TWI684390B - Apparatus and method for calibrating machining position - Google Patents

Abstract

The present invention relates to measuring the degree of material deformation when performing hole processing of printed circuit board materials. Based on this, an error correction formula is calculated to minimize the deviation between the designed processing hole position and the actual processing hole position, thereby Processing position correction device and method for improved processing precision. The processing position correction method includes: receiving design drawings for processing printed circuit board materials, extracting alignment mark design information from the received design drawings; The step of extracting the actual coordinate position information of the alignment mark of the printed circuit board material; the step of calculating the position compensation value for compensating the position of the machining hole based on the material deformation based on the alignment mark design information and the actual coordinate position information : And the step of correcting the coordinates of the machining hole position by the position compensation value calculated above, in order to embody the machining position correction method for the machining of holes for printed circuit board materials.

Description

Processing position correction device and method

The present invention relates to a processing position correction device and a method thereof, in particular, to measure the degree of material deformation when processing a hole of a printed circuit board material, based on which, an error correction formula is calculated to make the designed processing hole position and the actual processing hole position The error deviation between the errors is minimized, so as to improve the processing precision of the processing position correction device and method.

Recently, with the weight reduction of electronic devices such as smartphones, notebook computers, and tablet PCs, high-resolution of printed circuit boards (PCB, Printed Circuit Board) and flexible printed circuit boards (FPCB, Flexible Printed Circuit Board) are required And precision.

In the past, mechanical drills were mainly used to process small holes and special via holes corresponding to the interlayer connection paths of multilayer printed circuit boards. Recently, due to such high-resolution and precision requirements, The laser light mechanic device is mainly used. The laser processing device is a device that uses laser beams to perforate small holes and special through holes in order to connect layers to electronic devices on a multilayer substrate.

Use a mechanical drilling machine or laser drilling device to process holes on the printed circuit board, and use a printed circuit that designs a path for the motor to move on the processing surface Board design drawing.

In general, when processing holes in printed circuit boards, the positions of the holes are read by the alignment marks of 4 points or more on the periphery of the material to read the coordinates. Based on the coordinates of the alignment marks, the hole coordinates are designed and processed by the printed circuit board. The data is corrected to generate the corrected processing hole coordinates, and based on this, the printed circuit board hole processing is performed.

The prior art for processing holes on a printed circuit board is the following (Patent Document 1) to (Patent Document 4).

The prior art disclosed in (Patent Document 1) includes: an image imaging section to image an image including a hole; a hole information judgment section to obtain from the position of the drilling machine and the diameter of a bit installed on the drilling machine The size and position of the hole formed in the printed circuit board by the drilling machine; and the position control unit compares the position of the hole imaged by the image imaging unit and the position and size of the hole obtained by the tape and hole information judgment unit Adjust the position of the drilling machine so that the center of the hole formed by the drilling machine coincides with the center of the hole, determine the adjusted position as the reference position of the drilling machine, and determine the position of the drilling machine for printed circuit board processing And printed circuit board design values.

With this structure, productivity can be improved by saving working time, and the number of components can be reduced, so that production costs can be saved.

In addition, the prior art disclosed in (Patent Document 2) includes the steps of recognizing an alignment mark formed on the edge of a plate-shaped substrate as a laser processing target and calculating absolute coordinates; and storing the calculated absolute coordinates as reference position information The step of moving the plurality of optical pickup units along the horizontal or vertical pattern formed on the plate-shaped substrate; will pass the plurality of light The steps of storing the coordinates of the pattern detected by the pickup unit as error position information; and the step of comparing the reference position information and the error position information to modify the actual processing position information, using the processing error correction method of the optical pickup.

With this structure, the processing speed of the substrate using laser light or the like can be greatly increased.

Moreover, in the prior art disclosed in (Patent Document 3), in the through-hole processing step, in order to remove the insulation of the printed circuit board, when the required number of appropriate laser light irradiations is N, the beam size is B, the energy is P, and the pulse width When it is W, it is inversely proportional to the decrease in the number N of laser light irradiation, increasing the reference energy P of the above-mentioned laser light irradiation, and inversely proportional to the decrease in the number N of laser light irradiation, reducing the beam size B of the laser light irradiation to reduce The number N of laser light irradiation for through-hole processing.

With this structure, in the laser perforation processing step for through-hole processing, it is possible to improve productivity by reducing the number of laser light irradiations.

Also, the prior art disclosed in (Patent Document 4) includes: a processing range setting step to set a processing range formed by an arrival area of laser light incident on and reflecting from a mirror; and a loading step to load the The position information of the reference position of the position corresponding to the position of the plurality of holes of the processing substrate; the setting step until the reference, in the position information, after the density of the reference position in the processing range is removed from the reference position in the highest area, the The center point of the processing range is set as the reference position; the moving path setting step generates the moving path of the substrate to be measured from the reference position; and the processing step moves the above along the moving path The substrate is processed and laser processing is performed.

In the prior art of the above configuration, when laser processing, the processing range is set by a rotatable mirror, after processing a plurality of holes in the processing range, the substrate to be processed is moved, and the substrate to be processed is moved The path of movement is minimized, thereby reducing the time required to form a plurality of holes in the substrate to be processed.

[Prior Technical Literature]

[Patent Literature]

(Patent Document 1) Korean Patent No. 10-0607822 (issued on July 26, 2006) (device for determining the position of the drilling machine for printed circuit board processing and the design value of the printed circuit board).

(Patent Document 2) Korean Laid-open Patent No. 10-2011-0138879 (published on December 28, 2011) (a method for correcting processing errors using an optical pickup).

(Patent Document 3) Korean Published Patent No. 10-2014-0142403 (published on December 12, 2014) (Laser drilling machine driving method for processing through holes).

(Patent Document 4) Korean Patent Grant No. 10-1542018 (issued on July 29, 2015) (laser processing method with optimized moving path).

However, the above-mentioned general printed circuit board material hole processing method causes a large deformation of the material through the printed circuit board material production steps (heat, pressure). Without considering the above problems, the alignment mark (Alignment) on the periphery of the material Mark) is used as a reference to perform linear correction of the data to process the hole. Therefore, according to the material deformation phenomenon, the coordinate error between the corrected processing hole position and the actual processing hole position will occur, thereby reducing the processing precision.

In addition, the general hole processing method of printed circuit board materials uses the alignment mark coordinates on the periphery of the printed circuit board material as a reference to linearly correct the design and processing coordinates. Therefore, in the case of a large degree of nonlinear deformation of the material, the actual hole processing The coordinate error between the position and the corrected machining hole position is large.

In addition, the aforementioned prior art is not a method for providing processing precision, but a technology for improving productivity by saving working time, etc., and does not perform error correction of material deformation that occurs in the printed circuit board production step. Therefore, the prior art has a problem that since it is impossible to correct the deformation of the material size that occurs in the production step, the processing precision is reduced.

Therefore, the present invention is proposed to solve all the problems that have occurred in the prior art as described above. One of the objects of the present invention is to provide a method for measuring the degree of material deformation when processing holes in a printed circuit board material, and based on this, calculate the error correction Formally, a deviation and an error between the designed machining hole position and the actual machining hole position are generated to seek a machining position correction device and method for improving machining precision.

Another object of the present invention is to provide a reduction in the deviation between the error of the machining hole position and the corrected machining hole position caused by the material deformation in the material production step when the hole of the printed circuit board material is processed to improve the machining precision Degree machining position correction device and method.

In order to solve the above-mentioned problems, the processing position correction device of the present invention is characterized by including: an alignment mark design information extraction section, which extracts alignment mark design information from a design drawing for printed circuit board material processing; and an alignment mark coordinate extraction section , Use the shooting device to extract the actual coordinate position information of the alignment mark of the printed circuit board material; the position compensation value calculation unit, based on the above alignment mark design information and the actual coordinate position information, calculate the processing for compensating the material-based deformation The compensation value of the hole position; the machining hole coordinate correction part corrects the coordinates of the machining hole position by the position compensation value calculated in the position compensation value calculation unit, Among them, the present invention is characterized in that the photographing device uses a visual camera that photographs printed circuit board material for hole processing to acquire images of the printed circuit board material.

Among them, the present invention is characterized in that the position compensation value calculation unit includes: a virtual material change curve calculation unit that calculates a virtual material change for estimating the change of the material based on the alignment mark design information and the actual coordinate position information Curvilinear formula; and a processing area dividing section, which divides the entire processed hole area using the virtual material change curve formula calculated in the virtual material change curve calculating section.

Among them, the present invention is characterized in that the virtual material change curve calculation unit adds arbitrary alignment marks to the alignment mark design information of the actual printed circuit board material to calculate the virtual line calculation through the alignment mark coordinates by the virtual material change curve formula .

Among them, the present invention is characterized by the above virtual material change curve Based on the above-mentioned alignment mark design information and the above-mentioned actual coordinate position information, it is calculated by quadratic curve estimation, or calculated by piecewise spline interpolation.

Among them, the present invention is characterized in that the processing area dividing unit divides the entire processing hole area in a nearly linear shape based on a virtual material change curve type.

Among them, the present invention is characterized in that the processing area dividing unit divides the entire processing hole area in a quadrilateral form based on a virtual material change curve type.

Among them, the present invention is characterized in that the machining hole coordinate correction unit obtains the reference point of the virtual divided area in each divided area, and uses bilinear interpolation (Biliner Interpolation) by using the virtual divided area coordinates corresponding to the obtained reference point Correct the coordinates of the machining hole.

Moreover, the processing position correction method of the present invention is characterized by comprising: step (a), receiving a design drawing for processing printed circuit board materials, extracting alignment mark design information from the received design drawing; step (b) , Use the shooting device to extract the actual coordinate position information of the alignment marks of the printed circuit board material; step (c), based on the above alignment mark design information and the actual coordinate position information to calculate the compensation for processing based on material deformation Position compensation value of the hole position: and step (d), the position coordinate of the machined hole is corrected by the position compensation value calculated in the above step (c).

Among them, the present invention is characterized in that the step (c) includes the step (c1), based on the alignment mark design information and the actual coordinate position information, to calculate a virtual material change curve for estimating the change of the material; And step (c2), using the virtual material calculated in step (c) above Change the curve type to divide the whole processing hole area.

Among them, the present invention is characterized in that in the above step (c1), an arbitrary alignment mark is added to the alignment mark design information of the actual printed circuit board material to calculate the virtual line passing through the alignment mark coordinates by a virtual material change curve .

Among them, the present invention is characterized in that in the above step (c1), a quadratic curve is estimated based on the alignment mark design information and the actual coordinate position information to calculate a virtual material change curve type, or by piecewise spline interpolation Calculate the virtual material change curve.

Among them, the present invention is characterized in that in the above step (c2), based on the virtual material change curve type, the entire processed hole area is divided into regions that are nearly linear.

Among them, the present invention is characterized in that, in the above step (c2), based on the virtual material change curve type, the entire processed hole area is divided into a quadrilateral form.

Among them, the present invention is characterized in that in the above step (d), the reference points of the virtual divided area are obtained from each divided area, and the processing of the virtual divided area coordinates corresponding to the obtained reference points is used to perform processing by bilinear interpolation Correct the hole coordinates.

According to the present invention, the present invention has the advantage that, in the case of material deformation based on the printed circuit board material production step, the nonlinear deformation of the material is divided into a nearly rectangular area to linearly correct each virtual divided area by This can reduce the deviation of the processing coordinate error and improve the Work precision.

10‧‧‧ Alignment Mark Design Information Extraction Department

20‧‧‧ shooting device

30‧‧‧ Alignment Mark Coordinate Extraction Department

40‧‧‧ Position compensation value calculation unit

41‧‧‧ Virtual Material Change Curve Calculation Department

42‧‧‧Processing area division

60‧‧‧Correcting Department of Machining Hole

70‧‧‧Printed Circuit Board Hole Processing Department

FIG. 1 is a block diagram of a processing position correction device of the present invention.

FIG. 2 is a flowchart showing the processing position correction method of the present invention.

Fig. 3 is a diagram showing an example of division of a processing area for correcting a processing position in the present invention.

FIG. 4 is a diagram showing an example of division of a processing area added by a virtual reference point in the present invention.

FIG. 5 is a diagram showing an example of calculating a virtual material change curve in the present invention.

FIG. 6 is an illustration of an example of virtual division alignment positions and additional alignment marks in the present invention.

FIG. 7 is a result diagram when the machining error correction method of the present invention is applied.

Hereinafter, referring to the drawings, the processing position correction device and method of the preferred embodiment of the present invention will be described in detail.

1 is a block diagram of a processing position correction device according to a preferred embodiment of the present invention, including an alignment mark design information extraction section 10, a photographing device 20, an alignment mark coordinate extraction section 30, a position compensation value calculation unit 40, and a processing hole coordinate The correction unit 60 and the printed circuit board hole processing unit 70.

The above-mentioned alignment mark design information extraction unit 10 extracts alignment mark design information from a design drawing for printed circuit board material processing.

The above-mentioned imaging device 20 acquires an image by imaging the printed circuit board material for actual hole processing, and various image-capturing devices can be used, but In the present invention, as an embodiment, a visual camera is preferably used.

The alignment mark coordinate extraction unit 30 uses the imaging device 20 to extract the actual coordinate position information of the alignment mark of the printed circuit board.

The position compensation value calculation unit 40 calculates the position compensation value for compensating the position of the machining hole based on the material deformation based on the alignment mark design information and the actual coordinate position information.

Such a position compensation value calculation unit 40 may include: a virtual material change curve calculation section 41 that calculates a virtual material change curve formula for estimating a change in material based on the alignment mark design information and the actual coordinate position information; and The machining area dividing unit 42 divides the entire machining hole area using the virtual material change curve formula calculated by the virtual material change curve calculation unit.

3)次多項式。 Among them, the virtual material change curve calculation unit 41 adds an arbitrary alignment mark to the alignment mark design information of the actual printed circuit board material to calculate the virtual line passing through the alignment mark coordinates as a virtual material change curve type. At this time, the virtual material change curve formula is calculated based on the above-mentioned alignment mark design information and the above-mentioned actual coordinate position information to estimate a quadratic curve formula, or calculated by piecewise spline interpolation. Among them, the quadratic curve can include N(N

3) Degree polynomial.

In the preferred embodiment of the present invention, in order to calculate the above-mentioned virtual material change curve formula, only the second degree polynomial and the piecewise interpolation method have been described. However, the present invention is not limited to this, and ordinary technicians in the technical field to which the present invention belongs It is known that various construction methods disclosed for calculating the virtual material change curve can be used.

In addition, the processing area dividing unit 42 is based on a virtual material change curve In the formula, the entire processed hole area is divided into regions close to a linear shape. More preferably, the processing area dividing unit 42 divides the entire processing hole area in a quadrilateral form based on a virtual material change curve type.

The machining hole coordinate correction unit 60 corrects the machining hole position coordinates by the position compensation value calculated by the position compensation value calculation unit 40.

The machining hole coordinate correction unit 60 obtains the reference point of the virtual division area in each divided area, and corrects the machining hole coordinate by bilinear interpolation using the virtual division area coordinates corresponding to the acquired reference point.

2 is a method for correcting a processing position of the present invention, including: step (a), receiving a design drawing for printed circuit board material processing, and extracting alignment mark design information from the received design drawing (step S10, step S20) ; Step (b), use the shooting device to extract the actual coordinate position information of the alignment marks of the printed circuit board material (step S30); step (c), based on the alignment mark design information and the actual coordinate position information Calculate the position compensation value used to compensate the position of the machining hole based on material deformation (step S40, step S50): and step (d), correct the coordinates of the machining hole position by the position compensation value calculated in the above step (c) ( Step S60), processing the holes of the printed circuit board material based on the corrected processing hole position information (step S70).

The operation of the processing position correction device and method of the present invention configured as described above will be specifically described.

First, in the present invention, when the hole processing of the printed circuit board material is performed, in the material production step, errors between the actual processing hole position and the corrected processing hole position caused by material deformation caused by heat or pressure are reduced. Deviation to improve processing precision.

Therefore, as shown in FIG. 4, in addition to the four-point alignment marks (P0-P3) on the periphery of the printed circuit board material, at least one more alignment mark (A1, A2) is added to obtain the coordinate of the alignment mark. The virtual line divides the entire processing area into a plurality of virtual areas (virtual area #1 to virtual area #4) based on this, and corrects the processing position in each divided area by correcting the processing coordinates.

For example, in the alignment mark design information extraction section 10, the alignment mark is extracted from the design information used for printed circuit board material processing (step S10, step S20). The printed circuit board design information is printed circuit board material design information, as shown in FIG. As shown in FIG. 4, the four points P0, P1, P2, P3 on the periphery of the design information are extracted as alignment mark design information. Among them, the design information includes machining hole coordinates. The extracted alignment mark design information is transferred to the position compensation value calculation unit 40.

At the same time, the imaging device 20 uses an imaging device such as a visual camera to use the actual printed circuit board material used for hole processing, and transmits the imaged printed circuit board material image image to the alignment mark coordinate extraction unit 30. The phenomenon on the upper right side of FIG. 4 is the shape of the printed circuit board material actually photographed by the imaging device 20. The actual printed circuit board material deforms due to heat or pressure during the material production step.

The alignment mark coordinate extraction unit 30 extracts the alignment mark coordinate of the imaged printed circuit board material and transmits it to the position compensation value calculation unit 40 (step S30). Among them, the coordinates of the alignment marks of the printed printed circuit board material are the actual moving coordinate positions. At this time, in addition to the four-point peripheral alignment marks, two or more additional alignment mark movement coordinates are acquired. Moreover, you will get The moving coordinates are set to the actual position and reference position of the alignment mark.

The position compensation value calculation unit 40 calculates the compensation based on the alignment mark design information transmitted from the alignment mark design information extraction unit 10 and the actual coordinate position information transmitted from the alignment mark coordinate extraction unit 30. The compensation value of the machining hole position where the material is deformed.

For example, the virtual material change curve calculation unit 41 of the position compensation value calculation unit 40 calculates a virtual material change curve formula for estimating the change of the material based on the alignment mark design information and the actual coordinate position information (step S40). As shown in FIG. 5, the virtual material change curve formula for estimating the material change is calculated based on the moving coordinates of the alignment mark passing through 3 or more points (for example, P0→A0→P1). Among them, the virtual material change curve formula is calculated by estimating the quadratic curve formula (ax ² +bx+c=y) based on the above actual coordinate position information, or calculated by piecewise spline interpolation. In addition to the above two methods, various methods for calculating the virtual material change curve can be applied.

Among them, the detailed description of segment interpolation is as follows.

In Fig. 3, if point ① is (x0, f0), point ② is (x1, f1), point ③ is (x2, f2), use the following mathematical formula 1 and mathematical formula 2 and substitute the value of each point to calculate Coefficient.

If you substitute each point, you can find the following four mathematical formulas.

Mathematical formula 3 F ₀ = A ₁ × x ₀ ² + B ₁ × x ₀ + C ₁

Mathematical formula 4 F ₁ = A ₁ × x ₁ ² + B ₁ × x ₁ + C ₁

Mathematical formula 5 F ₁ = A ₂ × x ₁ ² + B ₂ × x ₁ + C ₂

Mathematical formula 6 F ₂ = A ₂ × x ₂ ² + B ₂ × x ₂ + C ₂

In addition, through the continuous condition, the virtual curve formula can find the following mathematical formula 7 as F1'(x)=F2'(x).

From the initial value, the following equation 8 or equation 9 is obtained by connecting the points ① and ② by selecting the condition of the straight line or curve.

If the above-mentioned known mathematical formulas 3 to 7 and mathematical formula 8 or mathematical formula 9 are calculated, the coefficients of the above mathematical formula 1 and mathematical formula 2 can be obtained as virtual curve formulas.

The virtual curve symmetrical to the above is calculated by the same method as above.

Next, the method of obtaining the virtual curve formula by the quadratic formula will be described as follows.

In Figure 3, if point ① is (x0, f0), point ② is (x1, f1), point ③ is (x2, f2), then use the following mathematical formula 10 to substitute the value of each point and find the coefficient of the formula.

By substituting each point, three formulas such as the following mathematical formula 11 to mathematical formula 13 can be obtained.

Mathematical formula 11 F ₁ = A ₁ × x ₀ ² + B ₁ × x ₀ + C ₁

Mathematical formula 12 F ₁ = A ₁ × x ₁ ² + B ₁ × x ₁ + C ₁

Mathematical formula 13 F ₁ = A ₁ × x ₂ ² + B ₁ × x ₂ + C ₁

If the known mathematical expressions 11 to 13 are calculated, the coefficient of the mathematical expression 10 which is the above virtual curve expression can be obtained.

The virtual curve of the point symmetrical to the above is calculated by the same method as above.

As described above, after the virtual material change curve formula is calculated, the entire processed hole area is divided into a plurality of pieces by using the virtual material change curve formula calculated at the processing area dividing unit 42 (step S50).

For example, add 1 alignment mark (A) between points ① and ② shown in FIG. 3, add 1 alignment mark (B) between ② and ③, and add A'and B'. In this way, the entire processing area is divided into a plurality of virtual areas (virtual area #1-virtual area #4). Among them, curve 1 is the curve connecting point ① and point A in virtual area #1, curve 2 is the virtual curve The curve connecting point ①'and point A'in quasi-region #1.

At this time, in the overall machining hole area, the nonlinear change based on the material deformation is divided into regions that are close to linear. More preferably, based on the virtual material change curve type, the entire machining hole area is divided in a quadrangular shape. After the virtual area is divided, the virtual divided area reference point is acquired for each virtual area. In FIG. 4, points V0 to V3 are virtual area division reference points of the virtual area divided based on the virtual material change curve type. FIG. 6 exemplifies the addition of one or more virtual division reference points such as V0 and V3 to divide the divided region close to a straight line.

In addition, the machined hole coordinate correction unit 60 corrects the machined hole coordinates in the virtual divided area by bilinear interpolation using the virtual divided area coordinates acquired as described above (step S60). For example, the divided regions are corrected by bilinear interpolation.

The above bilinear interpolation is as shown in the following mathematical formula 14.

Mathematical formula 14 F = A ₀ + A ₁ × U + A ₂ × V + A ₃ × U × V

FIG. 7 is a result diagram when the machining error correction method of the present invention is applied. When the error correction for the coordinate position is performed, the deviation of the machining coordinate error based on the virtual division area can be reduced corresponding to the case based on the material periphery.

After the processing hole coordinate correction is completed, the printed circuit board processing hole information is transmitted to the printed circuit board hole processing portion 70, and the printed circuit board hole processing portion 70 performs printed circuit board hole processing based on the corrected processing hole information (step S70) .

In the present invention, when the material deformation based on the printed circuit board material production step occurs, the non-linear deformation of the material is divided into a nearly rectangular area to linearly correct each virtual division area, thereby reducing the processing coordinates The deviation occurs and the processing precision can be adjusted.

The above-described embodiments have specifically described the invention of the present inventors, but the present invention is not limited to this, and various modifications can be made within the scope not exceeding the gist of the present invention.

10‧‧‧ Alignment Mark Design Information Extraction Department

20‧‧‧ shooting device

30‧‧‧ Alignment Mark Coordinate Extraction Department

40‧‧‧ Position compensation value calculation unit

41‧‧‧ Virtual Material Change Curve Calculation Department

42‧‧‧Processing area division

60‧‧‧Correcting Department of Machining Hole

70‧‧‧Printed Circuit Board Hole Processing Department

Claims (12)

A processing position correction device for processing holes of printed circuit board materials, including: an alignment mark design information extraction part, extracting alignment mark design information from a design drawing for printed circuit board material processing; an alignment mark coordinate extraction part , Use the shooting device to extract the actual coordinate position information of the alignment marks of the printed circuit board material; the position compensation value calculation unit calculates the compensation for the material-based deformation based on the alignment mark design information and the actual coordinate position information The compensation value of the machining hole position; and the machining hole coordinate correction unit, which corrects the machining hole position coordinate by the position compensation value calculated by the aforementioned position compensation value calculation unit; the aforementioned position compensation value calculation unit includes: a virtual material change curve calculation unit Calculate the virtual material change curve for estimating the material change based on the alignment mark design information and the aforementioned actual coordinate position information; and the processing area division part, using the virtual material change curve calculated in the virtual material change curve calculation part To divide the entire machining hole area; wherein the aforementioned machining hole coordinate correction unit obtains the reference point of the virtual division area in each divided area, and uses the virtual division area coordinates corresponding to the obtained reference point to coordinate the machining hole through bilinear interpolation Perform calibration. The processing position correction device described in claim 1, wherein the aforementioned The camera uses a visual camera that shoots printed circuit board material for hole processing to obtain printed circuit board material images. The processing position correction device according to claim 1, wherein the virtual material change curve calculation unit adds arbitrary alignment marks to the alignment mark design information of the actual printed circuit board material to calculate the alignment mark by the virtual material change curve type The virtual line of coordinates. The processing position correction device according to claim 3, wherein the virtual material change curve type is calculated by quadratic curve estimation based on the alignment mark design information and the actual coordinate position information, or calculated by piecewise spline interpolation . The processing position correction device according to claim 3, wherein the virtual material change curve formula is calculated by N-degree polynomial estimation based on the alignment mark design information and the actual coordinate position information, where N

3. The processing position correction device according to claim 1, wherein the processing area dividing unit divides the entire processing hole area in a nearly linear shape based on a virtual material change curve type. The processing position correction device according to claim 1, wherein the processing area dividing unit divides the entire processing hole area in a quadrilateral form based on a virtual material change curve type. A processing position correction method for hole processing of printed circuit board materials includes the following steps: step (a), receiving a design drawing for processing of printed circuit board materials, extracting alignment mark design information from the received design drawing ; Step (b), use the shooting device to extract the actual coordinate position information of the alignment marks of the printed circuit board material; Step (c), based on the aforementioned alignment mark design information and the aforementioned actual coordinate position information, calculate for compensation based on The position compensation value of the processing hole position of the material deformation: and step (d), the position coordinate of the processing hole is corrected by the position compensation value calculated in the foregoing step (c); the foregoing step (c) includes: step (c1), Based on the aforementioned alignment mark design information and the aforementioned actual coordinate position information, calculate a virtual material change curve formula for estimating the material change; and step (c2), using the virtual material change curve calculated in the aforementioned step (c) Use the formula to divide the whole machining hole area; in the previous step (d), obtain the reference point of the virtual divided area in each divided area, and use the coordinates of the virtual divided area corresponding to the obtained reference point to pass the bilinear interpolation pair Machine hole coordinates for correction. The processing position correction method described in claim 8, wherein in the aforementioned step (c1), any alignment mark is added to the alignment mark design information of the actual printed circuit board material to calculate the alignment through the virtual material change curve A virtual line marking the coordinates. The processing position correction method as described in claim 8, wherein in the aforementioned step (c1), a quadratic curve is estimated based on the aforementioned alignment mark design information and the aforementioned actual coordinate position information to calculate the virtual material change curve Linear, or calculate virtual material change curve by piecewise spline interpolation. The processing position correction method according to claim 8, wherein in the aforementioned step (c2), the entire processing hole area is divided into regions that are nearly linear based on the virtual material change curve. The machining position correction method according to claim 8, wherein in the aforementioned step (c2), the entire machining hole area is divided into quadrilateral shapes based on a virtual material change curve type.

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