KR101853530B1 - 다층 리지드 플렉시블 기판 및 그 제조방법 - Google Patents

다층 리지드 플렉시블 기판 및 그 제조방법 Download PDF

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Publication number
KR101853530B1
KR101853530B1 KR1020150136717A KR20150136717A KR101853530B1 KR 101853530 B1 KR101853530 B1 KR 101853530B1 KR 1020150136717 A KR1020150136717 A KR 1020150136717A KR 20150136717 A KR20150136717 A KR 20150136717A KR 101853530 B1 KR101853530 B1 KR 101853530B1
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KR
South Korea
Prior art keywords
flexible substrate
multilayer
rigid
layer
low
Prior art date
Application number
KR1020150136717A
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English (en)
Korean (ko)
Other versions
KR20160104532A (ko
Inventor
이치로 사카모토
Original Assignee
도시바 디엠에스 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 도시바 디엠에스 가부시키가이샤 filed Critical 도시바 디엠에스 가부시키가이샤
Publication of KR20160104532A publication Critical patent/KR20160104532A/ko
Application granted granted Critical
Publication of KR101853530B1 publication Critical patent/KR101853530B1/ko

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/304—Protecting a component during manufacturing

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
KR1020150136717A 2015-02-26 2015-09-25 다층 리지드 플렉시블 기판 및 그 제조방법 KR101853530B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2015-036557 2015-02-26
JP2015036557A JP6538372B2 (ja) 2015-02-26 2015-02-26 多層リジッドフレキシブル基板の製造方法

Publications (2)

Publication Number Publication Date
KR20160104532A KR20160104532A (ko) 2016-09-05
KR101853530B1 true KR101853530B1 (ko) 2018-04-30

Family

ID=56826491

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150136717A KR101853530B1 (ko) 2015-02-26 2015-09-25 다층 리지드 플렉시블 기판 및 그 제조방법

Country Status (4)

Country Link
JP (1) JP6538372B2 (ja)
KR (1) KR101853530B1 (ja)
CN (1) CN105934109B (ja)
TW (1) TWI613948B (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021020919A1 (ko) * 2019-07-30 2021-02-04 삼성전자 주식회사 경연성 인쇄 회로 기판 및 이를 포함하는 전자 장치

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002501676A (ja) * 1997-05-30 2002-01-15 テレダイン インダストリーズ、インコーポレーテッド 角度を持たせたプリプレグを用いた剛性／可撓性回路基盤
JP2002252469A (ja) * 2001-02-23 2002-09-06 Shin Etsu Chem Co Ltd 多層フレキシブル印刷配線板
KR200415210Y1 (ko) * 2006-02-14 2006-04-28 (주)인터플렉스 리지드 플렉시블 인쇄회로기판

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006066894A (ja) * 2004-07-28 2006-03-09 Hitachi Chem Co Ltd 印刷回路板
JP2006324406A (ja) * 2005-05-18 2006-11-30 Sharp Corp フレックスリジッド多層配線板
JP2007129153A (ja) * 2005-11-07 2007-05-24 Cmk Corp リジッドフレックス多層プリント配線板
CN101518163B (zh) * 2006-09-21 2011-06-08 株式会社大昌电子 刚挠性印刷电路板及该刚挠性印刷电路板的制造方法
JP5176680B2 (ja) * 2008-05-12 2013-04-03 富士通株式会社 多層プリント配線板，及び電子装置
TW201127228A (en) * 2010-01-22 2011-08-01 Ibiden Co Ltd Flex-rigid wiring board and method for manufacturing the same
JP5617028B2 (ja) * 2011-02-21 2014-10-29 パナソニック株式会社 金属張積層板、及びプリント配線板
TW201340807A (zh) * 2011-12-28 2013-10-01 Panasonic Corp 撓性配線基板與其製造方法、使用其之裝載製品、及撓性多層配線基板
AT13434U1 (de) * 2012-02-21 2013-12-15 Austria Tech & System Tech Verfahren zur Herstellung einer Leiterplatte und Verwendung eines derartigen Verfahrens
US20150257284A1 (en) * 2014-03-07 2015-09-10 Meiko Electronics Co., Ltd. Method of bending back rigid printed wiring board with flexible portion

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002501676A (ja) * 1997-05-30 2002-01-15 テレダイン インダストリーズ、インコーポレーテッド 角度を持たせたプリプレグを用いた剛性／可撓性回路基盤
JP2002252469A (ja) * 2001-02-23 2002-09-06 Shin Etsu Chem Co Ltd 多層フレキシブル印刷配線板
KR200415210Y1 (ko) * 2006-02-14 2006-04-28 (주)인터플렉스 리지드 플렉시블 인쇄회로기판

Also Published As

Publication number Publication date
TWI613948B (zh) 2018-02-01
KR20160104532A (ko) 2016-09-05
TW201705836A (zh) 2017-02-01
CN105934109B (zh) 2018-10-12
CN105934109A (zh) 2016-09-07
JP6538372B2 (ja) 2019-07-03
JP2016157902A (ja) 2016-09-01

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