TWI633279B - 基板測量裝置及雷射加工系統 - Google Patents

基板測量裝置及雷射加工系統 Download PDF

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Publication number
TWI633279B
TWI633279B TW106123047A TW106123047A TWI633279B TW I633279 B TWI633279 B TW I633279B TW 106123047 A TW106123047 A TW 106123047A TW 106123047 A TW106123047 A TW 106123047A TW I633279 B TWI633279 B TW I633279B
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TW
Taiwan
Prior art keywords
substrate
laser
machining
laser processing
unit
Prior art date
Application number
TW106123047A
Other languages
English (en)
Chinese (zh)
Other versions
TW201807376A (zh
Inventor
髙橋悌史
河野裕之
古田啓介
桂智毅
平山望
Original Assignee
日商三菱電機股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 日商三菱電機股份有限公司 filed Critical 日商三菱電機股份有限公司
Publication of TW201807376A publication Critical patent/TW201807376A/zh
Application granted granted Critical
Publication of TWI633279B publication Critical patent/TWI633279B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
TW106123047A 2016-07-14 2017-07-10 基板測量裝置及雷射加工系統 TWI633279B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2016-139423 2016-07-14
JP2016139423 2016-07-14
??PCT/JP2017/022410 2017-06-16
PCT/JP2017/022410 WO2018012199A1 (ja) 2016-07-14 2017-06-16 基板計測装置およびレーザ加工システム

Publications (2)

Publication Number Publication Date
TW201807376A TW201807376A (zh) 2018-03-01
TWI633279B true TWI633279B (zh) 2018-08-21

Family

ID=60951821

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106123047A TWI633279B (zh) 2016-07-14 2017-07-10 基板測量裝置及雷射加工系統

Country Status (5)

Country Link
JP (1) JP6594545B2 (ko)
KR (1) KR102127109B1 (ko)
CN (1) CN109475974B (ko)
TW (1) TWI633279B (ko)
WO (1) WO2018012199A1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI765173B (zh) * 2019-02-22 2022-05-21 日商鎧俠股份有限公司 檢查裝置及檢查方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI667471B (zh) * 2018-04-13 2019-08-01 揚朋科技股份有限公司 Apparatus and method for repairing printed circuit boards
JP7444548B2 (ja) * 2019-04-15 2024-03-06 ビアメカニクス株式会社 パターン検出とレーザ加工を行うための装置及び検出方法
CN110488512B (zh) * 2019-06-11 2021-12-24 惠科股份有限公司 一种显示面板测量设备的补正方法和补正系统
TWI768235B (zh) * 2019-08-14 2022-06-21 健鼎科技股份有限公司 二維條碼雷射雕刻機及定位方法
CN110441836A (zh) * 2019-08-21 2019-11-12 Oppo（重庆）智能科技有限公司 镜片的制备方法
US20220297192A1 (en) * 2019-11-11 2022-09-22 Mitsubishi Electric Corporation Additive manufacturing apparatus
DE102019220485A1 (de) * 2019-12-20 2021-06-24 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Verfahren zur Bestimmung und Korrektur des Maschinenzustands einer Werkzeugmaschine und Diagnosesystem
WO2021166209A1 (ja) * 2020-02-21 2021-08-26 三菱電機株式会社 加工エネルギーの制御方法およびレーザ加工装置

Citations (3)

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Publication number Priority date Publication date Assignee Title
US7462801B1 (en) * 1996-11-20 2008-12-09 Ibiden Co., Ltd. Laser machining apparatus, and apparatus and method for manufacturing a multilayered printed wiring board
JP2014013547A (ja) * 2012-07-05 2014-01-23 Amada Co Ltd 加工システムにおける誤差補正装置および方法
TWI522199B (zh) * 2010-10-15 2016-02-21 Mitsuboshi Diamond Ind Co Ltd A laser processing apparatus, a processing method of a workpiece, and a method of dividing a workpiece

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JP3126316B2 (ja) * 1996-11-20 2001-01-22 イビデン株式会社 多層プリント配線板の製造装置及び製造方法
JP3550617B2 (ja) * 1997-06-03 2004-08-04 日立ビアメカニクス株式会社 レーザ加工装置
CN1124917C (zh) * 1997-12-26 2003-10-22 三菱电机株式会社 激光加工装置
JP3518380B2 (ja) 1998-12-16 2004-04-12 三菱電機株式会社 レーザ加工装置
JP2003088983A (ja) * 2001-09-18 2003-03-25 Toppan Printing Co Ltd レーザードリル装置および多層配線基板の製造方法およびそれを用いた多層配線基板
JP2004288824A (ja) * 2003-03-20 2004-10-14 Juki Corp 電子部品装着装置のキャリブレーション法及びその方法を用いた装置
CN101178544A (zh) * 2006-04-12 2008-05-14 富士胶片株式会社 对准单元及使用该对准单元的图像记录装置
WO2008038385A1 (fr) * 2006-09-28 2008-04-03 Mitsubishi Electric Corporation Appareil d'usinage laser
JP2010162559A (ja) * 2009-01-13 2010-07-29 Mitsubishi Electric Corp レーザ加工方法および加工装置並びに被加工物
JP4907725B2 (ja) * 2010-03-23 2012-04-04 シャープ株式会社 キャリブレーション装置、欠陥検出装置、欠陥修復装置、表示パネル、表示装置、キャリブレーション方法
CN101870039B (zh) * 2010-06-12 2014-01-22 中国电子科技集团公司第四十五研究所 双工作台驱动激光加工机及其加工方法
CN103079746A (zh) * 2010-09-01 2013-05-01 三菱电机株式会社 激光加工装置及基板位置检测方法
JP5952875B2 (ja) * 2014-09-30 2016-07-13 株式会社片岡製作所 レーザ加工機、レーザ加工機のワーク歪補正方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7462801B1 (en) * 1996-11-20 2008-12-09 Ibiden Co., Ltd. Laser machining apparatus, and apparatus and method for manufacturing a multilayered printed wiring board
TWI522199B (zh) * 2010-10-15 2016-02-21 Mitsuboshi Diamond Ind Co Ltd A laser processing apparatus, a processing method of a workpiece, and a method of dividing a workpiece
JP2014013547A (ja) * 2012-07-05 2014-01-23 Amada Co Ltd 加工システムにおける誤差補正装置および方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI765173B (zh) * 2019-02-22 2022-05-21 日商鎧俠股份有限公司 檢查裝置及檢查方法

Also Published As

Publication number Publication date
WO2018012199A1 (ja) 2018-01-18
JPWO2018012199A1 (ja) 2018-11-01
CN109475974B (zh) 2021-01-01
TW201807376A (zh) 2018-03-01
JP6594545B2 (ja) 2019-10-23
KR20190017021A (ko) 2019-02-19
KR102127109B1 (ko) 2020-06-26
CN109475974A (zh) 2019-03-15

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