TWI622158B - 儲存元件,儲存裝置,製造儲存元件之方法,及磁頭 - Google Patents

儲存元件,儲存裝置,製造儲存元件之方法,及磁頭 Download PDF

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Publication number
TWI622158B
TWI622158B TW103117218A TW103117218A TWI622158B TW I622158 B TWI622158 B TW I622158B TW 103117218 A TW103117218 A TW 103117218A TW 103117218 A TW103117218 A TW 103117218A TW I622158 B TWI622158 B TW I622158B
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TW
Taiwan
Prior art keywords
layer
storage
barrier layer
electrode layer
spin barrier
Prior art date
Application number
TW103117218A
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English (en)
Chinese (zh)
Other versions
TW201507106A (zh
Inventor
大森廣之
細見政功
別所和宏
肥後豊
山根一陽
內田裕行
Original Assignee
新力股份有限公司
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Publication date
Application filed by 新力股份有限公司 filed Critical 新力股份有限公司
Publication of TW201507106A publication Critical patent/TW201507106A/zh
Application granted granted Critical
Publication of TWI622158B publication Critical patent/TWI622158B/zh

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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N50/00Galvanomagnetic devices
    • H10N50/01Manufacture or treatment
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/02Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
    • G11C11/16Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
    • G11C11/161Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect details concerning the memory cell structure, e.g. the layers of the ferromagnetic memory cell
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N50/00Galvanomagnetic devices
    • H10N50/10Magnetoresistive devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B61/00Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices
    • H10B61/20Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices comprising components having three or more electrodes, e.g. transistors
    • H10B61/22Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices comprising components having three or more electrodes, e.g. transistors of the field-effect transistor [FET] type

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Mram Or Spin Memory Techniques (AREA)
  • Hall/Mr Elements (AREA)
  • Magnetic Heads (AREA)
TW103117218A 2013-06-17 2014-05-15 儲存元件,儲存裝置,製造儲存元件之方法,及磁頭 TWI622158B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013-126388 2013-06-17
JP2013126388A JP6182993B2 (ja) 2013-06-17 2013-06-17 記憶素子、記憶装置、記憶素子の製造方法、磁気ヘッド

Publications (2)

Publication Number Publication Date
TW201507106A TW201507106A (zh) 2015-02-16
TWI622158B true TWI622158B (zh) 2018-04-21

Family

ID=52018520

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103117218A TWI622158B (zh) 2013-06-17 2014-05-15 儲存元件,儲存裝置,製造儲存元件之方法,及磁頭

Country Status (4)

Country Link
US (1) US9397288B2 (enExample)
JP (1) JP6182993B2 (enExample)
CN (1) CN104241286B (enExample)
TW (1) TWI622158B (enExample)

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Publication number Priority date Publication date Assignee Title
JP5040105B2 (ja) 2005-12-01 2012-10-03 ソニー株式会社 記憶素子、メモリ
US9461242B2 (en) 2013-09-13 2016-10-04 Micron Technology, Inc. Magnetic memory cells, methods of fabrication, semiconductor devices, memory systems, and electronic systems
US9608197B2 (en) 2013-09-18 2017-03-28 Micron Technology, Inc. Memory cells, methods of fabrication, and semiconductor devices
US10454024B2 (en) 2014-02-28 2019-10-22 Micron Technology, Inc. Memory cells, methods of fabrication, and memory devices
US9281466B2 (en) 2014-04-09 2016-03-08 Micron Technology, Inc. Memory cells, semiconductor structures, semiconductor devices, and methods of fabrication
US9349945B2 (en) 2014-10-16 2016-05-24 Micron Technology, Inc. Memory cells, semiconductor devices, and methods of fabrication
US9768377B2 (en) 2014-12-02 2017-09-19 Micron Technology, Inc. Magnetic cell structures, and methods of fabrication
US10439131B2 (en) 2015-01-15 2019-10-08 Micron Technology, Inc. Methods of forming semiconductor devices including tunnel barrier materials
JP6498968B2 (ja) * 2015-03-11 2019-04-10 株式会社東芝 磁気抵抗素子および磁気メモリ
US10050192B2 (en) 2015-12-11 2018-08-14 Imec Vzw Magnetic memory device having buffer layer
JP6540786B1 (ja) * 2017-12-28 2019-07-10 Tdk株式会社 スピン軌道トルク型磁化回転素子、スピン軌道トルク型磁気抵抗効果素子及び磁気メモリ
US11276649B2 (en) * 2019-06-28 2022-03-15 Taiwan Semiconductor Manufacturing Co., Ltd. Devices and methods having magnetic shielding layer
CN112289922B (zh) * 2019-07-22 2023-05-30 中电海康集团有限公司 磁传感器及其制作方法
CN112310273B (zh) * 2019-07-29 2023-04-07 中电海康集团有限公司 磁性隧道结及其制备方法
US11177225B2 (en) * 2020-02-04 2021-11-16 International Business Machines Corporation Semiconductor device including physical unclonable function
JP2022190838A (ja) * 2021-06-15 2022-12-27 ソニーセミコンダクタソリューションズ株式会社 記憶装置、メモリセルアレイ、メモリセルアレイの製造方法、磁気ヘッド及び電子機器
JP2023059471A (ja) 2021-10-15 2023-04-27 ソニーセミコンダクタソリューションズ株式会社 記憶素子及び記憶装置
US11630169B1 (en) * 2022-01-17 2023-04-18 Allegro Microsystems, Llc Fabricating a coil above and below a magnetoresistance element

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US7088609B2 (en) * 2004-05-11 2006-08-08 Grandis, Inc. Spin barrier enhanced magnetoresistance effect element and magnetic memory using the same
US20120023386A1 (en) * 2010-07-26 2012-01-26 Samsung Electronics Co., Ltd. Magnetic Memory Devices, Electronic Systems And Memory Cards Including The Same, Methods Of Manufacturing The Same, And Methods Of Controlling A Magnetization Direction Of A Magnetic Pattern
US8493695B1 (en) * 2011-06-28 2013-07-23 Western Digital (Fremont), Llc Method and system for providing a magnetic read transducer having an improved signal to noise ratio

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JP2004128015A (ja) * 2002-09-30 2004-04-22 Sony Corp 磁気抵抗効果素子および磁気メモリ装置
JP5039006B2 (ja) * 2008-09-26 2012-10-03 株式会社東芝 磁気抵抗効果素子の製造方法、磁気抵抗効果素子、磁気ヘッドアセンブリ及び磁気記録再生装置
US8363459B2 (en) * 2009-06-11 2013-01-29 Qualcomm Incorporated Magnetic tunnel junction device and fabrication
US8513749B2 (en) * 2010-01-14 2013-08-20 Qualcomm Incorporated Composite hardmask architecture and method of creating non-uniform current path for spin torque driven magnetic tunnel junction
JP2012059906A (ja) 2010-09-09 2012-03-22 Sony Corp 記憶素子、メモリ装置
US9006704B2 (en) * 2011-02-11 2015-04-14 Headway Technologies, Inc. Magnetic element with improved out-of-plane anisotropy for spintronic applications

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7088609B2 (en) * 2004-05-11 2006-08-08 Grandis, Inc. Spin barrier enhanced magnetoresistance effect element and magnetic memory using the same
US20120023386A1 (en) * 2010-07-26 2012-01-26 Samsung Electronics Co., Ltd. Magnetic Memory Devices, Electronic Systems And Memory Cards Including The Same, Methods Of Manufacturing The Same, And Methods Of Controlling A Magnetization Direction Of A Magnetic Pattern
US8493695B1 (en) * 2011-06-28 2013-07-23 Western Digital (Fremont), Llc Method and system for providing a magnetic read transducer having an improved signal to noise ratio

Also Published As

Publication number Publication date
JP6182993B2 (ja) 2017-08-23
CN104241286B (zh) 2018-09-21
US20140367814A1 (en) 2014-12-18
US9397288B2 (en) 2016-07-19
JP2015002281A (ja) 2015-01-05
CN104241286A (zh) 2014-12-24
TW201507106A (zh) 2015-02-16

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