JP6538372B2 - 多層リジッドフレキシブル基板の製造方法 - Google Patents
多層リジッドフレキシブル基板の製造方法 Download PDFInfo
- Publication number
- JP6538372B2 JP6538372B2 JP2015036557A JP2015036557A JP6538372B2 JP 6538372 B2 JP6538372 B2 JP 6538372B2 JP 2015036557 A JP2015036557 A JP 2015036557A JP 2015036557 A JP2015036557 A JP 2015036557A JP 6538372 B2 JP6538372 B2 JP 6538372B2
- Authority
- JP
- Japan
- Prior art keywords
- flexible substrate
- multilayer
- rigid
- layer
- flexible
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
- H05K2203/304—Protecting a component during manufacturing
Description
(2)層間剥離リスクの増加
(3)接着剤(ポリイミド製カバーレイ)によるスルーホール品質の低下
(4)製造工程数の増加
図1は、第1実施形態に係る多層リジッドフレキシブル基板の構成を示す図である。
図3は、第2実施形態に係る多層リジッドフレキシブル基板の構成を示す図である。
10、20…リジッド部
30…屈曲部
40…フレキシブル基板
45…低弾性プリプレグ
50…第1多層フレキシブル基板
60…第2多層フレキシブル基板
70…第3多層フレキシブル基板
80a〜80d…高弾性プリプレグ
85a〜85d…銅箔
95a〜95d…導体
110a〜110d…ソルダーレジスト
Claims (3)
- 複数のフレキシブル基板が積層された多層フレキシブル基板が複数積層され、両側縁部分を含む領域にリジッド部を有し、前記リジッド部の間の領域に前記リジッド部とつながった屈曲部を有する多層リジッドフレキシブル基板の製造方法であって、
積層される2つの前記フレキシブル基板同士を、前記リジッド部および前記屈曲部において第1の弾性プリプレグによって接合し、多層フレキシブル基板を形成する工程と、
積層される2つの前記多層フレキシブル基板同士を、前記リジッド部において前記第1の弾性プリプレグの弾性率より高い弾性率を有する第2の弾性プリプレグによって接合する工程と、
を有することを特徴とする多層リジッドフレキシブル基板の製造方法。 - 前記多層フレキシブル基板の前記リジッド部にスルーホールが設けられることを特徴とする請求項1に記載の多層リジッドフレキシブル基板の製造方法。
- 前記屈曲部において、前記複数積層された多層フレキシブル基板の層間に空間があることを特徴とする請求項1に記載の多層リジッドフレキシブル基板の製造方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015036557A JP6538372B2 (ja) | 2015-02-26 | 2015-02-26 | 多層リジッドフレキシブル基板の製造方法 |
TW104131143A TWI613948B (zh) | 2015-02-26 | 2015-09-21 | 多層剛性可撓性基板及其製造方法 |
KR1020150136717A KR101853530B1 (ko) | 2015-02-26 | 2015-09-25 | 다층 리지드 플렉시블 기판 및 그 제조방법 |
CN201510640100.5A CN105934109B (zh) | 2015-02-26 | 2015-09-30 | 多层刚挠性基板及其制造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015036557A JP6538372B2 (ja) | 2015-02-26 | 2015-02-26 | 多層リジッドフレキシブル基板の製造方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2016157902A JP2016157902A (ja) | 2016-09-01 |
JP2016157902A5 JP2016157902A5 (ja) | 2018-04-05 |
JP6538372B2 true JP6538372B2 (ja) | 2019-07-03 |
Family
ID=56826491
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015036557A Active JP6538372B2 (ja) | 2015-02-26 | 2015-02-26 | 多層リジッドフレキシブル基板の製造方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6538372B2 (ja) |
KR (1) | KR101853530B1 (ja) |
CN (1) | CN105934109B (ja) |
TW (1) | TWI613948B (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021020919A1 (ko) * | 2019-07-30 | 2021-02-04 | 삼성전자 주식회사 | 경연성 인쇄 회로 기판 및 이를 포함하는 전자 장치 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5997983A (en) * | 1997-05-30 | 1999-12-07 | Teledyneindustries, Inc. | Rigid/flex printed circuit board using angled prepreg |
JP2002252469A (ja) * | 2001-02-23 | 2002-09-06 | Shin Etsu Chem Co Ltd | 多層フレキシブル印刷配線板 |
JP2006066894A (ja) * | 2004-07-28 | 2006-03-09 | Hitachi Chem Co Ltd | 印刷回路板 |
JP2006324406A (ja) * | 2005-05-18 | 2006-11-30 | Sharp Corp | フレックスリジッド多層配線板 |
JP2007129153A (ja) * | 2005-11-07 | 2007-05-24 | Cmk Corp | リジッドフレックス多層プリント配線板 |
KR200415210Y1 (ko) * | 2006-02-14 | 2006-04-28 | (주)인터플렉스 | 리지드 플렉시블 인쇄회로기판 |
CN101518163B (zh) * | 2006-09-21 | 2011-06-08 | 株式会社大昌电子 | 刚挠性印刷电路板及该刚挠性印刷电路板的制造方法 |
JP5176680B2 (ja) * | 2008-05-12 | 2013-04-03 | 富士通株式会社 | 多層プリント配線板,及び電子装置 |
TW201127228A (en) * | 2010-01-22 | 2011-08-01 | Ibiden Co Ltd | Flex-rigid wiring board and method for manufacturing the same |
WO2012114680A1 (ja) * | 2011-02-21 | 2012-08-30 | パナソニック株式会社 | 金属張積層板、及びプリント配線板 |
TW201340807A (zh) * | 2011-12-28 | 2013-10-01 | Panasonic Corp | 撓性配線基板與其製造方法、使用其之裝載製品、及撓性多層配線基板 |
AT13434U1 (de) * | 2012-02-21 | 2013-12-15 | Austria Tech & System Tech | Verfahren zur Herstellung einer Leiterplatte und Verwendung eines derartigen Verfahrens |
CN105102086A (zh) * | 2014-03-07 | 2015-11-25 | 名幸电子股份有限公司 | 具有柔性部的刚性印制线路板的弯曲恢复方法 |
-
2015
- 2015-02-26 JP JP2015036557A patent/JP6538372B2/ja active Active
- 2015-09-21 TW TW104131143A patent/TWI613948B/zh active
- 2015-09-25 KR KR1020150136717A patent/KR101853530B1/ko active IP Right Grant
- 2015-09-30 CN CN201510640100.5A patent/CN105934109B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
TWI613948B (zh) | 2018-02-01 |
CN105934109B (zh) | 2018-10-12 |
KR20160104532A (ko) | 2016-09-05 |
TW201705836A (zh) | 2017-02-01 |
CN105934109A (zh) | 2016-09-07 |
KR101853530B1 (ko) | 2018-04-30 |
JP2016157902A (ja) | 2016-09-01 |
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