TW200613754A - Inspection apparatus, inspection method and sensor for inspection apparatus - Google Patents

Inspection apparatus, inspection method and sensor for inspection apparatus

Info

Publication number
TW200613754A
TW200613754A TW094129271A TW94129271A TW200613754A TW 200613754 A TW200613754 A TW 200613754A TW 094129271 A TW094129271 A TW 094129271A TW 94129271 A TW94129271 A TW 94129271A TW 200613754 A TW200613754 A TW 200613754A
Authority
TW
Taiwan
Prior art keywords
sensor plates
inspection
conductor
detection
inspected
Prior art date
Application number
TW094129271A
Other languages
Chinese (zh)
Inventor
Yasukuni Nishimoto
Shinichi Murakami
Shuji Yamaoka
Shogo Ishioka
Original Assignee
Oht Inc
Socio Diamond Systems Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oht Inc, Socio Diamond Systems Co Ltd filed Critical Oht Inc
Publication of TW200613754A publication Critical patent/TW200613754A/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/07—Non contact-making probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/006—Electronic inspection or testing of displays and display drivers, e.g. of LED or LCD displays
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/34—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source
    • G09G3/36—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source using liquid crystals
    • G09G3/3611—Control of matrices with row and column drivers
    • G09G3/3622—Control of matrices with row and column drivers using a passive matrix
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2300/00—Aspects of the constitution of display devices
    • G09G2300/06—Passive matrix structure, i.e. with direct application of both column and row voltages to the light emitting or modulating elements, other than LCD or OLED

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)

Abstract

To provide an apparatus for inspecting conductor states, which can precisely detect a state of an object to be inspected using a non-contact method, in the case the object to be inspected is a conductor. A plurality of X-axis sensor plates are arranged approximately in parallel at prescribed spacings on the front side of an insulating board near an inspection conductor (500) of the object to be inspected being supplied with an inspection signal by a signal supply section, and a plurality of Y-axis sensor plates are arranged at prescribed spacings on the back side of the insulating board approximately in parallel along a direction almost perpendicular to the X-axis sensor plates. Detection signals of the sensor plates are subtracted respectively, and detection values from the sensor plates on the one side are normalized by subtracting subtraction results from the detection values of the sensor plates on the one side, and relative rates of detection signal values from sensor plates on both sides are detected, thereby obtaining detection results corresponding to distances between the sensor plates and the inspection conductor.
TW094129271A 2004-08-27 2005-08-26 Inspection apparatus, inspection method and sensor for inspection apparatus TW200613754A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004247734A JP2006064551A (en) 2004-08-27 2004-08-27 Inspection apparatus, inspection method and sensor for inspection apparatus

Publications (1)

Publication Number Publication Date
TW200613754A true TW200613754A (en) 2006-05-01

Family

ID=35967628

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094129271A TW200613754A (en) 2004-08-27 2005-08-26 Inspection apparatus, inspection method and sensor for inspection apparatus

Country Status (5)

Country Link
JP (1) JP2006064551A (en)
KR (1) KR20070083501A (en)
CN (1) CN101023317A (en)
TW (1) TW200613754A (en)
WO (1) WO2006022434A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI636264B (en) * 2016-06-01 2018-09-21 Ｏｈｔ股份有限公司 Non-contact substrate inspection device and inspection method

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BRPI0906854B1 (en) * 2008-01-17 2019-04-02 Ihi Corporation DETECTION APPARATUS FOR A FLYING OBJECT IN SPACE
JP5391819B2 (en) * 2009-05-14 2014-01-15 日本電産リード株式会社 Touch panel inspection device
KR101104903B1 (en) 2009-08-24 2012-01-12 성균관대학교산학협력단 Preparing method of double layered connection structure of probe unit for inspection of flat display panel and double layered connection structure using the same
CN102770775B (en) * 2010-02-23 2015-05-27 本田技研工业株式会社 Method of measuring contact failure and contact failure measuring device
TWI478018B (en) * 2011-01-21 2015-03-21 Egalax Empia Technology Inc Method and device for inspecting the strips of a touch panel
CN108226695B (en) * 2018-01-02 2021-10-15 京东方科技集团股份有限公司 Device and method for detecting and positioning short circuit of adjacent metal wire
JP7084807B2 (en) * 2018-07-10 2022-06-15 オークマ株式会社 Sensor board for electromagnetic induction type position sensor and manufacturing method of sensor board

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5880411A (en) * 1992-06-08 1999-03-09 Synaptics, Incorporated Object position detector with edge motion feature and gesture recognition
JP3098635B2 (en) * 1992-09-30 2000-10-16 新光電気工業株式会社 Shape inspection method and shape inspection device
JP3225716B2 (en) * 1993-10-28 2001-11-05 ぺんてる株式会社 Information input device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI636264B (en) * 2016-06-01 2018-09-21 Ｏｈｔ股份有限公司 Non-contact substrate inspection device and inspection method

Also Published As

Publication number Publication date
CN101023317A (en) 2007-08-22
WO2006022434A1 (en) 2006-03-02
KR20070083501A (en) 2007-08-24
JP2006064551A (en) 2006-03-09

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