TWI633001B - Resin molding device and method thereof, film transport roller and film supply device for resin molding device - Google Patents

Resin molding device and method thereof, film transport roller and film supply device for resin molding device Download PDF

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Publication number
TWI633001B
TWI633001B TW106110036A TW106110036A TWI633001B TW I633001 B TWI633001 B TW I633001B TW 106110036 A TW106110036 A TW 106110036A TW 106110036 A TW106110036 A TW 106110036A TW I633001 B TWI633001 B TW I633001B
Authority
TW
Taiwan
Prior art keywords
roller
release film
mold
resin
resin molding
Prior art date
Application number
TW106110036A
Other languages
English (en)
Chinese (zh)
Other versions
TW201733769A (zh
Inventor
山田哲也
後藤智行
市橋秀男
Original Assignee
東和股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東和股份有限公司 filed Critical 東和股份有限公司
Publication of TW201733769A publication Critical patent/TW201733769A/zh
Application granted granted Critical
Publication of TWI633001B publication Critical patent/TWI633001B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/22—Component parts, details or accessories; Auxiliary operations
    • B29C39/36—Removing moulded articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
    • B29C37/0067—Using separating agents during or after moulding; Applying separating agents on preforms or articles, e.g. to prevent sticking to each other
    • B29C37/0075—Using separating agents during or after moulding; Applying separating agents on preforms or articles, e.g. to prevent sticking to each other using release sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/02—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
    • B29C39/04—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles using movable moulds not applied
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/22—Component parts, details or accessories; Auxiliary operations
    • B29C39/26—Moulds or cores
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/22—Component parts, details or accessories; Auxiliary operations
    • B29C39/38—Heating or cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
TW106110036A 2016-03-30 2017-03-24 Resin molding device and method thereof, film transport roller and film supply device for resin molding device TWI633001B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-067078 2016-03-30
JP2016067078A JP6506717B2 (ja) 2016-03-30 2016-03-30 樹脂成形装置、樹脂成形方法、フィルム搬送用ローラ及び樹脂成形装置用フィルム供給装置

Publications (2)

Publication Number Publication Date
TW201733769A TW201733769A (zh) 2017-10-01
TWI633001B true TWI633001B (zh) 2018-08-21

Family

ID=60007632

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106110036A TWI633001B (zh) 2016-03-30 2017-03-24 Resin molding device and method thereof, film transport roller and film supply device for resin molding device

Country Status (4)

Country Link
JP (1) JP6506717B2 (ko)
KR (1) KR102026520B1 (ko)
CN (1) CN107275232A (ko)
TW (1) TWI633001B (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6854784B2 (ja) * 2018-01-15 2021-04-07 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形品製造方法
JP7145576B2 (ja) * 2018-08-24 2022-10-03 株式会社Subaru 複合材賦形装置及び複合材賦形方法
JP7134926B2 (ja) * 2019-07-10 2022-09-12 Ｔｏｗａ株式会社 樹脂成形装置、及び樹脂成形品の製造方法
JP6869304B2 (ja) * 2019-09-17 2021-05-12 Ｊｘ金属株式会社 インサート成形品および、インサート成形品の製造方法
CN112978431A (zh) * 2021-02-04 2021-06-18 芯笙半导体科技(上海)有限公司 基于树脂成型的除静电薄膜处理设备
JP7230160B1 (ja) * 2021-12-01 2023-02-28 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形品の製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201532776A (zh) * 2013-12-26 2015-09-01 Towa Corp 樹脂封裝方法及樹脂封裝裝置

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06329276A (ja) * 1993-05-19 1994-11-29 Matsushita Electric Ind Co Ltd シート材給送装置
JP3595793B2 (ja) * 2001-12-04 2004-12-02 株式会社サイネックス 樹脂封止装置
JP2004039823A (ja) * 2002-07-03 2004-02-05 Nec Yamagata Ltd 半導体樹脂封止装置及びその方法
JP4585321B2 (ja) * 2005-01-12 2010-11-24 アピックヤマダ株式会社 樹脂モールド装置及び樹脂モールド方法
KR100609605B1 (ko) 2005-03-30 2006-08-08 주식회사지엠피 라미네이터
KR20070048034A (ko) * 2005-11-03 2007-05-08 엘지전자 주식회사 테이프 제품의 검사장치
JP2007250681A (ja) * 2006-03-14 2007-09-27 Matsushita Electric Ind Co Ltd 半導体樹脂封止装置及びリリースフィルムの供給方法
JP4135769B2 (ja) 2006-09-27 2008-08-20 東レ株式会社 間欠式フィルム成形装置および成形方法
KR101000776B1 (ko) * 2008-07-24 2010-12-15 세크론 주식회사 전자 부품 몰딩 장치
KR101101669B1 (ko) * 2009-12-01 2011-12-30 삼성전기주식회사 전자부품 제조장치 및 전자부품 제조방법
JP2013155007A (ja) * 2012-01-31 2013-08-15 Toyota Motor Corp 搬送ローラ
JP6298719B2 (ja) * 2014-06-09 2018-03-20 Ｔｏｗａ株式会社 樹脂封止装置及び樹脂封止方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201532776A (zh) * 2013-12-26 2015-09-01 Towa Corp 樹脂封裝方法及樹脂封裝裝置

Also Published As

Publication number Publication date
KR20170113022A (ko) 2017-10-12
CN107275232A (zh) 2017-10-20
TW201733769A (zh) 2017-10-01
KR102026520B1 (ko) 2019-09-27
JP6506717B2 (ja) 2019-04-24
JP2017183443A (ja) 2017-10-05

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