TWI629467B - 晶圓檢查方法及晶圓檢查裝置 - Google Patents

晶圓檢查方法及晶圓檢查裝置 Download PDF

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Publication number
TWI629467B
TWI629467B TW105126193A TW105126193A TWI629467B TW I629467 B TWI629467 B TW I629467B TW 105126193 A TW105126193 A TW 105126193A TW 105126193 A TW105126193 A TW 105126193A TW I629467 B TWI629467 B TW I629467B
Authority
TW
Taiwan
Prior art keywords
optical system
wafer
defect
detected
inspection method
Prior art date
Application number
TW105126193A
Other languages
English (en)
Chinese (zh)
Other versions
TW201719153A (zh
Inventor
長田達弥
江頭雅彦
內野智勝
Original Assignee
Ｓｕｍｃｏ股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ｓｕｍｃｏ股份有限公司 filed Critical Ｓｕｍｃｏ股份有限公司
Publication of TW201719153A publication Critical patent/TW201719153A/zh
Application granted granted Critical
Publication of TWI629467B publication Critical patent/TWI629467B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8803—Visual inspection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/24—Optical enhancement of defects or not directly visible states, e.g. selective electrolytic deposition, bubbles in liquids, light emission, colour change
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
TW105126193A 2015-10-06 2016-08-17 晶圓檢查方法及晶圓檢查裝置 TWI629467B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015198513A JP6493136B2 (ja) 2015-10-06 2015-10-06 ウェーハ検査方法およびウェーハ検査装置
JP2015-198513 2015-10-06

Publications (2)

Publication Number Publication Date
TW201719153A TW201719153A (zh) 2017-06-01
TWI629467B true TWI629467B (zh) 2018-07-11

Family

ID=58538652

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105126193A TWI629467B (zh) 2015-10-06 2016-08-17 晶圓檢查方法及晶圓檢查裝置

Country Status (3)

Country Link
JP (1) JP6493136B2 (ko)
KR (1) KR101885614B1 (ko)
TW (1) TWI629467B (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107976401B (zh) * 2016-10-24 2020-05-01 京元电子股份有限公司 半导体组件外观检验设备及其光学路径结构

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000162141A (ja) * 1998-11-27 2000-06-16 Hitachi Ltd 欠陥検査装置および方法
JP2008275540A (ja) * 2007-05-02 2008-11-13 Hitachi High-Technologies Corp パターン欠陥検査装置および方法
CN101241084B (zh) * 2007-02-06 2011-05-25 台湾积体电路制造股份有限公司 晶圆检查的方法和系统
JP2013238534A (ja) * 2012-05-16 2013-11-28 Shin Etsu Handotai Co Ltd ウエーハ表面の評価方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57132044A (en) * 1981-02-10 1982-08-16 Hitachi Metals Ltd Discriminating method of surface defect
KR100327340B1 (ko) * 1999-09-30 2002-03-06 윤종용 웨이퍼 표면 검사방법
JP2001153635A (ja) * 1999-11-29 2001-06-08 Sumitomo Metal Ind Ltd 半導体ウェ−ハの品質評価方法
JP4761427B2 (ja) * 2004-07-02 2011-08-31 東京エレクトロン株式会社 被処理体表面検査装置
JP4343911B2 (ja) * 2006-02-06 2009-10-14 株式会社日立製作所 欠陥検査装置
US7912658B2 (en) * 2008-05-28 2011-03-22 Kla-Tencor Corp. Systems and methods for determining two or more characteristics of a wafer
JP5433201B2 (ja) * 2008-10-23 2014-03-05 株式会社Ｓｕｍｃｏ ウェーハ裏面の評価方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000162141A (ja) * 1998-11-27 2000-06-16 Hitachi Ltd 欠陥検査装置および方法
CN101241084B (zh) * 2007-02-06 2011-05-25 台湾积体电路制造股份有限公司 晶圆检查的方法和系统
JP2008275540A (ja) * 2007-05-02 2008-11-13 Hitachi High-Technologies Corp パターン欠陥検査装置および方法
JP2013238534A (ja) * 2012-05-16 2013-11-28 Shin Etsu Handotai Co Ltd ウエーハ表面の評価方法

Also Published As

Publication number Publication date
KR101885614B1 (ko) 2018-08-06
JP6493136B2 (ja) 2019-04-03
KR20170041128A (ko) 2017-04-14
TW201719153A (zh) 2017-06-01
JP2017072443A (ja) 2017-04-13

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