KR101720004B1 - Machining position correction apparatus and method thereof - Google Patents

Abstract

The present invention relates to a processing position correcting device capable of promoting the improvement of processing accuracy by minimizing error generation difference between positions of an actual processing hole and a designed processing hole by measuring a transformed degree of a PCB material, when processing a hole in the PCB material, and calculating an error correcting formula based on the measured transformed degree of the PCB material, and to a processing position correcting method. The processing position correcting method includes: a step of receiving an input of a design drawing for processing the PCB material and extracting align mark design information from the inputted design drawing; a step of extracting actual coordinate information of an align mark on the PCB material with a photographing device; a step of calculating a position correcting value for correcting the difference between the positions of the actual processing hole and the designed processing hole based on the align mark design information and the actual coordinate information; and a step of correcting processing hole coordinates based on the calculated position correcting value.

Description

[0001] The present invention relates to a machining position correcting apparatus and method,

The present invention relates to an apparatus and method for correcting a machining position, and more particularly, to an apparatus and method for correcting a machining position, The present invention relates to a machining position correcting apparatus and a machining position correcting method.

2. Description of the Related Art Recently, electronic devices such as smart phones, notebooks, and tablets have been demanded to be lightweight and miniaturized, so that high resolution and precision of printed circuit boards (PCBs) and flexible printed circuit boards (FPCBs) are required.

Conventionally, a mechanical drill has been mainly used to process a small hole and a special via hole corresponding to the interlayer connection path of a multilayer printed circuit board. However, recently, due to the demand for such high resolution and precision, . The laser processing apparatus is a device for drilling a small hole and a special via hole with a laser beam for connection of each layer in an electronic apparatus of a multilayer substrate.

To use a mechanical drill or use a laser drilling machine to process holes in a printed circuit board, use a PCB design drawing that designates the path through which the motor moves on the machined surface.

In general, when machining a PCB material hole, the position of the machining hole is read through the recognition of four or more alignment marks of the material outer edge, and the data correction of the PCB design processing hole coordinates based on the alignment mark coordinate Corrected machining hole coordinates are generated and PCB hole machining is performed based on this.

Conventional techniques for processing a hole in a printed circuit board are disclosed in Patent Documents 1 to 4 below.

The prior art disclosed in Patent Document 1 includes an image pickup unit for picking up an image including a hole, a size of a hole to be formed on the PCB by drilling from a position of the drill and a diameter of a bit mounted on the drill, And the position and size of the hole obtained by the image information pickup unit are compared with the position and size of the hole obtained by the hole information determination unit so that the position of the drill is adjusted so that the center of the hole to be formed by the drill coincides with the center of the hole And a position control unit for determining the adjusted position as a reference position of the drill, thereby implementing a device for determining the position of the drill for PCB processing and the PCB design value.

With this configuration, the productivity can be improved by saving the working time, the defective product can be reduced, and the production cost can be reduced.

In addition, the prior art disclosed in Patent Document 2 includes a step of calculating an absolute coordinate by recognizing an alignment mark formed on the edge of a plate-shaped substrate to be laser-processed; Storing the calculated absolute coordinates as reference position information; Moving a plurality of optical pickup means along a horizontal or vertical pattern formed on the plate-shaped substrate; Storing coordinates of the pattern detected through the plurality of optical pickup means as error position information; And correcting the actual machining position information by comparing the reference position information and the error position information, thereby implementing a machining error correction method using the optical pickup.

With this configuration, the substrate processing speed using a laser or the like can be remarkably improved.

In the prior art disclosed in Patent Document 3, the appropriate number of laser shots required to remove an insulator of a printed circuit board (PCB) is N, the beam size is B, and the power is P By decreasing the beam size B of the laser shot in proportion to the reduction amount of the laser shot number N while increasing the reference power P of the laser shot in inverse proportion to the decrease amount of the laser shot number N when the pulse width is W, Lt; RTI ID = 0.0 > N < / RTI >

With this configuration, it is possible to increase the productivity by reducing the number of laser shots in the laser drilling process for via hole processing.

In addition, the prior art disclosed in Patent Document 4 includes a machining range setting step of setting a machining range formed by an arrival area of a laser incident and reflected by a reflecting mirror; A loading step of loading position information on which a reference point having a position corresponding to a position of a plurality of holes formed in the workpiece is formed; A reference position setting step of setting a center point of the machining range as a reference position after removing a reference point in an area having the highest density of the reference points included in the machining range from the positional information; A moving path generating step of generating a moving path of the measured substrate from the reference position; And a processing step of performing laser processing while moving the processed substrate in accordance with the movement path.

According to the conventional technique configured as described above, the machining range is set through the rotatable reflection mirror during the laser machining, the plurality of holes included in the machining range are machined, the machined substrate is moved, and the movement path of the machined substrate is minimized The time required for forming a plurality of holes in the processed substrate is reduced.

Korean Registered Patent No. 10-0607822 (Registered on July 26, 2006) (Apparatus for determining the position and PCB design value of drill for PCB processing) Korean Patent Laid-open No. 10-2011-0138879 (Dec. 28, 2011) (Method for correcting machining error using optical pickup) Korean Patent Laid-Open No. 10-2014-0142403 (Dec. 12, 2014) (Laser Drill Driving Method for Via Hole Processing) Korean Registered Patent No. 10-1542018 (Registered on May 29, 2015) (Laser Processing Method with Optimized Travel Path)

However, the above-mentioned general method of hole processing of PCB materials is based on the alignment marks of the outer edge of the material without considering the occurrence of material size deformation due to the PCB material production process (heat, pressure) There is a disadvantage in that a coordinate error is generated between the position of the machining hole corrected according to the deformed shape of the material and the position of the actual machining hole and the machining accuracy is lowered.

In addition, since the general PCB material hole machining method linearly corrects design machining coordinates based on the alignment mark coordinates of the PCB material outer edge, when the material size is nonlinear deformation, coordinates between the actual machining hole position and the corrected machining hole position There is a disadvantage in that an error occurs largely.

In addition, the above-mentioned conventional techniques are not a method for improving the machining accuracy, but are techniques for improving the productivity by saving work time and the like and do not correct the error correction for the material size deformation occurring in the PCB production process . Therefore, the conventional techniques have a disadvantage in that the processing accuracy is degraded because the deformation correction of the material size occurring in the production process can not be performed.

SUMMARY OF THE INVENTION Accordingly, the present invention has been made in order to solve all of the above-mentioned problems occurring in the prior art, and it is an object of the present invention to provide a method and apparatus for measuring a degree of deformation of a material during hole machining of a PCB material, The present invention is directed to a machining position correcting apparatus and a machining position correcting method for minimizing an error occurrence deviation between actual machining hole positions and thereby improving machining accuracy.

It is another object of the present invention to provide a machining position correcting device and a method therefor which can improve the machining accuracy by reducing the deviation of error between the actual machining hole position and the corrected machining hole position due to the material deformation occurring in the material producing process in the hole machining of the PCB material .

According to an aspect of the present invention, there is provided an alignment mark design information extraction unit for extracting alignment mark design information from a design drawing for processing a PCB material. An alignment mark coordinate extraction unit for extracting an actual coordinate position information of an alignment mark of the PCB material using a photographing apparatus; Position compensation value calculating means for calculating a position compensation value for compensating a machining hole position according to material deformation on the basis of the alignment mark design information and actual coordinate position information; And a machining hole coordinate correcting unit for correcting the machining hole position coordinate by the position compensation value calculated by the position compensation value calculating means.

The photographing apparatus uses a vision camera for photographing the PCB material and acquiring the PCB material image.

Wherein the position compensation value calculation means calculates a virtual material change curve expression for estimating a change of the material based on the alignment mark design information and the actual coordinate position information; And a machining area dividing section for dividing the entire machining hole area by using the virtual material change curve equation calculated by the virtual material change curve calculating section.

The virtual material change curve calculating unit may calculate an imaginary material change curve expression by adding an arbitrary alignment mark to the actual alignment mark design information of the actual PCB and correcting the virtual line passing through the alignment mark coordinates.

The virtual material variation curve equation may be calculated through quadratic curve estimation based on the alignment mark design information and the actual coordinate position information, or may be calculated through spline interpolation for each section.

The machining area dividing unit divides the entire machining hole area into a shape close to a linear shape based on a virtual material change curve expression.

The machining area dividing unit divides the entire machining hole area into a rectangular shape based on the virtual material change curve expression.

The machining hole coordinate correction unit obtains a reference point of a virtual divided area for each divided area and corrects the machining hole coordinates by bilinear interpolation using virtual divided area coordinates corresponding to the obtained reference point. do.

According to another aspect of the present invention, there is provided a method of correcting a machining position, comprising: (a) receiving a design drawing for processing a PCB material and extracting alignment mark design information from the input design drawing; (b) extracting actual coordinate position information of the alignment mark of the PCB material using the photographing apparatus; (c) calculating a position compensation value for compensating a machining hole position according to material deformation based on the alignment mark design information and the actual coordinate position information; And (d) correcting the machining hole position coordinate to the position compensation value calculated in the step (c).

The step (c) includes the steps of: (c1) calculating a virtual material change curve expression for estimating a change of a material based on the alignment mark design information and the actual coordinate position information; (c2) dividing the entire machining hole region using the virtual material variation curve equation calculated in the step (c1).

In the step (c1), an arbitrary alignment mark is added to the alignment mark design information of the actual PCB, thereby calculating a virtual material change curve expression for a virtual line passing through the alignment mark coordinates.

In the step (c1), a virtual material change curve equation is calculated by estimating a quadratic curve based on the alignment mark design information and the actual coordinate position information, or a virtual material change curve And calculating an equation.

In the step (c2), the entire machining hole region is divided into a region close to the linear shape based on the virtual material change curve.

In the step (c2), the entire machining hole region is divided into a rectangular shape based on the virtual material change curve expression.

In the step (d), a reference point of the virtual divided area is obtained for each divided area, and the machining hole coordinates are corrected by bilinear interpolation using the virtual divided area coordinates corresponding to the obtained reference point do.

According to the present invention, when the material transformation by the PCB material production process occurs, the nonlinear deformation of the material is divided into the regions close to the rectangle, and linear correction is performed on each of the virtual division regions. There is an advantage to be able to do.

1 is a block diagram of a machining position correcting apparatus according to the present invention;
2 is a flowchart showing a machining position correcting method according to the present invention,
Fig. 3 is a diagram showing an example of machining area division for machining position correction in the present invention,
4 is a diagram illustrating an example of processing area division through addition of virtual reference points in the present invention,
FIG. 5 is a diagram illustrating a virtual material change curve calculation example in the present invention,
Fig. 6 is a diagram showing a virtual division-in position and an additional alignment mark in the present invention,
Fig. 7 is a result of applying the machining error correction method according to the present invention. Fig.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an apparatus and method for correcting a machining position according to a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a block diagram of a processing position correcting apparatus according to a preferred embodiment of the present invention. The alignment mark design information extracting unit 10, the photographing apparatus 20, the alignment mark coordinate extracting unit 30 A position compensation value calculating means 40, a machining hole coordinate correcting unit 60, and a PCB hole machining unit 70.

The alignment mark design information extraction unit 10 extracts alignment mark design information from a design drawing for processing a PCB material.

The photographing device 20 photographs a PCB material (PCB panel) for actual hole processing to acquire an image, and various image photographing devices can be used. In the present invention, it is preferable to use a vision camera as an embodiment Will be described as an example.

The alignment mark coordinate extraction unit 30 extracts the actual coordinate position information of the alignment mark of the PCB material using the photographing apparatus 20. [

The position compensation value calculating means 40 calculates the position compensation value for compensating the machining hole position according to the material deformation on the basis of the alignment mark design information and the actual coordinate position information.

The position compensation value calculating means 40 includes a virtual material change curve calculating unit 41 for calculating a virtual material change curve expression for estimating a change of a material on the basis of the alignment mark design information and the actual coordinate position information, And a machining area dividing section 42 for dividing the entire machining hole area by using the virtual material change curve expression calculated by the virtual material change curve calculating section 41. [

Here, the virtual material change curve calculating unit 41 preferably adds an arbitrary alignment mark to the actual alignment mark design information of the PCB, and calculates a virtual line passing through the alignment mark coordinates as a virtual material change curve. At this time, it is preferable that the virtual material change curve expression is calculated by estimating and calculating a quadratic curve expression based on the alignment mark design information and the actual coordinate position information, or by spline interpolation for each section. Here, the quadratic curve equation may include N (N? 3) order polynomials.

In the preferred embodiment of the present invention, only the quadratic polynomial and the spline interpolation method are described for the virtual material variation curve calculation. However, the present invention is not limited to this, and various methods known in the art for calculating the virtual material variation curve expression It will be apparent to those skilled in the art that the present invention is not limited to the above embodiments.

The machining area dividing unit 42 divides the entire machining hole area into a shape close to the linear shape based on the virtual material change curve. More preferably, the machining area dividing unit 42 divides the entire machining hole area into a rectangular shape based on the virtual material change curve expression.

The machining hole coordinate correcting unit 60 serves to correct the machining hole position coordinates to the position compensation value calculated by the position compensation value calculating means 40. [

The machining hole coordinate correcting unit 60 obtains the reference point of the virtual divided area for each divided area and corrects the machining hole coordinates by bilinear interpolation using the virtual divided area coordinates corresponding to the acquired reference point .

(A) receiving a design drawing for processing a PCB material and extracting alignment mark design information from the received design drawing (S10, S20), (b) (S30) of extracting actual coordinate position information of the alignment mark of the PCB material by using the imaging device, (c) extracting actual coordinate position information of the alignment mark of the PCB material by using the alignment mark design information and the actual coordinate position information, (S40 to S50); (d) correcting the machining hole position coordinate to the position compensation value calculated in the step (c) (S60); and calculating the corrected machining hole position And processing the PCB material hole based on the information (S70).

The operation of the machining position correcting apparatus and method according to the present invention will be described in detail as follows.

First, the present invention aims at improving the machining accuracy by reducing the deviation of errors between actual machining hole positions and corrected machining hole positions due to material deformation caused by heat or pressure in the material production process during PCB material hole machining.

To this end, as shown in FIG. 4, at least one virtual alignment mark (A1, A2) is added in addition to the four alignment marks P0 - P3 of the PCB material outer edge, And the machining position is corrected by dividing the entire machining area into a plurality of virtual areas (virtual area # 1 to virtual area # 4) based on this line and correcting the machining coordinates for each divided area.

For example, the alignment mark design information extraction unit 10 extracts alignment marks from the design information for processing the PCB material (S10, S20). The PCB design information is PCB material design specification information. As shown in FIG. 4, four points (P0, P1, P2, P3) in the outer angle of the design information are extracted as alignment mark design information. Here, the design information includes machining hole coordinates. The alignment mark design information thus extracted is transmitted to the position compensation value calculating means 40. [

In addition, the photographing apparatus 20 photographs an actual PCB material for hole processing by using a photographing apparatus such as a vision camera, and transmits the photographed PCB material image image to the alignment mark coordinate extraction unit 30. FIG. It is assumed that the shape on the right side of FIG. 4 is the shape of the PCB material photographed through the actual photographing apparatus 20. The actual photographed PCB material is the material deformation caused by heat or pressure in the material production process.

The alignment mark coordinate extraction unit 30 extracts the alignment mark coordinates of the photographed PCB material and transmits the extracted alignment mark coordinates to the position compensation value calculation unit 40 at step S30. Here, the alignment mark coordinates of the photographed PCB material indicate actual motion coordinate positions. At this time, it is preferable to acquire two or more additional alignment mark motion coordinates in addition to the four alignment marks. Then, the acquired motion coordinates are set to the alignment mark actual position and reference position.

The position compensation value calculating means 40 calculates the position compensation value based on the alignment mark design information transmitted from the alignment mark design information extracting section 10 and the actual coordinate position information transmitted from the aligned mark coordinate extracting section 30 A position compensation value for compensating the machining hole position according to the material deformation is calculated.

For example, the virtual material variation curve calculating section 41 of the position compensation value calculating means 40 calculates a virtual material variation curve expression for estimating the change of the material on the basis of the alignment mark design information and the actual coordinate position information (S40). It is preferable to calculate the virtual material change curve expression for estimating the material change based on the motion coordinates passing through the alignment mark of three or more points (for example, P0 -> A0 -> P1) as shown in FIG. 5 Do. Here, the virtual material change curve expression may be calculated by a method of estimating a quadratic curve expression (ax ² + bx + c = y) based on the actual coordinate position information, or may be calculated by spline interpolation. In addition to the above two methods, various known methods of calculating the virtual material change curve equation may be applied.

Here, the spline interpolation will be described in more detail as follows.

In FIG. 3, letting (1) and (2) denote (x0, f0), (2) and The coefficient of the expression is obtained by substituting the value of the point.

When each point is substituted, the following four equations can be obtained.

Then, the following expression (7) can be obtained that the virtual curve expression is equal to F1 ^' (x) = F2 ^' (x) under the condition of continuity.

Through the initial value, the following equation (8) or (9) can be obtained through a condition of selecting a straight line or a curve for connecting the points (1) and (2).

The coefficients of the equations (1) and (2), which are virtual curvilinear equations, can be obtained by calculating the above-mentioned Equations (3) - (7) and (8) .

The virtual curve of the point symmetric with the above is calculated by the same method as described above.

Next, a method of obtaining a virtual curve expression by a quadratic expression is described as follows.

In FIG. 3, letting the points (x0, f0), the points (x1, f1) and the points (x2, f2) be the values of the respective points Find the coefficient of the equation.

When each point is substituted, three equations can be obtained as shown in the following equations (11) - (13).

By calculating the following equations (11) - (13), the coefficients of the virtual curvilinear equation (10) can be obtained.

The virtual curve of the point symmetric with the above is calculated by the same method as described above.

After the virtual material variation curve equation is calculated as described above, the entire machining hole area is divided into a plurality of parts using the virtual material variation curve equation calculated by the machining area dividing section 42 (S50).

For example, one alignment mark A is added between points 1 and 2 shown in FIG. 3, one alignment mark B is added between points 2 and 3, and a virtual curve A ^' And B ^' . In this way, the entire machining area is divided into a plurality of virtual areas (virtual area # 1 - virtual area # 4). Here, curve 1 is a curve connecting point ① and point A in virtual area # 1, and curve 2 is a curve connecting point ① 'and point A' in virtual area # 1.

At this time, it is preferable that the entire machining hole region is segmented into a nonlinear change due to material deformation in a form close to a linear shape. More preferably, the entire machining hole region is divided into a rectangular shape based on the virtual material change curve expression. After the virtual area division, a virtual divided area reference point is obtained for each virtual area. In FIG. 4, the points V0 - V3 become the virtual region division reference points of the virtual region divided based on the virtual material change curve expression. FIG. 6 is an example of dividing a divided region close to a straight line by adding one or more virtual division reference points such as V0 and V3.

Next, the machining hole coordinate correcting unit 60 corrects the machining hole coordinates in the virtual divided area by bilinear interpolation using the obtained virtual divided area coordinates (S60). For example, the divided regions are corrected by double linear interpolation.

The double linear interpolation method is expressed by the following equation (14).

FIG. 7 is a graph showing a result obtained when the machining error correction method according to the present invention is applied. In the case where an error is corrected with respect to a coordinate position, Is reduced.

After the completion of the processing hole coordinate correction, the PCB processing hole information is transmitted to the PCB hole processing unit 70, and the PCB hole processing unit 70 performs the PCB hole processing based on the corrected processing hole information (S70 ).

In the present invention, when the material is deformed by the PCB material production process, the nonlinear deformation of the material is divided into the regions close to the rectangle, and each virtual divided region is linearly corrected to reduce the deviation of the processing coordinate error. Accordingly, the machining precision can be improved.

Although the present invention has been described in detail with reference to the above embodiments, it is needless to say that the present invention is not limited to the above-described embodiments, and various modifications may be made without departing from the spirit of the present invention.

10: The alignment mark design information extracting unit
20: photographing apparatus
30: Aligned mark coordinate extraction unit
40: Position compensation value calculation means
41: virtual material change curve calculating section
42: Machining area division part
60: machining hole coordinate correcting unit
70: PCB hole processing part

Claims (16)

A machining position correcting device for hole machining of a PCB material,
An alignment mark design information extraction unit for extracting alignment mark design information from a design drawing for processing a PCB material;
An alignment mark coordinate extraction unit for extracting an actual coordinate position information of an alignment mark of the PCB material using a photographing apparatus;
Position compensation value calculating means for calculating a position compensation value for compensating a machining hole position according to material deformation on the basis of the alignment mark design information and actual coordinate position information;
And a machining hole coordinate correcting unit for correcting the machining hole position coordinate by the position compensation value calculated by the position compensation value calculating means,
Wherein the position compensation value calculation means calculates a virtual material change curve expression for estimating a change of a material on the basis of the alignment mark design information and the actual coordinate position information; And a machining area dividing section for dividing the entire machining hole area by using the virtual material change curve expression calculated by the virtual material change curve calculating section.
The apparatus according to claim 1, wherein the photographing apparatus uses a vision camera for photographing a PCB material for hole processing and acquiring a PCB material image.
delete The virtual material change curve calculating unit may calculate an imaginary material change curve equation by adding an arbitrary alignment mark to the actual alignment mark design information of the actual PCB and determining an imaginary line passing through the alignment mark coordinates Machining position compensation device ..
The virtual material variation curve expression may be calculated through quadratic curve estimation based on the alignment mark design information and the actual coordinate position information or may be calculated through spline interpolation for each section A machining position correcting device.
The apparatus according to claim 4, wherein the material change curve expression is calculated through N (N? 3) order polynomial estimation based on the alignment mark design information and the actual coordinate position information.
The machining position correcting apparatus according to claim 1, wherein the machining area dividing unit divides the entire machining hole area into a shape close to a linear shape based on a virtual material change curve expression.
The apparatus according to claim 1, wherein the machining area dividing unit divides the entire machining hole area into a rectangular shape based on a virtual material change curve expression.
The method of claim 1, wherein the machining hole coordinate correction unit obtains a reference point of a virtual divided area for each of the divided areas, and corrects the machining hole coordinates by bilinear interpolation using the virtual divided area coordinates corresponding to the acquired reference point And the machining position correcting device.
A machining position correcting method for hole machining of a PCB material,
(a) receiving a design drawing for processing a PCB material and extracting alignment mark design information from the input design drawing;
(b) extracting actual coordinate position information of the alignment mark of the PCB material using the photographing apparatus;
(c) calculating a position compensation value for compensating a machining hole position according to material deformation based on the alignment mark design information and the actual coordinate position information; And
(d) correcting the machining hole position coordinates to the position compensation value calculated in the step (c)
The step (c) includes the steps of: (c1) calculating a virtual material change curve expression for estimating a change of a material on the basis of the alignment mark design information and the actual coordinate position information; (c2) dividing the entire machining hole region using the virtual material variation curve equation calculated in the step (c1).
delete [11] The method of claim 10, wherein the step (c1) further comprises the step of adding an arbitrary alignment mark to the actual alignment mark design information of the actual PCB and calculating a virtual material variation curve expression through a virtual line passing through the alignment mark coordinates Position correction method.
The method of claim 10, wherein the step (c1) comprises: calculating a virtual material variation curve expression by estimating a quadratic curve based on the alignment mark design information and the actual coordinate position information, And calculating a material change curve expression.
[10] The method of claim 10, wherein the step (c2) comprises segmenting the entire machining hole area into a shape close to a linear shape based on a virtual material change curve.
[10] The method of claim 10, wherein the step (c2) comprises segmenting the entire machining hole area into a rectangular shape based on a virtual material change curve.
[11] The method of claim 10, wherein the step (d) comprises: obtaining a reference point of a virtual divided area for each of the divided areas, and correcting the processed hole coordinates by bilinear interpolation using the virtual divided area coordinates corresponding to the obtained reference point Wherein the machining position correcting method comprises:

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