TWI613948B - 多層剛性可撓性基板及其製造方法 - Google Patents

多層剛性可撓性基板及其製造方法 Download PDF

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Publication number
TWI613948B
TWI613948B TW104131143A TW104131143A TWI613948B TW I613948 B TWI613948 B TW I613948B TW 104131143 A TW104131143 A TW 104131143A TW 104131143 A TW104131143 A TW 104131143A TW I613948 B TWI613948 B TW I613948B
Authority
TW
Taiwan
Prior art keywords
flexible substrate
multilayer
rigid
low
prepreg
Prior art date
Application number
TW104131143A
Other languages
English (en)
Chinese (zh)
Other versions
TW201705836A (zh
Inventor
Ichiro Sakamoto
Original Assignee
Toshiba Design & Mfg Service Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Design & Mfg Service Corporation filed Critical Toshiba Design & Mfg Service Corporation
Publication of TW201705836A publication Critical patent/TW201705836A/zh
Application granted granted Critical
Publication of TWI613948B publication Critical patent/TWI613948B/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/304—Protecting a component during manufacturing

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
TW104131143A 2015-02-26 2015-09-21 多層剛性可撓性基板及其製造方法 TWI613948B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015036557A JP6538372B2 (ja) 2015-02-26 2015-02-26 多層リジッドフレキシブル基板の製造方法

Publications (2)

Publication Number Publication Date
TW201705836A TW201705836A (zh) 2017-02-01
TWI613948B true TWI613948B (zh) 2018-02-01

Family

ID=56826491

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104131143A TWI613948B (zh) 2015-02-26 2015-09-21 多層剛性可撓性基板及其製造方法

Country Status (4)

Country Link
JP (1) JP6538372B2 (ja)
KR (1) KR101853530B1 (ja)
CN (1) CN105934109B (ja)
TW (1) TWI613948B (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021020919A1 (ko) * 2019-07-30 2021-02-04 삼성전자 주식회사 경연성 인쇄 회로 기판 및 이를 포함하는 전자 장치

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI364245B (en) * 2008-05-12 2012-05-11 Fujitsu Ltd Multi-layer printed wiring board, electronic device, and fabrication method of electronic device
TW201503783A (zh) * 2014-03-07 2015-01-16 Meiko Electronics Co Ltd 具有可撓部之剛性印刷配線基板之彎回方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5997983A (en) * 1997-05-30 1999-12-07 Teledyneindustries, Inc. Rigid/flex printed circuit board using angled prepreg
JP2002252469A (ja) * 2001-02-23 2002-09-06 Shin Etsu Chem Co Ltd 多層フレキシブル印刷配線板
JP2006066894A (ja) * 2004-07-28 2006-03-09 Hitachi Chem Co Ltd 印刷回路板
JP2006324406A (ja) * 2005-05-18 2006-11-30 Sharp Corp フレックスリジッド多層配線板
JP2007129153A (ja) * 2005-11-07 2007-05-24 Cmk Corp リジッドフレックス多層プリント配線板
KR200415210Y1 (ko) * 2006-02-14 2006-04-28 (주)인터플렉스 리지드 플렉시블 인쇄회로기판
CN101518163B (zh) * 2006-09-21 2011-06-08 株式会社大昌电子 刚挠性印刷电路板及该刚挠性印刷电路板的制造方法
TW201127228A (en) * 2010-01-22 2011-08-01 Ibiden Co Ltd Flex-rigid wiring board and method for manufacturing the same
JP5617028B2 (ja) * 2011-02-21 2014-10-29 パナソニック株式会社 金属張積層板、及びプリント配線板
TW201340807A (zh) * 2011-12-28 2013-10-01 Panasonic Corp 撓性配線基板與其製造方法、使用其之裝載製品、及撓性多層配線基板
AT13434U1 (de) * 2012-02-21 2013-12-15 Austria Tech & System Tech Verfahren zur Herstellung einer Leiterplatte und Verwendung eines derartigen Verfahrens

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI364245B (en) * 2008-05-12 2012-05-11 Fujitsu Ltd Multi-layer printed wiring board, electronic device, and fabrication method of electronic device
TW201503783A (zh) * 2014-03-07 2015-01-16 Meiko Electronics Co Ltd 具有可撓部之剛性印刷配線基板之彎回方法

Also Published As

Publication number Publication date
KR101853530B1 (ko) 2018-04-30
KR20160104532A (ko) 2016-09-05
TW201705836A (zh) 2017-02-01
CN105934109B (zh) 2018-10-12
CN105934109A (zh) 2016-09-07
JP6538372B2 (ja) 2019-07-03
JP2016157902A (ja) 2016-09-01

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