TWI635138B - 可硬化性聚矽氧組合物、其硬化產品、及光半導體裝置 - Google Patents

可硬化性聚矽氧組合物、其硬化產品、及光半導體裝置 Download PDF

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Publication number
TWI635138B
TWI635138B TW102139156A TW102139156A TWI635138B TW I635138 B TWI635138 B TW I635138B TW 102139156 A TW102139156 A TW 102139156A TW 102139156 A TW102139156 A TW 102139156A TW I635138 B TWI635138 B TW I635138B
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TW
Taiwan
Prior art keywords
carbons
group
sio
mass
component
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TW102139156A
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English (en)
Chinese (zh)
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TW201420686A (zh
Inventor
飯村智浩
Tomohiro Iimura
須藤通孝
Michitaka Suto
西島一裕
Kazuhiro Nishijima
竹內香須美
Kasumi Takeuchi
古川晴彥
Haruhiko Furukawa
森田好次
Yoshitsugu Morita
Original Assignee
道康寧東麗股份有限公司
Dow Corning Toray Co., Ltd.
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Application filed by 道康寧東麗股份有限公司, Dow Corning Toray Co., Ltd. filed Critical 道康寧東麗股份有限公司
Publication of TW201420686A publication Critical patent/TW201420686A/zh
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Publication of TWI635138B publication Critical patent/TWI635138B/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/476—Organic materials comprising silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Silicon Polymers (AREA)
  • Sealing Material Composition (AREA)
TW102139156A 2012-10-30 2013-10-29 可硬化性聚矽氧組合物、其硬化產品、及光半導體裝置 TWI635138B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012239671A JP6081774B2 (ja) 2012-10-30 2012-10-30 硬化性シリコーン組成物、その硬化物、および光半導体装置
JP2012-239671 2012-10-30

Publications (2)

Publication Number Publication Date
TW201420686A TW201420686A (zh) 2014-06-01
TWI635138B true TWI635138B (zh) 2018-09-11

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW102139156A TWI635138B (zh) 2012-10-30 2013-10-29 可硬化性聚矽氧組合物、其硬化產品、及光半導體裝置

Country Status (7)

Country Link
US (1) US9312196B2 (enExample)
EP (1) EP2914664B1 (enExample)
JP (1) JP6081774B2 (enExample)
KR (1) KR101704425B1 (enExample)
CN (1) CN104812841B (enExample)
TW (1) TWI635138B (enExample)
WO (1) WO2014069610A1 (enExample)

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JP6157085B2 (ja) * 2012-10-24 2017-07-05 東レ・ダウコーニング株式会社 硬化性シリコーン組成物、その硬化物、および光半導体装置
TWI653295B (zh) * 2014-02-04 2019-03-11 日商道康寧東麗股份有限公司 硬化性聚矽氧組合物、其硬化物及光半導體裝置
TWI624510B (zh) * 2014-02-04 2018-05-21 日商道康寧東麗股份有限公司 硬化性聚矽氧組合物、其硬化物及光半導體裝置
WO2016022332A1 (en) * 2014-08-06 2016-02-11 Dow Corning Corporation Organosiloxane compositions and uses thereof
TWI663236B (zh) * 2014-10-16 2019-06-21 Dow Silicones Corporation 聚矽氧組合物及具有由該組合物製得之壓敏性黏著層的壓敏性黏著膜
CN106675505A (zh) * 2015-11-09 2017-05-17 北京科化新材料科技有限公司 用于led封装的硅胶
WO2017208936A1 (ja) * 2016-05-30 2017-12-07 日産化学工業株式会社 反応性ポリシロキサン及びそれを含む重合性組成物
US10894800B2 (en) * 2016-05-30 2021-01-19 Nissan Chemical Corporation Polymerizable silane compound
EP3498779A4 (en) * 2016-08-08 2020-01-15 Dow Toray Co., Ltd. HARDENABLE PARTICULAR SILICONE COMPOSITION, SEMICONDUCTOR ELEMENT WITH HARDENABLE PARTICLE SHAPED SILICONE COMPOSITION AND MOLDING PROCESS FOR SEMICONDUCTOR ELEMENT WITH HARDENABLE PARTICLE SHAPED SILICONE COMPOSITION
CN110382625B (zh) * 2017-02-27 2022-02-18 杜邦东丽特殊材料株式会社 可固化的有机聚硅氧烷组合物和半导体器件
JP6710175B2 (ja) * 2017-04-03 2020-06-17 信越化学工業株式会社 白色熱硬化性エポキシ・シリコーンハイブリッド樹脂組成物及び光半導体装置
WO2018235491A1 (ja) 2017-06-19 2018-12-27 東レ・ダウコーニング株式会社 硬化性粒状シリコーン組成物、それからなる半導体用部材、およびその成型方法
JP6863878B2 (ja) * 2017-11-02 2021-04-21 信越化学工業株式会社 付加硬化型シリコーン組成物、硬化物、及び光学素子
JP6823578B2 (ja) * 2017-11-02 2021-02-03 信越化学工業株式会社 付加硬化型シリコーン組成物、硬化物、光学素子
JP7021046B2 (ja) * 2018-10-22 2022-02-16 信越化学工業株式会社 付加硬化型シリコーン組成物、シリコーン硬化物、及び、光学素子
ES2970332T3 (es) * 2018-12-04 2024-05-28 Evonik Operations Gmbh Siloxanos reactivos
US20220186086A1 (en) * 2019-05-21 2022-06-16 Dow Silicones Corporation Polyorganosiloxane release coating and its preparation and use
US12139634B2 (en) 2020-04-14 2024-11-12 Shin-Etsu Chemical Co., Ltd. Silylated isocyanurate compound, metal corrosion inhibitor, curable organosilicon resin composition, and semiconductor apparatus
CN114058326B (zh) * 2021-11-22 2023-05-23 烟台德邦科技股份有限公司 一种粘接及可靠性优异的有机聚硅氧烷组合物及其制备方法
CN114181535B (zh) * 2021-12-08 2023-04-25 东莞市贝特利新材料有限公司 一种可固化的有机聚硅氧烷组合物及其制备方法
CN119546705A (zh) * 2023-02-16 2025-02-28 瓦克化学股份公司 可固化聚硅氧烷组合物和包含其的密封剂
CN119192854A (zh) * 2024-11-06 2024-12-27 江西贝特利新材料有限公司 一种可固化有机聚硅氧烷组合物及其制备方法

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JP6157085B2 (ja) 2012-10-24 2017-07-05 東レ・ダウコーニング株式会社 硬化性シリコーン組成物、その硬化物、および光半導体装置
JP6084808B2 (ja) 2012-10-24 2017-02-22 東レ・ダウコーニング株式会社 オルガノポリシロキサン、硬化性シリコーン組成物、その硬化物、および光半導体装置

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US20080207848A1 (en) * 2004-10-04 2008-08-28 Dow Corning Toray Co., Ltd. Organopolysiloxane and Curable Silicone Composition that Contains Aforementioned Organopolysiloxane
US20090118441A1 (en) * 2005-11-09 2009-05-07 Shinichi Yamamoto Curable Silicone Composition

Also Published As

Publication number Publication date
US9312196B2 (en) 2016-04-12
EP2914664A1 (en) 2015-09-09
CN104812841B (zh) 2017-08-29
EP2914664B1 (en) 2016-09-07
TW201420686A (zh) 2014-06-01
US20150252221A1 (en) 2015-09-10
JP2014088513A (ja) 2014-05-15
KR20150081292A (ko) 2015-07-13
KR101704425B1 (ko) 2017-02-08
CN104812841A (zh) 2015-07-29
JP6081774B2 (ja) 2017-02-15
WO2014069610A1 (en) 2014-05-08

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