25 | 2013-09-25 | 接著劑組成物及接著薄膜 |
TW102134520A TWI586776B (zh) | 2012-10-25 | 2013-09-25 | 接著劑組成物及接著薄膜 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW102134520A TWI586776B (zh) | 2012-10-25 | 2013-09-25 | 接著劑組成物及接著薄膜 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP6216575B2 (ja) |
KR (1) | KR102148125B1 (ja) |
TW (2) | TWI643922B (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI732764B (zh) * | 2015-06-01 | 2021-07-11 | 日商富士軟片股份有限公司 | 暫時接著劑、接著膜、接著性支持體、積層體及接著劑套組 |
JP6722001B2 (ja) * | 2016-03-03 | 2020-07-15 | 東京応化工業株式会社 | 接着剤組成物、積層体、及び、積層体の製造方法 |
WO2019106846A1 (ja) * | 2017-12-01 | 2019-06-06 | 日立化成株式会社 | 半導体装置の製造方法、仮固定材用樹脂組成物、及び仮固定材用積層フィルム |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003292919A (ja) * | 2002-01-30 | 2003-10-15 | Sanyo Chem Ind Ltd | ホットメルト接着剤 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS518334A (ja) * | 1974-07-10 | 1976-01-23 | Nichireki Chem Ind Co | Setsuchakuzaisoseibutsu |
JPS5491539A (en) * | 1977-12-29 | 1979-07-20 | Asahi Chem Ind Co Ltd | Adhesive |
JPH0230351B2 (ja) * | 1982-04-23 | 1990-07-05 | Hoechst Gosei Kk | Taisuiseinosuguretakyojugotaiemarujongatasetsuchakuzainoseiho |
MY111332A (en) * | 1991-06-28 | 1999-11-30 | Furukawa Electric Co Ltd | Semiconductor wafer-securing adhesive tape. |
JPH05279644A (ja) * | 1992-03-31 | 1993-10-26 | Sekisui Finechem Co Ltd | 異方導電性接着シート |
JP3038549B2 (ja) * | 1998-02-27 | 2000-05-08 | 三洋化成工業株式会社 | 接着剤用添加剤およびホットメルト接着剤組成物 |
JP2000351952A (ja) * | 1999-04-05 | 2000-12-19 | Nitto Denko Corp | 塗膜保護用シート |
JP2001207136A (ja) * | 2000-01-26 | 2001-07-31 | Nitto Denko Corp | 塗膜保護用シート |
JP4106283B2 (ja) * | 2002-02-08 | 2008-06-25 | フェリック株式会社 | 温熱材用粘着剤及びこれを用いた温熱材 |
JP2004099785A (ja) * | 2002-09-11 | 2004-04-02 | Sanyo Chem Ind Ltd | 床版の防水用ホットメルト接着剤 |
CA2554532C (en) * | 2004-02-06 | 2013-02-12 | Invista Technologies S.A.R.L. | Substrates containing adhesion promoting additives and articles prepared therewith |
US8268449B2 (en) | 2006-02-06 | 2012-09-18 | Brewer Science Inc. | Thermal- and chemical-resistant acid protection coating material and spin-on thermoplastic adhesive |
DE102006039833A1 (de) * | 2006-08-25 | 2008-03-20 | Henkel Kgaa | Schmelzklebstoff mit verbesserter Haftung |
JP5301486B2 (ja) * | 2010-03-17 | 2013-09-25 | 三井・デュポンポリケミカル株式会社 | 液晶ポリマー用ヒートシール性樹脂組成物、液晶ポリマー用ヒートシール材、蓋材 |
KR101536393B1 (ko) * | 2010-07-09 | 2015-07-13 | 미쓰이 가가쿠 가부시키가이샤 | 펠리클 및 그것에 이용하는 마스크 접착제 |
-
2013
- 2013-08-29 JP JP2013178626A patent/JP6216575B2/ja active Active
- 2013-09-25 TW TW106108756A patent/TWI643922B/zh active
- 2013-09-25 TW TW102134520A patent/TWI586776B/zh active
- 2013-10-22 KR KR1020130125726A patent/KR102148125B1/ko active IP Right Grant
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003292919A (ja) * | 2002-01-30 | 2003-10-15 | Sanyo Chem Ind Ltd | ホットメルト接着剤 |
Also Published As
Publication number | Publication date |
---|---|
KR20140052860A (ko) | 2014-05-07 |
TW201425506A (zh) | 2014-07-01 |
JP6216575B2 (ja) | 2017-10-18 |
TW201726867A (zh) | 2017-08-01 |
TWI586776B (zh) | 2017-06-11 |
JP2015013977A (ja) | 2015-01-22 |
KR102148125B1 (ko) | 2020-08-26 |
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