JP2018072541A - Pattern formation method, positioning method of substrate, positioning device, pattern formation device and manufacturing method of article - Google Patents

Abstract

PROBLEM TO BE SOLVED: To position a substrate at high accuracy even when an outer shape of the substrate is changed.SOLUTION: A first process for forming a pattern including an alignment mark on a substrate by positioning the substrate based on a measured value of a position of reference side of the substrate arranged on a stage and a second process for forming a pattern on the substrate on which the pattern including the alignment mark is formed are included, in the first process, a position of an opposite side to the reference side of the substrate is measured and a relative position of the opposite side and the alignment mark based on the measured value of the position of the reference side and the position of the opposite side measured in the first process are calculated, in the second process, the substrate on which the pattern was formed is arranged on the stage, the position of the opposite side of the substrate on which the pattern was formed is measured, the substrate on which the pattern was formed is positioned based on the measured value of the position of the opposite side of the substrate on which the patter was formed and the relative position to form a pattern on the substrate on which the pattern was formed.SELECTED DRAWING: Figure 5

Description

  The present invention relates to a pattern forming method, a substrate positioning method, a positioning device, a pattern forming device, and an article manufacturing method.

  In order to manufacture a semiconductor device, a liquid crystal display device, etc., a lithography process for forming a pattern on a substrate is performed. In this step, for example, an exposure apparatus that illuminates a mask (reticle) with an illumination optical system and projects an image of the mask pattern onto the substrate coated with a photosensitive resist layer via the projection optical system is used. In the exposure apparatus, there is a process called pre-alignment for positioning the substrate prior to substrate processing, for example, exposure processing for exposing the substrate or inspection processing for inspecting the substrate. The pre-alignment step is a step of positioning the substrate with coarse accuracy so that the amount of positional deviation of the substrate placed on the substrate stage is within a predetermined range before processing the substrate on the substrate stage. Thereafter, the substrate is processed by measuring the alignment mark using a scope with a narrow field of view and positioning the substrate with high accuracy. In the pre-alignment process, a reference portion on the outer periphery of the substrate, for example, the position of the edge of the substrate is measured, and rough positioning is performed based on the measurement result (for example, Patent Document 1).

Japanese Patent Laying-Open No. 2005-116777

  In the conventional pre-alignment process, the exposure position when exposing the first layer of the substrate and the second layer are exposed using the measurement value of the position of the reference side with the specific edge of the substrate as the reference side. Therefore, the target position of the substrate is calculated. Conventionally, when determining the target position of the substrate in each of the plurality of layers, the relative position from the common reference side has been managed.

  However, for example, when the outer shape of the substrate changes due to processing or deformation of the substrate, the relative distance from a reference side to a predetermined position on the substrate, for example, an alignment mark, varies. Therefore, if the pre-alignment is performed using the measurement value of the position of the reference side common to a plurality of layers as in the prior art, the position of the substrate is shifted or an alignment mark measurement error occurs. For example, the alignment mark formed on the substrate may not fit within the scope's field of view and the alignment mark cannot be detected, and thus the substrate may not be positioned with high accuracy.

  Accordingly, an object of the present invention is to position a substrate with high accuracy even when the outer shape of the substrate changes.

  A forming method for forming a pattern on a substrate as one aspect of the present invention that solves the above-described problem is to position the substrate based on a measurement value of a position of a reference side of the substrate disposed on the stage. A first step of forming a pattern including an alignment mark on the substrate; and a second step of forming a pattern on the substrate on which the pattern including the alignment mark is formed. In the first step, the substrate Measure the position of the opposite side with respect to the reference side, and based on the measured value of the position of the reference side and the position of the opposite side measured in the first step, to determine the relative position of the opposite side and the alignment mark, In the second step, the substrate on which the pattern is formed is placed on a stage, the position of the opposite side of the substrate on which the pattern is formed is measured, and the pattern is measured. Forming a pattern on the substrate on which the pattern is formed by positioning the substrate on which the pattern is formed based on a measured value of the position of the opposite side of the substrate on which the pattern is formed and the relative position; It is characterized by.

  According to the present invention, the substrate can be positioned with high accuracy even if the outer shape of the substrate changes.

1 is a schematic view showing an exposure apparatus 100. FIG. It is a flowchart of a pattern formation method. It is a figure which shows the mode of the positioning in a 1st pre-alignment process. It is a figure which shows the mode of the positioning in a 2nd process. It is a figure which shows the flowchart of the positioning method. It is a figure for demonstrating the example which divides | segments a board | substrate.

  Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings.

(Embodiment 1)
In this embodiment, an exposure apparatus that exposes a photosensitive substrate through an original and a projection optical system will be described as an example of a pattern forming apparatus (lithography apparatus) that forms a pattern on a substrate. An exposure apparatus 100 according to this embodiment will be described with reference to FIG. FIG. 1 is a schematic view showing an exposure apparatus 100 of the present embodiment. The exposure apparatus 100 of 1st Embodiment shall be employ | adopted for the lithography process in the manufacturing process of a liquid crystal display device (liquid crystal panel) as an example. The exposure apparatus 100 is a substrate (glass plate) that is a substrate on which a resist (photosensitive agent) layer is formed on the surface of the pattern formed on the mask 1 via the projection optical system 4 by a step-and-scan method. 5 is a scanning projection exposure apparatus that exposes the upper surface 5. In FIG. 1, the Y axis is taken in the scanning (moving) direction of the mask 1 and the substrate 5 at the time of exposure in a plane perpendicular to the Z axis, which is the vertical direction, and the X axis is taken in the non-scanning direction orthogonal to the Y axis. I'm taking it. The exposure apparatus 100 includes a mask stage 2, an illumination optical system 3, a projection optical system 4, a substrate stage 6, an alignment scope (mark detection apparatus) 7, and a control unit 8. The mask 1 is held on the mask stage 2 and the substrate 5 is held on the substrate stage 6.

  For example, the illumination optical system 3 receives light emitted from a light source 3a such as an Hg lamp and irradiates the mask 1 with illumination light formed in a slit shape. The mask 1 is, for example, a glass original plate on which a fine pattern to be exposed (for example, a circuit pattern) is drawn. The mask stage 2 is movable at least in the Y-axis direction while holding the mask 1 by, for example, vacuum suction. The projection optical system 4 maintains a mask 1 and the substrate 5 held on the substrate stage 6 in an optically conjugate relationship, and projects a pattern image on the substrate 5 at an equal magnification.

  The alignment scope 7 detects the alignment mark of the mask 1 and the alignment mark of the substrate 5 via the projection optical system 4. The control unit 8 includes a CPU and a memory, and controls each unit configuration of the exposure apparatus 100. The memory stores a control program executed by the CPU and various data. For example, the control unit 8 can be realized by a control board equipped with a multi-core CPU, GPU, or FPGA. However, the configuration is not limited to these. The control unit 8 controls processing for transferring the pattern of the mask 1 to the substrate 5 (processing for scanning and exposing the substrate 5).

  Next, a method for forming a pattern on the substrate will be described. FIG. 2 shows a flowchart of the pattern forming method. First, a pattern is formed on the first layer on the substrate (first step S301). In the first step S301, first, the position of an unexposed substrate is measured, and positioning (prealignment) is performed with rough accuracy using the measurement result (first prealignment step S303). Next, the pattern is exposed to the photosensitive agent on the first layer of the positioned substrate (1st exposure step S304). In the first exposure step S304, the exposure apparatus 100 synchronously scans the mask 1 and the substrate 5, and exposes a pattern image existing in the illumination range of the mask 1 to a certain shot area on the substrate 5. Then, the pattern is formed on the first layer on the substrate by developing the photosensitizer on the substrate on which the pattern is exposed and performing etching or the like.

  Next, a pattern is formed on the second layer on the first layer of the substrate (second step S302). In the second step S302, first, the position of the substrate on which the pattern is formed on the first layer is measured, and positioning is performed with rough accuracy using the measurement result (second pre-alignment step S305). Next, the alignment mark formed together with the circuit pattern of the device on the first layer of the substrate is detected by the alignment scope 7 simultaneously with the alignment mark of the mask 1 to obtain position information of the alignment mark. Then, the substrate is positioned so that the patterns are accurately overlapped and formed based on the position of the alignment mark (alignment step S306). Next, using the exposure apparatus 100 having a pattern forming unit including the illumination optical system 3 and the projection optical system 4, the mask pattern is exposed to the photosensitive agent on the second layer of the positioned substrate. Then, the photosensitizer exposed to the pattern is developed and etched to form a pattern on the second layer on the substrate (2nd exposure step S307).

  Next, a positioning device used in the pre-alignment process will be described. FIG. 3 shows the positioning in the first pre-alignment step together with the positioning device. The positioning apparatus 200 is configured in the exposure apparatus 100 and constitutes a part of the control unit 8 and a substrate stage 6 that holds and moves the substrate 5. The substrate stage 6 is provided with a chuck 208 that holds the substrate 5 by vacuum suction, bar mirrors 214 and 215, and measuring units 230 and 231 that measure the positions of the edges of the substrate. Interferometers 211 and 212 measure the position of the bar mirror 215 in the Y direction, and the interferometer 213 measures the position of the bar mirror 214 in the X direction. The angle around the Z axis of the substrate stage 6 can be obtained from two Y-direction positions of the bar mirror 215 by the interferometers 211 and 212. The positioning device 200 calculates a target position of the substrate stage 6 based on the measurement values of the measurement units 230 and 231 and a stage that controls the substrate stage 6 based on the calculation result of the calculation unit 216. A control unit 217 is included. The positioning apparatus 200 includes an interferometer control unit 218 that acquires a measurement value obtained by the interferometer and controls the interferometer, and a storage unit 219 that stores position information of the substrate 5 and the like. Note that the storage unit 219 may be configured by a memory or the like and installed in a device different from the positioning device 200.

  As shown in FIG. 3, the substrate 5 has a rectangular shape. Each side of the substrate 5 is divided into a first reference side 201, a second reference side 202 that is an end perpendicular to the first reference side 201, and a first opposite side that is the opposite side to the first reference side 201. Reference numeral 203 denotes a second opposite side 204 that is opposite to the second reference side 202. The measuring unit 230 measures the positions of the first reference side 201 and the second reference side 202 of the substrate 5 transferred onto the substrate stage 6 by a substrate transfer robot (not shown). The measurement unit 231 measures the position of the first opposite side 203. The calculation unit 216 acquires measurement values measured by the measurement unit 230 and the measurement unit 231. The stage control unit 217 determines the position of the substrate stage 6 based on the target position obtained from the calculation unit 216 and the actual position information of the substrate stage 6 measured by the interferometer and obtained through the interferometer control unit 218. And control the angle.

  Next, details of the process of forming a pattern will be described. In the first pre-alignment step S303, the measurement unit 230 measures the positions of the first reference side 201 and the second reference side 202 of the substrate 5 placed on the substrate stage 6. Then, based on the measured values of the positions of the first reference side 201 and the second reference side 202, the first target position of the substrate stage 6 for forming a pattern including alignment marks on the substrate in the first exposure step S304. Is calculated. The target position includes a position in the X and Y directions and a rotation angle around the Z axis. Then, the substrate 5 is positioned by controlling the position and angle of the substrate stage 6 based on the calculated first target position (pre-alignment). In step S <b> 303, the position of the first opposite side 203 is measured by the measurement unit 231, and the calculation unit 216 acquires a measurement value of the position of the first opposite side 203. Using the measurement value of the first reference side 201 measured by the measurement unit 230 in step S303 and the measurement value of the first opposite side 203 measured by the measurement unit 231 in step S303, the calculation unit 216 uses the first measurement value. The relative position between the reference side 201 and the first opposite side 203 is calculated. The calculated relative position between the first reference side 201 and the first opposite side 203 is transmitted to the storage unit 219 and stored in the storage unit 219. In the first exposure step S304, when the pattern is exposed to the photosensitive agent on the first layer of the substrate 5 positioned based on the measured values of the positions of the first reference side 201 and the second reference side 202, the alignment mark is also used. Exposure. Then, an alignment mark 205 is formed on the first layer of the substrate 5. Further, based on the calculated relative position of the first reference side 201 and the first opposite side 203, the relative relationship between the position of the alignment mark 205 and the position of the first opposite side 203 is obtained, and information on the relative relationship is obtained. The data is transmitted to the storage unit 219 and stored in the storage unit 219.

  Here, the outer shape of the substrate may change between the first step (first pre-alignment step) and the second step (second pre-alignment step) due to processing or deformation of the substrate. For example, it is assumed that the substrate is thermally deformed between the first step and the second step. In addition, there may be a case where the position of the first reference side 201 cannot be measured in the positioning device that performs the second pre-alignment step during the second pre-alignment step.

  FIG. 4 shows the positioning in the second step together with the positioning device. In the second pre-alignment step S305, the position of the first opposite side 203 of the substrate 5 placed on the substrate stage 6 and having the pattern formed on the first layer is measured by the measuring unit 231, and the calculating unit 216 A measurement value of the position of the opposite side 203 is acquired. Further, the second reference side 202 of the substrate 5 is measured by the measuring unit 230. In the second pre-alignment step S305, the position of the first reference side 201 is not measured. The calculation unit 216 acquires the relative relationship between the position of the alignment mark 205 and the position of the first opposite side 203 stored in the storage unit 219 in the first step S301. The calculation unit 216 determines the position of the substrate stage 6 based on the position of the first opposite side 203 measured in the second pre-alignment step S305 and the relative relationship between the acquired position of the alignment mark 205 and the position of the first opposite side 203. A second target position is calculated. The second target position is a position where the alignment mark 205 can be detected by the alignment scope 220, and is also a position for performing alignment of the substrate after detection and forming a pattern on the substrate. Then, the stage control unit 217 performs pre-alignment of the substrate 5 on which the pattern is formed on the first layer by moving the substrate stage 6 to the target position using the calculated second target position.

  In the alignment step S306, the mark 205 is detected by the alignment scope 220, and the calculation unit 216 calculates the target position of the substrate stage 6 from the position of the mark 205. Then, the substrate stage 6 is controlled to position the substrate 5 with high accuracy required for the 2nd exposure step S307.

  As described above, in the first step S301, a pattern including alignment marks is formed on the substrate by positioning the substrate based on the measured value of the position of the reference side of the substrate placed on the stage. In the second step S302, a pattern is formed on the substrate on which the pattern including the alignment mark is formed. The position of the opposite side with respect to the reference side of the substrate is measured in the first step, and the relative position between the opposite side and the alignment mark is obtained based on the measured value of the position of the reference side and the position of the opposite side measured in the first step. . In the second step, the substrate on which the pattern is formed is placed on the stage, and the position of the opposite side of the substrate on which the pattern is formed is measured. Then, the pattern is formed on the substrate on which the pattern is formed by positioning the substrate on which the pattern is formed based on the measured value of the position of the opposite side of the substrate on which the pattern is formed and the relative position.

  FIG. 5 shows a flowchart focusing on the positioning method for positioning the substrate. In the positioning method of this embodiment, the measurement values of the position of the reference side of the first substrate placed on the stage and the position of the opposite side with respect to the reference side of the substrate are acquired (acquisition step S401). Next, the first target position of the stage for forming the pattern including the alignment mark on the substrate is calculated based on the measured value of the position of the reference side, and the position of the stage or the like is calculated based on the calculated first target position. The substrate is positioned by controlling the angle (first positioning step S402). Next, a relative position between the opposite side and the alignment mark is obtained based on the measurement values of the position of the reference side and the position of the opposite side acquired in the acquisition step (S403). The measurement value of the position of the opposite side of the second substrate which is arranged on the stage and on which the pattern is formed is acquired. Then, the second target position of the stage for forming the pattern on the second substrate is calculated based on the measured value of the position of the opposite side of the second substrate and the relative position obtained in S403. Then, the second substrate is positioned by controlling the position and angle of the stage based on the calculated second target position (second positioning step S404). In the positioning method, software (program) for realizing the function is supplied to the system or apparatus via a network or a storage medium, and the computer (control unit, CPU, MPU, etc.) of the system or apparatus reads the program. It is also realized by processing to be executed.

  According to this embodiment, even when the outer shape of the substrate changes due to processing or deformation of the substrate, the substrate can be pre-aligned with high accuracy in the second step, and the substrate can be positioned with high accuracy.

  When measuring the positional relationship between the first reference side 201 and the first opposite side 203 of the substrate 5, it is desirable that two or more measurement units 231 are arranged. When there is a single measuring unit 231, a rotation component cannot be calculated from the positional relationship between the first reference side and the first opposite side. Therefore, by providing a plurality of measuring units so as to measure the positions of a plurality of locations on one side, the rotation component is calculated when calculating the positional relationship between the first reference side 201 and the first opposite side 203. It becomes possible to do. And the precision of pre-alignment can be improved by adjusting the rotation component of the board | substrate 5 in a rotation mechanism not shown.

  In the first pre-alignment step S303, the first reference side 201 and the second reference side 202 are measured, but the combination of the reference side to be measured and the second reference side orthogonal thereto is not limited thereto. Absent. For example, when the side 202 is the first reference side and the side 203 is the second reference side, the side 203 is the first reference side and the side 204 is the second reference side, or the side 204 is the first reference side. In the case where the reference side and the side 201 are used as the second reference side, either of them may be used.

  In the second step S302, the description has been made on the assumption that the exposure is performed using the same exposure apparatus as that in the first step. However, an exposure apparatus different from the exposure apparatus used in the first step S301 may be used. That is, in the second pre-alignment step S305, a positioning device different from the positioning device used in the first pre-alignment step S303 may be used.

(Embodiment 2)
In the present embodiment, as an example of the case where the outer shape of the substrate changes, a case where the substrate is divided into two after the first step S301 and the second step S302 is performed on each of the divided substrates. FIG. 6 shows an example of dividing the substrate. In the first pre-alignment step S303, as shown in FIG. 6A, the position of the first reference side 201 of the substrate 5 is measured by the measurement unit 230 on the substrate stage 6. Then, by performing the first exposure step S304 with the first reference side 201 as a reference, alignment marks 205a and 205b are formed on the substrate 5. Then, the substrate 5 is divided into two after the first step S301. Next, as shown in FIG. 6B, in the second pre-alignment step S305, the two substrates 5a (first substrate) and the substrate 5b (second substrate) divided on the substrate stage 6 are arranged. The substrate 5a has a first opposite side 203 and an alignment mark 205a, and the substrate 5b has a first reference side 201 and an alignment mark 205b. As shown in FIG. 6B, after the substrate 5 is divided, the relative relationship between the position of the first reference side 201 and the position of the alignment mark 205a is a state before dividing the substrate 5 (FIG. 6B). It is different from a)). However, the alignment mark 205a is formed close to the first opposite side 203, and the relative relationship between the position of the first opposite side 203 and the position of the alignment mark 205a may not be shifted even if the substrate 5 is divided.

  Therefore, in the second pre-alignment step S305, the position of the first opposite side 203 of the substrate 5a is measured by the measuring unit 231. Details will be described below. In the second pre-alignment step S305, the measurement unit 231 measures the position of the first opposite side 203 of the substrate 5a placed on the substrate stage 6 and having the pattern formed on the first layer, and the calculation unit 216 performs the first calculation. A measurement value of the position of the opposite side 203 is acquired. The calculation unit 216 acquires the relative relationship between the position of the alignment mark 205a and the position of the first opposite side 203, which is stored in the storage unit 219 in the first step S301. The calculation unit 216 determines the position of the substrate stage 6 based on the position of the first opposite side 203 measured in the second pre-alignment step S305 and the relative relationship between the acquired position of the alignment mark 205a and the position of the first opposite side 203. A second target position is calculated. The second target position is a position where the alignment mark 205a can be detected by the alignment scope 220, and is also a position for performing alignment of the substrate 5a after detection and forming a pattern on the substrate 5a. Then, the stage control unit 217 performs pre-alignment of the substrate 5a on which the pattern is formed on the first layer by moving the substrate stage 6 to the target position using the calculated second target position.

  In the alignment step S306, the alignment scope 220 detects the mark 205a, and the calculation unit 216 calculates the target position of the substrate stage 6 from the position of the mark 205a. Then, the substrate stage 6 is controlled to position the substrate 5a with high accuracy required in the 2nd exposure step S307. In the 2nd exposure step, the mask pattern is exposed to the photosensitive agent on the second layer of the positioned substrate 5a using the exposure apparatus 100 having the pattern forming unit including the illumination optical system 3 and the projection optical system 4.

  Next, the process of exposing the substrate 5b will be described. In the second pre-alignment step S305, the measurement unit 230 measures the position of the first reference side 201 of the substrate 5b. The calculating unit 216 calculates the target position of the substrate stage 6 based on the position of the first reference side 201 measured in step S305. The target position is a position at which the mark 205b can be detected by the scope 220, and is also a position for aligning the substrate 5b after detection and forming a pattern on the substrate 5b. Then, the stage control unit 217 moves the substrate stage 6 to the target position using the calculated target position, and performs pre-alignment of the substrate 5b on which the pattern is formed on the first layer. In the alignment step S306, the mark 205b is detected by the scope 220, and the calculation unit 216 calculates the target position of the substrate stage 6 from the position of the mark 205b. Then, the substrate stage 6 is controlled to position the substrate 5b with high accuracy required in the 2nd exposure step S307. In the 2nd exposure step, the mask pattern is exposed to the photosensitive agent on the second layer of the positioned substrate 5b by using the exposure apparatus 100 having the pattern forming unit including the illumination optical system 3 and the projection optical system 4.

  According to this embodiment, even when the outer shape of the substrate is changed by dividing the substrate, the pre-alignment of the substrate can be accurately performed in the second step, and the substrate can be positioned with high accuracy.

(Product manufacturing method)
Next, a method for manufacturing an article (semiconductor IC element, liquid crystal display element, color filter, MEMS, etc.) using the above-described exposure apparatus will be described. For the article, the above-described exposure apparatus is used to expose a substrate (wafer, glass substrate, etc.) coated with a photosensitive agent, a step of developing the substrate (photosensitive agent), and the developed substrate. It is manufactured by processing in the known process. Other known processes include etching, resist stripping, dicing, bonding, packaging, and the like. According to this device manufacturing method, it is possible to manufacture a higher quality device than before.

  As mentioned above, although preferable embodiment of this invention was described, this invention is not limited to these embodiment, A various deformation | transformation and change are possible within the range of the summary.

  The exposure apparatus has been described as a lithography apparatus for forming a pattern on a substrate. However, the present invention is not limited to this. For example, an imprint apparatus or an electron beam drawing apparatus that forms a pattern by bringing a mold and an imprint material (resin, etc.) Can also be applied. In a method for manufacturing an article using an imprint apparatus, a pattern is formed on a substrate on which a pattern is formed by contacting a mold and an imprint material on the substrate, and the substrate on which the pattern is formed is processed by etching, dicing, or the like. To produce an article.

Claims (12)

In a forming method for forming a pattern on a substrate,
A first step of forming a pattern including alignment marks on the substrate by positioning the substrate based on a measurement value of a position of a reference side of the substrate disposed on the stage;
Forming a pattern on a substrate on which a pattern including the alignment mark is formed, and
Measuring the position of the opposite side relative to the reference side of the substrate in the first step;
Based on the measured value of the position of the reference side and the position of the opposite side measured in the first step, to determine the relative position of the opposite side and the alignment mark,
In the second step, the substrate on which the pattern is formed is placed on a stage, the position of the opposite side of the substrate on which the pattern is formed is measured, and the position of the opposite side of the substrate on which the pattern is formed A pattern is formed on the substrate on which the pattern is formed by positioning the substrate on which the pattern is formed based on the measured value and the relative position. In a positioning method for positioning the substrate by controlling a stage that holds and moves the substrate,
An acquisition step of acquiring a measurement value of the position of the reference side of the substrate disposed on the stage and the position of the opposite side with respect to the reference side of the substrate;
A first target position of the stage for forming a pattern including an alignment mark on the substrate is calculated based on a measurement value of the position of the reference side, and the stage is moved based on the calculated first target position. A first positioning step for controlling and positioning the substrate;
A second positioning step in which the substrate on which the pattern including the alignment mark is formed by positioning in the first positioning step is arranged on the stage, and the substrate on which the pattern is formed is positioned by controlling the stage; Have
Based on the measured value of the position of the reference side and the position of the opposite side acquired in the acquisition step, to determine the relative position of the opposite side and the alignment mark,
In the second positioning step, a measurement value of the position of the opposite side of the substrate on which the pattern arranged on the stage is formed, and a measurement value of the position of the opposite side of the substrate on which the pattern is formed A second target position of the stage for forming a pattern on the substrate on which the pattern is formed is calculated based on a relative position, and the stage is controlled based on the calculated second target position. A positioning method characterized by positioning a substrate on which is formed. The substrate has a rectangular shape;
The positioning method according to claim 2, wherein the reference side of the substrate includes a first reference side of the rectangle and a second reference side perpendicular to the first reference side.   4. The positioning method according to claim 2, wherein, in the obtaining step, the position of a plurality of locations on a reference side of the substrate is measured to obtain a rotation component of the substrate. Between the first positioning step and the second positioning step, the substrate on which the pattern is formed is divided into a plurality of portions,
The positioning method according to any one of claims 2 to 4, wherein the divided substrate is positioned in the second positioning step. The divided substrate includes a first substrate including the opposite side and a second substrate including the reference side,
In the second positioning step,
A measurement value of the position of the opposite side of the first substrate arranged on the stage is acquired, and a pattern is formed on the first substrate based on the measurement value of the position of the opposite side of the first substrate and the relative position. Calculating a target position of the stage for forming, positioning the first substrate by controlling the stage,
A measurement value of the position of the reference side of the second substrate arranged on the stage is acquired, and a pattern is formed on the second substrate based on the measurement value of the position of the reference side of the second substrate. 6. The positioning method according to claim 5, further comprising: calculating a target position of the stage for positioning and controlling the stage to position the second substrate.   5. The positioning according to claim 2, wherein after the second positioning step, an alignment mark on the substrate is detected, and the substrate is positioned based on the position of the alignment mark. 6. Method.   The positioning method according to claim 7, wherein an alignment mark of the substrate is closer to the opposite side than a reference side of the substrate. After positioning the first substrate in the second positioning step, the alignment mark of the first substrate is detected, and the first substrate is positioned based on the position of the alignment mark of the first substrate,
After the second substrate is positioned in the second positioning step, an alignment mark on the second substrate is detected, and the second substrate is positioned based on the position of the alignment mark on the second substrate. The positioning method according to claim 6. In a positioning device for positioning a substrate,
A stage for holding and moving the substrate;
A control unit for controlling the stage,
The controller is
Obtain the measurement value of the position of the reference side of the substrate placed on the stage and the position of the opposite side to the reference side of the substrate,
A first target position of the stage for forming a pattern including an alignment mark on the substrate is calculated based on a measurement value of the position of the reference side, and the stage is moved based on the calculated first target position. Control to position the substrate,
Based on the obtained measurement value of the position of the reference side and the position of the opposite side, to determine the relative position of the opposite side and the alignment mark,
The measured value of the position of the opposite side of the substrate on which the pattern arranged on the stage is formed, and the pattern based on the measured value of the position of the opposite side of the substrate on which the pattern is formed and the relative position A second target position of the stage for forming a pattern on the substrate on which the pattern is formed is calculated, and the substrate on which the pattern is formed is positioned by controlling the stage based on the calculated second target position. A positioning device characterized by that. In a pattern forming apparatus for forming a pattern on a substrate,
A positioning device for positioning a substrate according to claim 10,
And a forming unit that forms a pattern on the substrate positioned by the positioning device. Forming a pattern on a substrate using the pattern forming apparatus according to claim 11;
And a step of manufacturing the article by processing the substrate on which the pattern is formed.

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