JP2013123766A - Processing point position correcting method in groove processing of thin film solar cell workpiece - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a processing point position correcting method in which a workpiece exclusively for correction is made unnecessary by processing a processing point position correction mark in an optional position in an edge deletion region of a thin film solar cell workpiece when groove processing is performed in the thin film solar cell workpiece.SOLUTION: The processing point position correcting method includes: a step for relatively moving a processing point of a processing means to an optional position in the edge deletion region of the thin film solar cell workpiece; a step for processing the processing point position correction mark in an optional position of the edge deletion region; a step for detecting the processing point position correction mark; a step for measuring a center position of the processing point position correction mark; a step for comparing the center position of the processing point position correction mark with a targeted position when the processing point position correction mark is processed and calculating a displacement of the processing point; a step for setting, to a controller, a correction amount canceling the displacement of the processing point; and a step for determining whether the displacement after correction is lower than an allowable value and outputting an alarm when it is an allowable value or higher.

Description

  The present invention relates to a method for correcting a processing point position of processing means when linearly grooving a thin film solar cell work.

  Conventionally, in a thin film solar cell manufacturing process, in order to separate a thin film layer from an adjacent structure with respect to a thin film solar cell work in which a thin film is arranged on the surface of a transparent glass substrate, a linear shape is formed by laser light irradiation or the like. Grooving is applied to A laser processing apparatus that performs such groove processing is disclosed in Patent Document 1, for example. The laser processing apparatus of Patent Document 1 irradiates laser light from the back side of the workpiece to the thin film on the surface side of the workpiece by a processing head unit (processing means) disposed on the back side of the thin film solar cell workpiece. Has been given. Since variations in the interval between the processed grooves have a large effect on the performance of the thin film solar cell, it is necessary to maintain the positioning of the processing points of the processing means with high accuracy.

  Japanese Patent Application Laid-Open No. 2004-26883 discloses a printed circuit board processing machine for processing a workpiece by irradiating a laser beam to a processing position, in order to confirm the positioning accuracy of a galvano mirror when a galvano correction time specified in advance is reached. It is disclosed that a galvano accuracy correction work is irradiated with light, a processed hole is read by a camera, a position error is obtained by an image device, and the galvano device is corrected based on the position error.

WO2010 / 101060A1 publication (FIG. 2)

JP 2004-130365 A (paragraph 0023)

  Acrylic plates are usually used for correction work in laser processing machines because they are cheap, easy to obtain, lightweight, easy to handle, and easy to work with. When processing marks on correction workpieces with different plate thicknesses, it is necessary to change the processing conditions such as laser output, number of shots, and focal length, as well as tolerances and correction amounts for position errors due to differences in materials and plate thickness. Also had to be taken into account, which was a burden on the workers.

  Also, in order to reduce the cost of the compensation dedicated work, in order to maximize the number of marks processed per compensation dedicated work, the number of marks on the compensation dedicated work and each The distance between marks must be obtained and control must be performed so that the mark position is shifted, and the size of the compensation-dedicated workpiece must also be determined in consideration of the size of the device, the number of machining axes, the clamping mechanism, etc. The burden on the worker was further increased.

  In addition to the cost of the compensation-dedicated workpiece, using the compensation-dedicated workpiece, installation space for the compensation-dedicated workpiece, clamping mechanism, time required for loading / unloading for the compensation-dedicated workpiece, dedicated for loading / unloading A mechanism or the like is required, increasing the production cost and reducing the production efficiency.

  Therefore, an object of the present invention is to solve the above-described problems of the prior art due to the use of a correction-dedicated workpiece.

  In order to solve the above-mentioned problems, the processing point position correction mark is processed at an arbitrary position in the edge deletion region of the thin film solar cell work, so that the work dedicated for correction is not required.

  The edge deletion region is a region provided at the peripheral portion of the workpiece to be insulated so as to ensure electrical insulation from the surroundings, and is usually set at a certain width or more from the end of the workpiece.

  In a thin film solar cell workpiece, the edge deletion region is set with a predetermined width (for example, 10 to 15 mm) from the edge of the workpiece so as to surround the groove processing region, and is subjected to insulation processing in a subsequent process of the groove processing. In this case, even if a mark or the like that is not necessary for processing the thin film solar cell is processed in the edge deletion region, the battery performance is not affected. In addition, since the material and thickness of the edge deletion area are exactly the same as those of the groove processing area, processing conditions such as laser output and focal length are required for processing the processing point position correction mark in the edge deletion area. There is no need to set a new. The processing point position correction mark can be processed under the same processing conditions as the groove processing, so that the reliability of positioning accuracy is improved. Furthermore, since the mark processing position may be an arbitrary position within the edge deletion area, it is not necessary to perform mark position control that shifts the mark position to the correction-dedicated work. From the above, the inventor of the present application has found that the processing point position correction mark should be processed in the edge deletion region.

  The present invention eliminates the need for a compensation-only workpiece, and eliminates the cost, installation space, clamping mechanism, time required for loading / unloading the compensation-only workpiece, and a dedicated mechanism for loading / unloading. Costs can be reduced, downtime can be reduced, and initial costs can be reduced, leading to improved productivity.

It is a flowchart which shows the operation | movement of the process point position correction process which concerns on this invention. It is a top view for demonstrating the edge deletion area | region of a thin film solar cell workpiece. It is a figure for demonstrating the relationship between the position which the mark for process point position correction was processed, and the aim position of the mark for process point position correction. It is a figure for demonstrating the positional relationship of the mark for process point position correction, and the mark for process point position confirmation. It is a whole block diagram of the apparatus which gives a groove process to the thin film solar cell workpiece | work which concerns on this invention. FIG. 6 is an overall configuration diagram when the mark position detection in FIG. 5 is performed by image processing.

  Hereinafter, the present invention will be described in detail based on illustrated embodiments.

  The processing point position correction processing in the step of grooving the workpiece of the thin-film solar cell is performed with a flow as shown in FIG. 1 at every predetermined correction time interval.

  First, correction processing is performed. In the first step S10, as shown in FIG. 2, the processing point of the processing unit 20 is relatively moved to an arbitrary position in the edge deletion region 1a of the thin-film solar cell work 1 by using the positioning unit 24. The positioning means 24 is an XY table as an example. Or what mounted the drive device in the processing means 20 or the mark position detection means 21 may be used. Examples of the processing means 20 include a laser oscillator, a galvano scanner, and a drill.

  In the next step S20, the processing point position correcting mark 11 is processed at an arbitrary position in the edge deletion area 1a by using the processing means 20. The shape of the processing point position correction mark 11 is a cross shape or a round shape (point), and the mark size is usually about 1 mm × 1 mm in the case of a cross shape, but the mark position detection means 21 can detect the center position. If it is.

  Next, the mark position detecting means 21 shown in FIG. 5 detects the machining point position correcting mark 11 (S30), measures the center position of the mark (S40), and calculates the deviation from the target position 12 (S40). S50).

  When the mark position is detected by image processing, for example, as shown in FIG. 6, the image pickup means 22 for picking up the processing point position correction mark 11, the center position of the mark is measured from the picked up image, and the target position 12 is obtained. And an image processing device 23 for calculating a deviation amount.

  For example, when the center position of the image pickup unit 22 is set as the reference position of the apparatus, the center position of the image pickup unit 22 becomes the target position 12 as shown in FIG.

  In the case of performing image processing, steps S30 to S50 are as follows.

  In step S30, the imaging point of the imaging unit 22 is moved relative to the position of the processing point position correction mark 11 using the positioning unit 24, and the processing point position correction mark 11 is imaged using the imaging unit 22.

  In step S <b> 40, the center position of the processing point position correction mark 11 is measured from the captured image using the image processing device 23.

In step S50, the image processing device 23 compares the center position of the processing point position correction mark 11 measured in step S40 with the target position 12 when processing the processing point position correction mark 11 to process the position of the processing point. The amount of deviation is calculated. For example, the distance from the reference position is measured, the target position 12 is P12 = (X12, Y12) = (10 mm, 10 mm), and the center position of the processing point position correction mark 11 is P11 = (X11, Y11) = (
Assuming that X12−0.012 mm, Y12 + 0.010 mm), the machining point shift amount D is D = (ΔX, ΔY) = (− 0.012 mm, +0.010 mm).

  In step S <b> 60, a correction amount A that cancels the machining point deviation amount D is set in the control device 25. The correction amount A in this embodiment is A = (Xa, Ya) = (− ΔX, −ΔY) = (+ 0.012 mm, −0.010 mm), which is set in the control device 25. As a result, the machining point moves to a position where P = (X, Y) = (X12 + Xa, Y12 + Ya) = (10 + 0.012 mm, 10−0.010 mm) = (10.122 mm, 9.990 mm), and the target position 12 The position of the processing point is corrected so that the processing point position correction mark 11 is processed.

  Next, a confirmation process is performed to determine whether the set correction amount A is appropriate. In step S110, as in step S10, the processing point of the processing means 20 in the edge deletion region 1a of the thin-film solar cell work 1 is arbitrarily spaced from the processing point position correction mark 11 processed in S20. Move relative to position.

  In step 120, the processing point position confirmation mark 111 is processed at an arbitrary position having a certain distance from the processing point position correction mark 11 in the edge deletion area 1a by using the processing means 20. Usually, the processing point position confirmation mark 111 is the same as the processing point position correction mark 11. The positional relationship between the processing point position correction mark 11 and its target position 12 and the processing point position confirmation mark 111 and its target position 112 is shown in FIG.

  Next, the mark position detection means 21 shown in FIG. 5 detects the machining point position confirmation mark 111 (S130), measures the center position of the mark (S140), and the amount of deviation from the target position 112 at this time Is calculated (S150). Normally, steps S130 to S150 are performed in the same procedure as steps S30 to S50.

  In step S160, the corrected machining point deviation D ′ = (ΔX ′, ΔY ′) calculated in step S150 is compared with an allowable value T = (Tx, Ty) to determine whether it is less than the allowable value. To do. When ΔX ′ <Tx and ΔY ′ <Ty, it is determined that the value is less than the allowable value.

  If the corrected machining point deviation amount D ′ is greater than or equal to the allowable value, an alarm is output that the machining means 20 is abnormal, and the machining point position correction process is terminated.

  When the corrected machining point deviation amount D ′ is less than the allowable value, the machining point position correction process is terminated as it is.

DESCRIPTION OF SYMBOLS 1 Thin film solar cell work 1a Edge deletion (insulation process) area | region 1b Groove process area | region 11 Mark for process point position correction | amendment 12 Target position of the mark for process point position correction | amendment 20 Process means 21 Mark position detection means 22 Imaging means 23 Image processing apparatus 24 Positioning means 25 Control device 111 Machining point position confirmation mark 112 Target position of machining point position confirmation mark

Claims (1)

When a thin film is placed on the surface of a transparent glass substrate and a thin film solar cell workpiece having an edge deletion region that is subjected to insulation processing at a peripheral portion in a subsequent process is subjected to grooving using a processing means, a predetermined correction time A machining point position correction method for correcting a displacement of a machining point of the machining means for each interval,
Relatively moving the machining point of the machining means to an arbitrary position in the edge deletion area of the workpiece;
Processing a processing point position correction mark at the arbitrary position using the processing means;
Detecting the machining point position correction mark;
Measuring the detected center position of the processing point position correction mark;
Comparing the center position of the processing point position correction mark and the target position at the time of processing point position correction mark processing, and calculating a processing point deviation amount;
Setting a correction amount for canceling the deviation amount of the machining point in the control device;
Relatively moving the machining point of the machining means to an arbitrary position having a fixed distance from the machining point position correction mark in the edge deletion area of the workpiece;
Processing the processing point position confirmation mark at an arbitrary position having a certain distance from the processing point position correction mark using the processing means;
Detecting the processing point position confirmation mark;
Measuring the center position of the detected processing point position confirmation mark;
Comparing the center position of the processing point position confirmation mark and the target position at the time of processing point confirmation mark processing, and calculating a corrected deviation amount of the processing point;
Determining whether the calculated post-correction deviation amount of the machining point is less than an allowable value;
If the amount of deviation after correction of the machining point is greater than or equal to an allowable value, outputting an alarm;
A machining point position correcting method characterized by comprising:

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