TWI625531B - 電路基板之檢查方法、電路基板之檢查裝置及電路基板之檢查程式 - Google Patents

電路基板之檢查方法、電路基板之檢查裝置及電路基板之檢查程式 Download PDF

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Publication number
TWI625531B
TWI625531B TW106109032A TW106109032A TWI625531B TW I625531 B TWI625531 B TW I625531B TW 106109032 A TW106109032 A TW 106109032A TW 106109032 A TW106109032 A TW 106109032A TW I625531 B TWI625531 B TW I625531B
Authority
TW
Taiwan
Prior art keywords
inspection
information
aforementioned
circuit board
setting
Prior art date
Application number
TW106109032A
Other languages
English (en)
Chinese (zh)
Other versions
TW201740129A (zh
Inventor
早苗駿一
斎藤智一
遠藤友悟
川戶貴幸
Original Assignee
山葉汎提克股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 山葉汎提克股份有限公司 filed Critical 山葉汎提克股份有限公司
Publication of TW201740129A publication Critical patent/TW201740129A/zh
Application granted granted Critical
Publication of TWI625531B publication Critical patent/TWI625531B/zh

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
    • G01R31/2813—Checking the presence, location, orientation or value, e.g. resistance, of components or conductors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2805—Bare printed circuit boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06705—Apparatus for holding or moving single probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
TW106109032A 2016-03-23 2017-03-17 電路基板之檢查方法、電路基板之檢查裝置及電路基板之檢查程式 TWI625531B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016058442 2016-03-23
JP??2016-058442 2016-03-23

Publications (2)

Publication Number Publication Date
TW201740129A TW201740129A (zh) 2017-11-16
TWI625531B true TWI625531B (zh) 2018-06-01

Family

ID=59933069

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106109032A TWI625531B (zh) 2016-03-23 2017-03-17 電路基板之檢查方法、電路基板之檢查裝置及電路基板之檢查程式

Country Status (4)

Country Link
JP (1) JP6877025B2 (ko)
KR (1) KR101966513B1 (ko)
CN (1) CN107229011B (ko)
TW (1) TWI625531B (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019211395A (ja) * 2018-06-07 2019-12-12 ヤマハファインテック株式会社 接触燃焼式ガスセンサ及びその製造方法
JP7035857B2 (ja) * 2018-07-03 2022-03-15 オムロン株式会社 検査方法、検査システム及びプログラム
CN109884501B (zh) * 2019-03-06 2022-04-19 惠科股份有限公司 一种检测机台、断线短路检测机及校正方法
US20210148975A1 (en) * 2019-11-15 2021-05-20 Tektronix, Inc. Indirect acquisition of a signal from a device under test

Citations (5)

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JP2006260068A (ja) * 2005-03-16 2006-09-28 Fuji Photo Film Co Ltd 処理装置の調整方法及び装置
CN1806368B (zh) * 2003-06-12 2010-09-01 Jsr株式会社 各向异性导电连接器装置及其制造方法以及电路装置的检查装置
US7952373B2 (en) * 2000-05-23 2011-05-31 Verigy (Singapore) Pte. Ltd. Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies
TW201538983A (zh) * 2014-03-27 2015-10-16 Tokyo Electron Ltd 基板檢查裝置
TW201543189A (zh) * 2014-02-20 2015-11-16 Tokyo Electron Ltd 基板處理裝置、位置偏移修正方法及記憶媒體

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JPS63244854A (ja) * 1987-03-31 1988-10-12 Tokyo Electron Ltd プロ−ブ装置
US5416592A (en) * 1992-03-23 1995-05-16 Tokyo Electron Kabushiki Kaisha Probe apparatus for measuring electrical characteristics of objects
JPH06129831A (ja) * 1992-10-14 1994-05-13 Nitto Seiko Co Ltd 基板検査装置
JP2899492B2 (ja) * 1992-12-18 1999-06-02 株式会社テスコン プリント基板検査方法と検査装置
JPH06347502A (ja) * 1993-06-10 1994-12-22 Fujitsu Ltd プリント基板試験方法
JP3509040B2 (ja) * 1995-03-23 2004-03-22 日置電機株式会社 回路基板検査装置におけるプローブの移動制御方法
US7218127B2 (en) * 2004-02-18 2007-05-15 Formfactor, Inc. Method and apparatus for probing an electronic device in which movement of probes and/or the electronic device includes a lateral component
JP2006214820A (ja) * 2005-02-02 2006-08-17 Yamaha Motor Co Ltd 基板検査装置および基板検査方法
US8311758B2 (en) * 2006-01-18 2012-11-13 Formfactor, Inc. Methods and apparatuses for dynamic probe adjustment
JP2008164292A (ja) * 2006-12-26 2008-07-17 Tokyo Electron Ltd プローブ検査装置、位置ずれ補正方法、情報処理装置、情報処理方法及びプログラム
JP4987497B2 (ja) * 2007-01-31 2012-07-25 日置電機株式会社 回路基板検査装置
JP4932618B2 (ja) * 2007-06-29 2012-05-16 東京エレクトロン株式会社 検査方法及びこの方法を記録したプログラム記録媒体
US9000798B2 (en) * 2012-06-13 2015-04-07 Taiwan Semiconductor Manufacturing Company, Ltd. Method of test probe alignment control
JP6277347B2 (ja) * 2014-02-28 2018-02-14 日本電産リード株式会社 可撓性回路基板を対象とする検査装置及び検査方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7952373B2 (en) * 2000-05-23 2011-05-31 Verigy (Singapore) Pte. Ltd. Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies
CN1806368B (zh) * 2003-06-12 2010-09-01 Jsr株式会社 各向异性导电连接器装置及其制造方法以及电路装置的检查装置
JP2006260068A (ja) * 2005-03-16 2006-09-28 Fuji Photo Film Co Ltd 処理装置の調整方法及び装置
TW201543189A (zh) * 2014-02-20 2015-11-16 Tokyo Electron Ltd 基板處理裝置、位置偏移修正方法及記憶媒體
TW201538983A (zh) * 2014-03-27 2015-10-16 Tokyo Electron Ltd 基板檢查裝置

Also Published As

Publication number Publication date
JP6877025B2 (ja) 2021-05-26
CN107229011B (zh) 2020-11-24
TW201740129A (zh) 2017-11-16
KR20170110523A (ko) 2017-10-11
KR101966513B1 (ko) 2019-04-05
JP2017181497A (ja) 2017-10-05
CN107229011A (zh) 2017-10-03

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