TWI633279B - Substrate measuring device and laser processing system - Google Patents

Abstract

The substrate measuring device (1) includes: a measuring camera (8) that acquires image data of a substrate (5) provided with a positioning alignment mark (7) and having a laser processed portion (6); The measuring station (4) is a carrier substrate (5), and changes the relative position of the substrate (5) and the measuring camera (8); the image processing unit (12) is based on the image data and the measuring station (4) The position information is obtained, and the measurement position coordinates of the alignment mark (7) and the measurement position coordinates of the processed portion (6) are obtained; and the conversion coefficient calculation unit (13) determines the coordinates of the measurement position from the alignment mark (7). a conversion coefficient to the design position coordinate of the alignment mark (7); and a machining error calculation unit (14) that converts the coordinate of the measurement position of the processed portion (6) into a converted position coordinate using a conversion coefficient, and The machining error is obtained based on the difference between the coordinate of the position after the conversion and the coordinates of the design position of the workpiece (6).

Description

Substrate measuring device and laser processing system

The present invention relates to a substrate measuring device for measuring a processing position error of a processing hole of a printed substrate or the like after laser drilling, and a laser for laser drilling of the printed substrate using the measurement result of the substrate measuring device Injection processing system.

In the conventional laser processing system, a laser drilling device is used for improving the processing precision of the laser processing, and after the laser processing, the position error of the drilling processing is measured by the machining position accuracy inspection unit. The correction data is produced and the correction data is used for laser processing (for example, refer to Patent Document 1).

The laser processing system includes a drilling processing unit and a machining position accuracy inspection unit. The drilling processing unit (hereinafter referred to as a machining unit) is provided with a galvano scanner and a processing table for the printed substrate ( Hereinafter, the laser light is irradiated by irradiating laser light, and the processing accuracy inspection unit (hereinafter referred to as an inspection unit) performs measurement of the position of the laser processing hole of the substrate using a camera and a measuring station.

The processing unit is based on the substrate measured before laser processing The scale value is determined by the reduction and transmitted to the inspection unit. In the inspection unit, the machining position error of the laser processing hole of the substrate is measured by the camera, and the position correction data, that is, the deviation value is obtained by using the above-mentioned proportional value, and transmitted to the processing unit. The processing unit further corrects the irradiation position of the laser using the above-described deviation value, and suppresses the temporal change of the processing accuracy in the continuous operation to ensure the processing accuracy.

Further, in the above-described inspection unit, in the inspection method of the accuracy of the drilling processing position, a CCD (Charge-Coupled Device) camera is used to measure the pad on the substrate which is the target of the irradiation of the laser light. The center coordinates and the center coordinates of the machined holes after the laser beam is irradiated with the laser beam, and the difference between the two is obtained to obtain a machining position error.

Further, the ratio value corresponding to the amount of shrinkage of the substrate is measured before the laser drilling process, and when the processing unit performs the alignment process of the process of shifting the position of the reference substrate, the amount of shrinkage of the substrate is measured and determined therefrom. .

[Previous Technical Literature] [Patent Literature]

Patent Document 1: Japanese Laid-Open Patent Publication No. 2003-88983

However, in the laser processing apparatus as disclosed in Patent Document 1, especially when laser processing according to thermal processing such as CO ₂ laser is performed, the substrate is thermally deformed after laser processing, resulting in laser processing. The amount of substrate shrinkage and the ratio change. As a result, in the inspection unit, the position correction data obtained based on the machining position error and the above-described proportional value may include thermal deformation errors. Therefore, when the machining position data of the machining unit is corrected based on the position correction data, there is a problem that the machining accuracy becomes poor.

Furthermore, since the machining unit and the inspection unit use different XY stages, in the case where the direct angles of the X-axis and the Y-axis of the respective XY stages are different, when the mechanical error characteristics of the respective XY stages are different, in the processing unit and The offset of the coordinate system will be generated between the inspection units. The machining position error measured by the inspection unit will include the offset of the coordinate system, resulting in machining when the machining position data of the machining unit is corrected according to the machining position error. The problem of poor accuracy.

Similarly, when the substrate is obliquely disposed on the measuring table of the inspection unit, the machining position error measured by the inspection unit also includes the alignment error of the substrate, resulting in correction of the machining position data of the machining unit according to the machining position error. The problem of poor processing accuracy becomes poor.

The present invention has been made in view of the above problems, and an object thereof is to obtain a substrate measuring device capable of measuring a machining error with high accuracy.

In order to solve the above problems and achieve the object, the present invention includes a camera for measurement, which is obtained by acquiring an image of a substrate provided with a positioning alignment mark and having a processed portion subjected to laser processing, and a measuring station, which is a carrier substrate. And changing the relative position between the substrate and the measuring camera; and the image processing unit obtains the measurement position coordinates of the alignment mark and the measurement position coordinates of the processed portion based on the image data and the position information of the measurement table. The present invention further includes: a conversion coefficient calculation unit that determines a measurement bit from the alignment mark The conversion coefficient of the coordinates of the design position of the alignment mark is converted; and the machining error calculation unit converts the measurement position coordinate of the processed portion into the converted position coordinate using the conversion coefficient, and is processed according to the converted position coordinate and the coordinate The difference between the coordinates of the design position of the part and the machining error.

According to the present invention, it is possible to achieve the effect of realizing a substrate measuring device capable of measuring a machining error with high accuracy.

1‧‧‧Substrate measuring device

2‧‧‧Measurement drive department

3‧‧‧Measurement Control Department

4‧‧‧Measuring station

4a, 33a‧‧‧ top

5, 31‧‧‧ substrate

6‧‧‧Processing holes

7‧‧‧ alignment mark

8‧‧‧Measurement camera

9‧‧‧Measurement Command Department

10‧‧‧Measurement Desk Control Department

11‧‧‧Measurement Camera Control Department

12‧‧‧Image Processing Department

13‧‧‧Conversion coefficient calculation department

14‧‧‧Machining Error Calculation Department

15‧‧‧ Laser processing correction value calculation unit

16‧‧‧Making defective judgment department

17‧‧‧Transportation device

20, 44, 63, 73‧ ‧ laser processing systems

21, 51, 64, 74‧‧ ‧ laser processing equipment

22, 60, 70‧‧‧System Command Department

23‧‧‧ Laser Processing Department

24, 54, 65, 75‧‧ ‧ Laser Processing Control Department

25‧‧‧Laser oscillator

26‧‧‧Laser light

27X, 27Y‧‧‧ galvanometer mirror

28X, 28Y‧‧‧ motor

29X, 29Y‧‧‧ galvanometer scanner

30‧‧‧F θ lens

32‧‧‧Processing head

33‧‧‧Processing table

34‧‧‧Processing camera

35‧‧‧Processing Command Department

36‧‧‧Laser Oscillator Control Unit

37‧‧‧Processing Station Control Department

38‧‧‧Processing Camera Control Department

39‧‧‧Alignment correction calculation unit

40, 47‧‧ ‧ alignment correction department

41, 46, 61, 71‧‧ ‧ Laser Processing Correction Department

42, 45‧‧‧ deflector alignment correction unit

43‧‧‧Laser deflector control unit

50‧‧‧Second Image Processing Department

62, 72‧‧ ‧ laser processing correction value memory

101‧‧‧CPU

102‧‧‧ memory

103‧‧‧Processing Circuit

Fig. 1 is a view showing the configuration of a substrate measuring apparatus according to a first embodiment of the present invention.

Fig. 2 is a view showing the state of the substrate of the first embodiment.

Fig. 3 is a flow chart for explaining the operation of the substrate measuring apparatus of the first embodiment.

Fig. 4 is a view showing the configuration of a laser processing system according to a second embodiment of the present invention.

Fig. 5 is a flow chart showing the operation of the laser processing system of the second embodiment.

Fig. 6 is a view showing the configuration of a laser processing system according to a third embodiment of the present invention.

Fig. 7 is a flow chart showing the operation of the laser processing system of the third embodiment.

Fig. 8 is a view showing the configuration of a laser processing system according to a fifth embodiment of the present invention.

Fig. 9 is a view showing another configuration of the laser processing system of the fifth embodiment.

Fig. 10 is a view showing the hardware configuration of the computer system of the first to fifth embodiments.

Fig. 11 is a view showing a configuration in which the functions of the measurement control unit, the system command unit, and the laser processing control unit of the first to fifth embodiments are realized by dedicated hardware.

Hereinafter, a substrate measuring device and a laser processing system according to embodiments of the present invention will be described in detail based on the drawings. Further, the present invention is not limited to the embodiment.

Embodiment 1.

Fig. 1 is a view showing the configuration of a substrate measuring apparatus 1 according to Embodiment 1 of the present invention. The substrate measuring device 1 measures the machining error of the laser drilling process performed on the substrate. The substrate measuring device 1 includes a measurement driving unit 2 and a measurement control unit 3 that controls the measurement driving unit 2. Fig. 2 is a view showing a state of the substrate 5 of the first embodiment. Fig. 2 is a view of the substrate 5 viewed from the top to the bottom in the vertical direction of the paper surface of Fig. 1.

In the first drawing, a block diagram of the processing function is displayed for the measurement control unit 3. The measurement control unit 3 includes a measurement command unit 9, a measurement station control unit 10, a measurement camera control unit 11, an image processing unit 12, a conversion coefficient calculation unit 13, a machining error calculation unit 14, and a laser machining correction value calculation unit 15. And the processing failure determining unit 16.

The measurement drive unit 2 includes a measurement stage 4 belonging to the XY stage. The top table 4a of the measuring table 4 carries the substrate 5 processed by the laser opening. In Fig. 1, the driving direction of the measuring table 4 belongs to the X direction of the vertical direction of the paper surface and the Y direction of the left and right direction of the paper surface. The top table 4a of the measuring table 4 is a part of the measuring table 4 that is movable in the X direction and the Y direction. Further, a linear encoder (not shown) is provided on the X-axis and the Y-axis of the measuring table 4, so that the top table 4a can be positioned with high precision. The substrate 5 provided on the top table 4a of the measuring table 4 is formed with a processing hole 6 belonging to the laser-processed portion, and an alignment mark 7 for positioning is printed.

In Fig. 2, a plurality of machined holes 6 are formed in the substrate 5. The substrate 5 is a printed circuit board provided in an electronic device such as a personal computer or a mobile phone, and the processed hole 6 formed by laser processing is mainly a hole for connecting the layers of the multilayer printed circuit board, that is, a through hole. Generally, the hole diameter of the machined hole 6 is φ 20 μm to φ 200 μm, and the number of holes of the machined hole 6 is tens of thousands of holes to about one million holes per substrate.

Further, an alignment mark 7 belonging to the positioning mark for positioning of the substrate 5 is provided on the peripheral portion of the substrate 5 by printing. In general, the alignment mark 7 is printed with two to four prints on the workpiece. In the second drawing, four alignment marks 7 are printed on the substrate 5.

As shown in FIG. 1, the measurement camera 4 of the measurement drive unit 2 is provided with a measurement camera 8 that acquires the processing hole 6 and the pair of the processed portion formed on the processed surface of the substrate. Image data of the quasi-marker 7. The measuring camera 8 is mounted on a Z-axis stage (not shown). The Z-axis table is by the Z in the up and down direction of the paper belonging to the first figure. The focus adjustment of the camera 8 for measurement can be performed by moving in the direction.

Since the relative position of the substrate 5 and the measuring camera 8 is changed by moving the measuring table 4, the measuring camera 8 can capture images of all the processed holes 6 and the alignment marks 7 on the substrate 5. Further, although not shown, the measurement camera 8 is provided with an illumination function and an autofocus function. Specifically, the measuring camera 8 is a linear camera using a line sensor. The image processing unit 12 performs image processing based on the image information obtained by the linear sensor and the position information of the measuring table 4, and measures the position coordinates of the machining hole 6 and the alignment mark 7 at high speed.

In addition, the linear camera has a measurement width of only about 80 mm. Therefore, when the size of the substrate 5 is, for example, 320 mm × 320 mm, the linear camera is scanned twice or twice, or four cameras are arranged in one direction. By scanning the measurement table 4 and the measurement camera 8 in a direction perpendicular to the direction, the image data of the entire surface of the substrate 5 can be collected. Further, the position coordinates measured by the image processing unit 12, the measurement table 4, and the measurement camera 8 are defined as measurement position coordinates.

The measurement control unit 3 controls the measurement unit 4 and the control unit of the measurement camera 8. The computer system that realizes the function of the measurement control unit 3 further includes a monitor (not shown), various external interfaces, a servo amplifier, and the like.

The measurement command unit 9 outputs the design position coordinates and the alignment mark 7 of the machining hole 6 obtained from the CAD (Computer-Aided Design) stored in the memory not shown in FIG. 1 in accordance with the measurement program. Design location coordinates. And, for measurement The station control unit 10 outputs a control command to the measurement station 4, and outputs a control command to the measurement camera control unit 11 to the measurement camera 8. In addition, the design position coordinates are coordinate positions given by CAD or the like.

The measurement stage control unit 10 uses the position command input from the measurement command unit 9 and the position information from the linear encoder provided on the measurement table 4 to position and control the measurement table 4. Further, the measurement station control unit 10 outputs the position information of the linear encoder to the image processing unit 12 in accordance with the sampling period captured by the measurement camera 8.

The measurement camera control unit 11 controls the imaging of the measurement camera 8 by the camera control command input from the measurement command unit 9. Further, in general, a linear camera used as a measuring camera captures an image with a sampling period of several kHz to several tens of kHz. Further, the measurement camera control unit 11 outputs the image data captured by the measurement camera 8 in the sampling cycle to the image processing unit 12.

Further, the measurement command unit 9 issues a movement command to the measurement table control unit 10 so that the measurement camera 8 can capture image information of all the processing holes 6 of the substrate 5 and the alignment mark 7, and cooperates with the measurement table 4. The measurement is performed on the measurement camera control unit 11 by moving the measurement camera 8 to move. Thereby, the measurement camera control unit 11 collects image data of the entire surface of the substrate 5 captured by the measurement camera 8.

The image processing unit 12 collects image data captured by the measurement camera 8 in the sampling cycle from the measurement camera control unit 11, and collects the measurement station from the measurement station control unit 10 when the image data is captured. 4 linear encoders to obtain the X and Y position positions The target is used as the position information of the measuring station 4.

After the image data and the collection of the position coordinates of the measurement table 4 are completed, the image processing unit 12 applies image processing techniques called pattern matching to determine the substrate belonging to the substrate based on the image data and the position coordinates of the measurement table 4. The measurement position coordinates of the machining hole 6 of the workpiece to be processed and the measurement position coordinates of the alignment mark 7.

The conversion coefficient calculation unit 13 receives the measurement position coordinates of the alignment mark 7 obtained by the image processing unit 12, and inputs the design position coordinates of the alignment mark 7 from the measurement command unit 9. The conversion coefficient calculation unit 13 uses the measurement position coordinates of the input alignment mark 7 and the design position coordinates of the input alignment mark 7 to determine the design of the conversion from the measurement position coordinate of the alignment mark 7 to the alignment mark 7. The conversion factor of the position coordinates.

The above conversion coefficient is used to eliminate an error caused by thermal deformation of the substrate 5, an error caused by a deviation of a straight angle of the X-axis and the Y-axis of the measuring table 4, or an alignment error of the substrate 5.

The position coordinate system after the coordinate conversion of the measurement position coordinates of the alignment mark 7 using the above-described conversion coefficient substantially coincides with the design position coordinate of the alignment mark 7.

Furthermore, when the measurement position coordinates of the processing holes 6 are multiplied by the conversion coefficient, the converted position coordinates of the processed processing holes 6 are used to eliminate errors caused by thermal deformation of the substrate 5, or due to the measurement table 4 The error caused by the deviation of the straight angle of the X-axis and the Y-axis or the alignment error of the substrate 5. Here, when the machining hole 6 has no machining error, the post-conversion position coordinate of the machining hole 6 substantially coincides with the design position coordinate of the machining hole 6. however, When there is a machining error in the machining hole 6, the coordinates of the design position of the machining hole 6 may cause a positional error with respect to the machining error with respect to the design position coordinate of the machining hole 6.

One of the conversion coefficients when the alignment mark 7 is four is as follows, for example. The position coordinates of each alignment mark 7 are set to (Xam(k), Yam(k)) (k=1, 2, 3, 4), and the corresponding design position coordinates are set to (Xar(k), Yar (k)) (k = 1, 2, 3, 4). In addition, when P11, P12, P13, P21, P22, and P23 are examples of the conversion coefficient obtained by the conversion coefficient calculation unit 13, the relationship of the following equation (1) is obtained.

(k=1, 2, 3, 4)

The conversion coefficients P11, P12, P13, P21, P22, and P23 of the equation (1) can be utilized according to the measurement position coordinates of the alignment mark 7 and the design position coordinates corresponding thereto if the alignment marks 7 are three or more. The equation (1) is obtained. If the alignment marks 7 are four or more, it can be further accurately obtained using the least squares method.

P11, P12, P13, P21, P22, and P23 of the equation (1) are elements of the coordinate conversion matrix converted from the measurement position coordinates of the alignment mark 7 to the design position coordinates of the alignment mark 7, and the composition is biased for existence. Effective coordinate conversion matrix for the case of shift, gain, rotation, and quadrature deviation of the coordinate axis.

When the coordinate conversion matrix is obtained based on the measurement position coordinates of the alignment mark 7 and the design position coordinate corresponding thereto, the coordinates of the measurement position of the machining hole 6 obtained by the image processing unit 12 can be converted into a machining hole by using the coordinate conversion matrix. 6 post-conversion position coordinates. Therefore, regardless of the case where the substrate 5 is deformed by thermal expansion, the X-axis and the Y-axis of the measuring table 4 have orthogonal deviations, or the alignment error of the substrate 5 is present, the error can be found. The converted position coordinates of the machining hole 6.

Further, the relationship of the following formula (2) using another example of the conversion coefficient may be used. However, the conversion coefficient is not limited to those shown by the formula (1) and the formula (2).

(k=1, 2, 3, 4)

The machining error calculation unit 14 receives the conversion coefficient obtained by the conversion coefficient calculation unit 13, and the measurement position coordinate of the machining hole 6 is input by the image processing unit 12, and the corresponding machining hole 6 is input by the measurement command unit 9. Design location coordinates. The machining error calculation unit 14 converts the coordinate of the measurement position of the machining hole 6 into a converted position coordinate using the input conversion coefficient, and according to the difference between the design position coordinate of the machining hole 6 and the converted position coordinate of the machining hole 6 Calculate the machining error.

The measurement position coordinates of the machining hole 6 are set to (Xhm(n), Yhm(n)), and the design position coordinates of the corresponding machining hole 6 are set to (Xhr(n), Yhr(n)), the machining error (ΔXe(n), ΔYe(n)) of each machining hole 6 can be obtained by the following equation (3). Where n=1, 2, 3, 4, ..., N, N are the number of processed holes.

(n=1, 2, 3, 4, ..., N: N is the number of holes processed)

The laser machining correction value calculation unit 15 receives the machining error (ΔXe(n), ΔYe(n)) obtained by the machining error calculation unit 14. The laser machining correction value calculation unit 15 calculates a laser machining correction value for the laser machining apparatus that performs the laser drilling process of the substrate 5 based on the machining error (ΔXe(n), ΔYe(n)) ( △ Xh, ΔYh).

When calculating the laser machining correction value (ΔXh, ΔYh), a plurality of or all machining errors (ΔXe(n), ΔYe(n)) are used. Specifically, when the laser machining correction value (ΔXh, ΔYh) is obtained using the average value, the average value is calculated as shown in the following equation (4).

(n=1, 2, 3, 4, ..., N: N is the number of holes processed)

In the equation (4), if n=N, the average value of the machining errors (ΔXe(n), ΔYe(n)) of all the machining holes 6 is used to obtain the laser addition. For the correction value (ΔXh, ΔYh), the laser machining correction value (ΔXh, ΔYh) can be obtained by calculating the average value of the machining error using 2 or more values of N as n.

The machining failure determining unit 16 compares the calculated values (ΔXe(n), ΔYe(n)) of the machining errors obtained by the machining error calculating unit 14 with the machining defect determination reference values set in advance to determine whether or not there is a machining failure. . By comparing the machining error with a predetermined machining defect determination reference value, it is possible to perform a highly reliable machining failure determination.

When the machining failure determination reference value is Remax, the square root of the square of the machining error ΔXhe(n) in the X direction and the machining error ΔYhe(n) in the Y direction and Remax satisfy the following equation at some n ( 5) When it is determined, the processing is defective.

(n=1, 2, 3, 4, ..., N: N is the number of holes processed)

When the machining failure determining unit 16 determines that the machining is defective, the monitoring device (not shown) displays an alarm. Further, in addition to the equation (5), the following equation (6) or equation (7) may be used as the equation for determining the machining failure.

(n=1, 2, 3, 4, ..., N: N is the number of holes processed)

(n=1, 2, 3, 4, ..., N: N is the number of holes processed)

Fig. 3 is a flow chart for explaining the operation of the substrate measuring apparatus 1 of the first embodiment.

First, the substrate 5 is placed on the measurement stage 4 by a manual or a substrate transfer device (not shown) (step S1).

The measurement table control unit 10 drives the measurement table 4, and the measurement camera 8 controlled by the measurement camera control unit 11 collects image data of the entire surface of the substrate 5 (step S2).

The image processing unit 12 performs image processing based on the image data of the processing hole 6 and the alignment mark 7 of the substrate 5 and the position coordinates of the position information belonging to the measurement table 4, and obtains the processing hole 6 and the alignment mark 7. The position coordinates are measured (step S3).

The conversion coefficient calculation unit 13 obtains the conversion coefficient from the measurement position coordinates of the alignment mark 7 and the design position coordinates using the equation (1) or the like (step S4).

The machining error calculating unit 14 converts the coordinate of the measurement position of the machining hole 6 into a converted position coordinate using the conversion coefficient obtained in step S4, and calculates the machining of all the machining holes 6 using the equation (3) or the like. Error (ΔXe(n), ΔYe(n)) (step S5).

The laser machining correction value calculation unit 15 calculates the laser for the laser drilling process of the substrate 5 by using the equation (4) based on the machining errors of all the machining holes 6 obtained by the machining error calculation unit 14. Processing device The laser processing correction value (ΔXh, ΔYh) (step S6).

The defective product determination unit 16 uses the machining error and the machining failure determination reference value of all the machining holes 6 obtained by the machining error calculation unit 14 in step S5, and uses the equation (5), the equation (6), or the equation. (7) The determination of the processing failure is performed (step S7). When the machining failure determining unit 16 determines that the machining is defective, the monitoring device displays an alarm.

According to the substrate measuring apparatus 1 of the first embodiment, even when the substrate 5 is thermally deformed after laser processing, when the straight angles of the X-axis and the Y-axis of the measuring table 4 are not good, or when the substrate 5 is misaligned, These error factors can be eliminated, and the machining error can be measured with high accuracy. Therefore, it is possible to obtain a machining correction value for laser processing that reduces these error factors.

In the above description, the laser machining correction value calculation unit 15 obtains one laser machining correction value (ΔXh, ΔYh) using the equation (4). However, if the machining error (ΔXe(n), ΔYe(n)) of all the machining holes 6 obtained by the equation (3) is directly set as the laser machining correction value of each machining hole 6, The machining error inherent to each of the machining holes 6 is corrected. Thereby, the laser processing can be corrected more correctly.

Further, in the first embodiment, the linear sensor is used as the measuring camera 8, and the same effect can be obtained when the area camera which is a camera including the area sensor is used.

Embodiment 2

Fig. 4 is a view showing the configuration of a laser processing system 20 according to a second embodiment of the present invention. The same constituent elements as in the first embodiment are all the same No., so the description is omitted.

The laser processing system 20 includes a laser processing device 21, a substrate measuring device 1, a system command unit 22, and a transport device 17. The laser processing apparatus 21 performs laser drilling processing on a substrate which is not subjected to laser drilling. The substrate measuring device 1 is the one described in the first embodiment, and measures the machining error of the substrate subjected to the laser drilling process by the laser processing device 21. The system command unit 22 controls the laser processing device 21 and the substrate measuring device 1.

The system command unit 22 is a system controller that controls peripheral devices such as the laser processing device 21, the substrate measuring device 1, and the transport device 17, and is constituted by a computer system such as a personal computer. The system command unit 22 is also connected to a CAD system and a CAM (Computer-Aided Manufacturing) system, and transmits the design position coordinates of the machining hole 6, the design position coordinates of the alignment mark 7 of the substrate 31, and various programs to Laser processing device 21 and substrate measuring device 1.

The laser processing system 20 prevents the processing error of the laser drilling process from being augmented by the temperature rise of the laser processing apparatus 21, and maintains a long-term stable processing accuracy. To achieve this, the laser processing system 20 measures the machining error by the substrate measuring device 1 for the substrate subjected to the laser processing by the laser processing device 21, and further calculates the corrected laser processing by the substrate measuring device 1. The laser machining error correction value of the error is corrected, and the machining command of the laser machining device 21 is corrected.

The laser processing apparatus 21 includes a laser processing unit 23 and a laser processing control unit 24 that controls the laser processing unit 23.

The laser processing unit 23 includes a laser oscillator 25 that outputs laser light, a processing head 32, and a processing table 33 that belongs to the XY stage of the carrier substrate 31. Here, the substrate 5 is referred to as a first substrate, and the substrate 31 to be subjected to laser processing is referred to as a second substrate. Further, the substrate 5 is a substrate which has been processed before the substrate 31. The processing head 32 includes an ammeter scanner 29X, an ammeter scanner 29Y, and an F θ lens 30. The galvanometer scanner 29X includes a galvanomib mirror 27X and a motor 28X. The galvanometer scanner 29Y includes an ammeter mirror 27Y and a motor 28Y. The galvanometer scanners 29X, 29Y are laser deflectors. The galvanometer scanners 29X and 29Y bias the laser light 26 from the laser oscillator 25 toward the substrate 31 and are positioned on the substrate 31. The processing head 32 is fixed to a Z-axis stage (not shown), and is movable in the Z direction perpendicular to the processing surface of the substrate 31 to adjust the focus of the laser light 26. The processing table 33 changes the relative position of the substrate 31 carried by the galvanometer scanners 29X and 29Y.

The laser light 26 output from the laser oscillator 25 of the laser processing unit 23 is deflected in the two-dimensional direction by the galvanometer scanners 29X and 29Y. The deflected laser light 26 is condensed by the F θ lens 30, and a laser processed hole is formed on the substrate 31 belonging to the workpiece which is not subjected to laser boring. Here, the laser deflector control unit 43 can control the laser light 26 to be positioned within a range of about 50 mm × 50 mm on the substrate 31 by controlling the angles of the galvanomirrors 29X and 29Y.

Further, the substrate 31 is a printed circuit board equivalent to the substrate 5 of the first embodiment, but is a substrate before the laser drilling process, and the periphery of the substrate 31 is printed in the same manner as the substrate 5 shown in FIG. Use Alignment mark 7.

As shown in FIG. 4, the substrate 31 is provided on the top table 33a of the processing table 33. The processing table 33 can move the substrate 31 in the X direction which is perpendicular to the paper surface in Fig. 4 and the Y direction shown in Fig. 4, and controls the relative positions of the galvanomirrors 29X and 29Y and the substrate 31. The processing table 33 is normally moved in a range of about 600 mm × 600 mm so that the entire surface of the processed surface of the substrate 31 can be subjected to laser processing. Further, the processing table 33 is provided with a linear encoder (not shown) as a positioning sensor. The linear encoder measures the position of the top table 33a of the setting substrate 31 with high accuracy, and the processing table control portion 37 uses this measurement result to position the control processing table 33.

The processing head 32 is mounted with a processing camera 34 that measures the position coordinates of the alignment marks 7 of the substrate 31. The processing table control unit 37 positions the processing table 33 such that the processing camera 34 can image the positioning marks 7 of the substrate 31, and then the processing camera 34 captures the alignment marks 7 of the substrate 31. The processing camera 34 is specifically a camera using an image sensor such as a CCD camera or a CMOS (Complementary Metal-Oxide-Semiconductor) camera.

The position coordinates of the alignment mark 7 can be measured using the image data of the alignment mark 7 taken by the processing camera 34 and the value of the linear encoder belonging to the position information of the processing table 33 when the image data is captured.

The measurement position coordinates of the position coordinates belonging to the measured alignment mark 7 are used for correction of the command of the galvanometer scanners 29X, 29Y or the command of the processing table 33, even if there is an alignment error of the substrate 31 or expansion and contraction of the substrate 31, It is also possible to irradiate the laser light 26 onto the substrate 31 with high precision. The location coordinates of the purpose.

After the laser drilling process of the substrate 31 is completed, the substrate 31 is transported to the top table 4a of the measuring table 4 of the substrate measuring device 1 by the transport device 17 in response to a command from the system command unit 22. The substrate 31 which is disposed on the top table 4a of the measuring table 4 by laser drilling is the substrate 5.

The laser processing control unit 24 of Fig. 4 describes the function by using a block diagram. The laser processing control unit 24 includes a machining command unit 35, a laser oscillator control unit 36, a machining station control unit 37, a machining camera control unit 38, a second image processing unit 50, and an alignment correction value calculation unit 39. The stage alignment correction unit 40, the laser processing correction unit 41, the deflector alignment correction unit 42, and the laser deflector control unit 43.

The laser processing control unit 24 controls the laser processing unit 23, and controls the laser oscillator 25, the galvanometer scanners 29X and 29Y, the processing table 33, and the processing camera 34.

The laser processing control unit 24 is a computer system. The computer system has one or a plurality of CPUs (Central Processing Units), memory, and even a digital transmission interface, an analog input device, an analog output device, and a human-machine interface. Further, the laser processing control unit 24 also includes a servo amplifier and a power source for driving the laser oscillator 25, the galvanometer scanners 29X and 29Y, and the processing table 33.

The machining command unit 35 acquires the design position coordinates of the machining hole 6 , the design position coordinates of the alignment mark 7 of the substrate 31 , and the machining program from the system command unit 22 , and records various setting parameters, laser machining conditions, and the like. The machining command unit 35 is based on the addition work acquired from the system command unit 22. a laser oscillation command, a laser oscillation command for each of the laser oscillator 25, the processing table 33, and the galvanometer scanners 29X, 29Y, a positional coordinate for positioning the processing table 33, a positioning galvanometer scanner 29X, 29Y instruction position coordinates and other instructions.

Further, the command position coordinates given to the processing table 33 and the command position coordinates given to the galvanomirrors 29X and 29Y which are output from the machining command unit 35 are obtained from the design position coordinates of the machining hole 6, and do not include the deformation of the substrate 31. The coordinate deviation of the processing table 33 and the alignment error.

Further, the size of the substrate 31 is usually 300 mm × 300 mm or more, but the scanning area of the laser light 26 depending on the galvanometer scanners 29X and 29Y is about 50 mm × 50 mm. Therefore, in order to perform laser processing by scanning the entire surface of the processing area of the substrate 31 to be subjected to the hole processing by the galvanomirrometers 29X and 29Y, it is necessary to move the processing table 33 so that the scanning area of the galvanometer scanners 29X and 29Y is The processing surface of the substrate 31 moves.

The command position coordinates of the processing table 33 for performing the above processing, specifically, the processing area to be subjected to the hole drilling processing on the substrate 31 by the size of the scanning area of the ammeter scanners 29X and 29Y, and It is obtained in the form of the center coordinates of the machining holes 6 of the divided machining regions. There may be more than one machining hole 6 in each of the divided machining regions. Therefore, the center coordinate is a maximum value, a minimum value, and a maximum value of a design position coordinate in the Y direction of the one-side machining hole 6 included in each of the divided machining regions. The form of the central coordinate of the quadrilateral region determined by the minimum value is calculated and calculated. The center seat of the machining hole 6 of each of the above-mentioned divided processing regions The index is set to the command position coordinate of the processing table 33 (Xtr0(m), Ytr0(m)). Where m = 1, 2, 3, ..., M, M are the number of divisions of the above-described division of the processing region.

Accordingly, the command position coordinates of the galvanomirrors 29X and 29Y of the machining holes 6 can be obtained by subtracting the command position coordinates of the machining table 33 from the design position coordinates of the machining holes 6, wherein the machining is performed. The command position coordinate of the table 33 includes the center coordinate of the machining hole 6 in the divided machining region of the machining hole 6.

Here, if the design position coordinates of the machining hole 6 obtained from the CAD data are (Xhr(n), Yhr(n)), the center of the machining hole 6 including the divided machining region of the design position coordinate is included. The command position coordinates (Xtr0(m), Ytr0(m)) of the coordinate processing table 33 are set to (Xtr(n), Ytr(n)), and the command position coordinates of the galvanometer scanners 29X and 29Y (Xgr(n) ), Ygr(n)) can be obtained by the following formula (8).

(n=1, 2, 3, 4, ..., N: N is the number of holes processed)

Further, the command position coordinates (Xtr(n), Ytr(n)) of the machining table 33 and the command position coordinates (Xgr(n), Ygr(n)) of the galvanometer scanners 29X and 29Y are obtained as described above. It is output from the machining command unit 35.

Further, the laser oscillator control unit 36 is configured to input the laser processing condition to the laser oscillator control unit 36 by the machining command unit 35, and input the laser oscillation command so that the laser oscillator 25 outputs a pulse-like lightning. Light In the manner of 26, the laser oscillator 25 outputs a laser oscillation command.

The machining table control unit 37 acquires the table command position coordinates from the machining command unit 35, and positions and controls the machining table 33, and outputs the position information of the machining table 33 in accordance with the position coordinates of the linear scale.

The processing camera control unit 38 operates in accordance with the camera control command from the machining command unit 35, and performs control of the machining camera 34 and collection of image data of the alignment mark 7 of the substrate 31 captured by the processing camera 34. The image data of the alignment mark 7 is collected after the positioning of the processing table 33 is completed.

The second image processing unit 50 uses the image data collected by the processing camera control unit 38, and obtains the alignment mark 7 in the image plane of the processing camera 34 by using an image processing method such as pattern matching. Position coordinates. Further, the second image processing unit 50 inputs the position coordinates of the processing table 33 when the image data is captured from the processing table control unit 37. The second image processing unit 50 adds the position coordinates of the alignment mark 7 on the image plane to the position coordinates of the processing table 33, and obtains the measurement position coordinates of the alignment mark 7 of the substrate 31 on the processing table 33. .

The alignment correction value calculation unit 39 acquires the measurement position coordinates of the alignment mark 7 of the substrate 31 obtained by the second image processing unit 50, and acquires the design position coordinates of the corresponding alignment mark 7 from the machining command unit 35, The conversion coefficient for correcting the alignment error on the processing table 33 of the substrate 31 and the deformation of the substrate 31 is obtained. The conversion coefficient obtained by the conversion coefficient calculation unit 13 in the first embodiment is referred to as a first conversion coefficient, and the conversion coefficient obtained by the alignment correction value calculation unit 39 is referred to as a second conversion coefficient.

Q11, Q12, Q13, Q21, Q22, and Q23 are taken as an example of the second conversion coefficient, and it is assumed that there are four alignment marks 7 of the substrate 31. When the measurement position coordinates of the alignment mark 7 of the substrate 31 are set to (Xam2(k), Yam2(k)) (k=1, 2, 3, 4), and the corresponding design position coordinates are set to (Xar2( k), Yar2(k)) (k = 1, 2, 3, 4), which can express the relational expression of the following formula (9).

(k=1, 2, 3, 4)

In the second conversion coefficients Q11, Q12, Q13, Q21, Q22, and Q23 of the equation (9), if the alignment marks 7 of the substrate 31 are three or more, the measurement position coordinates of the alignment marks 7 of the substrate 31 can be used. The design position coordinates and the equation (9) are obtained. When the alignment mark 7 of the substrate 31 is four or more, it can be further accurately obtained by the least squares method.

Q11, Q12, Q13, Q21, Q22, and Q23 of the equation (9) are elements that are converted from the design position coordinates of the alignment marks 7 of the substrate 31 to the coordinate conversion matrix of the measurement position coordinates on the processing table 33, and constitute a pair. There is a coordinate conversion matrix that is effective in the case of offset, gain, rotation, and orthogonal deviation of the coordinate axis of the substrate 31.

The second conversion coefficient obtained by the alignment correction value calculation unit 39 is output to the stage alignment correction unit 40 and the deflector alignment correction unit 42.

The stage alignment correction unit 40 converts using the second conversion coefficient The command position coordinates for positioning the processing table 33 output from the machining command unit 35 are obtained, and the command position coordinates obtained by correcting the alignment error of the substrate 31 and the error due to the deformation are obtained and output to the processing table control unit 37. . The correction made by the conversion using the second conversion coefficient is referred to as alignment correction. The command position coordinates obtained before the alignment correction of the processing table 33 obtained from the machining command unit 35 are (Xtr(n), Ytr(n)), and the command position after the alignment correction according to the second conversion coefficient is used. When the coordinates are (Xtr2(n), Ytr2(n)), the relationship is expressed by the following equation (10).

(n=1, 2, 3, 4, ..., N: N is the number of holes processed)

The laser processing correction unit 41 acquires the command position coordinates (Xgr(n), Ygr(n)) for positioning the galvanomirrors 29X and 29Y, which are output from the machining command unit 35, and is obtained by the substrate measuring device 1. The laser processing correction value (?Xh, ?Yh) of the laser processing apparatus 21 corrects the command position coordinates of the ammeter scanners 29X and 29Y.

The laser processing unit 41 calculates the command position coordinates (Xgr(n), Ygr(n)) of the galvanometer scanners 29X and 29Y input from the machining command unit 35, and the laser machining correction value from the substrate measuring device 1. The laser processing correction value (ΔXh, ΔYh) input from the unit 15 is used to obtain the corrected command position coordinates (Xgr2(n) of the galvanomirror scanners 29X and 29Y using the following equation (11). Ygr2(n)). In addition, in the equation (11), the laser processing correction value ΔXh and ΔYh are multiplied by the correction coefficients khx1 and khy1 to adjust the correction amount. In general, the correction coefficients khx1 and khy1 are set in the range of 0 to 1, but when set to this range, stable correction in which the machining error does not increase can be performed.

(n=1, 2, 3, 4, ..., N: N is the number of holes processed)

The corrected command position coordinates (Xgr2(n), Ygr2(n)) of the galvanometer scanners 29X, 29Y reflect the correction of the machining error of the substrate 5 processed by the laser processing apparatus 21 in the past. Further, the command position coordinates of the ammeter scanners 29X and 29Y are corrected so as to improve the machining error caused by the temporal change of the temperature of the laser processing apparatus 21 or the like.

The deflector alignment correcting unit 42 uses the second conversion coefficient to correct the corrected command position coordinates (Xgr2(n), Ygr2(n)) of the galvanometer scanners 29X and 29Y belonging to the output of the laser machining correction unit 41. The coordinate conversion is performed, and the output causes the alignment error of the substrate 31 and the error caused by the deformation of the substrate 31 to be aligned with the command position coordinates of the corrected ammeter scanners 29X and 29Y. The command position coordinates of the galvanometer scanners 29X and 29Y before the alignment correction are set to (Xgr2(n), Ygr2(n)), and the command position coordinates of the alignment galvanometer scanners 29X and 29 are set to (Xgrs(n), Ygrs(n)) is a relationship shown by the following formula (12).

(n=1, 2, 3, 4, ..., N: N is the number of holes processed)

The laser deflector control unit 43 performs an error on the optical system generated by the F θ lens 30 or the like in the command position coordinates (Xgrs(n), Ygrs(n)) input from the deflector alignment correction unit 42. The nonlinear correction is then converted into the rotation angle of the galvanometer scanners 29X, 29Y, and the galvanometer scanners 29X, 29Y are positioned and controlled in such a manner that the laser light 26 can be irradiated to the position of the target of the substrate 31.

Fig. 5 is a flow chart showing the operation of the laser processing system 20 of the second embodiment. In addition, steps S1 to S7 which are the same as the processing in FIG. 3 are denoted by the same step numbers, and description thereof will be omitted.

First, the laser processing system 20 mounts the substrate 31 on the top table 33a of the processing table 33 by using a substrate transfer device (not shown) (step S10).

Next, the laser processing control unit 24 controls the processing table 33 and the processing camera 34 to cause the processing camera 34 to capture the alignment mark 7 of the substrate 31. The processing camera control unit 38 collects image data captured by the processing camera 34. The second image processing section 50 performs image processing on the collected image data, and measures the measurement position coordinates of the alignment mark 7 of the substrate 31 using the position coordinates of the processing table 33 (Xam2(k), Yam2(k) )). The alignment correction calculation unit 39 is based on the measurement position coordinates (Xam2(k), Yam2(k)) of the alignment mark 7 and the design position coordinates (Xar(k), Yar(k)) of the alignment mark 7, and the number of uses. Calculating the second conversion coefficient of the substrate 31 by the formula (9) (Step S11).

Next, the machining command unit 35 determines whether or not all the drilling processes of the substrate 31 have been completed (step S12). When the drilling process has not been completed (step S12: NO), the process proceeds to step S13, and when all the hole drilling processes are completed (step S12: YES), the process proceeds to step S20.

When the drilling process has not been completed (step S12: NO), the command position coordinates (Xtr(n)) of the processing table 33 from the machining command portion 35 for moving to the next scanning region of the galvanometer scanners 29X, 29Y. Ytr(n)), multiplied by the second conversion coefficient for alignment correction obtained in step S11, and the alignment correction unit 40 performs alignment correction (step S13).

The alignment corrected position coordinates (Xtr2(n), Ytr2(n)) are input to the processing table control unit 37, and the processing table control unit 37 is based on the alignment corrected command position coordinates (Xtr2(n), Ytr2). (n)) The processing table 33 is positioned (step S14).

The laser machining correction value (ΔXh, ΔYh) obtained by the laser machining correction value calculating unit 15 corrects the command position coordinates (Xgr(n) from the galvanometer scanners 29X and 29Y of the machining command unit 35. , Ygr(n)) (step S15). Further, the initial values of the laser machining correction values (ΔXh, ΔYh) are respectively 0.

Multiplying the command position coordinates (Xgr2(n), Ygr2(n)) of the galvanometer scanners 29X, 29Y corrected by the laser machining correction values (ΔXh, ΔYh) by the second conversion coefficient, and by the deflector The alignment correction unit 42 performs alignment correction (step S16).

The index of the galvanometer scanner 29X, 29Y corrected by alignment The position coordinates (Xgrs(n), Ygrs(n)) are input to the laser deflector control unit 43, and the galvanometer scanners 29X and 29Y are positioned by the laser deflector control unit 43 (step S17).

The laser oscillation command from the machining command unit 35 is input to the laser oscillator control unit 36, and the laser oscillator control unit 36 outputs the pulsed laser light 26 from the laser oscillator 25 (step S18).

Next, the machining command unit 35 determines whether or not all the drilling processes in the scanning area of the galvanomirrors 29X and 29Y are completed (step S19). When the drilling process in the scanning area has not been completed (step S19: No), the process proceeds to step S15, and when all the hole drilling processes in the scanning area are completed (step S19: Yes), the process proceeds to Step S12.

In step S12, when all the drilling processes are completed (step S12: YES), the substrate 31 whose laser processing is completed is moved by the conveying device 17 to the measuring table 4 of the substrate measuring device 1 (step S20).

Steps S1 to S7 subsequent to step S20 are the contents described in the first embodiment. After the measurement of the substrate 5 by the substrate measuring device 1 is completed, that is, after the step S7, the substrate 5 is moved from the measuring table 4 to the external substrate storage device using a substrate unloading device (not shown), and the substrate is measured from the substrate. The device 1 is carried out (step S21).

Thereafter, the system command unit 22 determines whether or not there is an unprocessed substrate (step S22). When there is an unprocessed substrate (step S22: YES), the process proceeds to step S10, and when there is no unprocessed substrate (step S22: NO), the process ends.

As described above, the laser processing system 20 of the second embodiment performs laser drilling on the substrate 31 by the laser processing apparatus 21, After the laser drilling process, the substrate measuring device 1 measures the machining error of the machining hole 6 formed in the substrate 5, and corrects the command position coordinates of the ammeter scanners 29X and 29Y so as to reduce the machining error. Thereby, even when the plurality of substrates are continuously processed, the laser processing system 20 can suppress the processing error caused by the temperature change of the laser processing apparatus 21 and the like, and the machining error does not increase. . That is, the laser processing system 20 of the second embodiment can realize stable laser processing with high accuracy for a long period of time even in continuous processing.

In addition, in the above description, the case where the measurement control unit 3, the system command unit 22, and the laser processing control unit 24 are individual computer systems will be described, but these may be configured by the same computer system. Thereby, the data communication between the measurement control unit 3, the system command unit 22, and the processing unit of the laser processing control unit 24 becomes smooth.

In the above description, the case where the laser processing apparatus 21 includes one processing head 32 will be described. However, even if it has a configuration of a plurality of processing heads, the same effect as described above can be obtained. Furthermore, the substrate measuring device 1 may include a plurality of measuring cameras 8 .

Further, the laser processing correction unit 41 uses the laser machining correction values (ΔXh, ΔYh) and the equations for the command position coordinates (Xgr(n), Ygr(n)) of the galvanomirrors 29X and 29Y. (11) Perform correction calculation. The machining error (ΔXe(n), ΔYe(n)) of each of the machining holes 6 obtained by the equation (3) is used as the laser machining correction value obtained by the laser machining correction value calculation unit 15. When the formula (11) is replaced by the following formula (13) and corrected for each of the processing holes 6, the effect of further suppressing the machining error can be obtained. In addition, the formula (13) In addition, the correction amounts are multiplied by the correction coefficients khx2 and khy2 for the machining errors ΔXe(n) and ΔYe(n), respectively. In general, the correction coefficients khx2 and khy2 are set in the range of 0 to 1, but when set to this range, stable correction in which the machining error does not increase can be performed.

(n=1, 2, 3, 4, ..., N: N is the number of holes processed)

Further, for the laser processing correction value in the equation (11) or the equation (13) used in the laser machining correction unit 41, the laser processing can be performed by filtering the filter having the low-pass characteristic to adjust the laser processing. Correction value.

Embodiment 3

Fig. 6 is a view showing the configuration of a laser processing system 44 according to a third embodiment of the present invention. The laser processing system 44 includes a laser processing device 51, a substrate measuring device 1, a system command unit 22, and a transport device 17. The laser processing apparatus 51 performs laser drilling processing on a substrate that has not been subjected to laser drilling. The substrate measuring apparatus 1 is a method described in the first embodiment, and measures a machining error of a substrate subjected to laser drilling by the laser processing apparatus 51. The system command unit 22 controls the laser processing device 51 and the substrate measuring device 1. The laser processing system 51 includes a laser processing unit 23 and a laser processing control unit 54 that controls the laser processing unit 23.

In the sixth embodiment, the same components as those of the laser processing system 20 of the second embodiment shown in Fig. 4 are denoted by the same reference numerals and the description thereof is omitted. Description. The laser processing control unit 54 of the laser processing system 44 is provided with a deflector alignment correcting unit 45 instead of the deflector alignment correcting unit 42 of the laser processing control unit 24 of the laser processing system 20, and is provided with laser processing correction. Instead of the laser alignment correction unit 41, the portion 46 is provided with a stage alignment correction unit 47 instead of the stage alignment correction unit 40. The other configuration of the laser processing system 44 is the same as that of the laser processing system 20.

In the laser processing system 20 of the second embodiment, the laser machining correction value obtained by the laser machining correction value calculation unit 15 is used, and the laser machining correction unit 41 corrects the galvanometer scanner 29X output from the machining command unit 35. The command position coordinates of 29Y are input to the deflector alignment correction unit 42. On the other hand, the laser processing system 44 of the third embodiment differs from the laser processing system 20 in that the laser processing correction unit 46 is configured to determine the laser machining correction value based on the laser machining correction value calculation unit 15. The command position coordinates for positioning the machining table 33 output from the machining command unit 35 are corrected and input to the stage alignment correction unit 47.

The deflector alignment correcting unit 45 coordinates the command position coordinates (Xgr(n), Ygr(n)) of the galvanometer scanners 29X and 29Y belonging to the output of the machining command unit 35 using the second conversion coefficient, and outputs the same. The error caused by the alignment error of the substrate 31 and the deformation of the substrate 31 is aligned with the corrected command position coordinates (Xgrs(n), Ygrs(n)).

Alignment of the command position coordinates (Xgr(n), Ygr(n)) before alignment correction of the galvanometer scanners 29X, 29Y with the alignment of the galvanometer scanners 29X, 29Y (Xgrs(n), Ygrs(n)) is a relationship of the following formula (14).

(n=1, 2, 3, 4, ..., N: N is the number of holes processed)

The laser processing correction unit 46 corrects the laser machining correction value (ΔXh, ΔYh) obtained by the laser machining correction value calculation unit 15 of the substrate measuring device 1 to correct the output of the machining command unit 35 for positioning. The command position coordinates of the processing table 33 (Xtr(n), Ytr(n)). The laser processing correction unit 46 is based on the command position coordinates (Xtr(n), Ytr(n)) of the processing table 33 input from the machining command unit 35 and the laser machining correction value input from the laser machining correction value calculation unit 15. (ΔXh, ΔYh), the corrected command position coordinates (Xtr2(n), Ytr2(n)) of the processing table 33 are obtained using the following equation (15). Further, in the equation (15), the correction amounts are adjusted by multiplying the laser machining correction values ΔXh and ΔYh by the correction coefficients khx3 and khy3. In general, the correction coefficients khx3 and khy3 are set in the range of 0 to 1, but when set to this range, stable correction in which the machining error does not increase can be performed.

(n=1, 2, 3, 4, ..., N: N is the number of holes processed)

The stage alignment correcting unit 47 converts the corrected command position coordinates (Xtr2(n), Ytr2(n)) of the processing table 33 output from the laser machining correction unit 46 using the second conversion coefficient, and outputs the substrate. 31 alignment error The error caused by the difference and the deformation of the substrate 31 is aligned with the corrected command position coordinate (Xtrs(n), Ytrs(n)). The coordinate position coordinates (Xtr2(n), Ytr2(n)) before alignment correction and the position command coordinates (Xtrs(n), Ytrs(n)) after alignment correction are the following equations (16). The relationship shown.

(n=1, 2, 3, 4, ..., N: N is the number of holes processed)

Fig. 7 is a flow chart showing the operation of the laser processing system 44 of the third embodiment. The same steps as those in the fifth embodiment are denoted by the same step numbers, and the description thereof will be omitted. The following description differs from the flowchart of Fig. 5.

In step S12, when the drilling process is not completed (step S12: NO), the laser machining correction unit 46 determines the laser machining correction value (ΔXh, ΔYh) obtained by the laser machining correction value calculation unit 15, The command position coordinates (Xtr(n), Ytr(n)) of the processing table 33 for moving the galvanometer scanners 29X and 29Y to the next scanning region are input from the machining command unit 35. Further, the initial values of the laser machining correction values (ΔXh, ΔYh) are respectively 0.

For the command position coordinates (Xtr2(n), Ytr2(n)) of the processing table 33 corrected by the laser machining correction value (ΔXh, ΔYh), the stage alignment correcting unit 47 multiplies it by the alignment. The second conversion coefficient of the correction coefficient is aligned and corrected (step S24), and the station command position coordinates (Xtrs(n), Ytrs(n)) are obtained. The processing table control unit 37 is based on the alignment position corrected by the alignment The coordinates (Xtrs(n), Ytrs(n)) are used to position the processing table 33 (step S14).

The deflector alignment correcting unit 45 multiplies the command position coordinates (Xgr(n), Ygr(n)) from the galvanometer scanners 29X and 29Y of the machining command unit 35 by the second conversion coefficient in the equation (14). The alignment correction is performed in the manner shown (step S25). After step S25, the process proceeds to step S17. In addition, in step S19, when the drilling process in the scanning area has not been completed (step S19: No), the process proceeds to step S25.

As described above, the laser processing system 44 according to the third embodiment can obtain the same effects as the laser processing system 20 of the second embodiment in a configuration and method different from those of the laser processing system 20.

In the second embodiment and the third embodiment, the measurement control unit 3 of the substrate measuring device 1 includes the laser processing correction value calculating unit 15, but the laser processing of the laser processing devices 21 and 51 may be employed. The control units 24 and 54 include a laser machining correction value calculation unit 15. In this case, the machining error output from the machining error calculation unit 14 of the measurement control unit 3 is input to the laser machining control units 24 and 54, and the laser machining correction values are provided in the laser machining control units 24 and 54. The components of the function of the calculation unit 15 can obtain the same effects as described above.

Further, the laser processing control units 24 and 54 of the laser processing apparatuses 21 and 51 may be provided with the laser processing correction unit 41 of the second embodiment and the laser processing correction unit 46 of the third embodiment.

Embodiment 4

The configuration of the laser processing system 20 of the fourth embodiment and the second embodiment The same is true, as shown in Figure 4. The difference from the second embodiment is the calculation method of the corrected command position coordinates (Xgr2(n), Ygr2(n)) of the galvanometer scanners 29X and 29Y in the laser machining correction unit 41. Hereinafter, differences from the second embodiment will be described.

The laser processing correction unit 41 according to the second embodiment is based on the command position coordinates (Xgr(n), Ygr(n)) of the galvanomirrors 29X and 29Y input from the machining command unit 35, and is input from the substrate measuring device 1. The laser processing correction value (ΔXh, ΔYh) or (ΔXe(n), ΔYe(n)) is obtained by using the equation (11) or the equation (13) to obtain the galvanometer scanners 29X and 29Y. Corrected command position coordinates (Xgr2(n), Ygr2(n)). On the other hand, the laser processing correction unit 41 of the fourth embodiment further uses the integral value of the laser processing correction value obtained each time the substrate measuring device 1 measures the substrate 5.

In the laser processing system 20 of the second embodiment, the laser processing performed by the laser processing apparatus 20 using the laser processing correction value and the substrate measuring apparatus 1 for obtaining the laser processing correction value are repeatedly performed. Measurement. However, even if this repetitive action is performed, there is a case where the laser machining correction value does not converge to a constant deviation of zero. In this case, if the integral value of the laser machining correction value is used, the effect of reducing the constant deviation is obtained.

The laser processing correction value (ΔXh, ΔYh) obtained by measuring the i-th substrate by the substrate measuring device 1 is (ΔXh(i), ΔYh(i)), and the laser processing correction value is obtained. The integral value is defined as (XhI(i), YhI(i)). The laser processing correction unit 41 of the second embodiment obtains the corrected command position coordinates (Xgr2(n), Ygr2(n)) using the equation (11), whereas the laser processing correction unit of the fourth embodiment The 41 series uses the following formula (14) to find the corrected finger. Let the position coordinates (Xgr2(n), Ygr2(n)).

(i=1, 2, 3, ...: i is a variable of the measurement order of the display substrate)

In the equation (17), khx4, khy4, khx5, and khy5 are correction coefficients, and (Xgr(n), Ygr(n)) are command position coordinates of the galvanomirrers 29X and 29Y input from the machining command unit 35.

Further, the integral value (XhI(i), YhI(i)) of the laser processing correction value is obtained by the following equation (18), and is updated every time the substrate 31 of the laser processing apparatus 21 is exchanged.

(i=1, 2, 3, ...: i is a variable of the measurement order of the display substrate)

The initial values XhI(1) and YhI(1) of the integral values XhI(i) and XhI(i) of the laser machining correction values are set to 0, respectively.

Further, the laser machining correction value (ΔXe(n), ΔYe(n)) of each of the machining holes 6 obtained by measuring the i-th substrate by the substrate measuring device 1 is (ΔXe(n)(i) ΔYe(n)(i)), the integral value of the laser processing correction value of each machining hole 6 is defined as (XeI(n)(i), YeI(n)(i)). The laser processing correction unit 41 of the second embodiment obtains the corrected command position coordinates (Xgr2(n), Ygr2(n)) using the equation (13), whereas the laser processing correction unit of the fourth embodiment The 41 series uses the following formula (19) to find the corrected command position coordinates. (Xgr2(n), Ygr2(n)).

(n=1, 2, 3, 4, ..., N: N is the number of holes processed)

(i=1, 2, 3, ...: i is a variable of the measurement order of the display substrate)

In the formula (19), khx6, khy6, khx7, and khy7 are correction coefficients, and the laser processing correction value (ΔXe(n)(i), ΔYe(n)(i)) refers to the ith measurement substrate. The laser processing correction value of the nth hole of 5. Furthermore, the integral value (XeI(n)(i), YeI(n)(i))) of the laser processing correction value in the equation (19) is obtained by the following equation (20), and is exchanged each time. The substrate 31 of the laser processing apparatus 21 is updated.

(n=1, 2, 3, 4, ..., N: N is the number of holes processed)

(i=1, 2, 3, ...: i is a variable of the measurement order of the display substrate)

Further, the integral values XeI(n)(i) of the laser processing correction values, the initial values XeI(n)(1) and YeI(n)(1) of the YeI(n)(i) are set to 0, respectively.

As described above, the laser machining correction unit 41 of the fourth embodiment is based on the equations (17) and (19), and uses the integral value (XhI(i), YhI(i)) of the laser machining correction value or (XeI(n)(i), YeI(n)(i)), the corrected command position coordinates (Xgr2(n), Ygr2(n)) of the galvanometer scanners 29X, 29Y are calculated. Thereby, the laser processing system 20 of the fourth embodiment can be made constant The predetermined deviation is smaller than that of the laser processing system 20 of the second embodiment, and processing with high precision with little machining error can be performed for a long time.

Further, the laser processing system 44 of another configuration of the laser processing system according to the fourth embodiment is substantially the same as that of the third embodiment, as shown in Fig. 6. The difference from the third embodiment is the calculation method of the corrected command position coordinates (Xtr2(n), Ytr2(n)) of the processing table 33 in the laser machining correction unit 46. Hereinafter, differences from the third embodiment will be described.

As described above, the laser processing correction value (ΔXh, ΔYh) obtained by measuring the i-th substrate by the substrate measuring device 1 is set to (ΔXh(i), ΔYh(i)), and the laser processing is performed. The integral value of the correction value is defined as (XhI(i), YhI(i)). The laser processing correction unit 46 of the third embodiment obtains the corrected command position coordinates (Xtr2(n), Ytr2(n)) using the equation (15). On the other hand, the laser processing correction unit 46 of the fourth embodiment The corrected command position coordinates (Xtr2(n), Ytr2(n)) are obtained using the following equation (21).

(i=1, 2, 3, ...: i is a variable of the measurement order of the display substrate)

In the equation (21), khx8, khy8, khx9, and khy9 are correction coefficients, and (Xtr(n), Ytr(n)) is a command position coordinate of the processing table 33 input from the machining command unit 35.

As described above, the laser machining correction unit 46 calculates the corrected command position of the machining table 33 by using the integral value (XhI(i), YhI(i)) of the laser machining correction value in the equation (21). Coordinates (Xtr2(n), Ytr2(n)). With this, The laser processing system 44 of the fourth embodiment can make the constant deviation smaller than the laser processing system 44 of the third embodiment, and can perform processing with high precision with little processing error for a long time.

Embodiment 5

Fig. 8 is a view showing the configuration of a laser processing system of the fifth embodiment. With respect to the laser processing system 20 of the second embodiment shown in FIG. 4, the laser processing correction unit 62 is newly added to the laser processing system 63 of the fifth embodiment, and the system command unit 22 is changed to the system command unit. 60. The laser processing correction unit 41 is changed to the laser processing correction unit 61, the laser processing device 21 is changed to the laser processing device 64, and the laser processing control unit 24 is changed to the laser processing control unit 65. The system command unit 60 operates differently from the system command unit 22, and the laser machining correction unit 61 operates differently from the laser machining correction unit 41. The functions of the elements of the same reference numerals in Fig. 8 and Fig. 4 are the same as those described in the second embodiment.

The laser machining correction unit 41 of the second embodiment calculates the corrected command position coordinates (Xgr2(n), Ygr2(n)) of the galvanomirror scanners 29X and 29Y using the equation (11) or the equation (13). . On the other hand, the laser processing correction unit 61 of the fifth embodiment differs in that the laser processing device 64 uses the substrate 5 belonging to the first substrate measured by the substrate measuring device 1 as the substrate 31 belonging to the second substrate, and further The correction value of the command position coordinates of the galvanometer scanners 29X, 29Y used in the past laser processing is used.

In the laser processing system 20 of the second embodiment, even if the laser processing apparatus 21 using the laser processing correction value is repeatedly executed, the lightning is performed. The measurement by the substrate measurement apparatus 1 for determining the laser processing correction value may also cause a situation where the laser processing correction value does not converge to a constant deviation of zero. At this time, similarly to the case where the integral value of the laser machining correction value is used in the fourth embodiment, the laser machining correction unit 61 causes the laser processing device 64 to use the substrate 5 measured by the substrate measuring device 1 as the substrate 31. On the other hand, the correction value of the command position coordinates of the galvanometer scanners 29X and 29Y used in the past laser processing is used to reduce the constant deviation.

The operation in the case where the laser machining correction value (ΔXh, ΔYh) is input from the substrate measuring device 1 to the laser machining correction unit 61 will be described.

The system command unit 60 outputs the board number p of the substrate 5 measured by the substrate measuring device 1 in addition to the operation of the system command unit 22 of the second embodiment. The substrate number p is the only number specifying the substrate 5 and the substrate 31, and is determined by the system command unit 60 when the substrate 31 is processed by the laser processing apparatus 64. The substrate number p is determined, for example, in the order of the processing time, and p=1, 2, 3, ..., P, and P are the number of processed sheets of the substrate 31.

In the laser processing correction unit 61, similarly to the laser processing correction unit 41 of the second embodiment, the command position coordinates (Xgr(n), Ygr(n)) of the ammeter scanners 29X and 29Y are input from the machining command unit 35. And the laser processing correction value (ΔXh, ΔYh) obtained by measuring the substrate 5 by the substrate measuring device 1 is input.

Further, the laser processing correction unit 61 inputs the substrate number p from the system command unit 60 during the processing of the substrate 31 of the substrate number (p+d). Here, d is the offset value due to the time difference between processing and measurement. The laser processing correction unit 61 that has received the substrate number p acquires the command position coordinates of the galvanometer scanners 29X and 29Y used for processing the substrate 31 of the substrate number p stored in advance from the laser processing correction value storage unit 62. The corrected values (ΔXgr2(p), ΔYgr2(p)) are used to calculate the corrected command position coordinates (Xgr2(n), Ygr2(n)) of the galvanometer scanners 29X and 29Y.

Here, the laser processing correction value (ΔXh, ΔYh) obtained by measuring the substrate 5 of the substrate number p by the substrate measuring device 1 is set to (ΔXh(p), ΔYh(p)), and the relative The correction value of the command position coordinate of the substrate 31 on the substrate number p is defined as (ΔXgr2(p), ΔYgr2(p)).

The laser processing correction unit 41 of the second embodiment obtains the corrected command position coordinates (Xgr2(n), Ygr2(n)) of the galvanomirror scanners 29X and 29Y based on the equation (11). The laser machining correction unit 61 of the form 5 obtains the corrected command position coordinate value (Xgr2(n), Ygr2(n)) based on the following equation (22).

(n=1, 2, 3, ..., N: N is the number of holes processed)

(p=1, 2, 3, ..., P: P is the number of processed sheets of the substrate)

In the equation (22), khx10, khy10, khx11, and khy11 are correction coefficients. Further, the correction value (ΔXgr2(p), ΔYgr2(p)) of the command position coordinates of the substrate 31 of the substrate number p used in the equation (22) can be obtained by the following equation (23).

Further, the d of the formula (23) is as described above, and is an offset value due to a time difference between processing and measurement. When the laser processing apparatus 64 performs processing and measurement in parallel with the substrate measuring apparatus 1, d=1, and when processing and measurement are simultaneously performed, d=2, the measurement time of the substrate measuring apparatus 1 is more than the processing time of the laser processing apparatus 64. For a long time, d becomes a larger positive integer value. Further, the initial values of ΔXgr2(p-d) and ΔYgr2(p-d), that is, ΔXgr2(p-d) and ΔYgr2(p-d) when the (p-d) is 1 or less, are set to 0, respectively.

The laser machining correction value storage unit 62 sequentially stores the substrate number p obtained from the laser machining correction unit 61 and the correction value of the command position coordinate obtained by the equation (23) in the form of a data table (ΔXgr2 ( p), ΔYgr2(p)). Further, as described above, the initial values of ΔXgr2(p) and ΔYgr2(p) are respectively stored as 0.

Further, when the laser processing correction value storage unit 62 receives the substrate number p from the laser processing correction unit 61, the laser machining correction value storage unit 62 obtains the correction value (ΔXgr2(p) of the command position coordinate corresponding to the substrate number p from the data table. Δgr2(p)) is output to the laser machining correction unit 61.

As described above, the laser machining correction unit 61 calculates the corrected command position coordinates (Xgr2(n), Ygr2(n) of the ammeter scanners 29X and 29Y using the equations (22) and (23). ). As a result, the laser processing system 63 of the fifth embodiment has a constant variation smaller than that of the laser processing system 20 of the second embodiment, and can perform high-precision addition with a small processing error for a long period of time. work.

Next, the case where the laser machining correction value input from the substrate measuring device 1 to the laser machining correction unit 61 is the machining error (ΔXe(n), ΔYe(n)) of each machining hole 6 will be described.

The laser processing correction value (ΔXe(n), ΔYe(n)) obtained by the substrate measuring device 1 measuring the substrate 5 of the substrate number p is (ΔXe(n)(p), ΔYe(n) (p)), and the correction value of the command position coordinate of the substrate 31 of the substrate number p is defined as (ΔXgr2(n)(p), ΔYgr2(n)(p)).

The laser processing correction unit 41 of the second embodiment obtains the corrected command position coordinates (Xgr2(n), Ygr2(n)) of the galvanomirror scanners 29X and 29Y based on the equation (13). The laser processing correction unit 61 of the fifth embodiment obtains the corrected command position coordinates (Xgr2(n), Ygr2(n)) based on the following equation (24).

(n=1, 2, 3, ..., N: N is the number of holes processed)

(p=1, 2, 3, ..., P: P is the number of processed sheets of the substrate)

In the equation (24), khx12, khy12, khx13, and khy13 are correction coefficients. Further, the correction value of the command position coordinates (ΔXgr2(n)(p), ΔYgr2(n)(p)) refers to the galvanometer scanner 29X of the machined hole number n when the substrate of the substrate number p is processed. The correction value of the command position coordinate of 29Y is obtained by the following equation (25).

Further, the d of the equation (25) is the same as the equation (23), and is an offset value due to the time difference between the processing and the measurement. Furthermore, the initial values of ΔXgr2(n)(pd) and ΔYgr2(n)(pd), that is, ΔXgr2(n)(pd) and ΔYgr2(n) when (pd) is 1 or less ( Pd) is set to 0 respectively.

In this case, the laser processing correction value storage unit 62 sequentially stores the board number p obtained from the laser processing correction unit 61 and the command position coordinates obtained from the equation (25) in the form of a data table. Correction value (ΔXgr2(n)(p), ΔYgr2(n)(p)). Further, as described above, the initial values of ΔXgr2(n)(p) and ΔYgr2(n)(p) are respectively stored as 0.

As described above, the laser machining correction unit 61 calculates the corrected command position coordinates (Xgr2(n), Ygr2(n)) of the galvanomirror scanners 29X and 29Y using the equations (24) and (25). . As a result, the laser processing system 63 of the fifth embodiment can make the constant deviation smaller than that of the laser processing system 20 of the second embodiment, and can perform processing with high precision with less processing error for a long time.

Fig. 9 is a view showing another configuration of the laser processing system of the fifth embodiment. With respect to the laser processing system 44 of the third embodiment shown in Fig. 6, in the laser processing system 73 of the fifth embodiment, the laser machining correction value storage unit 72 is newly added, and the system command unit 22 is changed to the system command unit. 70. The laser processing correction unit 46 is changed to the laser processing correction unit 71, the laser processing device 51 is changed to the laser processing device 74, and the laser processing control unit 54 is changed to the laser processing control unit 75. System command unit 70 system and system The command unit 22 operates differently, and the laser machining correction unit 71 operates differently from the laser machining correction unit 46. The functions of the elements of the same reference numerals in Fig. 9 and Fig. 6 are the same as those described in the third embodiment.

The laser machining correction unit 46 of the third embodiment calculates the corrected command position coordinates (Xtr2(n), Ytr2(n)) of the machining table 33 using the equation (15). On the other hand, the laser processing correction unit 7 of the fifth embodiment differs in that the laser processing device 74 uses the substrate 5 belonging to the first substrate measured by the substrate measuring device 1 as the substrate 31 belonging to the second substrate, and further The correction value of the command position coordinates of the processing table 33 used in the past laser processing is used.

In the laser processing system 44 of the third embodiment, the laser processing by the laser processing apparatus 51 using the laser processing correction value and the substrate measuring apparatus 1 for obtaining the laser processing correction value are repeatedly performed. The measurement also has a situation in which the laser machining correction value does not converge to a constant deviation of zero. In the same manner as the laser processing correction unit 61, the laser processing correction unit 71 of the fifth embodiment causes the laser processing device 74 to use the substrate 5 measured by the substrate measuring device 1 as the substrate 31, and uses it in the past. The correction value of the command position coordinates of the processing table 33 used in the laser processing is used to reduce the constant deviation.

The operation in the case where the laser machining correction value (ΔXh, ΔYh) is input from the substrate measuring device 1 to the laser machining correction unit 71 will be described.

The system command unit 70 outputs the substrate 5 measured by the substrate measuring device 1 in addition to the operation of the system command unit 22 of the third embodiment. Substrate number p. The substrate number p uniquely specifies the numbers of the substrate 5 and the substrate 31, and is determined by the system command unit 70 when the substrate 31 is processed by the laser processing apparatus 74. The substrate number p is determined, for example, in the order of the processing time, and p=1, 2, 3, ..., P, and P are the number of processed sheets of the substrate 31.

In the laser processing correction unit 71, the command position coordinates (Xtr(n), Ytr(n)) of the processing table 33 are input from the machining command unit 35 in the same manner as the laser machining correction unit 46 of the third embodiment, and are input thereto. The substrate measuring device 1 measures the laser processing correction value (ΔXh, ΔYh) obtained by the substrate 5.

Further, the laser processing correction unit 71 inputs the substrate number p from the system command unit 70 during the processing of the substrate 31 of the substrate number (p+d). Here, d is the offset value due to the time difference between processing and measurement. The laser processing correction unit 71 that has received the substrate number p acquires the correction value of the command position coordinate of the processing table 33 used for processing the substrate 31 of the substrate number p stored in advance from the laser machining correction value storage unit 72 (Δ) Xtr2(p), ΔYtr2(p)), and the corrected command position coordinates (Xtr2(n), Ytr2(n)) of the processing table 33 are calculated.

Here, the laser processing correction value (ΔXh, ΔYh) obtained by measuring the substrate 5 of the substrate number p by the substrate measuring device 1 is set to (ΔXh(p), ΔYh(p)), and the relative The correction value of the command position coordinate of the processing table 33 of the substrate 31 of the substrate number p is defined as (ΔXtr2(p), ΔYtr2(p)).

The laser processing correction unit 46 of the third embodiment obtains the corrected command position coordinates (Xtr2(n), Ytr2(n)) of the processing table 33 based on the equation (15). The shot processing correction unit 71 is The corrected command position coordinate value (Xtr2(n), Ytr2(n)) is obtained according to the following equation (26).

(n=1, 2, 3, ..., N: N is the number of holes processed)

(p=1, 2, 3, ..., P: P is the number of processed sheets of the substrate)

In the equation (26), khx14, khy14, khx15, and khy15 are correction coefficients. Further, the correction value (ΔXtr2(p), ΔYtr2(p)) of the command position coordinates of the substrate 31 for the substrate number p used in the equation (26) is obtained by the following equation (27).

Further, the d of the equation (27) is the offset value due to the time difference between the processing and the measurement, similarly to the equation (23). In addition, ΔXtr2(p-d) and ΔYtr2(p-d) when the initial values of ΔXtr2(p-d) and ΔYtr2(p-d), that is, (p-d) are 1 or less, are set to 0, respectively.

The laser machining correction value storage unit 72 sequentially stores the substrate number p obtained from the laser machining correction unit 71 and the correction value of the command position coordinate obtained by the equation (27) in the form of a data table (ΔXtr2 ( p), ΔYtr2(p)). Further, as described above, the initial values of ΔXtr2(p) and ΔYtr2(p) are respectively stored as 0.

Further, the laser processing correction value storage unit 72 is attached to the laser When the processing correction unit 71 inputs the substrate number p, the correction value (ΔXtr2(p), Δtr2(p)) of the command position coordinates corresponding to the substrate number p is obtained from the data table, and is output to the laser processing correction unit. 71.

As described above, the laser machining correction unit 71 calculates the corrected command position coordinates (Xtr2(n), Ytr2(n)) of the machining table 33 using the equations (26) and (27). As a result, the laser processing system 73 of the fifth embodiment can make the constant deviation smaller than the laser processing system 44 of the third embodiment, and can perform processing with high precision with less processing error for a long time.

Further, the laser machining correction unit 61 of the fifth embodiment uses the equation (22) or the equation in order to obtain the corrected command position coordinates (Xgr2(n), Ygr2(n)) of the galvanomirrors 29X and 29Y. (24), except that the integral value (XhI(i), YhI(i)) or (XhI() of the laser machining correction value used in the equation (17) or the equation (19) used in the fourth embodiment is added. n) (i), YhI(n)(i)), can also get the same effect.

Further, the laser processing correction unit 71 of the fifth embodiment uses the equation (26) in order to obtain the corrected command position coordinates (Xtr2(n), Ytr2(n)) of the processing table 33, but even if it is added The integral value (XhI(i), YhI(i)) of the laser processing correction value of the equation (21) used in the fourth embodiment can also obtain the same effect.

In addition, the laser deflectors of Embodiments 1 to 5 are described by the galvanometer scanner, but the above description can also be obtained by using a laser deflector such as a polygon mirror, an acoustic optical deflector or an electro-optical deflector. The same effect.

Figure 10 is a diagram showing the computer system of Embodiments 1 to 5 A diagram of the hardware composition. As described above, the measurement control unit 3, the system command units 22, 60, and 70 and the laser processing control units 24, 54, 65, and 75 of the first to fifth embodiments can be realized by the computer system shown in FIG. 10, respectively. . At this time, each of the functions of the measurement control unit 3, the system command units 22, 60, 70, and the laser processing control units 24, 54, 65, 75, or the functions integrated into one can be performed by the CPU 101. And the memory 102 is realized. The functions of the measurement control unit 3, the system command units 22, 60, 70, and the laser processing control units 24, 54, 65, 75 can be realized by a combination of a soft body, a firmware, or a combination of a soft body and a firmware. The software or tough system is described in the form of a program and stored in the memory 102. The CPU 101 realizes the functions of the respective units by reading and executing the program stored in the memory 102. That is, the memory 102 having a memory program for performing the functions of the measurement control unit 3, the system command units 22, 60, 70, and the laser processing control units 24, 54, 65, 75 is provided. As a result, the operation of the measurement control unit 3, the system command units 22, 60, and 70 and the laser processing control units 24, 54, 65, and 75 is performed. Further, the programs may be programs or methods for causing the computer to execute the measurement control unit 3, the system command units 22, 60, 70, and the laser processing control units 24, 54, 65, 75. Here, the memory 102 corresponds to, for example, a RAM (Randon Access Memory), a ROM (Read Only Memory), a flash memory, or an EPROM (Erasable Programmable Read Only Memory). Non-volatile or volatile semiconductor memory, disk, floppy disk, CD-ROM, EEPROM (Electrically Erasable Programmable Read Only Memory), EEPROM (Electrically Erasable Programmable Read Only Memory) CD (Compact disk), DVD (Digital Versatile Disk). Further, the processing failure determining unit 16 also includes a display device such as a display or a printer.

Fig. 11 is a view showing a configuration in which the measurement control unit 3, the system command units 22, 60, 70, and the laser processing control units 24, 54, 65, and 75 of the first to fifth embodiments are realized by dedicated hardware. . Each of the measurement control unit 3, the system command units 22, 60, and 70 and the laser processing control units 24, 54, 65, and 75 shown in Fig. 11 is constituted by a processing circuit 103 belonging to a dedicated hardware. The processing circuit 103 is equivalent to a single circuit, a composite circuit, a programmed processor, a parallel programmed processor, an ASIC (Application Specific Integrated Circuit), and an FPGA (Field Programmable Gate Array). Programmable gate arrays) or combine them. The functions of each of the measurement control unit 3, the system command units 22, 60, 70, and the laser processing control units 24, 54, 65, 75 may be implemented by a plurality of processing circuits 103, or may be combined by a processing circuit 103. Achieve the functions of each department. Further, the measurement control unit 3, the system command units 22, 60, 70, and the laser processing control units 24, 54, 65, 75 may be realized by one processing circuit.

Further, the functions of the measurement control unit 3, the system command units 22, 60, 70, and the laser processing control units 24, 54, 65, and 75 can be realized by a dedicated hardware, and can also be borrowed. A part of it is realized by software or firmware. As described above, the measurement control unit 3, the system command units 22, 60, and 70, and the laser processing control units 24, 54, 65, and 75 can realize the above functions by a combination of hardware, software, firmware, or the like.

The configuration shown in the above embodiment is only for displaying the present invention. It is to be understood that a part of the configuration may be omitted or changed without departing from the spirit and scope of the invention.

Claims (8)

A substrate measuring device comprising: a measuring camera that acquires image data of a substrate provided with a positioning alignment mark and has a laser processed portion; and a measuring station that carries the substrate and changes the substrate and The image processing unit obtains the measurement position coordinates of the alignment mark and the measurement position coordinates of the processed portion based on the image data and the position information of the measurement station; the conversion coefficient calculation is performed based on the image data and the position information of the measurement station. a portion that obtains a conversion coefficient from a measurement position coordinate of the alignment mark to a design position coordinate of the alignment mark; and a machining error calculation unit that uses the conversion coefficient to set a measurement position coordinate of the processed portion The coordinate is converted into the converted position coordinate, and the machining error is obtained according to the difference between the coordinate position coordinate of the converted position and the design position coordinate of the processed portion. The substrate measuring device according to claim 1, further comprising: a laser processing correction value calculating unit that obtains a laser machining correction value based on the machining error. The substrate measuring device according to the first or second aspect of the invention, further comprising: a machining failure determining unit that determines whether or not there is a machining failure by comparing the machining error with a predetermined machining failure determination reference value. A laser processing system comprising: the substrate measuring device described in claim 2; a laser oscillator that outputs laser light; and a laser deflector that biases and positions the laser light to a second substrate that is a target of laser processing when the substrate is used as a first substrate; Carrying the second substrate and changing the relative position of the second substrate and the laser deflector; the processing command portion outputs a command position coordinate for positioning the laser deflector; and the laser processing correction portion is used The aforementioned laser machining correction value corrects the aforementioned command position coordinates. A laser processing system includes: a substrate measuring device according to claim 2; a laser oscillator that outputs laser light; and a laser deflector, when the substrate is used as the first substrate, The second substrate of the laser processing object deflects and positions the laser light; the processing station carries the second substrate, and changes the relative position of the second substrate and the laser deflector; and the processing instruction unit outputs a command position coordinate for positioning the processing table; and a laser processing correction unit for correcting the command position coordinate using the laser processing correction value. The laser processing system of claim 4, wherein the laser processing correction section further uses the laser processing correction The integral value of the value is used to correct the aforementioned command position coordinates. The laser processing system according to claim 4, wherein the laser processing correction unit uses the first substrate as the second substrate, and also uses the laser processing used in the past. The correction value of the command position coordinate is used to correct the aforementioned command position coordinate. The laser processing system of claim 7, further comprising: a laser processing correction value memory unit for storing a correction value of the command position coordinate.