JP2012208237A - Inspection device for drawing apparatus, drawing apparatus, program, inspection method for drawing apparatus, and manufacturing method for printed circuit board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To inspect the ability of a drawing apparatus more easily and to make a correction if necessary.SOLUTION: An inspection device for a drawing apparatus comprises: a storage device storing drawing data including a first mark and a second mark, one surrounding the other; first drawing parts (an exposure control part 201d and so on) for causing the drawing apparatus to draw the first mark based on the drawing data; a first detection part (a drawing position detecting part 201i) for detecting the position of the drawn first mark; a correction part (a data correcting part 201e) for correcting the drawing data based on the drawing data and the detected position of the first mark; second drawing parts (an exposure control part 201d and so on) for causing the drawing apparatus to draw the second mark based on the corrected drawing data; a second detection part (a drawing position detection part 201i) for detecting the position of the drawn second mark; and a displacement acquisition part (a data processing part 201k) for obtaining, based on the detected positions of the first and second marks, the aspect of the displacement between them.

Description

  The present invention relates to a drawing apparatus inspection apparatus, a drawing apparatus, a program, a drawing apparatus inspection method, and a printed wiring board manufacturing method.

  Patent Document 1 discloses a drawing apparatus.

Japanese Patent No. 4244156

  In recent years, in drawing in the production of a printed wiring board or the like, high-accuracy alignment may be required. However, in the drawing apparatus described in Patent Literature 1, the stability of the alignment accuracy is not sufficient, and the alignment accuracy is manually inspected, so that it takes time and effort to confirm the alignment accuracy. There is.

  The present invention has been made in view of such circumstances, and an object of the present invention is to more easily check the capability of the drawing apparatus and correct it if necessary. Another object of the present invention is to form an opening in a solder resist with high positional accuracy in the production of a printed wiring board.

  An inspection apparatus for a drawing apparatus according to the present invention includes a storage device that stores drawing data including a first mark and a second mark, one of which has a shape surrounding the other, and a drawing apparatus based on the drawing data. Based on the first drawing unit for drawing the first mark, the first detection unit for detecting the position of the drawn first mark, the drawing data and the position of the detected first mark, A correction unit that corrects the drawing data; a second drawing unit that causes the drawing device to draw the second mark based on the corrected drawing data; and a second unit that detects a position of the drawn second mark. 2 detection units, and a displacement acquisition unit for obtaining a displacement mode of both based on the detected position of the first mark and the detected position of the second mark.

  A drawing apparatus according to the present invention includes an inspection apparatus for the drawing apparatus.

  A program according to the present invention is a first drawing unit that causes a drawing device to draw a first mark based on drawing data including a first mark and a second mark having a shape in which one surrounds the other. A first detection unit for detecting a position of the drawn first mark; a correction unit for correcting the drawing data based on the drawing data and the detected position of the first mark; and the corrected drawing data A second drawing unit that causes the drawing device to draw the second mark, a second detection unit that detects a position of the drawn second mark, and the detected position of the first mark. Further, based on the position of the second mark, it is made to function as a displacement acquisition unit for obtaining the position displacement mode of both.

  In the drawing apparatus inspection method according to the present invention, the computer causes the drawing apparatus to draw the first mark based on the drawing data including the first mark and the second mark having a shape in which one surrounds the other. And the computer detects the position of the drawn first mark, and the computer corrects the drawing data based on the drawing data and the detected position of the first mark; Based on the corrected drawing data, the computer causes the drawing device to draw the second mark, the computer detects the position of the drawn second mark, and the computer detects the detection. And determining a position shift mode of both based on the position of the first mark and the detected position of the second mark.

  The manufacturing method of the printed wiring board concerning this invention includes forming an opening part in the soldering resist of a printed wiring board with the said drawing apparatus.

  According to the present invention, the ability of the drawing apparatus can be more easily inspected and corrected if necessary. Or according to this invention, in manufacture of a printed wiring board, an opening part can be formed in a soldering resist with high position accuracy.

It is a figure which shows the outline | summary of the drawing apparatus which concerns on embodiment of this invention. It is a figure which shows the outline | summary of the exposure machine which concerns on embodiment of this invention. It is a figure for demonstrating operation | movement of the exposure machine which concerns on embodiment of this invention. It is a figure which shows the structure of the control unit which concerns on embodiment of this invention. It is a functional block diagram of the computer contained in the control unit which concerns on embodiment of this invention. It is a 1st flowchart which shows the inspection method of the drawing apparatus which concerns on embodiment of this invention. It is a figure which shows the 1st drawing pattern of the drawing data which concerns on embodiment of this invention. In the embodiment of the present invention, it is a figure showing another example of the 1st drawing pattern. It is a figure which shows the 2nd drawing pattern of the drawing data which concerns on embodiment of this invention. In the embodiment of the present invention, it is a figure showing another example of the 2nd drawing pattern. It is a figure which shows the relationship between the 1st inspection mark and 2nd inspection mark which concern on embodiment of this invention. It is a figure for demonstrating the drawing aspect which concerns on embodiment of this invention. It is a figure which shows the drawn 1st drawing pattern in the test | inspection of the drawing apparatus which concerns on embodiment of this invention. FIG. 6 is a diagram showing drawing data before correction in the correction of drawing data according to the embodiment of the present invention. FIG. 5 is a diagram illustrating a correction mode of a drawing data coordinate system in correction of drawing data according to the embodiment of the present invention. FIG. 4 is a diagram showing corrected drawing data in correction of drawing data according to the embodiment of the present invention. FIG. 5 is a diagram illustrating a drawing mode after correction in the correction of drawing data according to the embodiment of the present invention. It is a figure which shows the board | substrate with which the 1st inspection mark and the 2nd inspection mark were drawn in the test | inspection of the drawing apparatus which concerns on embodiment of this invention. It is a 2nd flowchart which shows the inspection method of the drawing apparatus which concerns on embodiment of this invention. It is a figure which shows the position shift aspect which concerns on embodiment of this invention. It is a figure for demonstrating the 1st process of the manufacturing method of the printed wiring board which concerns on embodiment of this invention. It is a top view of the printed wiring board shown to FIG. 18A. It is a figure for demonstrating the 2nd process after the process of FIG. 18A. It is a top view of the printed wiring board shown to FIG. 19A. It is a figure for demonstrating the 3rd process after the process of FIG. 19A. It is a figure for demonstrating the 4th process after the process of FIG. It is a top view of the printed wiring board shown to FIG. 21A. In another embodiment of the present invention, it is a flowchart showing an inspection method of a drawing apparatus that corrects drawing data only in a predetermined case. In another embodiment of the present invention, it is a flowchart showing an inspection method of a drawing apparatus that corrects drawing data again when drawing positional deviation based on corrected drawing data is large. In another embodiment of the present invention, it is a flowchart showing an inspection method of a drawing apparatus in which different processing is performed according to the degree of misalignment. In drawing data concerning an embodiment of the present invention, it is a figure showing the 1st other example in which the 2nd inspection mark has other shapes. In drawing data concerning an embodiment of the present invention, it is a figure showing the 2nd other example in which the 2nd inspection mark has other shapes. In the drawing data which concerns on embodiment of this invention, it is a figure which shows the 3rd another example in which the 2nd test | inspection mark has another shape. In the manufacturing method of the printed wiring board concerning the embodiment of the present invention, it is a figure showing another example in which the pad of the outermost layer of a printed wiring board has other shapes. In the drawing data which concerns on embodiment of this invention, it is a figure which shows the 1st another example in which the 1st mark for inspection has another shape. In drawing data concerning an embodiment of the present invention, it is a figure showing the 2nd other example in which the 1st inspection mark has other shapes. In other embodiment of this invention, it is a figure which shows the drawing data by which the some 1st mark for an inspection is enclosed by the mark for 2nd inspection.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In the figure, arrows X1, X2, Y1, Y2, Z1, and Z2 indicate six directions related to three axes (XYZ axes) orthogonal to each other. Hereinafter, “upper” means the Z1 side, and “lower” means the Z2 side.

  “Light” is not limited to visible light. In addition to visible light, light includes short-wave electromagnetic waves such as ultraviolet rays and X-rays and long-wave electromagnetic waves such as infrared rays.

  The “opening” includes notches and cuts in addition to holes and grooves.

  In “enclose”, in addition to completely closing one region with a ring having no cuts (see FIG. 9), surrounding one region with a ring having some cuts (see FIG. 25A) In addition, a region surrounded by a dashed ring (see FIG. 25B) is also included. A ring refers to a plane figure formed by connecting both ends of a line, and includes not only a circle (see FIG. 9) but also a polygon (see FIG. 26).

  The “positional deviation mode” includes not only the amount of positional deviation (distance) but also the direction of positional deviation.

  The drawing apparatus 1000 of this embodiment (specifically, a drawing apparatus having an inspection apparatus) includes a processing unit 100 and a control unit 200 as shown in FIG. The control unit 200 is communicably connected to the processing unit 100 in a wired or wireless manner, acquires signals (detected values and the like) from the sensors of the processing unit 100, and gives instructions to the actuators of the processing unit 100.

  The processing unit 100 includes an input unit 101, an exposure machine 102, and a payout unit 103. The exposure machine 102 includes a transport unit 102a, an alignment unit 102b, and an exposure unit 102c.

  The input unit 101 is connected to the payout unit 103 via the transport unit 102a, and the transport unit 102a is connected to the exposure unit 102c via the alignment unit 102b. These are connected so that the substrate S can be transferred to each other. The substrate S set in the loading unit 101 is loaded into the transport unit 102a, and is transported from the transport unit 102a to the exposure unit 102c via the alignment unit 102b. Then, after the substrate S is exposed by the exposure unit 102c, the exposure position (for example, XY coordinates) is measured by the alignment unit 102b, and the substrate S is delivered to the delivery unit 103 through the transport unit 102a. In the present embodiment, the control unit 200 controls the transport (automatic transport) of the substrate S.

  FIG. 2 shows an outline of the exposure device 102. The exposure apparatus 102 of the present embodiment directly draws a predetermined pattern on the substrate S by light controlled based on, for example, predetermined drawing data (specifically, an electromagnetic wave having a predetermined wavelength emitted from a light source) ( A direct type exposure machine (hereinafter referred to as a direct image exposure machine). According to the exposure device 102, a pattern corresponding to predetermined drawing data can be exposed on the substrate S. In the present embodiment, a rectangular pattern is used as a drawing data pattern (hereinafter referred to as a drawing pattern) (see FIGS. 7A and 8A described later). Hereinafter, data in the X direction of the drawing pattern is referred to as an X line, and data in the Y direction of the drawing pattern is referred to as a Y line. However, the drawing pattern is not limited to a rectangular pattern and is arbitrary.

  The exposure machine 102 includes bases 10 and 20, a stage 30, and a U-shaped gate 70.

  In this embodiment, the base 10 consists of a rectangular parallelepiped board which makes a Y direction a longitudinal direction. On the base 10, two rails 11a and 11b extending in the Y direction are laid.

  The base 20 is connected to the base 10 via a connecting material 21. The base 20 is formed of a rectangular parallelepiped block, for example, and is disposed on both sides (X1 side and X2 side) of the base 10.

  The stage 30 is arrange | positioned on the base 10, and has the flat table 31, 32, 33 in this order from the Z2 side (base 10 side).

  On the table 31, two rails 31a extending in the X direction are provided. Further, two bars 31b extending in the same direction as the rails 11a and 11b (that is, the Y direction) are provided under the table 31, and each bar 31b can be engaged with the rails 11a and 11b. A guide 31c is attached. For example, two guides 31c are provided for each rail. The interval between the two bars 31b corresponds to the interval between the rails 11a and 11b, and the table 31 (and thus the stage 30) is moved on the base 10 by the guide 31c engaging with the rails 11a and 11b. It is possible to move along the rails 11a and 11b (that is, in the Y direction). Power for moving the stage 30 in the Y direction is applied by, for example, a motor 35. In the present embodiment, the motor 35 is an AC servo motor. Further, the position of the stage 30 in the Y direction (hereinafter referred to as Y coordinate) is detected by, for example, a linear encoder. This linear encoder corresponds to a Y position detector 35a (FIGS. 4 and 5) described later. The resolution of the linear encoder is preferably about 0.2 μm.

  A guide 32a that can be engaged with the rail 31a is attached under the table 32. For example, two guides 32a are provided for each rail. By engaging the guide 32a with the rail 31a, the table 32 (and also the table 33) can move on the table 31 along the rail 31a (that is, in the X direction). Power for moving the tables 32 and 33 in the X direction is applied by a motor 34, for example. In the present embodiment, the motor 34 is an AC servo motor. The position in the X direction of the stage 30 (hereinafter referred to as X coordinate) is detected by, for example, a linear encoder. This linear encoder corresponds to an X position detector 34a (FIGS. 4 and 5) described later. The resolution of the linear encoder is preferably about 0.2 μm.

  The table 32 and the table 33 are coupled so as to be relatively movable in the Z direction. The table 33 can be moved up and down with respect to the table 32 along a guide in the Z direction (not shown). Power for moving the table 33 in the Z direction is applied by a motor 36, for example. In the present embodiment, the motor 36 is an AC servo motor. Further, the position of the table 33 in the Z direction (hereinafter referred to as Z coordinate) is detected by, for example, a rotary encoder. This rotary encoder corresponds to a Z position detector 36a (FIGS. 4 and 5) described later. The resolution of the rotary encoder is preferably about 0.0013 μm, and the command unit of the rotary encoder is preferably about 0.1 μm.

  The gate 70 is provided so as to straddle the base 10. The stage 30 can pass through the gate 70 by moving in the Y direction. The gate 70 includes a leg portion 40, a top plate 50, and an exposure unit 60.

  The leg 40 is erected on the base 20. When the base 20 is fixed to the base 10 and the leg portion 40 is fixed to the base 20, the gate 70 is fixed to the base 10.

  A plurality of (for example, three) cameras 51 are attached to the front surface (Y1 side) of the top board 50. Each of the cameras 51 is attached in such a manner that it can move relative to the top board 50. Specifically, the cameras 51 are arranged, for example, in the X direction, and each of the cameras 51 can move along a direction (that is, the X direction) orthogonal to the moving direction (Y direction) of the stage 30. It has become.

  By moving the table 33 below the camera 51 (a position corresponding to the alignment portion 102b (FIG. 1)), the camera 51 optically changes the surface form (particularly the exposure position) of the substrate S on the table 33. Can be recognized. By moving the table 33 in the Y direction and the camera 51 in the X direction, it is possible to recognize the form of an arbitrary position on the substrate S (and thus the entire surface of the substrate S). In the present embodiment, the camera 51 is disposed in the vicinity of the (exposure head). This makes it easier to accurately capture the exposure position with the camera 51.

  The camera 51 is composed of, for example, a CCD (Charge Coupled Device) as an imaging device. However, the present invention is not limited to this, and the number, type, and arrangement of the cameras 51 are arbitrary. For example, the camera 51 may be composed of a CMOS (Complementary Metal Oxide Semiconductor) as an image sensor.

  Power for moving the camera 51 in the X direction is applied by a motor 52, for example. In the present embodiment, the motor 52 is an AC servo motor. The X coordinate of the camera 51 is detected by, for example, a rotary encoder. This rotary encoder corresponds to a camera position detection unit 52a (FIGS. 4 and 5) described later. The resolution of the rotary encoder is preferably about 0.0013 μm, and the command unit of the rotary encoder is preferably about 0.1 μm.

  The exposure unit 60 includes a light source unit 61, an exposure optical system 62, and a temperature adjustment unit 63. In the present embodiment, the exposure unit 60 performs drawing (exposure) by the projection exposure method. The position of the light exit (exposure head) for performing drawing is fixed. The exposure method of the exposure unit 60 is not limited to the projection exposure method and is arbitrary.

  As shown in FIG. 3, the light source unit 61 includes a high-pressure mercury lamp 61a (light source) and an ellipsoidal mirror 61b. However, the configuration is not limited to this, and the configuration of the light source unit 61 is arbitrary. For example, a semiconductor laser or the like may be used instead of the high-pressure mercury lamp 61a. The wavelength of the light source is, for example, in the ultraviolet (UV) region.

  As shown in FIG. 2, the exposure optical system 62 includes a plane mirror 62a, a collimator lens 62b, a fly-eye lens 62c, a relay lens 62d, a plane mirror 62e, a condenser lens 62f, a DMD (Digital Micro-mirror). Device: a registered trademark) element 62g and an imaging lens 62h.

  In this embodiment, eight sets of exposure optical systems 62 are arranged in the X direction, and light is irradiated onto the substrate S from each exposure head (imaging lens 62h). Here, the DMD element 62g is a reflective spatial light modulation element having a group of micromirrors, and is on / off controlled in units of micromirrors. The exposure / non-exposure of each exposure optical system 62 varies depending on the state (on / off) of the micromirror of the DMD element 62g. Therefore, by controlling the state (for example, angle) of the micromirror of the DMD element 62g of each exposure optical system 62 arranged in the X direction according to the drawing pattern, drawing is performed as a dot pattern corresponding to the state of each micromirror. Any X line of the pattern can be drawn (exposed). Further, the entire drawing pattern can be drawn on the substrate S by moving the stage 30 in synchronization with the exposure of each exposure optical system 62 (X line drawing) (see FIG. 10 described later in detail). The number of exposure optical systems 62 is arbitrary. The spatial light modulation element is not limited to the DMD element 62g, and is arbitrary. For example, an LCD (Liquid Crystal Display) or an AOM (Acoustic Optical Modulator) may be used instead of the DMD element 62g.

  The operation of the exposure apparatus 102, particularly the exposure optical system 62, will be described below mainly with reference to FIG. In FIG. 3, the collimator lens 62b and the like are omitted for convenience.

  As shown in FIG. 3, in the exposure optical system 62, the light emitted from the high-pressure mercury lamp 61a is turned back by a plane mirror 62a (cold mirror), so that a necessary wavelength is cut out. Then, the light reflected by the plane mirror 62a is condensed by a collimator lens 62b (FIG. 2) as a condensing optical element, and is made uniform by a fly-eye lens 62c (FIG. 2) as an integrator. The uniformized light (planar light) passes through the relay lens 62d (FIG. 2), is reflected by the plane mirror 62e, passes through the condenser lens 62f, and enters the DMD element 62g.

  Here, the DMD element 62g is controlled by the control unit 200 (FIG. 1). Specifically, if the instruction (exposure / non-exposure) given from the control unit 200 to the DMD element 62g is non-exposure, the light is reflected by the micromirror of the DMD element 62g, and the substrate S is not irradiated with light. Is exposed to light, the light passes through the DMD element 62g and is irradiated onto the substrate S through the imaging lens 62h.

  The temperature adjustment unit 63 includes, for example, a temperature sensor (temperature detection means) and a heater (heating means) not shown. In the present embodiment, the temperature adjustment unit 63 is controlled by the control unit 200 (FIG. 1). Specifically, the temperature sensor detects the temperature in the exposure unit 60 (such as the high-pressure mercury lamp 61a and the exposure optical system 62), and controls the heater based on the detected value to set the temperature in the exposure unit 60 to a predetermined value. It can be adjusted within the temperature range. The temperature adjustment unit 63 may include a cooling unit instead of or in addition to the heating unit.

  As shown in FIG. 4, the control unit 200 includes a computer 201, an auxiliary storage device 202, an input / output interface 203, a keyboard 204 (input device), and a monitor 205 (output device).

  The computer 201 includes a CPU and a RAM (main storage device), and is connected to each of the auxiliary storage device 202, the keyboard 204, and the monitor 205 via the input / output interface 203 so as to be communicable. The user can input data, instructions, and the like into the computer 201 by operating the keyboard 204. In addition, the calculation result of the computer 201 can be output (displayed) to the monitor 205. Note that the control unit 200 may have an input device such as a mouse instead of or in addition to the keyboard 204.

  As the auxiliary storage device 202, a ROM, a hard disk, an EEPROM (Electrically Erasable and Programmable Read Only Memory), or the like can be used. The number of auxiliary storage devices 202 is arbitrary, and for example, a plurality of different types of auxiliary storage devices 202 can be used. The auxiliary storage device 202 stores various programs, exposure conditions, drawing data, and the like.

  Signals (detection values, etc.) from the sensors of the processing unit 100 are input to the input / output interface 203, and signals (instructions, etc.) to the actuators of the processing unit 100 are output from the input / output interface 203.

  FIG. 5 is a functional block diagram of the computer 201. As shown in FIG. 5, the computer 201 includes a system control unit 201a, a data creation unit 201b, a data conversion unit 201c, an exposure control unit 201d, a data correction unit 201e, a stage control unit 201f, and a light source control. A unit 201g, a camera position controller 201h (imaging position controller), a drawing position detector 201i, a temperature controller 201j, and a data processor 201k. Each of these is configured by hardware such as a circuit, software (program) stored in a ROM or the like, or a combination of hardware and software.

  In the present embodiment, a CAD (Computer Aided Design) system is constructed by the data creation unit 201b, and a CAM (Computer Aided Manufacturing) system (hereinafter referred to as a drawing system) is constructed by the above-described units (FIG. 5) constituting the computer 201. Is done. In this drawing system, the system control unit 201a collectively controls the entire system. In the present embodiment, the system control unit 201a is connected so as to be able to communicate directly or indirectly with other parts constituting the drawing system (see FIG. 5). As a result, data can be exchanged and instructions can be transmitted within the drawing system via the system control unit 201a.

  The user can create drawing data by the data creation unit 201b. The drawing data created by the data creation unit 201b is output toward the data conversion unit 201c. Also, separately created drawing data can be input to the data conversion unit 201c. The data conversion unit 201c converts the data format of the drawing data into a predetermined data format (for example, raster data). In the present embodiment, drawing data is created as vector data, and converted to raster data (bitmap data) by the data conversion unit 201c.

  The exposure control unit 201d controls the DMD element 62g (for example, on / off of the micromirror) based on the drawing data that has been converted into a predetermined data format by the data conversion unit 201c. The data correction unit 201e also has predetermined drawing data stored in the auxiliary storage device 202 (FIG. 4) and a detection position of an inspection mark drawn on the substrate S based on the drawing data (hereinafter referred to as drawing). The drawing data is corrected based on the position). The exposure control unit 201d can also control the DMD element 62g based on the drawing data corrected by the data correction unit 201e (hereinafter referred to as corrected drawing data). The drawing position of the inspection mark can be detected by the camera 51.

  During drawing (exposure) of the inspection mark, the system control unit 201a controls the substrate fixing unit 37 through the stage control unit 201f to fix the substrate S on the stage 30, and the X position detection unit 34a and the Y position detection unit. The position of the stage 30 (specifically, the motors 34 to 36) is controlled while confirming the position of the stage 30 by the 35a and the Z position detection unit 36a, and the light source unit 61 (specifically, the light source unit 61) Strength etc.). The stage control unit 201f moves the stage 30 even during drawing (see FIG. 10 described later).

  When detecting the drawing position, the system control unit 201a controls the position of the camera 51 (specifically, the motor 52) while confirming the position of the camera 51 by the camera position detection unit 52a through the camera position control unit 201h. Based on the detection result of the camera 51, the drawing position of the inspection mark is acquired through the detection unit 201i.

  The temperature control unit 201j controls the temperature adjustment unit 63 so that the temperature in the exposure unit 60 is within a predetermined temperature range at least during drawing and detection.

  The data processing unit 201k calculates a shift mode between the two data detected by the camera 51, and outputs (displays) the calculation result (shift mode) to the monitor 205.

  Using such a drawing apparatus 1000, for example, the drawing apparatus as shown in FIGS. 6 and 16 can be inspected. In the present embodiment, data related to the drawing apparatus 1000 (particularly, the exposure device 102) is acquired based on drawing (exposure) in the process of FIG. 6, and the data acquired by the process of FIG. 6 is analyzed in the process of FIG. To do.

  Note that the processing by the computer 201 is started or proceeds, for example, when the CPU executes a predetermined program. The acquired data (detection or calculation) is stored in, for example, the auxiliary storage device 202 (FIG. 4). However, the present invention is not limited to this, and the data storage method is arbitrary. It is desirable to store data used for a long time in a nonvolatile storage device. In the present embodiment, the temperature control unit 201j controls the temperature adjustment unit 63 to always manage the temperature in the exposure unit 60 within a predetermined temperature range (for example, 22 ° C. ± 1.5 ° C.). .

  In step S <b> 11 of FIG. 6, for example, when the user operates the keyboard 204, parameters (dimensions of the substrate S, exposure conditions, etc.) used for inspection are set in the computer 201. Further, drawing data (for example, converted raster data) is stored in the auxiliary storage device 202 (FIG. 4).

  7A to 8B show dimensions and drawing patterns (first drawing pattern and second drawing pattern) of the substrate S according to the inspection of the present embodiment. In each figure, the width d11 indicates the width in the horizontal direction (X direction) of the substrate S, and the width d12 indicates the width in the vertical direction (Y direction) of the substrate S.

  In the present embodiment, as shown in FIGS. 7A and 8A, a rectangular substrate that is long in the lateral direction (X direction) is used as the substrate S. Specifically, the width d11 is, for example, 510 mm, and the width d12 is, for example, 340 mm. However, the present invention is not limited to this. For example, as shown in FIGS. 7B and 8B, a rectangular substrate (for example, 510 m long × 340 mm wide) that is long in the vertical direction (Y direction) may be used as the substrate S. Alternatively, the substrate S may be a square substrate. It is preferable to select an appropriate substrate S (inspection substrate) in accordance with the state of the drawing apparatus 1000 or the like.

  The drawing patterns used in this embodiment are the first drawing pattern shown in FIG. 7A and the second drawing pattern shown in FIG. 8A. As shown in FIGS. 7A and 8A, each of the first drawing pattern and the second drawing pattern is a grid-like (matrix-like) rectangular pattern. In the first drawing pattern, for example, nine dot-shaped (specifically, circular) first inspection marks M1 are arranged at substantially constant intervals in the horizontal direction (X direction) and the vertical direction (Y direction), respectively. In the second drawing pattern, for example, nine circular ring-shaped second inspection marks M2 are arranged at substantially constant intervals in the horizontal direction (X direction) and the vertical direction (Y direction). That is, the drawing pattern according to the present embodiment has nine X lines L11 to L19 and nine Y lines L21 to L29. Further, as shown in FIG. 9, the second inspection marks M2 related to the second drawing pattern are respectively arranged so as to surround the first inspection marks M1 related to the first drawing pattern. In the present embodiment, the position of the center of gravity of the first inspection mark M1 matches the position of the center of gravity of the second inspection mark M2. Then, the first inspection mark M1 and the second inspection mark M2 having such a relationship are disposed on substantially the entire surface of the substrate S, respectively.

  Note that the drawing data patterns (first drawing pattern and second drawing pattern) are not limited to the patterns shown in FIGS. 7A and 8A and are arbitrary. For example, as shown in FIGS. 7B and 8B, the pattern of the drawing data may be a rectangular pattern that is long in the vertical direction (Y direction). Alternatively, the drawing data pattern may be a square pattern or a circular pattern. The shapes of the first inspection mark M1 and the second inspection mark M2 are not limited to circles and are arbitrary (see FIG. 26). It is preferable to select appropriate drawing data according to the state of the drawing apparatus 1000 or the like.

  When all preparations necessary for the inspection are completed, the inspection program is executed by sending a command to the computer 201 through the keyboard 204, for example. However, the present invention is not limited to this, and may be automatically executed based on establishment of a predetermined condition.

  Subsequently, in step S12 of FIG. 6, the substrate S is loaded into the exposure device 102 (specifically, the transport unit 102a). Specifically, for example, an operator sets the substrate S in the input unit 101 (FIG. 1), and after the alignment, the control unit 200 (specifically, the computer 201) controls a transfer robot (not shown) to thereby control the input unit. The board | substrate S set to 101 is conveyed to the conveyance part 102a (FIG. 1).

  Prior to the loading, a photosensitive layer (hereinafter referred to as a photosensitive layer) is formed on the surface of the substrate S. Specifically, for example, a photosensitive dry film is pasted on the substrate S prior to loading. However, the present invention is not limited to this. For example, a photoresist may be applied to the surface of the substrate S.

  Subsequently, in step S13 of FIG. 6, the first inspection mark M1 (FIG. 7A) is drawn (exposed) on the substrate S (specifically, the photosensitive layer) based on the drawing data. The drawing method (exposure method) according to this embodiment will be described below mainly with reference to FIGS.

  The substrate S to be exposed (drawn) by the exposure unit 102c (FIG. 1) is placed on the table 33 at a position corresponding to the transport unit 102a (FIG. 1), and is fixed by the substrate fixing unit 37 (FIGS. 4 and 5). It is fixed on the table 33. Specifically, the substrate fixing unit 37 operates based on an instruction from the stage control unit 201 f to fix the substrate on the table 33. The substrate fixing unit 37 is composed of, for example, a vacuum suction device.

  Subsequently, when the stage control unit 201f controls the motor 35, the stage 30 moves on the base 10 to the Y2 side along the rails 11a and 11b. As a result, the substrate S is transported to a position corresponding to the exposure unit 102c (below the imaging lens 62h), specifically to the first exposure position.

  If necessary, the stage control unit 201f activates the motors 34 to 36 while confirming the position of the stage 30 by the X position detection unit 34a, the Y position detection unit 35a, and the Z position detection unit 36a based on the drawing data. To adjust the X, Y, and Z coordinates of the stage control unit 201f.

  Subsequently, a first drawing pattern (see FIG. 7A) is drawn on the substrate S. Specifically, as shown in FIG. 10, the lateral width (X-direction width) of the substrate S is divided into eight bands B11 to B18 (corresponding to the number of exposure optical systems 62), and these bands B11 to B18 are divided. Each is assigned to the exposure optical system 62 at the corresponding position. Each of the bands B11 to B18 is further divided into three regions (drawing bands B1 to B3), and the drawing heads of the exposure optical systems 62 draw the drawing bands B1 to B3 in each of the bands B11 to B18 in order. I will do it. The drawing bands B1, B2, and B3 are drawn in this order by moving the stage 30 in the Y direction or the X direction while performing exposure by each exposure optical system 62. Then, the drawing head of the exposure optical system 62 reciprocates the substrate S in the vertical direction (Y direction) by 1.5, thereby scanning the entire region of the substrate S. As a result, the entire first drawing pattern (specifically, all the first inspection marks M1 constituting the first drawing pattern) is drawn on the substrate S. The widths of the drawing bands B1 to B3 are each 22.5 mm, for example, the widths of the bands B11 to B18 are each 67.5 mm (= 22.5 mm × 3), for example, and the maximum drawing width is 540 mm (= 67.5 mm × 8). Hereinafter, the first inspection mark related to the drawing data is referred to as the first inspection mark M1, while the actually drawn first inspection mark is referred to as the first inspection mark A1.

  The exposure by the exposure optical system 62 is performed, for example, when the light source control unit 201g controls the light source unit 61 and the exposure control unit 201d controls the DMD element 62g. The exposure control unit 201d controls on / off of the micromirror of the DMD element 62g based on the drawing data (see FIG. 7A) converted into a predetermined data format (for example, raster data) by the data conversion unit 201c. By doing so, the dot pattern of each X line exposed by the exposure optical system 62 corresponds to each X line of the drawing data.

  The stage 30 is moved during drawing by the stage controller 201 f controlling the motors 34 and 35. The stage control unit 201f moves the stage 30 in the Y direction or the X direction, for example, intermittently or continuously.

  By the exposure, the first inspection mark A1 (see FIG. 11) having a pattern corresponding to the drawing data (see FIG. 7A) is drawn on the substrate S. However, since the alignment accuracy of the exposure machine 102 (high ability to draw accurately at the intended position) is affected by the state of the exposure machine 102, the position of the first inspection mark M1 related to the drawing data is not necessarily the same. It does not coincide with the position (drawing position) of the first inspection mark A1 actually drawn. Therefore, in the subsequent step S14 in FIG. 6, the camera 51 detects the drawing position of the first inspection mark A1. Since the exposure apparatus 102 of the present embodiment has three cameras 51, three marks positioned at the same Y coordinate can be read simultaneously. In order to improve the reading accuracy, it is preferable to perform an operation of confirming the origin position of the camera 51 at a predetermined timing. The position detection by the camera 51 may be performed every time the exposure of a predetermined portion is completed, but it is preferable to perform the position detection after the exposure of all the patterns in order to improve the work efficiency.

  In the present embodiment, as shown in FIG. 11, among the drawn first inspection marks A1 (= 9 × 9), the first inspection marks A11 to A14 at the four corners of the substrate S, and the substrate The drawing positions of the first inspection marks A15 to A18 near the midpoint of each side of S and the first inspection mark A19 at the center of gravity of the substrate S are detected. The drawing data corresponding to the first inspection marks A11 to A14, A15 to A18, and A19 are referred to as first inspection marks M11 to M14, M15 to M18, and M19, respectively.

  When the drawing position of the first inspection mark A1 is detected, the stage control unit 201f controls the motors 34 and 35 to control the position of the stage 30 in the Y direction or the X direction, and the camera position control. The unit 201h controls the position of the camera 51 in the X direction by controlling the motor 52 while confirming the position of the camera 51 by the camera position detection unit 52a. Thereby, the stage 30 can be moved to the alignment part 102b (FIG. 1), and arbitrary 1st inspection marks A1 on the board | substrate S can be arrange | positioned under the camera 51. FIG. Then, the drawing position detection unit 201i performs predetermined signal processing (such as image processing and calculation) based on a signal (imaging signal) from the camera 51, thereby acquiring the drawing position of the first inspection mark A1. Can do.

  Subsequently, in step S15 of FIG. 6, the data correction unit 201e uses the drawing data (first inspection marks M11 to M19) stored in the auxiliary storage device 202 (FIG. 4) and the board based on the drawing data. The drawing data is corrected based on the positions (drawing positions) of the first inspection marks A11 to A19 drawn on S. Hereinafter, this correction will be described with reference to FIGS.

  For example, drawing is performed based on the first inspection mark M1 of the drawing data as shown in FIG. 12, and actually, the first inspection mark A1 is drawn on the substrate S (see FIG. 11) as shown in FIG. 13A. In this case, since a positional deviation has occurred between the first inspection mark M1 and the first inspection mark A1, the coordinate system (XY coordinate axes) of the drawing data is corrected based on the deviation. Specifically, as shown in FIG. 13A, the first inspection mark M1 is corrected to the opposite side by the amount of deviation, and the coordinate system of the drawing data is distorted accordingly (by interpolating the data). By recognizing the alignment mark and expanding / contracting the drawing data in accordance with the expansion / contraction of the alignment mark, the coordinates of the drawing data coincide with the coordinates on the substrate S to be actually drawn. Hereinafter, the corrected first inspection mark is referred to as a first inspection mark M1 ', and the X axis and the Y axis in the corrected coordinate system are referred to as an axis X' and an axis Y ', respectively. The coordinates of the drawing data before correction are defined by axes X and Y, and the coordinates of the drawing data after correction are defined by axes X ′ and Y ′ (pattern M10 shown in FIG. 12 and pattern M10 shown in FIG. 13B). 'reference).

  FIG. 13B shows the corrected drawing data. For example, if drawing is performed based on the first inspection mark M1 ′ and the pattern M10 ′ of the corrected drawing data, as shown in FIG. 14, the first inspection mark A1 and the pattern A10 are formed on the substrate S (FIG. 12). It is thought that it is drawn in (see).

  Such correction is performed on nine points of the first inspection marks M11 to M19 (FIG. 11). The correction value is stored in the auxiliary storage device 202 (FIG. 4) separately from the drawing data before correction. Thereby, the exposure control unit 201d controls the DMD element 62g based on the corrected drawing data (data in which the correction value is reflected in the drawing data before correction). However, the present invention is not limited to this, and the drawing data before correction may be deleted and updated (overwritten) to the drawing data after correction. Further, when the drawing data is corrected, the exposure control unit 201d may automatically use the corrected drawing data, or the user determines whether to use the drawing data before correction or the corrected drawing data. You may make it selectable.

  The correction method is not limited to the above method and is arbitrary. For example, position detection and drawing data correction may be performed for all first inspection marks M1 instead of only nine points. Further, more complicated correction may be performed using a finite element method or the like.

  Subsequently, in step S16 in FIG. 6, based on the corrected drawing data, the first inspection mark A1 drawn in step S13 is surrounded on the substrate S (specifically, the photosensitive layer) so as to surround each of the first inspection marks A1. 2 Draw (expose) the inspection mark M2 (FIG. 8A). The second inspection mark related to the drawing data is referred to as a second inspection mark M2, while the actually drawn second inspection mark is referred to as a second inspection mark A2. The second inspection marks A2 corresponding to the first inspection marks A11 to A14, A15 to A18, and A19 are referred to as second inspection marks A21 to A24, A25 to A28, and A29, respectively.

  In step S16 in FIG. 6, if the second inspection mark A2 is drawn out of the target position (drawing data) with the same tendency as when drawing the first inspection mark A1 (step S13 in FIG. 6). It is considered that the second inspection mark A2 is drawn so as to surround each of the first inspection marks A1. The control mode (control mode of the stage 30, the light source unit 61, the exposure optical system 62, etc.) when drawing the second inspection mark A2 is when drawing the first inspection mark A1 (step S13 in FIG. 6). It is the same. However, in the present embodiment, as described above, the second inspection mark A2 is aimed at the position of the already drawn first inspection mark A1 based on the corrected drawing data (corrected coordinate system). Each is drawn. As a result, it is considered that the second inspection mark A2 is drawn so as to surround each of the first inspection marks A1 drawn on the substrate S as shown in FIG.

  Subsequently, in step S <b> 17 of FIG. 6, the drawing position of the second inspection mark A <b> 2 is detected by the camera 51. Specifically, corresponding to the detection of the drawing position of the first inspection mark A1 (step S14 in FIG. 6), the second inspection marks A21 to A24 at the four corners of the substrate S and the vicinity of the midpoint of each side of the substrate S The drawing positions of the second inspection marks A25 to A28 and the second inspection mark A29 at the center of gravity of the substrate S are detected. The drawing data corresponding to the second inspection marks A21 to A24, A25 to A28, and A29 are referred to as second inspection marks M21 to M24, M25 to M28, and M29, respectively.

  In the present embodiment, the drawing position detection unit 201i performs predetermined signal processing (image processing, calculation, etc.) based on a signal (imaging signal) from the camera 51, thereby determining the drawing position of the second inspection mark A2. get. The control mode (control mode of the stage 30, the camera 51, etc.) when detecting the drawing position of the second inspection mark A2 is when detecting the drawing position of the first inspection mark A1 (step S14 in FIG. 6). ).

  Subsequently, in step S18 of FIG. 6, the substrate S is paid out from the exposure machine 102 to the payout unit 103 (see FIG. 1). Specifically, the stage control unit 201f controls the motor 35 to transfer the substrate S from the alignment unit 102b to the transfer unit 102a, and the control unit 200 (specifically, the computer 201) controls a transfer robot or the like (not shown). As a result, the substrate S is delivered to the delivery unit 103.

  As described above, the drawing positions of the first inspection marks A11 to A19 and the drawing positions of the second inspection marks A21 to A29 are obtained as data related to the drawing apparatus 1000 (particularly, the exposure apparatus 102) by the processing of FIG. Can be obtained. Next, in the process of FIG. 16, the data acquired by the process of FIG. 6 is analyzed. The process of FIG. 16 is automatically started when the drawing position of the second inspection mark A2 is detected in step S17 of FIG. 6, for example.

  In step S21 of FIG. 16, the data processing unit 201k displays the drawing position of the first inspection mark A1 (specifically, the first inspection marks A11 to A19 shown in FIG. 11) and the second inspection mark A2 (specifically, Then, a position deviation mode with respect to the drawing position of the second inspection marks A21 to A29) shown in FIG. 15 is obtained. In the present embodiment, a positional deviation amount is employed as the positional deviation mode. However, the present invention is not limited to this, and the position deviation mode to be obtained is arbitrary. For example, a vector including a direction (for example, an angle) may be obtained as the position deviation aspect.

  In the present embodiment, the data processing unit 201k uses the drawing position (for example, XY coordinates) of the first inspection mark A1 detected in step S14 in FIG. 6 and the second inspection mark A2 detected in step S17 in FIG. 17 and the center of gravity P1 of the first inspection mark A1 and the center of gravity P2 of the second inspection mark A2 (specifically, the center of gravity of the figure drawn by the ring), as shown in FIG. ) And a positional deviation amount (distance d10).

The distance d10 corresponds to the machine alignment accuracy. Alignment accuracy corresponding to camera 51 reading and recognition error is Cp1, drawing accuracy corresponding to machine writing position error is Cp2, DAT correction accuracy corresponding to data conversion error is Cp3, and corresponds to machine distortion due to temperature change When the in-machine temperature change to be performed is Cp4, it can be expressed as mechanical alignment accuracy = √ (Cp1 ² + Cp2 ² + Cp3 ² + Cp4 ² ).

A process capability index representing a numerical relationship between data distribution in a process and a standard is referred to as Cp. Cp is based on the premise that the center (= average value) of the distribution of data is at the center between the upper limit specification value and the lower limit specification value, and deviation is not considered. Therefore, an index used when the average value is deviated from the center of the vertical standard (there is a bias) is Cpk. Cpk (Cpu or Cpl) can be obtained from the average of the data distribution of the distance d10 and the standard deviation σ using the following (Expression 1) to (Expression 3).
(Expression 1) In the case of only the upper limit standard: Cpu = (upper limit standard value−average value) / 3σ
(Formula 2) In the case of only the lower limit standard: Cpl = (lower limit standard value−average value) / 3σ
(Formula 3) For both-side standards: the smaller value of Cpu and Cpl

  Subsequently, in step S <b> 22 of FIG. 16, the data processing unit 201 k causes the monitor 205 to display the position deviation mode (for example, the distance d <b> 10) and the parameter (for example, Cpk) calculated based on the mode. At this time, the data may be displayed as a numerical value or may be displayed as a graphic (as a graph, a chart, a plan view, a three-dimensional view, or the like). Thereby, the user can confirm the drawing accuracy (alignment accuracy) of the drawing apparatus 1000 and the like. Note that only one of the above-described misregistration mode and the parameter calculated based on the misalignment mode may be displayed on the monitor 205.

  The inspection apparatus (control unit 200) of the drawing apparatus according to the present embodiment includes a first mark (first inspection mark M1) and a second mark (second inspection mark M2) surrounding the first mark. A storage device (auxiliary storage device 202) in which drawing data is stored, a first drawing unit (such as an exposure control unit 201d and a light source control unit 201g) that causes the exposure device 102 to draw a first mark based on the drawing data; Based on the first detection unit (drawing position detection unit 201i) for detecting the position of the drawn first mark (first inspection mark A1) and the drawing data and the detected position of the first mark A correction unit (data correction unit 201e) that corrects data, and a second drawing unit (exposure) that causes the exposure device 102 to draw a second mark so as to surround the drawn first mark based on the corrected drawing data Control unit 01d and the light source controller 201g), a second detector (drawing position detector 201i) for detecting the position of the drawn second mark (second inspection mark A2), and the detected position of the first mark And a displacement acquisition unit (data processing unit 201k) that obtains a displacement mode (distance d10) of both based on the detected position of the second mark (FIGS. 1, 4, 5, and 7A). FIG. 8A and FIG. 17). For this reason, it is possible to more easily inspect and correct the capability of the exposure machine 102 (particularly, the alignment accuracy affected by the state of the exposure machine 102). In addition, the inspection can be performed in a short time by automating each process (see FIGS. 6 and 16).

  In particular, in a direct image exposure machine, since the alignment accuracy of the exposure machine 102 greatly affects quality or productivity, it is effective to use the inspection apparatus (control unit 200) for the inspection of the direct image exposure machine.

  The inspection apparatus (control unit 200) of the drawing apparatus according to the present embodiment includes a display instruction unit (data processing unit 201k) that causes a display device (monitor 205) to display a position shift mode and a parameter calculated based on the mode. As a result, the user can easily check the alignment accuracy of the exposure device 102 by looking at the data displayed on the monitor 205.

  After the processing in FIG. 16, when the user views the data displayed on the monitor 205 and determines that sufficient drawing accuracy is obtained, the drawing is performed as shown in FIGS. 18A to 20B, for example. Using the apparatus 1000, an opening can be formed in the solder resist of the printed wiring board. Hereinafter, this will be further described with reference to FIGS. 18A to 21B.

  For example, as shown in FIGS. 18A and 18B, a printed wiring board 301 before the solder resist is formed is prepared. The outermost conductor layer 301a of the printed wiring board 301 includes pads 301b for mounting electronic components (for example, semiconductor elements) or other wiring boards (for example, a motherboard) in addition to wiring. As illustrated in FIG. 18B, the shape (XY plane) of the pad 301b is, for example, a circle. However, it is not limited to this, and the shape (XY plane) of the pad 301b is arbitrary (see FIG. 27 described later).

  Subsequently, a solder resist 302 is formed on the printed wiring board 301 as shown in FIGS. 19A and 19B. The solder resist 302 is made of a photosensitive material (eg, negative resist) corresponding to the light source of the drawing apparatus 1000.

  Subsequently, in order to form an opening in the solder resist 302 by the drawing apparatus 1000, as shown in FIG. 20, the solder is performed in the same manner as the drawing of the second inspection mark A2 (step S16 in FIG. 6). A circular drawing corresponding to the shape of the pad 301 b is performed on the resist 302. However, here, the portion excluding the circular pattern portion R11 is exposed and insolubilized in the developer. Thereafter, the circular pattern portion R11 (unexposed portion) is removed by development.

  As a result, as shown in FIGS. 21A and 21B, a columnar opening 303 that exposes the central portion of the pad 301b can be formed in the solder resist 302 on the pad 301b.

  In the printed wiring board, the positional accuracy between the outermost layer pad 301b and the opening 303 of the solder resist 302 is important. In this regard, in the present embodiment, the opening 303 is formed in advance with respect to the dot-shaped first inspection mark M1 assuming the pad 301b in the above-described inspection (see FIGS. 6 and 16) of the drawing apparatus 1000. Since the drawing of the ring-like second inspection mark M2 surrounding the first inspection mark M1 is assumed and the positional accuracy of the drawing is ensured, the drawing apparatus 1000 is used for printing wiring. When manufacturing a board, it becomes easy to improve the positional accuracy of the outermost layer pad 301b and the opening 303 of the solder resist 302. Further, since the opening 303 of the solder resist 302 can be easily formed at an appropriate position, the printed wiring board can be easily refined.

  The printed wiring board manufactured in this way can be used as a circuit board of a mobile phone or a small computer.

  On the other hand, after the processing in FIG. 16, when the user views the data displayed on the monitor 205 and determines that sufficient drawing accuracy is not obtained, for example, mechanical adjustment of the exposure device 102 is performed. It is preferable to perform another inspection (see FIGS. 6 and 16).

  Although the case where a negative resist is used as the solder resist 302 has been described in the above embodiment, a positive resist may be used as the solder resist 302.

  The present invention is not limited to the above embodiment. For example, the present invention can be modified as follows.

  In the above embodiment, it is not essential to always perform the correction of the drawing data (step S15 in FIG. 6). For example, instead of the process of FIG. 6, the process of FIG. 22 may be performed. In the example of FIG. 22, after steps S <b> 11 to S <b> 14 having the same contents as in FIG. 6, in step S <b> 14 a, the data processing unit 201 k (FIG. 5) Cpk) is calculated, and in subsequent step S14b, the data processing unit 201k (FIG. 5) determines whether or not the calculated value (for example, Cpk) is larger than a predetermined threshold value. If it is determined that there is a calculated value (positional deviation) larger than the threshold (step S14b: Yes), the drawing data is corrected (step S15), and the calculated value (positional deviation) larger than the threshold is obtained. If it is determined that there is not (step S14b: No), the subsequent processing of steps S16 to S18 (similar to the processing of FIG. 6) is performed without correcting the drawing data.

  In the above embodiment, the misalignment mode calculated in step S21 in FIG. 16 is displayed on the monitor 205 (FIG. 4), and the user confirms the alignment accuracy of the exposure apparatus 102. However, the present invention is not limited to this. For example, instead of the process of FIG. 16, the process of FIG. 23 or FIG. 24 may be performed.

  In the example of FIG. 23, after calculating the position deviation mode and the like in step S21 having the same contents as in FIG. 16, the data processing unit 201k (FIG. 5) has a predetermined value (for example, the distance d10 shown in FIG. 17). It is determined whether it is larger than the threshold value. If it is determined that there is a calculated value (positional deviation) larger than the threshold (step S22a: Yes), the process of FIG. 6 and the process of FIG. 16 are automatically executed again in the subsequent step S23. .

  In the example of FIG. 24, the degree of positional deviation is divided into a plurality of stages (for example, small, medium, and large), and different processing is performed according to the degree of positional deviation. Specifically, after calculating the displacement mode and the like in step S21 having the same contents as in FIG. 16, the data processing unit 201k (FIG. 5) determines that the calculated value (for example, the distance d10 shown in FIG. 17) is a predetermined value. It is determined whether or not it is larger than the threshold value K1. When it is determined that there is a calculated value larger than the threshold value K1 (step S22a: Yes), in the subsequent step S22b, the calculated value (for example, the distance d10) is larger than a predetermined threshold value K2 larger than the threshold value K1. It is judged whether it is also large. If it is determined that there is a calculated value larger than the threshold value K2 (degree of misalignment = large) (step S22b: Yes), an alarm is issued in the subsequent step S23a. The alarm is arbitrary and may be sound (including sound), display on the monitor 205, or lighting of the lamp. If it is determined in step S22b that there is no calculated value larger than the threshold value K2 (degree of misalignment = medium) (step S22b: No), in the subsequent step S23, the process and the diagram of FIG. 16 processes are automatically executed. If it is determined in step S22a that there is no calculated value larger than the threshold value K1 (the degree of positional deviation = small) (step S22a: No), the positional deviation mode calculated in step S21 in the subsequent step S22. Etc. are displayed on the monitor 205.

  The shape of the second inspection mark (second mark) is not limited to the ring shape as shown in FIG. 9 and is arbitrary as long as it surrounds the first inspection mark (first mark). The shape of the second inspection mark may be, for example, a circular ring having a cut C1 as shown in FIG. 25A, for example, a broken-line circular ring having a plurality of cuts C2, as shown in FIG. 25B. There may be.

  The shape (XY plane) of the first inspection mark M1 and the second inspection mark M2 is not limited to a circular shape, and may be a polygonal shape (for example, a rectangular shape) as shown in FIG. . As shown in FIG. 27, when the rectangular opening 303 is formed in the solder resist 302 on the rectangular pad 301b, the rectangular first inspection mark M1 and the second inspection mark M2 (FIG. 26). ) Is preferably used.

  The shape of the first inspection mark M1 (first mark) is not limited to the dot shape (see FIG. 9). For example, it may be linear as shown in FIG. 28, or may be ring-like as shown in FIG.

  For example, as shown in FIG. 30, drawing data may be such that a plurality of (for example, three) first inspection marks M1 are surrounded by the second inspection marks M2.

  In the above embodiment, the first mark and the second mark (the first inspection mark M1 and the second inspection mark M2) that have a shape in which one surrounds the other, the marks (first inspection mark M1) that are surrounded. , The surrounding mark (second inspection mark M2) is drawn, but conversely, after the surrounding mark (second inspection mark M2) is drawn, the enclosed mark (first inspection mark M1) is drawn. ) May be drawn.

  The function of the control unit 200 according to the above embodiment can be realized by dedicated hardware or by a normal computer system.

  For example, the program stored in the auxiliary storage device 202 in the above embodiment is a computer such as a flexible disk, a CD-ROM (Compact Disk Read-Only Memory), a DVD (Digital Versatile Disk), or an MO (Magneto-Optical disk). By storing and distributing the program in a readable recording medium and installing the program in the computer 201, an apparatus that executes the above-described processing can be configured.

  Further, the program may be stored in a disk device or the like included in a predetermined server device on a communication network such as the Internet, and may be downloaded to the computer 201 by being superimposed on a carrier wave, for example.

  The above-described processing can also be achieved by starting and executing a program while transferring it via a communication network. The above-described processing can also be achieved by executing all or part of the program on the server device and executing the program while the computer 201 transmits / receives information related to the processing via the communication network.

  When the above functions are realized by sharing an OS (Operating System), or when the functions are realized by cooperation between the OS and an application, only the part other than the OS may be stored and distributed in the medium. Moreover, you may download to the computer 201.

  With respect to other points as well, the configurations of the processing unit 100 and the control unit 200 can be arbitrarily changed without departing from the spirit of the present invention.

  For example, the stage 30 may be fixed, and the position of the light exit (for example, the exposure head) for drawing may be movable. Specifically, a motor or the like for moving may be provided, and the exit (exposure head) of the exposure unit 60 may be movable.

  In the above embodiment, the cameras 51 are arranged in a line in the X direction, but the number and arrangement of the cameras 51 are arbitrary. For example, the cameras 51 may be arranged in the Y direction, the cameras 51 may be arranged in two or more rows (for example, in a matrix), or the number of cameras 51 may be one.

  The drawing apparatus inspection method and printed wiring board manufacturing method according to the above embodiment are not limited to the order and contents shown in FIGS. 6, 16, and 18A to 24, and do not depart from the spirit of the present invention. The order and contents can be changed arbitrarily. Moreover, you may omit the process which is not required according to a use etc.

  The embodiment of the present invention has been described above. However, various modifications and combinations required for design reasons and other factors are not limited to the invention described in the “claims” or the “mode for carrying out the invention”. It should be understood that it is included in the scope of the invention corresponding to the specific examples described in the above.

  The drawing apparatus and the method for manufacturing a printed wiring board according to the present invention are suitable for manufacturing a printed wiring board used for a circuit board of a mobile phone. The drawing apparatus inspection apparatus, drawing apparatus inspection method, and program according to the present invention are suitable for inspection of a drawing apparatus used for manufacturing a printed wiring board.

10, 20 Base 11a, 11b, 31a Rail 21 Connecting material 30 Stage 31, 32, 33 Table 31b Bar 31c, 32a Guide 34, 35, 36 Motor 34a X position detector 35a Y position detector 36a Z position detector 37 Substrate fixing part 40 Leg part 50 Top plate 51 Camera 52 Motor 52a Camera position detection part 60 Exposure unit 61 Light source unit 61a High pressure mercury lamp 61b Ellipsoidal mirror 62 Exposure optical system 62a Plane mirror 62b Collimator lens 62c Fly eye lens 62d Relay lens 62e Flat mirror 62f Condenser lens 62g DMD element 62h Imaging lens 63 Temperature adjustment unit 70 Gate 100 Processing unit 101 Input unit 102 Exposure machine 102a Transport unit 102b Alignment unit 102c Exposure unit 10 3 Dispensing unit 200 Control unit 201 Computer 201a System control unit 201b Data creation unit 201c Data conversion unit 201d Exposure control unit 201e Data correction unit 201f Stage control unit 201g Light source control unit 201h Camera position control unit 201i Drawing position detection unit 201j Temperature control unit 201k Data processing unit 202 Auxiliary storage device 203 Input / output interface 204 Keyboard 205 Monitor 301 Printed wiring board 301a Conductor layer 301b Pad 302 Solder resist 303 Opening 1000 Drawing device A1, A11-A19 First inspection mark A2, A21-A29 First 2 Inspection marks C1, C2 Cut line L11-L19 X line L21-L29 Y line M1, M11-M19 First inspection mark M2, M21-M2 Second check marks P1, P2 centroid R11 pattern portion R1~R4 region S substrate

Claims (13)

A storage device that stores drawing data including a first mark and a second mark, each of which has a shape that surrounds the other;
A first drawing unit that causes the drawing device to draw the first mark based on the drawing data;
A first detector for detecting a position of the drawn first mark;
A correction unit that corrects the drawing data based on the drawing data and the position of the detected first mark;
A second drawing unit that causes the drawing device to draw the second mark based on the corrected drawing data;
A second detector for detecting the position of the drawn second mark;
A shift acquisition unit for determining a position shift mode of both based on the position of the detected first mark and the position of the detected second mark;
Having
An inspection apparatus for a drawing apparatus. The first mark has a dot shape,
The second mark has a ring shape surrounding the first mark,
The drawing apparatus inspection apparatus according to claim 1. The misalignment mode is a distance between the detected center of gravity of the first mark and the detected center of gravity of the second mark.
The drawing apparatus inspection apparatus according to claim 1, wherein the drawing apparatus is an inspection apparatus. An image sensor for imaging the first mark and the second mark;
Each of the first detection unit and the second detection unit obtains a position of the first mark or a position of the second mark based on a signal from the image sensor;
The drawing apparatus inspection apparatus according to claim 1, wherein the drawing apparatus is an inspection apparatus. Having an imaging position controller for controlling the position of the imaging element;
The drawing apparatus inspection apparatus according to claim 4. A stage control unit that controls the position of the stage on which the drawing target is placed according to the drawing position when performing the drawing;
The drawing apparatus inspection apparatus according to claim 1, wherein the drawing apparatus inspection apparatus comprises: A temperature control unit that manages the temperature of the exposure optical system of the drawing apparatus;
The drawing apparatus inspection apparatus according to claim 1, wherein the drawing apparatus is inspected. A display instruction unit for displaying on the display device at least one of the positional deviation mode and the parameter calculated based thereon,
The drawing apparatus inspection apparatus according to claim 1, wherein the drawing apparatus inspection apparatus includes: The inspection apparatus for a drawing apparatus according to claim 1,
A drawing apparatus characterized by that. The position of the light exit for performing the drawing is fixed,
The drawing apparatus according to claim 9. Computer
A first drawing unit that causes a drawing device to draw the first mark based on drawing data including a first mark and a second mark, one of which has a shape surrounding the other;
A first detector for detecting a position of the drawn first mark;
A correction unit for correcting the drawing data based on the drawing data and the position of the detected first mark;
A second drawing unit for causing the drawing device to draw the second mark based on the corrected drawing data;
A second detector for detecting a position of the drawn second mark;
A deviation acquisition unit for obtaining a position deviation mode of both based on the position of the detected first mark and the position of the detected second mark;
Program to function as. Causing the drawing device to draw the first mark based on drawing data including a first mark and a second mark having a shape such that one surrounds the other;
A computer detecting a position of the drawn first mark;
A computer correcting the drawing data based on the drawing data and the position of the detected first mark;
A computer causing the drawing device to draw the second mark based on the corrected drawing data;
A computer detecting a position of the drawn second mark;
A computer obtains a displacement mode of both based on the position of the detected first mark and the position of the detected second mark;
including,
A method for inspecting a drawing apparatus. Including forming an opening in a solder resist of a printed wiring board by the drawing apparatus according to claim 9 or 10,
A printed wiring board manufacturing method characterized by the above.

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