TWI636264B - 非接觸型基板檢查裝置及其檢查方法 - Google Patents

非接觸型基板檢查裝置及其檢查方法 Download PDF

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Publication number
TWI636264B
TWI636264B TW106118090A TW106118090A TWI636264B TW I636264 B TWI636264 B TW I636264B TW 106118090 A TW106118090 A TW 106118090A TW 106118090 A TW106118090 A TW 106118090A TW I636264 B TWI636264 B TW I636264B
Authority
TW
Taiwan
Prior art keywords
signal
detection signal
sensor
wiring pattern
output
Prior art date
Application number
TW106118090A
Other languages
English (en)
Chinese (zh)
Other versions
TW201805641A (zh
Inventor
村上真一
橫道彌生
Original Assignee
Ｏｈｔ股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ｏｈｔ股份有限公司 filed Critical Ｏｈｔ股份有限公司
Publication of TW201805641A publication Critical patent/TW201805641A/zh
Application granted granted Critical
Publication of TWI636264B publication Critical patent/TWI636264B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/304—Contactless testing of printed or hybrid circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • H01L22/34—Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
TW106118090A 2016-06-01 2017-06-01 非接觸型基板檢查裝置及其檢查方法 TWI636264B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-110394 2016-06-01
JP2016110394A JP6202452B1 (ja) 2016-06-01 2016-06-01 非接触型基板検査装置及びその検査方法

Publications (2)

Publication Number Publication Date
TW201805641A TW201805641A (zh) 2018-02-16
TWI636264B true TWI636264B (zh) 2018-09-21

Family

ID=59969344

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106118090A TWI636264B (zh) 2016-06-01 2017-06-01 非接觸型基板檢查裝置及其檢查方法

Country Status (4)

Country Link
JP (1) JP6202452B1 (ko)
KR (1) KR101926978B1 (ko)
CN (1) CN107449990A (ko)
TW (1) TWI636264B (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110095704B (zh) * 2019-04-17 2022-02-22 深圳市华星光电半导体显示技术有限公司 检测阵列基板中电路缺陷的装置及方法
CN111542218B (zh) * 2020-04-23 2021-07-20 国网浙江省电力有限公司营销服务中心 一种电能表可信生产贴片环节采集验证方法及系统

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004191381A (ja) * 2002-11-30 2004-07-08 Oht Inc 回路パターン検査装置及び回路パターン検査方法
US20040135734A1 (en) * 2002-10-30 2004-07-15 Kouichi Uesaka Narrow-directivity electromagnetic-field antenna probe, and electromagnetic-field measurement apparatus, electric-current distribution search-for apparatus or electrical-wiring diagnosis apparatus using this antenna probe
TW200613754A (en) * 2004-08-27 2006-05-01 Oht Inc Inspection apparatus, inspection method and sensor for inspection apparatus
TW200632339A (en) * 2005-01-19 2006-09-16 Oht Inc Inspection device, inspection method, and sensor for inspection device
TW201435373A (zh) * 2013-01-08 2014-09-16 Oht Inc 電路圖案檢查裝置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS593271A (ja) * 1982-06-29 1984-01-09 Mitsubishi Electric Corp 水冷ケ−ブルの断線予報装置
US6316949B1 (en) * 1999-01-19 2001-11-13 Nidec-Read Corporation Apparatus and method for testing electric conductivity of circuit path ways on circuit board
JP2995716B1 (ja) * 1999-01-19 1999-12-27 日本電産リード株式会社 基板の導通検査装置及びその導通検査方法
JP4277398B2 (ja) * 1999-03-26 2009-06-10 富士通株式会社 配線板の検査装置
JP2001235501A (ja) * 2000-02-22 2001-08-31 Oht Inc 検査装置及びセンサ
JP2002090407A (ja) * 2000-09-11 2002-03-27 Oht Inc 検査装置及び検査方法
JP4191948B2 (ja) * 2002-04-17 2008-12-03 オー・エイチ・ティー株式会社 検査装置及び検査方法
JP2002365325A (ja) * 2001-06-11 2002-12-18 Oht Inc 回路パターン検査装置並びに回路パターン検査方法及び記録媒体
JP2005208058A (ja) * 2003-12-26 2005-08-04 Oht Inc 回路パターン検査装置及び回路パターン検査方法
KR100630005B1 (ko) * 2004-05-18 2006-09-27 엘지전자 주식회사 비파괴 검사 장치 및 검사 방법
TWI325980B (en) * 2005-10-26 2010-06-11 Au Optronics Corp Non-contact panel detecting device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040135734A1 (en) * 2002-10-30 2004-07-15 Kouichi Uesaka Narrow-directivity electromagnetic-field antenna probe, and electromagnetic-field measurement apparatus, electric-current distribution search-for apparatus or electrical-wiring diagnosis apparatus using this antenna probe
JP2004191381A (ja) * 2002-11-30 2004-07-08 Oht Inc 回路パターン検査装置及び回路パターン検査方法
TW200613754A (en) * 2004-08-27 2006-05-01 Oht Inc Inspection apparatus, inspection method and sensor for inspection apparatus
TW200632339A (en) * 2005-01-19 2006-09-16 Oht Inc Inspection device, inspection method, and sensor for inspection device
TW201435373A (zh) * 2013-01-08 2014-09-16 Oht Inc 電路圖案檢查裝置

Also Published As

Publication number Publication date
KR101926978B1 (ko) 2018-12-07
CN107449990A (zh) 2017-12-08
TW201805641A (zh) 2018-02-16
JP6202452B1 (ja) 2017-09-27
KR20170136450A (ko) 2017-12-11
JP2017215257A (ja) 2017-12-07

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